EP2436046A1 - Verfahren zur herstellung einer leuchtdiode - Google Patents
Verfahren zur herstellung einer leuchtdiodeInfo
- Publication number
- EP2436046A1 EP2436046A1 EP10716511A EP10716511A EP2436046A1 EP 2436046 A1 EP2436046 A1 EP 2436046A1 EP 10716511 A EP10716511 A EP 10716511A EP 10716511 A EP10716511 A EP 10716511A EP 2436046 A1 EP2436046 A1 EP 2436046A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- conversion material
- luminescence conversion
- dye
- light
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/02—Coating starting from inorganic powder by application of pressure only
- C23C24/04—Impact or kinetic deposition of particles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
- C23C4/134—Plasma spraying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/22—Roughened surfaces, e.g. at the interface between epitaxial layers
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102009022682A DE102009022682A1 (de) | 2009-05-26 | 2009-05-26 | Verfahren zur Herstellung einer Leuchtdiode |
PCT/EP2010/054663 WO2010136252A1 (de) | 2009-05-26 | 2010-04-08 | Verfahren zur herstellung einer leuchtdiode |
Publications (1)
Publication Number | Publication Date |
---|---|
EP2436046A1 true EP2436046A1 (de) | 2012-04-04 |
Family
ID=42312878
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP10716511A Withdrawn EP2436046A1 (de) | 2009-05-26 | 2010-04-08 | Verfahren zur herstellung einer leuchtdiode |
Country Status (7)
Country | Link |
---|---|
US (1) | US9806237B2 (zh) |
EP (1) | EP2436046A1 (zh) |
JP (1) | JP2012528473A (zh) |
KR (1) | KR20120027032A (zh) |
CN (1) | CN102439742A (zh) |
DE (1) | DE102009022682A1 (zh) |
WO (1) | WO2010136252A1 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011122033A1 (de) * | 2011-12-22 | 2013-06-27 | Osram Gmbh | Aufbringen eines Leuchtstoffs auf ein optisches Element |
CN108417481B (zh) * | 2018-03-22 | 2021-02-23 | 京东方科技集团股份有限公司 | 氮化硅介电层的处理方法、薄膜晶体管和显示装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10010638A1 (de) * | 2000-03-03 | 2001-09-13 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines lichtabstrahlenden Halbleiterkörpers mit Lumineszenzkonversionselement |
DE102004060358A1 (de) * | 2004-09-30 | 2006-04-13 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen von Lumineszenzdiodenchips und Lumineszenzdiodenchip |
US20060258028A1 (en) * | 2004-11-12 | 2006-11-16 | Philips Lumileds Lighting Company Llc | Color control by alteration of wavelength converting element |
US20090084981A1 (en) * | 2005-05-10 | 2009-04-02 | Commonwealth Scientific And Industrial Research Organisation | High-resolution tracking of industrial process materials using trace incorporation of luminescent markers |
Family Cites Families (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19638667C2 (de) * | 1996-09-20 | 2001-05-17 | Osram Opto Semiconductors Gmbh | Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
FR2793950A1 (fr) * | 1999-05-21 | 2000-11-24 | Thomson Plasma | Procede de fabrication de composants sur substrats de verre devant etre scelles, tels que des ecrans d'affichage plats du type panneau a plasma |
US6410002B2 (en) * | 2000-05-12 | 2002-06-25 | Unilever Home & Personal Care Usa Division Of Conopco, Inc. | Preparation of antiperspirant gels which obviates the use of simple glycols |
US7008559B2 (en) | 2001-06-06 | 2006-03-07 | Nomadics, Inc. | Manganese doped upconversion luminescence nanoparticles |
JP2004107727A (ja) * | 2002-09-18 | 2004-04-08 | Shimane Pref Gov | 蛍光発光皮膜の蛍光色の制御方法 |
JPWO2005086239A1 (ja) * | 2004-03-05 | 2008-01-24 | コニカミノルタホールディングス株式会社 | 白色発光ダイオード(led)及び白色ledの製造方法 |
JP2006008793A (ja) | 2004-06-24 | 2006-01-12 | Konica Minolta Holdings Inc | 蛍光体皮膜とその製造方法及びそれを用いた放射線画像変換パネル |
DE102004045947A1 (de) * | 2004-06-30 | 2006-01-19 | Osram Opto Semiconductors Gmbh | Leuchtdiodenanordnung |
DE102005017528A1 (de) * | 2004-08-27 | 2006-03-09 | Osram Opto Semiconductors Gmbh | Leuchtmittel mit vorgegebener Abstrahlcharakteristik und Primäroptikelement für ein Leuchtmittel |
KR100631845B1 (ko) | 2004-09-24 | 2006-10-09 | 삼성전기주식회사 | 에어로졸법을 이용한 형광체막 형성방법 |
US7195944B2 (en) | 2005-01-11 | 2007-03-27 | Semileds Corporation | Systems and methods for producing white-light emitting diodes |
JP2006210588A (ja) * | 2005-01-27 | 2006-08-10 | Konica Minolta Holdings Inc | 白色発光ダイオード及び白色発光ダイオードの製造方法 |
DE102005005359B4 (de) * | 2005-02-02 | 2009-05-07 | Siemens Ag | Verfahren zum Kaltgasspritzen |
JP4912598B2 (ja) | 2005-02-15 | 2012-04-11 | 株式会社フジミインコーポレーテッド | 溶射用粉末 |
DE102005020908A1 (de) * | 2005-02-28 | 2006-08-31 | Osram Opto Semiconductors Gmbh | Beleuchtungsvorrichtung |
JP2006303001A (ja) * | 2005-04-18 | 2006-11-02 | Konica Minolta Opto Inc | 発光ダイオード及びその製造方法 |
JP2006313829A (ja) | 2005-05-09 | 2006-11-16 | Konica Minolta Opto Inc | 白色発光ダイオード及びその製造方法 |
JP2006324407A (ja) * | 2005-05-18 | 2006-11-30 | Toyoda Gosei Co Ltd | 発光装置 |
US7445340B2 (en) * | 2005-05-19 | 2008-11-04 | 3M Innovative Properties Company | Polarized, LED-based illumination source |
JP2006332502A (ja) * | 2005-05-30 | 2006-12-07 | Konica Minolta Opto Inc | 白色発光ダイオードの製造方法とそれにより造られた白色発光ダイオード |
JP2006339217A (ja) * | 2005-05-31 | 2006-12-14 | Konica Minolta Opto Inc | 発光ダイオード及びその製造方法 |
EP1899435A4 (en) | 2005-07-01 | 2010-06-02 | Lamina Lighting Inc | LIGHTING DEVICE WITH WHITE LIGHT EMITTING DIODES AND DIODE ARRANGEMENTS AND METHOD AND DEVICE FOR PRODUCING THEM |
EP2022834A4 (en) * | 2006-05-19 | 2011-11-23 | Mitsubishi Chem Corp | NITROGENIC ALLOY AND THEIR USE FOR THE PREPARATION OF PHOSPHORUS |
JP2008108952A (ja) * | 2006-10-26 | 2008-05-08 | Matsushita Electric Ind Co Ltd | 半導体発光装置および半導体発光装置の製造方法 |
DE102007010244A1 (de) | 2007-02-02 | 2008-08-07 | Osram Opto Semiconductors Gmbh | Anordnung und Verfahren zur Erzeugung von Mischlicht |
JP4521013B2 (ja) * | 2007-05-15 | 2010-08-11 | 株式会社日立製作所 | 照明装置および該照明装置を用いた液晶表示装置 |
DE102007037875A1 (de) | 2007-08-10 | 2009-02-12 | Osram Gesellschaft mit beschränkter Haftung | Strahlungsemittierende Vorrichtung |
DE102007041852A1 (de) * | 2007-09-03 | 2009-03-05 | Osram Opto Semiconductors Gmbh | Hochleistungs- LED Modul |
JP5100301B2 (ja) * | 2007-10-16 | 2012-12-19 | 京セラ株式会社 | 発光装置 |
JP5374857B2 (ja) * | 2007-10-23 | 2013-12-25 | 三菱化学株式会社 | 蛍光体含有組成物の製造方法、及び半導体発光デバイスの製造方法 |
US7989236B2 (en) * | 2007-12-27 | 2011-08-02 | Toyoda Gosei Co., Ltd. | Method of making phosphor containing glass plate, method of making light emitting device |
DE102008031786B4 (de) * | 2008-07-04 | 2012-11-08 | Osram Ag | LED-Modul mit einem Kühlkörper |
DE202009000537U1 (de) | 2009-01-14 | 2009-04-02 | Reinhausen Plasma Gmbh | Strahlgenerator zur Erzeugung eines gebündelten Plasmastrahls |
DE102011114641B4 (de) * | 2011-09-30 | 2021-08-12 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements |
-
2009
- 2009-05-26 DE DE102009022682A patent/DE102009022682A1/de not_active Withdrawn
-
2010
- 2010-04-08 US US13/265,407 patent/US9806237B2/en not_active Expired - Fee Related
- 2010-04-08 WO PCT/EP2010/054663 patent/WO2010136252A1/de active Application Filing
- 2010-04-08 EP EP10716511A patent/EP2436046A1/de not_active Withdrawn
- 2010-04-08 CN CN2010800222045A patent/CN102439742A/zh active Pending
- 2010-04-08 JP JP2012512271A patent/JP2012528473A/ja active Pending
- 2010-04-08 KR KR1020117031014A patent/KR20120027032A/ko not_active Application Discontinuation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10010638A1 (de) * | 2000-03-03 | 2001-09-13 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines lichtabstrahlenden Halbleiterkörpers mit Lumineszenzkonversionselement |
DE102004060358A1 (de) * | 2004-09-30 | 2006-04-13 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen von Lumineszenzdiodenchips und Lumineszenzdiodenchip |
US20060258028A1 (en) * | 2004-11-12 | 2006-11-16 | Philips Lumileds Lighting Company Llc | Color control by alteration of wavelength converting element |
US20090084981A1 (en) * | 2005-05-10 | 2009-04-02 | Commonwealth Scientific And Industrial Research Organisation | High-resolution tracking of industrial process materials using trace incorporation of luminescent markers |
Non-Patent Citations (1)
Title |
---|
See also references of WO2010136252A1 * |
Also Published As
Publication number | Publication date |
---|---|
US20120070926A1 (en) | 2012-03-22 |
WO2010136252A1 (de) | 2010-12-02 |
US9806237B2 (en) | 2017-10-31 |
DE102009022682A1 (de) | 2010-12-02 |
KR20120027032A (ko) | 2012-03-20 |
CN102439742A (zh) | 2012-05-02 |
JP2012528473A (ja) | 2012-11-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20110907 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR |
|
DAX | Request for extension of the european patent (deleted) | ||
17Q | First examination report despatched |
Effective date: 20160915 |
|
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: OSRAM OPTO SEMICONDUCTORS GMBH |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20191101 |