KR20120018666A - Scintillator panel and x-ray image sensor including the same - Google Patents

Abstract

PURPOSE: A scintillator panel and a radiation image sensor including the panel are provided to form a secure wall and to protect the wall from moisture. CONSTITUTION: A scintillator panel comprises a scintillator layer(20), a first protective layer(30) and a first hard coating layer(40). The scintillator layer is included of a plurality of columnar crystals. The scintillator layer changes the radiation into the light of the fixed wavelet range. The first protective layer is formed on the scintillator layer. The first hard-coating layer is formed on the first protective layer. The first hard-coating layer is included of the thermosetting resin.

Description

A scintillator panel and a radiation image sensor including the panel {scatter panel and X-ray image sensor INCLUDING THE SAME}

The present invention relates to a scintillator panel and an image sensor comprising the panel.

Conventional X-ray (X-ray) imaging, using a film and screen method, there was a problem that requires space and manpower to store the film filmed. In order to solve this problem, the work of digitizing the photographed film with a scanner has been promoted, but this also has a problem in that the expense is doubled because the film cannot be used. Due to this problem, a digital radiation imaging apparatus capable of converting radiation into an electrical signal and transmitting it to a computer through a detector without using a film has emerged.

Digital radiation imaging apparatus is divided into direct conversion method and indirect conversion method according to the conversion method. The direct conversion method is a method of directly converting irradiated X-rays into electrical signals and detecting them as image signals. On the other hand, the indirect conversion method is a method of converting the X-ray to visible light and then converting the visible light into an electrical signal using an image sensor such as a photodiode, CMOS or CCD sensor to implement an image. The direct conversion method is often used because indirect conversion method can be detected only when a high voltage is applied.

An indirect conversion detector is an X-ray detector. The X-ray detector includes a radiation image sensor for forming an image using X-rays passing through the object. The method for forming an image by the radiation image sensor is as follows. X-rays passing through the object are converted to light by a scintillator installed on the input surface. The converted light is converted back into photoelectrons and amplified by an electron gun therein, and the amplified photons collide with the fluorescent material of the output unit and are converted into visible light. The converted visible light is converted into an electrical signal through a light receiving element such as a photodiode, and an image is realized using the converted signal.

Methods of manufacturing the radiation image sensor used in the X-ray detector are largely indirect deposition and direct deposition. Indirect deposition method produces a scintillator panel in a separate process by sequentially laminating a scintillator layer and a protective layer made of parylene on an aluminum substrate that transmits radiation and reflects visible light, and then on a glass substrate. The scintillator panel is integrated by an optical adhesive with an image pickup device having a plurality of light receiving elements arranged on a central surface and a plurality of electrode pads disposed on an edge surface on the glass substrate and electrically connected to the light receiving elements. .

On the other hand, the direct deposition method directly deposits a scintillator on the surface of an imaging device having a plurality of light receiving elements arranged on the central surface of the glass substrate and a plurality of electrode pads disposed on the edge surface of the substrate and electrically connected to the light receiving element. To form a scintillator layer, a protective layer made of parylene on the entire surface of the imaging device including the scintillator layer, and form a reflective layer with an aluminum film on the protective layer to manufacture an image sensor.

Parylene has the property of being coated along the unevenness of the surface to be coated. BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows a part of cross section of the structure of the scintillator panel when only a protective layer is formed on a scintillator layer.

As shown in FIG. 1, a scintillator layer 20 is formed on the imaging device 10, and a protective layer 30 made of parylene is formed on the scintillator layer 20. The scintillator layer 20 has a plurality of columnar structures. Since the pillars forming the scintillator layer 20 grow irregularly by the deposition process, irregularities exist on the surface of the scintillator layer 20.

 Since the protective layer 30 is formed along the unevenness of the scintillator layer 20, the unevenness also exists on the surface of the protective layer 30.

When the adhesive layer is applied on the protective layer 30 and the reflective layer or the substrate is adhered to the protective layer 30, the adhesion area of the protective layer 30 is reduced due to the unevenness, so that the substrate or the reflective layer is hardly bonded to the protective layer 30. There is a problem.

FIG. 2 is a diagram showing a part of a cross section of the scintillator panel structure when a substrate or the like is directly formed on the protective layer of the scintillator panel. As shown in FIG. 2, when the substrate 4 or the like is directly attached onto the protective layer 30 using an adhesive or the like, an air gap 5 is formed in the joint surface due to the irregularities. There is a problem.

In order to solve this problem, it may be considered to coat the protective layer thinly several times. However, since the protective layer is formed by chemical vapor deposition (CVD), the protective layer may be formed several times. The process takes a long time, there is a problem that the productivity worsens.

1 and 2 and the above description are based on a direct deposition method, but instead of the imaging device 10 in FIGS. 1 and 2, a scintillator panel is independently manufactured by using an aluminum substrate and the imaging is performed. In the case of applying an indirect deposition method in which a device is bonded, the same problem described above occurs.

CsI, which is a material of the scintillator layer 20, is a hygroscopic material and absorbs and dissolves water vapor (moisture) in air. It is important to protect the scintillator layer 20 from moisture because the resolution of the radiographic image sensor deteriorates when the scintillator layer 20 absorbs and damages moisture. The protective layer 30 serves to protect the scintillator layer 20 from moisture, and a structure of the scintillator panel capable of further improving the moisture proof effect of the protective layer 30 is required.

In addition, when the protective layer 30 is damaged by an external impact or the like, the protective layer 30 may not protect the scintillator layer 30 from moisture smoothly, thereby making the protective layer 30 durable. The structure of the scintillator panel which can improve is required.

The present invention has been made to solve the conventional problems, and includes a scintillator panel and the scintillator panel can increase the flatness of the scintillator surface, improve the moisture-proof effect, and improve durability It is to provide a radiation image sensor.

The scintillator panel according to an aspect of the present invention for solving the above problems consists of a plurality of columnar crystals and a scintillator layer for converting radiation into light of a predetermined wavelength range, the first scintillator layer formed on the scintillator layer And a first hard coating layer formed on the moisture proof layer and the first moisture proof layer and made of a thermosetting resin.

The first moisture barrier layer may be made of parylene.

The scintillator panel may further include a second moisture barrier layer formed on the first hard coat layer.

The second moisture barrier layer may be made of parylene.

The scintillator panel may further include a substrate and a reflective layer formed on the substrate, and the scintillator layer may be formed on the reflective layer.

The scintillator panel may further include a second protective layer formed between the reflective layer and the scintillator layer.

The thermosetting resin may be one of an acrylic resin, an epoxy resin, a polyester resin, a melamine resin, a urea resin, and a urethane resin.

Scintillator panel according to another aspect of the present invention for solving the above problems is a scintillator layer formed of a plurality of columnar panels made of crystals and converting radiation into light of a predetermined wavelength range, the scintillator layer is formed on the scintillator layer And a first hard coating layer formed on the first moisture proof layer and the UV moisture curable resin.

The first moisture barrier layer may be made of parylene.

The scintillator panel may further include a second moisture barrier layer formed on the first hard coat layer.

The second moisture barrier layer may be made of parylene.

The scintillator panel may further include a substrate and a reflective layer formed on the substrate, and the scintillator layer may be formed on the reflective layer.

The scintillator panel may further include a second protective layer formed between the reflective layer and the scintillator layer.

The UV curable resin may be one of an ethylenically unsaturated urethane acrylate resin, an ethylenically unsaturated polyester acrylate resin, and an ethylenically unsaturated epoxy acrylate including an ethylenically unsaturated group.

The first hard coat layer may be formed by a wet coating method.

The first hard coating layer includes particles for reflecting light in the predetermined wavelength range, wherein the particles are TiO _{2 ,} LiF, MgF ₂ , SiO ₂ , Al ₂ O ₃ , MgO, SiN, CaF ₂ , NaCl, It may be made of at least one of KBr, KCl, AgCl, SiNO ₃ , Au, SiO, AlO, B ₄ C, BNO ₃ .

The scintillator panel may further include a second hard coating layer made of a thermosetting resin on the first hard coating layer.

The thermosetting resin constituting the second hard coat layer may be one of an acrylic resin, an epoxy resin, a polyester resin, a melamine resin, a urea resin, and a urethane resin.

The scintillator panel may further include a second hard coating layer made of a UV curable resin on the first hard coating layer.

The UV curable resin constituting the second hard coat layer may be one of an ethylenically unsaturated urethane acrylate resin, an ethylenically unsaturated polyester acrylate resin, and an ethylenically unsaturated epoxy acrylate resin including an ethylenically unsaturated group.

The scintillator panel may further include a reflective layer formed on the first hard coating layer to reflect light in the predetermined wavelength range.

The reflective layer may be made of a material including at least one of Al, Ag, Cr, Cu, Ni, Ti, Mg, Ph, Pt, and Au.

When the flatness is defined as (1- (difference between the highest and lowest height of the surface after coating) / (difference between the highest and lowest height of the surface before coating) x 100, the flatness of the first hard coat layer is It may be greater than the flatness of the first moisture barrier.

The flatness of the first hard coat layer may be 70 or more.

The radiation image sensor may include an imaging device for capturing an image by the scintillator panel and the light in the predetermined wavelength range, and the scintillator panel may be disposed on the imaging device.

According to the scintillator panel according to the present invention, since the hard coating layer has a greater flatness than the protective layer, when the substrate, the reflective layer, or the like is formed on the hard coating layer using an adhesive or the like, it is possible to improve the adhesion performance. We can plan. In addition, since the hard coating layer has a very high hardness, it prevents the protective layer from abrasion from external shock, thereby increasing durability, and forming a solid barrier against moisture to further improve the moisture barrier effect of the protective layer. In addition, since the hard coating layer is formed in a wet manner, it does not take a long time to improve the productivity of the scintillator panel.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows a part of cross section of the structure of the scintillator panel when only a protective layer is formed on a scintillator layer.
FIG. 2 is a diagram showing a part of a cross section of the scintillator panel structure when a substrate or the like is directly formed on the protective layer of the scintillator panel.
3 is a view showing a part of the cross section of the structure of the scintillator panel according to the first embodiment of the present invention.
4 is a view showing a part of the cross section of the structure of the scintillator panel according to the second embodiment of the present invention.
5 is a view showing a part of the cross section of the structure of the scintillator panel according to the third embodiment of the present invention.
6 is a view showing a part of the cross section of the structure of the scintillator panel according to the fourth embodiment of the present invention.
7 is a view showing a part of the cross section of the structure of the scintillator panel according to the fifth embodiment of the present invention.
8 is a view showing a part of the cross section of the structure of the scintillator panel according to the sixth embodiment of the present invention.
9 is a view showing a part of the cross section of the structure of the scintillator panel according to the seventh embodiment of the present invention.
10 is a view showing a part of the cross section of the structure of the scintillator panel according to the eighth embodiment of the present invention.
11 is a view showing a part of the cross section of the structure of the scintillator panel according to the ninth embodiment of the present invention.
12 is a view showing a part of the cross section of the structure of the scintillator panel according to the tenth embodiment of the present invention.

The present invention relates to a scintillator panel, hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. First of all, in adding reference numerals to the components of each drawing, it should be noted that the same reference numerals have the same reference numerals as much as possible even if displayed on different drawings. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

Hereinafter, the structure of the scintillator panel according to the first embodiment of the present invention will be described.

First Example

3 is a view showing a part of the cross section of the structure of the scintillator panel according to the first embodiment of the present invention. As illustrated in FIG. 3, the scintillator panel 100 includes an imaging device 10, an imaging device including a scintillator layer 20 formed on a surface of the imaging device 10, and the scintillator layer 20. 10) a protective layer 30 formed on the protective layer 30 and a hard coating layer 40 formed on the protective layer 30. The protective layer 30 serves to protect the scintillator layer 20 from the outside, and in particular, serves as a moisture proof layer that prevents moisture from penetrating into the scintillator layer 20.

The imaging device 10 includes a substrate, a light receiving portion composed of a light receiving element arranged on a surface of the substrate, and an electrode portion composed of electrode pads disposed at an edge of the substrate surface. More specifically, the light receiving portion is composed of a plurality of light receiving elements for performing photoelectric conversion formed by being arranged in one or two dimensions on a Si substrate or a glass substrate. When the radiation incident on the scintillator layer 20 is converted into light by the scintillator layer 20, the light receiving element detects the converted light and converts the converted light into an electrical signal. The light-receiving element may include a photo diode (PD) made of amorphous silicon, a thin film transistor (TFT), a charged coupled device (CCD), a complementary metal-oxide-semiconductor (CMOS) sensor, and a fiber optical Plate) may be used.

The electrode unit is composed of a plurality of electrode pads formed on the edge of the substrate surface outside the light receiving unit, the electrode pad reads the electrical signal generated by the light receiving element and transmits it to an image analysis device, etc., although not shown in FIG. It is electrically connected with the light receiving element by wiring, such as a wire.

The scintillator layer 20 of the columnar structure which converts the incident radiation into the light containing the wavelength band which a light receiving element can detect is formed on the light receiving part of the imaging element 10. Light is not limited to visible light in this specification, but is a concept containing electromagnetic waves, such as an ultraviolet-ray, an infrared ray, or predetermined radiation. The scintillator layer 20 is preferably formed so as to cover the entire forming surface of the light receiving element and its surroundings.

The material for forming the scintillator layer 20 is not particularly limited as long as it can convert radiation into light of a specific wavelength band. Specifically, CsI, CsI doped with thallium (Tl), CsI doped with sodium (Na), NaI doped with thallium (Tl), and the like. CsI doped with thallium (Tl) which emits double visible light and has good luminous efficiency is preferable.

The scintillator layer 20 has a plurality of columnar structures. Since the pillars forming the scintillator layer 20 grow irregularly by the deposition process, irregularities exist on the surface of the scintillator layer 20.

In addition, the thickness of the scintillator layer 20 is about 20-2000 micrometers.

CsI, a material of the typical scintillator layer 20, is a hygroscopic material and absorbs and dissolves water vapor (moisture) in air. If the scintillator layer 20 absorbs moisture and is damaged, the resolution of the radiation image sensor deteriorates, so that a structure for protecting the scintillator from moisture is required. Therefore, in the scintillator panel 100 according to the present invention, the protective layer 30 is formed to seal the scintillator layer 20.

The protective layer 30 is preferably formed so as to cover the entire formation surface of the scintillator layer 20 and its surroundings.

The material for forming the protective layer 30 is not particularly limited as long as it transmits radiation (X-ray) and simultaneously blocks water vapor, and is preferably an organic resin, more preferably a parylene-based resin. . Parylene is a brand name of chemically deposited polyparaxylene polymer, such as parylene N, parylene C, parylene D, parylene AF-4, etc., and the coating film by parylene has a relatively low permeation of water vapor and gas, It has high water repellency and chemical resistance, has excellent electrical insulation even in a thin film, and has excellent characteristics suitable for a protective film such as transmitting radiation and visible light.

Parylene may be coated by chemical vapor deposition (CVD), which deposits on a support in vacuum as well as vacuum deposition of metals. This is a step of rapidly cooling a product obtained by thermally decomposing diparaxylene monomer as a raw material in an organic solvent such as toluene or benzene to obtain diparaxylene called a dimer, and pyrolyzing the dimer to generate a stable radical paraxylene gas. And gas generated by adsorption and polymerization on the material to polymerize and form a polyparaxylene membrane having a molecular weight of about 5x10 ⁵ .

The scintillator layer 20 has a plurality of columnar structures, and since the pillars forming the scintillator layer 20 grow irregularly by a deposition process, the scintillator layer 20 has a surface of FIG. As shown in the figure, unevenness exists.

In the case of forming the protective layer 30 on the scintillator layer 20, since the protective layer 30 is formed along the unevenness of the surface of the scintillator layer 20, as shown in FIG. Unevenness also exists on the surface of (30).

When bonding a substrate or a reflective layer to the surface of the protective layer 30 using an adhesive or the like, the adhesion area of the surface of the protective layer 30 is reduced due to the unevenness of the surface of the protective layer 30 and due to the unevenness There is a problem that the substrate or the reflective layer is hardly bonded to the protective layer 30. In addition, there is a problem that the voids are formed in the joint surface due to the irregularities.

In order to solve this problem, the present invention proposes to form the hard coating layer 40 on the protective layer (30).

The hard coating layer 40 may be formed using a thermosetting resin. In detail, a thermosetting resin, a curing agent, a curing accelerator, a solvent, an additive, and the like are combined to form a composition, and the coating is applied on the protective layer 30 by using a wet coating method to form the hard coating layer 40. Can be. The curing agent, curing accelerator, solvent and additives may be appropriately selected depending on the type of resin.

As the solvent, a low boiling point solvent and a high boiling point solvent can be used. As the low boiling point solvent, for example, methyl ethyl ketone and ethyl acetate may be used alone or in combination. For the high boiling point solvent, for example, butyl acetate, benzene, toluene, xylene, butyl cellosolve and the like may be used alone. Or in combination. The solvent is not limited to the solvents exemplified above, and the present invention is not particularly limited as long as it can dissolve the compound uniformly, impart chemical stability, and is not reactive with the compound.

The additive plays a role of suppressing bubble generation and imparting an excellent appearance when forming a film, and the additive includes silicone-based, fluorine-based, and acrylic-based additives.

The thermosetting resin may be one of an acrylic resin, an epoxy resin, a polyester resin, a melamine resin, a urea resin, and a urethane resin.

In the case of acrylic resin, a composition can be formed, for example with 100 weight part of acrylic resins, 10-50 weight part of hardening | curing agents, 150 weight part of solvents, and 1 weight part of additives.

In addition, the hard coating layer 40 may be formed using a UV curable resin. Specifically, a UV-curable resin and a monomer containing a large amount of ethylenically unsaturated functional groups, a radical initiator, a solvent and an additive that generate radicals when UV is irradiated are mixed to make a composition, and a wet coating method The hard coat layer 40 may be formed by applying it onto the protective layer 30 using the method. Solvents and additives can be the same as the solvents and additives used in the thermosetting resin.

The UV curable resin is an oligomer containing two or more ethylenically unsaturated functional groups having a weight average molecular weight of 2x10 ³ to 2x10 ⁴ and an ethylenically unsaturated urethane acrylate resin containing ethylenically unsaturated groups, and an ethylenically unsaturated polyester. It may be one of an acrylate resin, ethylenically unsaturated epoxy acrylate.

In the case of UV curable resin, the composition may be formed by using 100 parts by weight of the oligomer, 50 parts by weight of the monomer, 5 parts by weight of the radical initiator, 150 parts by weight of the solvent, and 1 part by weight of the additive.

Spin coating, gravure coating, spray coating, dip coating, flow coating, screen printing, roll coating by the wet coating method One of roll coating, bar coating, curtain coating, die coating, and knife coating may be used. The wet coating method may be appropriately selected depending on the object to be coated.

Meanwhile, in addition to the thermosetting resin and the UV curable resin, water glass or the like may be used as a material forming the hard coating layer 40.

In order to indicate the flatness of the surface of the hard coating layer 40, the flatness can be defined as shown in Equation 1 below.

When calculating the flatness of the hard coating layer 40, the difference between the highest height and the lowest height of the surface after the coating of Equation 1 corresponds to the difference between the highest height and the lowest height of the surface of the hard coating layer 40, The difference between the highest height and the lowest height of the surface before coating corresponds to the difference between the highest height and the lowest height of the surface of the protective layer 30.

In addition, when calculating the flatness of the protective layer 30, the difference between the highest height and the lowest height of the surface after the coating of Equation 1 corresponds to the difference between the highest height and the lowest height of the surface of the protective layer 30 of the surface The difference between the highest and lowest height of the surface before coating corresponds to the difference between the highest and lowest height of the surface of the scintillator layer 20.

Since the surface of the hard coating layer 40 has a greater flatness than the protective layer 30, when the reflective layer or the like is bonded to the hard coating layer 40 using an adhesive or the like, the hard coating of the substrate or the reflective layer or the like is performed. It can be well bonded with layer 40. In addition, since no air gap is formed in the joining surface after the joining process, the defect rate can be lowered and the reliability of the panel can be improved.

In addition, since the hard coating layer 40 has a very high hardness, it prevents the protective layer 30 from abrasion from external shock, thereby increasing durability, and forming a solid barrier against moisture to further improve the moisture barrier effect of the protective film. Let's do it.

Hereinafter, when the hard coat layer 40 is formed using an epoxy resin in the thermosetting resin, an experiment and an experimental result of measuring the flatness and moisture proof performance of the hard coat layer 40 will be described.

Table 1 below is a table showing the mixing ratio of the compositions of the first to fifth experimental examples for forming the hard coat layer 40.

Epoxy resin Hardener Hardening accelerator solvent additive Ethyl acetate Butyl acetate Experimental Example 100 parts by weight 10 parts by weight 0.1 parts by weight 50 parts by weight 50 parts by weight 0.1 parts by weight Experimental Example 100 parts by weight 50 parts by weight 0.1 parts by weight 50 parts by weight 50 parts by weight 0.1 parts by weight Experimental Example 100 parts by weight 1 part by weight 0.1 parts by weight 50 parts by weight 50 parts by weight 0.1 parts by weight Experimental Example 4 100 parts by weight 10 parts by weight - 50 parts by weight 50 parts by weight 0.1 parts by weight Experimental Example 100 parts by weight 10 parts by weight 0.1 parts by weight - - 0.1 parts by weight

After sufficiently stirring the composition formed in the compounding ratio of the first to the fifth experimental example of Table 1 by applying a bar coating method on a polyethylene terephthalate (PET) film, and dried at 60 ℃ for 1 hour Again drying at 120 ℃ for 2 hours to proceed with curing. As the additive contained in the composition, a siloxane additive based on silicone was used.

The appearance, adhesion, fire resistance, and flatness of the hard coat layer formed by the compositions of Experimental Examples 1 to 5 were measured and compared.

In appearance, the appearance of the hard coating layer under the three-wavelength fluorescent lamp in the dark room and the presence of bubbles and haze (haze) was observed. When bubbles and haze exist and the appearance is not good, it is represented by X, and when the appearance is good without bubbles and haze, it is represented by ○.

Adhesiveness was measured by using the adhesion test standard ASTM-D3359, and the PET film having the hard coating layer was cut into a lattice-shaped coating film, and then the adhesive tape was attached and quickly detached. When the degree of fall was 0%, 5B, 5% was 4B, 5-15% was 3B, 15-35% was 2B, and 35-65% was 0B.

Chemical resistance is settled in a solvent containing acetone and IPA (Isopropyl Alcohol) 1: 1 mixed with a PET film with a hard coating layer for 30 minutes, and then observed the appearance, if the appearance is good, if there is no change in appearance ○, if there is a change in appearance It is represented by X.

In this case, the experimental results are shown in Table 2 below.

Exterior Adhesion Chemical resistance flatness Experimental Example ○ 5B ○ 70% Experimental Example ○ 4B ○ 70% Experimental Example X 3B ○ 55-65% Experimental Example 4 ○ 3B ○ 55-65% Experimental Example X 3B ○ Less than 55%

According to Table 2, it can be seen that the first experimental example has the best value in appearance, adhesion, chemical resistance and flatness. Therefore, when the hard coating layer 40 is formed using the epoxy resin, it can be seen that it is preferable to make the composition of the epoxy resin at the compounding ratio according to the first experimental example.

On the other hand, in order to determine how the hard coating layer 40 affects the moisture-proof, only the protective layer made of parylene on the PET film and the hard coating layer according to the first experimental example on the protective layer made of parylene Moisture-proof performance was tested to compare the cases formed. The results are shown in Table 3 below.

WVTR Appearance change after measurement When only the protective layer is formed on the PET film 3.46 ○ When the protective layer and the hard coating layer according to the first experiment were sequentially formed on the PET film 2.8 ○

In order to measure the degree of moisture dampness, Table 3 uses the water vapor transmission rate (WVTR), and the lower the WVTR value, the higher the moisture resistance. The unit of WVTR is g / m ² / day, which represents the amount of water permeated per unit area during the day. MOCON's PERMATRAN Model 3/33 was used as the WVTR analysis equipment. At this time, the conditions of the WVTR were 50 ° C and 100% humidity. As shown in Table 3, when the protective layer and the hard coating layer according to the first experiment were sequentially formed on the PET film, the WVTR was improved by about 20% than when only the protective layer was formed on the PET film. Able to know. Therefore, it can be seen that the hard coating layer improves moisture resistance as well as increasing flatness and durability.

Hereinafter, a scintillator panel according to a second embodiment of the present invention will be described.

2nd Example

4 is a view showing a part of the cross section of the structure of the scintillator panel according to the second embodiment of the present invention. As illustrated in FIG. 4, the scintillator panel 200 includes an imaging device 10, an imaging device including a scintillator layer 20 formed on a surface of the imaging device 10, and the scintillator layer 20. 10) a protective layer 30 formed on the protective layer 30, a hard coating layer 40 formed on the protective layer 30, and a reflective layer 50 formed on the hard coating layer 40.

The reflective layer 50 may be formed of a material capable of transmitting radiation and simultaneously reflecting visible light. As the reflective layer 50, a metal film or a dielectric multilayer film having a predetermined reflectivity with respect to visible light such as Al, Ag, Cr, Cu, Ni, Ti, Mg, Ph, Pt, and Au may be suitably used. It may further comprise a radiation transmitting material formed on another surface that does not face the protective layer. Examples of the radiation transmitting material include resins such as glass and vinyl chloride, and carbonaceous substrates.

The reflective layer 50 may be formed by metal chemical vapor deposition (CVD), physical vapor deposition (PVD), sputtering, ion beam deposition, or plasma CVD.

Since the flatness of the hard coating layer 40 is greater than the flatness of the protective layer 30, the reflective layer (not shown) is formed on the hard coating layer 40 rather than when the reflective layer 50 is formed directly on the protective layer 30. 50) may have a greater bonding force.

Hereinafter, a scintillator panel according to a third embodiment of the present invention will be described.

The third Example

5 is a view showing a part of the cross section of the structure of the scintillator panel according to the third embodiment of the present invention. As illustrated in FIG. 5, the scintillator panel 300 includes an imaging device 10, an imaging device including a scintillator layer 20 formed on a surface of the imaging device 10, and the scintillator layer 20. 10, a protective layer 30 formed on the protective layer 30, a hard coating layer 40 formed on the protective layer 30, a reflective layer 50 formed on the hard coating layer 40, and a protective layer 60 formed on the reflective layer 50. ).

Since the scintillator panel 300 according to the present exemplary embodiment includes the protective layer 30 serving as the first protective layer and the protective layer 60 serving as the second protective layer, the moistureproof effect is further improved.

Hereinafter, a scintillator panel according to a fourth embodiment of the present invention will be described.

Fourth Example

6 is a view showing a part of the cross section of the structure of the scintillator panel according to the fourth embodiment of the present invention. As illustrated in FIG. 6, the scintillator panel 400 includes an imaging device 10, an imaging device including a scintillator layer 20 formed on a surface of the imaging device 10, and the scintillator layer 20. 10) a protective layer 30 formed on the protective layer 30, a hard coating layer 40 formed on the protective layer 30, and a protective layer 60 formed on the hard coating layer 40.

Since the scintillator panel 400 according to the present exemplary embodiment includes a protective layer 30 which is a first protective layer and a protective layer 60 which is a second protective layer, the moisture proof effect is further improved.

In addition, since the flatness of the hard coating layer 40 is greater than the flatness of the protective layer 30, the hard coating layer 40 than when the protective layer 60 is formed directly on the protective layer 30. In the case where the protective layer 60 is formed thereon, it may have a greater bonding force.

Hereinafter, a scintillator panel according to a fifth embodiment of the present invention will be described.

5th Example

7 is a view showing a part of the cross section of the structure of the scintillator panel according to the fifth embodiment of the present invention. As illustrated in FIG. 7, the scintillator panel 500 includes an imaging device 10, an imaging device including a scintillator layer 20 formed on a surface of the imaging device 10, and the scintillator layer 20. 10, a protective layer 30 formed on the protective layer 30, a hard coating layer 40 formed on the protective layer 30, a protective layer 60 formed on the hard coating layer 40, and a reflective layer formed on the protective layer 60 ( 50).

Since the scintillator panel 400 according to the present exemplary embodiment includes a protective layer 30 which is a first protective layer and a protective layer 60 which is a second protective layer, the moisture proof effect is further improved.

In addition, since the flatness of the hard coating layer 40 is greater than the flatness of the protective layer 30, the hard coating layer 40 than when the protective layer 60 is formed directly on the protective layer 30. In the case where the protective layer 60 is formed thereon, it may have a greater bonding force.

In addition, since the flatness of the hard coating layer 40 is greater than the flatness of the protective layer 30, the protective layer 60 formed on the hard coating layer 40 has a greater flatness than the protective layer 30. Has Therefore, the case where the reflective layer 50 is formed on the protective layer 60 may have a greater coupling force than the case where the reflective layer 50 is formed on the protective layer 30.

Hereinafter, a scintillator panel according to a sixth embodiment of the present invention will be described.

6th Example

8 is a view showing a part of the cross section of the structure of the scintillator panel according to the sixth embodiment of the present invention. The scintillator panel 600 illustrated in FIG. 8 has the same structure as the scintillator panel 100 of the first embodiment except for the reflective beads 70 included in the hard coating layer 40. The reflective bead 70 performs a function of reflecting the light converted into light of a predetermined wavelength range by the scintillator layer 20 to the imaging device 10. By including the reflective beads 70 in the hard coating layer 40, the hard coating layer 40 serves as a reflective layer.

As a material of the reflecting beads 50, TiO _{2 ,} LiF, MgF ₂ , SiO ₂ , Al ₂ O ₃ , MgO, SiN, CaF ₂ , NaCl, KBr, KCl, AgCl, SiNO ₃ , Au, SiO, AlO, At least one or more of B ₄ C and BNO ₃ may be used. The hard coat layer 40 may be formed by using the thermosetting resin, UV curable resin, water glass, or the like described in the first embodiment as a binder and the reflective bead 70 as a reflective pigment.

The hard coating layer 40 including the reflective bead 70 may prevent the light in the scintillator panel from going out and reflect it to the lower imaging device 10 to maximize the efficiency of the scintillator panel. In addition, it is not necessary to form a reflective layer separately, which can shorten the scintillator panel production process time.

Meanwhile, the structure of the scintillator panel according to the seventh embodiment of the present invention will be described below.

7th Example

9 is a view showing a part of the cross section of the structure of the scintillator panel according to the seventh embodiment of the present invention. As illustrated in FIG. 9, the scintillator panel 700 includes an imaging device 10, an imaging device including a scintillator layer 20 formed on a surface of the imaging device 10, and the scintillator layer 20. 10. A hard coating layer 80 including a protective layer 30 formed on the protective layer 30, a hard coating layer 40 formed on the protective layer 30, and reflective beads 70 formed on the hard coating layer 40. It includes. The scintillator panel 700 according to the present exemplary embodiment includes a hard coating layer 40 which is a first hard coating layer and a second hard coating layer 80 which is a second hard coating layer. The hard coat layer 80 may be formed by using the thermosetting resin, the UV curable resin, or the water glass described in the first embodiment as a binder, and the reflective beads described in the sixth embodiment as the reflecting pigment. .

In the present embodiment, since the hard coating layer 80 is formed integrally with a thermosetting resin, UV curable resin or water glass as a binder and the reflecting beads as a pigment, the scintillator panel production process time can be shortened. .

Hereinafter, the structure of the scintillator panel according to the eighth embodiment of the present invention will be described.

8th Example

10 is a view showing a part of the cross section of the structure of the scintillator panel according to the eighth embodiment of the present invention. As illustrated in FIG. 10, the scintillator panel 800 includes an imaging device 10, an imaging device including a scintillator layer 20 formed on a surface of the imaging device 10, and the scintillator layer 20. 10, a hard coat layer 40 formed on the protective layer 30, a reflective bead 70 formed on the protective layer 30, and a hard coat layer 80 formed on the hard coat layer 40. It includes. The scintillator panel 800 according to the present exemplary embodiment includes a hard coating layer 40 which is a first hard coating layer and a second hard coating layer 80 which is a second hard coating layer. The hard coating layer 40 may be formed by using the thermosetting resin, UV curable resin, or water glass described in the first embodiment as a binder, and the reflective beads described in the sixth embodiment as the reflecting pigment. .

The hard coating layer 80 is located on the hard coating layer 40 to protect the hard coating layer 40 from the outside, thereby improving the durability of the scintillator panel 800.

The first to eighth embodiments described so far are related to a scintillator panel applied to a direct deposition method. Hereinafter, a scintillator panel structure according to the present invention that can be applied to an indirect deposition method will be described.

In the indirect deposition method, a scintillator panel can be independently formed on a substrate and then bonded to an imaging device. At this time, the substrate is an aluminum plate, a metal plate, glass (glass), quartz substrate, carbon substrate (graphite), PC (PolyCarbonate), PMMA (PolyMethly MethAcrylate), PI (PolyImide), PES (PolyEther Sulfone), PEN (PolyEthylene) Polymer films such as Naphtalate) and ABS (Acrylonitrile Butadiene Styrene Copolymer) may be used.

Hereinafter, the structure of the scintillator panel according to the ninth embodiment of the present invention that can be applied to an indirect deposition method will be described.

9th Example

11 is a view showing a part of the cross section of the structure of the scintillator panel according to the ninth embodiment of the present invention. As illustrated in FIG. 11, the scintillator panel 900 includes a substrate 90, a reflective layer 50 formed on the surface of the substrate 90, a scintillator layer 20 formed on the reflective layer 50, and the scintillator. A protective layer 30 formed on the layer 20 and a hard coating layer 40 formed on the protective layer 30.

Since the flatness of the hard coat layer 40 is greater than the flatness of the protective layer 30, the hard coat layer 40 is bonded to the image pickup device using the protective layer 30 as a bonding surface. In this case, a larger bonding force can be obtained when bonding to an imaging device.

Hereinafter, the structure of the scintillator panel according to the tenth embodiment of the present invention that can be applied to the indirect deposition method will be described.

10th Example

12 is a view showing a part of the cross section of the structure of the scintillator panel according to the tenth embodiment of the present invention.

As shown in FIG. 12, the scintillator panel 910 includes a substrate 90, a reflective layer 50 formed on the surface of the substrate 90, a protective layer 60 formed on the reflective layer 50, and the protective layer ( 60 includes a scintillator layer 20 formed on the scintillator layer 20, a protective layer 30 formed on the scintillator layer 20, and a hard coating layer 40 stacked on the protective layer 30.

Since the scintillator panel 910 according to the present exemplary embodiment includes the protective layer 30 serving as the first protective layer and the protective layer 60 serving as the second protective layer, the moistureproof effect is further improved.

Since the flatness of the hard coat layer 40 is greater than the flatness of the protective layer 30, the hard coat layer 40 is bonded to the image pickup device using the protective layer 30 as a bonding surface. In this case, a larger bonding force can be obtained when bonding to an imaging device.

The scintillator panel according to the first to tenth embodiments described so far may be applied to a radiation image sensor.

The invention can be embodied in other specific forms without departing from the spirit and essential features of the invention. Accordingly, the above detailed description should not be construed as limiting in all aspects and should be considered as illustrative. The scope of the invention should be determined by reasonable interpretation of the appended claims, and all modifications within the equivalent scope of the invention are included in the scope of the invention.

The invention can be used in radiation image sensors.

4: substrate 5: void
10: imaging device 20: scintillator layer
30: protective layer 40: hard coating layer
50: reflective layer 60: protective layer
70: reflective bead 80: hard coating layer
100: scintillator panel according to the first embodiment of the present invention
200: scintillator panel according to second embodiment of the present invention
300: the scintillator panel according to the third embodiment of the present invention
400: scintillator panel according to the fourth embodiment of the present invention
500: scintillator panel according to Embodiment 5 of the present invention
600: scintillator panel according to a sixth embodiment of the present invention
700: scintillator panel according to Embodiment 7 of the present invention
800: scintillator panel according to Embodiment 8 of the present invention
900: scintillator panel according to a ninth embodiment of the present invention
910: scintillator panel according to the tenth embodiment of the present invention

Claims (25)

A scintillator layer composed of a plurality of columnar crystals and converting radiation into light in a predetermined wavelength range;
A first protective layer formed on the scintillator layer;
A first hard coating layer formed on the first protective layer and made of a thermosetting resin.
Scintillator panel.
The method of claim 1,
The first protective layer is made of parylene
Scintillator panel.
The method of claim 1,
The scintillator panel further includes a second protective layer formed on the first hard coat layer.
Scintillator panel.
The method of claim 3,
The second protective layer is made of parylene
Scintillator panel.
The method of claim 1,
The scintillator panel further includes a substrate and a reflective layer formed on the substrate, wherein the scintillator layer is formed on the reflective layer.
Scintillator panel.
The method of claim 5,
The scintillator panel further includes a second protective layer formed between the reflective layer and the scintillator layer.
Scintillator panel.
The method of claim 1,
The thermosetting resin is one of an acrylic resin, an epoxy resin, a polyester resin, a melamine resin, a urea resin, and a urethane resin.
Scintillator panel.
A scintillator layer composed of a plurality of columnar crystals and converting radiation into light in a predetermined wavelength range;
A first protective layer formed on the scintillator layer;
A first hard coating layer formed on the first protective layer and made of a UV curable resin.
Scintillator panel.
The method of claim 8,
The first protective layer is made of parylene,
Scintillator panel.
The method of claim 8,
The scintillator panel further includes a second protective layer formed on the first hard coat layer.
Scintillator panel.
The method of claim 10,
The second protective layer is made of parylene
Scintillator panel.
The method of claim 8,
The scintillator panel further includes a substrate and a reflective layer formed on the substrate, wherein the scintillator layer is formed on the reflective layer,
Scintillator panel.
The method of claim 12,
The scintillator panel further includes a second protective layer formed between the reflective layer and the scintillator layer.
Scintillator panel.
The method of claim 8,
The UV curable resin is one of an ethylenically unsaturated urethane acrylate resin, an ethylenically unsaturated polyester acrylate resin, an ethylenically unsaturated epoxy acrylate containing an ethylenically unsaturated group
Scintillator panel.
The method according to any one of claims 1 to 14,
The first hard coat layer is formed by a wet coating method
Scintillator panel.
The method according to any one of claims 1 to 8,
The first hard coating layer includes particles for reflecting light in the predetermined wavelength range, wherein the particles are TiO _{2 ,} LiF, MgF ₂ , SiO ₂ , Al ₂ O ₃ , MgO, SiN, CaF ₂ , NaCl, Consisting of at least one of KBr, KCl, AgCl, SiNO ₃ , Au, SiO, AlO, B ₄ C, BNO ₃
Scintillator panel
The method of claim 16,
The scintillator panel
Further comprising a second hard coating layer made of a thermosetting resin on the first hard coating layer
Scintillator panel.
The method of claim 17,
The thermosetting resin constituting the second hard coat layer is one of an acrylic resin, an epoxy resin, a polyester resin, a melamine resin, a urea resin, and a urethane resin.
Scintillator panel.
The method of claim 16,
The scintillator panel
Further comprising a second hard coating layer made of a UV curable resin on the first hard coating layer
Scintillator panel.
20. The method of claim 19,
The UV curable resin constituting the second hard coat layer is one of an ethylenically unsaturated urethane acrylate resin, an ethylenically unsaturated polyester acrylate resin and an ethylenically unsaturated epoxy acrylate resin containing an ethylenically unsaturated group.
Scintillator panel.
The method according to any one of claims 1 to 8,
The scintillator panel further includes a reflective layer formed on the first hard coating layer to reflect light in the predetermined wavelength range.
Scintillator panel.
The method of claim 21,
The reflective layer is made of a material containing at least one of Al, Ag, Cr, Cu, Ni, Ti, Mg, Ph, Pt, and Au
Scintillator panel.
The method according to any one of claims 1 to 14,
When the flatness is defined as (1- (difference between the highest and lowest height of the surface after coating) / (difference between the highest and lowest height of the surface before coating) x 100, the flatness of the first hard coat layer is Greater than the flatness of the first moisture barrier layer
Scintillator panel.
The method of claim 23, wherein
The flatness of the first hard coat layer is 70 or more
Scintillator panel.
15. A scintillator panel according to any one of claims 1 to 14 and an imaging device for imaging an image by light in the predetermined wavelength range, wherein the scintillator panel is disposed on the imaging device.
Radiation image sensor.

Images