KR20120025195A - Cutting apparatus with laser - Google Patents
Cutting apparatus with laser Download PDFInfo
- Publication number
- KR20120025195A KR20120025195A KR1020100087425A KR20100087425A KR20120025195A KR 20120025195 A KR20120025195 A KR 20120025195A KR 1020100087425 A KR1020100087425 A KR 1020100087425A KR 20100087425 A KR20100087425 A KR 20100087425A KR 20120025195 A KR20120025195 A KR 20120025195A
- Authority
- KR
- South Korea
- Prior art keywords
- laser
- protective gas
- nozzle
- laser nozzle
- cutting device
- Prior art date
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/703—Cooling arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
The present invention relates to a laser nozzle mounted on a laser cutting device, and more particularly, to a laser cutting device equipped with a laser nozzle for preventing foreign matter from penetrating into the laser nozzle and cooling the lens at the same time.
In general, in cutting brittle materials such as glass, wafers, and ceramics using a laser, the laser is the method of performing high quality clean processing while minimizing residual thermal stress caused by dust or thermal shock generated during laser processing. Laser thermocleaving is widely used.
The basic principle of the laser thermal cutting method is to cut the material without loss of material by maximizing the expansion / compression force inside the brittle material by heating and cooling the brittle material below the softening point. The cutting can be performed only by heating.
1 is a perspective view of a conventional laser cutting device. As shown in FIG. 1, the conventional laser cutting device includes a
Here, the optical unit 110 for focusing the laser beam is installed to have the same axis as the traveling direction of the laser beam reflected and reflected downward by the
The beam was focused and irradiated to the workpiece together with the gas supplied through the working
Cutting with a laser has been widely used in industry since the invention of the laser. In this method, the laser beam is focused in a circular shape to melt and vaporize the material to remove the material, and the cutting process is performed using the laser nozzle to protect the optical part and remove the molten material.
The new laser nozzle transforms the laser beam into an ellipse shape to heat the material. The elliptical beam has a short axis of several mm and a long axis of several tens of mm.
LCD glass is made of double glazed glass, and for mass production process, it is necessary to irradiate the laser beam from up and down, and also the liquid which can cool the laser beam is sprayed up and down, preventing damage to the optical part and concentrating to cool the heated lens. Invented the present laser nozzle.
In the process of cutting the brittle material using a conventional laser cutting device, the laser beam generated by the
When the foreign matter is introduced into the
The present invention has been made to solve the above problems, and an object of the present invention is to provide a laser cutting device that can prevent foreign matter from penetrating into the laser nozzle and provides a function to cool the heated lens.
Laser cutting device according to the present invention for achieving the above object is a beam generating unit for emitting a laser beam; and, an optical unit that serves to modify the size and shape of the laser beam; and at the lower end of the optical unit And a laser nozzle having a beam hole through which a laser beam passing through the optical part passes, and a protective gas inlet port provided at one side of the laser nozzle to supply a protective gas having a predetermined pressure into the laser nozzle. Characterized in that made.
Preferably, the optical portion includes a cylindrical lens and a condenser lens as a means for forming an elliptical beam.
Preferably, the beam hole has a straight shape.
Preferably, the protective gas inlet of the laser nozzle is connected to the protective gas supply pipe, the protective gas supply pipe is connected to the protective gas supply pump.
The laser cutting device according to the present invention has the following effects.
As a protective gas inlet for supplying an inert gas such as nitrogen or clean air at a predetermined pressure is provided at one side of the laser nozzle, foreign substances penetrating through the beam hole of the laser nozzle through which the laser beam passing through the condenser lens of the optical unit passes. It is possible to effectively discharge the back.
In addition, the gas having a predetermined pressure supplied through the protective gas inlet is discharged toward the surface of the cutting material through the beam hole, thereby obtaining the effect of cooling the cutting material with the progress of the cutting process. This eliminates the need for a separate cooler as in the prior art.
1 is a perspective view of a laser cutting device according to the prior art.
2 is a perspective view of a laser cutting device according to the present invention.
3A to 3C are reference diagrams for explaining the geometric correlation in the laser cutting device according to the present invention.
According to a feature of the present invention, by providing a protective gas inlet for supplying an inert gas such as nitrogen or clean air at a predetermined pressure on one side of the laser nozzle, the laser nozzle passing through the condensing lens of the optical unit passes through It is possible to effectively discharge the foreign matter penetrated through the beam hole, and has a function of cooling the lens is heated the gas having a predetermined pressure supplied through the protective gas inlet.
Hereinafter, a laser cutting device according to the present invention will be described in detail with reference to the drawings. 2 is a perspective view of a laser cutting device according to the present invention, Figures 3a to 3c is a reference diagram for explaining the geometrical correlation in the laser cutting device according to the present invention.
First, as shown in FIG. 2, the laser cutting device according to the present invention is largely composed of a
The
Although the
In the present invention, as a means for solving such a problem, a
As the inert gas having a predetermined pressure is supplied into the
The
First, referring to FIG. 3A, the length A in the Y-axis direction of the
(Equation 1)
1 / f = 1 / f 1 + 1 / f 2 + ... + 1 / f n
In
Next, referring to FIG. 3C, the focal length F1 is determined by the
As the flow rate of the gas increases in proportion to the area of the
In consideration of such a determination condition of the size of the
An
In addition, the
201: beam generator 202: reflector
203:
203b: protective gas inlet 210: optical part
211: cylindrical lens 212: first lens holder
213: condenser lens 214: second lens holder
Claims (5)
An optical unit which serves to modify the size and shape of the laser beam;
A laser nozzle provided at a lower end of the optical part and having a beam hole through which a laser beam passing through the optical part passes;
And a protective gas inlet provided at one side of the laser nozzle to supply a protective gas having a predetermined pressure into the laser nozzle.
And the optical unit comprises a cylindrical lens and a condenser lens as means for forming an elliptical beam.
The beam hole is a laser cutting device, characterized in that having a straight shape.
The laser gas cutting device, characterized in that the protective gas inlet is connected to the protective gas supply pipe, the protective gas supply pipe is connected to the protective gas supply pump.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020100087425A KR20120025195A (en) | 2010-09-07 | 2010-09-07 | Cutting apparatus with laser |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020100087425A KR20120025195A (en) | 2010-09-07 | 2010-09-07 | Cutting apparatus with laser |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20120025195A true KR20120025195A (en) | 2012-03-15 |
Family
ID=46131665
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020100087425A KR20120025195A (en) | 2010-09-07 | 2010-09-07 | Cutting apparatus with laser |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR20120025195A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110039176A (en) * | 2019-05-08 | 2019-07-23 | 温岭市豪基机床附件有限公司 | A kind of laser cutter residue cleaning plant |
-
2010
- 2010-09-07 KR KR1020100087425A patent/KR20120025195A/en not_active Application Discontinuation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110039176A (en) * | 2019-05-08 | 2019-07-23 | 温岭市豪基机床附件有限公司 | A kind of laser cutter residue cleaning plant |
CN110039176B (en) * | 2019-05-08 | 2020-10-16 | 温岭市豪基机床附件有限公司 | Residue cleaning device for laser cutter |
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WITN | Withdrawal due to no request for examination |