KR20120015770A - Method for probe film used probe block - Google Patents

Abstract

PURPOSE: A method for manufacturing a probe film for a probe block is provided to simplify process and to reduce manufacturing costs. CONSTITUTION: A sacrificial layer is formed on the top of a substrate(S1101). A plurality of contact bumps is formed on the top of the sacrificial layer at a fixed interval(S1102). An release layer is formed on the upper side of the sacrificial layer and contact bump(S1103). The upper side of the release layer is flattened(S1104). A second photo resist layer is patterned on the upper side of the release layer and a signal line domain is formed(S1105). Conductive materials are filled in the signal line domain and a probe unit is formed(S1106). The second photo resist layer is eliminated(S1107). Adhesive is spread on the upper side of the probe unit and a film unit is welded(S1108). The sacrificial layer and the release layer are eliminated and a probe film is manufactured(S1110).

Description

Method for producing a probe film for a probe block {METHOD FOR PROBE FILM USED PROBE BLOCK}

The present invention relates to a method for producing a probe film for a probe block.

LCD (Liquid Crystal Display) production process is a cell process for manufacturing display panel, and driver, back light, light guide plate and polarizer are assembled with display panel produced in cell process to make finished product. It is roughly classified as a module assembly process.

Here, the display panel is an image display device in which the surfaces on which the source electrode and the gate electrode are formed are disposed to face each other on a substrate. The display panel injects a liquid crystal material between the substrates, and then generates an electric field by applying a voltage to the two electrodes. The liquid crystal molecules are moved by the generated electric field to change the transmittance of light to express an image.

In this case, the display inspection probe unit (hereinafter, referred to as a “probe unit”) performs an inspection on the display panel produced through a cell process to check whether there is a defect that may occur in the manufacturing process.

For example, the probe unit may be a display such as thin film transistor (TFT), twisted nematic (TN), super twisted nematic (STN), color super twisted nematic (CSTN), double super twisted nematic (DSTN), organic electroluminescent (EL), or the like. A test electrical signal is applied to the electrodes (or pads) of the panel to check whether the corresponding display panel is operating normally without pixel error.

1 is an overall configuration diagram of a probe unit for inspecting a conventional display panel.

As shown in FIG. 1, the probe unit 10 is positioned on the display panel 20 to check for abnormality of each cell. In this case, the probe unit 10 applies an electrical signal to the electrode of the display panel 20, receives the output signal according to the electrode, and transmits the output signal to the inspection system.

To this end, the probe unit 10 may include a probe block that connects a probe to an electrode of the display panel 20 to apply an electrical signal and detect an output signal according to the probe block.

And through this process it is possible to inspect the presence of defects such as point defects, predecessors, stain defects of the display panel 20 that may occur in the manufacturing process.

On the other hand, in recent years, display panels of high quality are continuously increasing, and accordingly, there is a need for a probe block having a probe for inspecting a high density display panel.

However, in the related art, since a probe formed in a probe block is manufactured through a process of etching a substrate, a manufacturing process is complicated, and the etched substrate cannot be reused.

One embodiment of the present invention is to provide a method for manufacturing a probe film for a probe block that can simplify the process and reduce the manufacturing cost by manufacturing a probe film without etching a rigid substrate.

In addition, an embodiment of the present invention is to provide a method for producing a probe film for the probe block can be produced by reusing the substrate several times, and to facilitate the release of the substrate during the production of the probe film. have.

As a technical means for achieving the above technical problem, a method of manufacturing a probe film for a probe block for inspecting a display panel according to the first aspect of the present invention comprises the steps of (a) forming a sacrificial layer on a substrate, (b) ) Forming one or more contact bumps on top of the formed sacrificial layer, (c) forming a release layer on the top surface of the formed contact bumps and the top surface of the sacrificial layer, and exposing the top surface of the contact bumps, (d ) Forming at least one signal line on top of the release layer so as to be respectively connected to the top surface of the contact bump, (e) bonding the top surface of the signal line to the film portion, and (f) sacrificial and release layers from the substrate. Removing the step.

Here, step (c) is a step of planarizing the upper surface of the release layer formed on the upper surface of the sacrificial layer.

In addition, the planarization of the upper surface of the release layer may be performed by a chemical mechanical polishing (CMP) process.

In addition, step (d) includes forming a signal line portion region by patterning the first photoresist layer on the release layer and forming a signal line by filling a conductive material in the signal line portion region.

In addition, step (e) includes removing the patterned first photoresist layer and bonding the film portion by applying an adhesive to an upper surface of the signal line.

Also, step (f) may be performed by a wet etching process or a dry etching process.

In addition, in the step (b), forming a contact bump region by patterning a second photoresist layer on the top surface of the sacrificial layer, and filling the contact bump region with a conductive material, and removing the second photoresist layer to remove the contact bumps. Forming a step.

In addition, the above-described conductive material may include at least one metal of Ni, NiCo, NiFe, and NiW.

At least one of the first photoresist layer and the second photoresist layer may be removed by any one of an ashing process, a wet removal process, and an O ₂ plasma method.

In addition, the sacrificial layer and the release layer may be formed by a plating process.

The method may further include preparing a probe film for the probe block by performing steps (a) to (f) on the substrate from which the sacrificial layer and the release layer are removed.

A method of manufacturing a probe film for a probe block for inspecting a display panel according to a second aspect of the present invention, (a) forming a sacrificial layer on a substrate, (b) a first photoresist layer on top of the formed sacrificial layer Forming a release layer on top of the patterned first photoresist layer and on top of the sacrificial layer, (c) planarizing the top surface of the release layer, and removing the patterned first photoresist layer, (d) patterning a second photoresist layer over the release layer to form a probe region, (e) filling the probe region with a conductive material to form a probe comprising signal lines and contact bumps, ( f) removing the second photoresist layer, (g) bonding the top surface of the probe portion to the film portion, and (h) removing the sacrificial layer and release layer from the substrate.

Here, the conductive material is characterized in that it comprises at least one metal of Ni, NiCo, NiFe and NiW.

In addition, the sacrificial layer is formed by a plating process.

The method may further include preparing a probe film for the probe block by performing steps (a) to (h) on the substrate from which the sacrificial layer and the first photoresist layer are removed.

According to any one of the problem solving means of the present invention described above, by producing a probe film without etching the rigid substrate, it is possible to simplify the process and reduce the manufacturing cost.

In addition, according to any one of the problem solving means of the present invention described above, it is possible to manufacture the probe film by reusing the substrate several times, it is easy to release the substrate during the production of the probe film.

1 is an overall configuration diagram of a probe unit for inspecting a conventional display panel.
2 is a perspective view of a probe unit according to an embodiment of the present invention.
3 is a perspective view of a probe unit according to another embodiment of the present invention.
4A-4C show the tip portion of the probe block.
5 is an exploded perspective view of the probe unit of FIG. 3.
6 is an overall flowchart of a method of manufacturing a probe film for a probe block according to an embodiment of the present invention.
7 is a detailed flowchart of a method of manufacturing a probe film for a probe block according to an embodiment of the present invention.
8A to 8L illustrate a process for explaining a method of manufacturing a probe film for a probe block according to an embodiment of the present invention.
9 is a side view of the probe film formed by the process of FIGS. 8A to 8L.
FIG. 10 illustrates a form in which a plurality of probes of the probe film of FIG. 9 are collectively formed.
11A to 11K illustrate a process for explaining a method of manufacturing a probe film for a probe block according to another embodiment of the present invention.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and like reference numerals designate like parts throughout the specification.

Throughout the specification, when a part is "connected" to another part, this includes not only "directly connected" but also "electrically connected" with another element in between. . In addition, when a part is said to "include" a certain component, which means that it may further include other components, except to exclude other components unless otherwise stated.

2 is a perspective view of a probe unit according to an embodiment of the present invention.

As shown in FIG. 2, the probe unit 101 according to an embodiment of the present invention includes a probe block 102, a PCB unit 106, and a head block 104.

The probe block 102 connects the probe to the electrode of the display panel 20 to apply an electrical signal, and detects the output signal according to the test process. Here, the probe block 102 may be integrally formed with a Taped Carrier Package (TCP) block (not shown), and the TCP block transmits an electrical signal received from the PCB unit 106 to the probe block 102. .

The head block 104 moves the probe block 102 up or down or fixes it at a predetermined position so that the probe of the probe block 102 contacts the electrode of the display panel 20 at a suitable physical pressure.

The PCB unit 106 generates an electrical signal for inspecting each cell of the display panel 20 and transmits the electrical signal to the probe block 102 through the film 18.

3 is a perspective view of a probe unit according to another embodiment of the present invention. 4A-4C show the tip portion of the probe block. 5 is an exploded perspective view of the probe unit of FIG. 3.

3 to 5, the probe unit 200 according to another embodiment of the present invention includes a head block 210, a probe block 220, and a crimping block 230.

The head block 210 is coupled to the upper portion of the probe block 220 to move and fix the probe block 220 up and down so that the probe portion of the probe block 220 is connected to the electrode of the display panel at an appropriate physical pressure.

The probe block 220 is coupled to the probe block body 222 including the inclined protrusion 224 and the lower side of the inclined protrusion 224, and extends to protrude toward the end of the inclined protrusion 224, thereby extending the display panel. A second coupled to an upper surface of the probe film 100 and the inclined protrusion 224 connected to the electrode to apply a signal, and connected to an upper surface of the protruding probe film 100 to support the probe film 100. Plate 242. Here, the probe block 220 may further include a fixing block 250 coupled to the upper surface of the second plate 242 to fix and support the second plate 242.

More specifically, as shown in FIG. 4A, the tip portion A of the probe block 220 may include a first plate 241 coupled to a lower side of the inclined protrusion 224, and a portion of the first plate 241. It is coupled to the lower side, is coupled to the upper surface of the probe film 100 and the inclined protrusion 224 is connected to the electrode of the display panel to apply a signal, and is connected to the upper surface of the first plate 241 first plate It may include a second plate 242 for supporting the front end portion (241-1) of. In this case, the tip portion 242-1 of the second plate 242 may be connected to the tip portion 241-1 of the first plate 241 at an inclined angle.

And, as shown in FIG. 4B, in another embodiment, the tip portion A ′ of the probe block 220 is the first plate 241 described above between the lower side of the inclined protrusion 224 and the probe film 100. ) Is not interposed, the probe film 100 is coupled to the lower side of the inclined protrusion 224 and extends to protrude toward the end side of the inclined protrusion 224, the tip portion 242-2 of the second plate 242 is It may be configured in a form that extends to be connected side by side to the upper surface of the protruding extended probe film 100.

In addition, as shown in FIG. 4C, in another embodiment, the distal end portion A ″ of the probe block 220 may be integrally formed with the first plate 241 and the second plate 242, and the first plate. The probe film 100 may be coupled to the lower side of the 241.

The crimping block 230 is detachably coupled to the lower portion of the probe block 220. The crimping block 230 includes a crimping block body part 231 accommodated in a recess formed in the lower portion of the probe block 220, a coupling protrusion 232 protruding to one side of the body part 231, and a crimping block body part ( The connection film 233 extends from the lower portion of the lower portion 231 around the coupling protrusion 232 and is pressed and connected to the probe film 100 from the upper surface of the coupling protrusion 232.

Here, the connection film 233 is mounted with a drive integrated circuit (IC) (not shown) for inspecting the display panel. The driving IC applies an electrical signal to each electrode of the display panel and simultaneously detects an output so that a test process for the display panel may be performed. The connection film 233 may be implemented as a chip on film.

Hereinafter, the manufacturing process of the probe film for the probe block described above will be described in detail.

6 is an overall flowchart of a method of manufacturing a probe film for a probe block according to an embodiment of the present invention.

As shown in FIG. 6, in order to manufacture the probe film for the probe block of the present invention, first, the contact bumps 152 and the contact bumps 152 protruding from the sacrificial layer 120 on the substrate 110 may be formed. A plurality of probes 150 each including a signal line part 151 formed on the release layer 125 to be connected to each other are collectively formed using the photolithography method (S1001). This step S1001 may correspond to steps S1101 to S1106 to be described later.

Next, the upper surface of the probe unit 150 is bonded to the film unit 170 (S1002). This step S1002 may correspond to steps S1107 and S1108 to be described later.

In operation S1003, the sacrificial layer 120 and the release layer 125 are removed. This step S1003 may correspond to the step S1109 to be described later.

More detailed process steps and detailed manufacturing procedures of the method for manufacturing the above-described probe film will be described below with reference to FIGS. 7 and 8A to 8L.

7 is a detailed flowchart of a method of manufacturing a probe film for a probe block according to an embodiment of the present invention. 8A to 8L illustrate a process for explaining a method of manufacturing a probe film for a probe block according to an embodiment of the present invention. In order to help understanding of the present invention, (a) of Figure 8d to 8i is a front view showing the manufacturing process of the probe film, Figure 8d to 8i (b) is shown in a plan view.

First, as shown in FIG. 8A, the sacrificial layer 120 is formed on the substrate 110 (S1101). Herein, the substrate 110 may be formed of silicon (Si), glass, or ceramic material. The sacrificial layer 120 may be formed by a plating process of plating a metal such as Cu.

Next, a plurality of contact bumps 152 are formed at intervals set on the sacrificial layer 120 (S1102).

More specifically, as shown in FIG. 8B, the first photoresist layer 142 is patterned on the top surface of the sacrificial layer 120 to form the contact bump region 152a.

Here, the first photoresist layer 142 may be patterned according to a pattern of the mask by exposing the photoresist layer to a light using an ultraviolet exposure apparatus using a predefined mask layer and performing a developing process on the exposed photoresist layer.

 As shown in FIG. 8C, the contact bump region 152a is filled with a conductive material by plating at least one metal of Ni, NiCo, NiFe, and NiW to form the contact bump 152.

Next, as shown in FIG. 8D, the first photoresist layer 142 is removed. Here, the contact bump 152 may be formed in a shape having a predetermined horizontal length a ', vertical length c', and width b '. The first photoresist layer 140 may be removed by any one of an ashing process, a wet removal process, and an O2 plasma method.

Next, as shown in FIG. 8E, the release layer 125 is formed on the top surface of the contact bump 152 and the top surface of the sacrificial layer 120 (S1103). Here, the release layer 125 may be formed by a plating process for plating a metal such as Cu, like the sacrificial layer 120 described above.

Next, as shown in FIG. 8F, the top surface of the release layer 125 is planarized (S1104). Here, the upper surface of the release layer 125 may be planarized by a chemical mechanical polishing (CMP) process, thereby exposing the upper surface of the contact bump 152.

Next, as illustrated in FIG. 8G, the second photoresist layer 155 is patterned on the top surface of the planarized release layer 125 to form a signal line portion region 151a (S1105).

Next, as illustrated in FIG. 8H, the probe part 150 is formed by filling the signal line region 151a with a conductive material (S1106). As a result, one or more signal line portions 151 respectively connected to the upper surface of the contact bump 152 are formed on the release layer. Here, one end of the probe part 150 is used as the signal line part 151, and the other end formed in the form protruding from the one end is used as the contact bump 152. Here, the conductive material may be made of the same material as the contact bump 152 described above.

Next, as shown in FIG. 8I, the patterned second photoresist layer 155 is removed (S1107). Here, the second photoresist layer 155 may be removed by any one of an ashing process, a wet removal process, and an O ₂ plasma method.

Next, as illustrated in FIGS. 8J and 8K, the adhesive 160 is applied to the upper surface of the probe unit 150 and the film unit 170 is bonded (S1108). That is, by performing epoxy spreading on the upper surface of the signal line unit 151, the adhesive unit 160 may be coated to bond the film unit 170.

Next, as illustrated in FIG. 8L, the preparation of the probe film is completed by removing the sacrificial layer 120 and the release layer 125 (S1110). Here, the sacrificial layer 120 and the release layer 125 may be removed by a wet etching process or a dry etching process.

By fabricating the probe film without etching the rigid substrate 110 as described above, the process can be simplified and the manufacturing cost can be reduced.

FIG. 9 is a side view of the probe film formed by the process of FIGS. 8A to 8L, and FIG. 10 illustrates a form in which a plurality of probe parts of the probe film are collectively formed.

9 and 10, the plurality of probes 150 bonded to the film unit 170 may be collectively formed by using photolithography. In this case, one contact bump 152 may be formed to protrude from the signal line unit 151.

On the other hand, the manufacturing process of the probe film for the probe block described above may be implemented by the process of Figure 11a to 11k below. Hereinafter, descriptions overlapping with the above-described FIGS. 8A to 8L will be omitted and the manufacturing process of the probe film for the probe block according to another embodiment of the present invention will be described.

11A to 11K illustrate a manufacturing process of a probe film for a probe block according to another embodiment of the present invention.

First, as shown in FIG. 11A, the sacrificial layer 120 is formed on the substrate 110. Here, the sacrificial layer 120 and the release layer 125 to be described later may be formed by a plating process.

Next, as shown in FIG. 11B, the first photoresist layer 142 is patterned on the sacrificial layer 120.

Next, as shown in FIG. 11C, a release layer 125 is formed on the patterned first photoresist layer 142 and on the sacrificial layer 120.

Next, as shown in FIG. 11D, the top surface of the release layer 125 is planarized.

Next, as shown in FIG. 11E, the patterned first photoresist layer 142 is removed.

Next, as illustrated in FIG. 11F, the probe region 150a is formed by patterning the second photoresist layer 155 on the release layer 125.

Next, as illustrated in FIG. 11G, the probe portion 150a is filled with a conductive material to form the probe 150 including the signal line 151 and the contact bump 152. Here, the conductive material may include at least one metal of Ni, NiCo, NiFe, and NiW.

Next, as shown in FIG. 11H, the second photoresist layer 155 is removed.

Next, as shown in FIGS. 11I and 11J, the adhesive 160 is applied to the upper surface of the probe unit 150 and the film unit 170 is bonded.

Next, as shown in FIG. 11K, the sacrificial layer 120 and the release layer 125 are removed to complete the fabrication of the probe film. As such, the probe film for the probe block may be manufactured by repeating the process of FIGS. 11A to 11K on the substrate from which the sacrificial layer 120 and the release layer 125 are removed.

As described above with reference to FIGS. 9 and 10, the plurality of probes 150 bonded to the film unit 170 may be collectively formed using a photolithography method.

On the other hand, the above description of the present invention is intended for illustration, and those skilled in the art can understand that the present invention can be easily modified in other specific forms without changing the technical spirit or essential features of the present invention. There will be. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single type may be implemented in a distributed manner, and similarly, components described as distributed may be implemented in a combined form.

And the scope of the present invention is represented by the appended claims rather than the detailed description, and all changes or modifications derived from the meaning and scope of the claims and their equivalent concepts are included in the scope of the present invention. Should be.

100: probe film 150: probe
151: signal line portion 152: contact bump
170: film portion 200: probe unit
210: head block 220: probe block
230: crimping block 241: first plate
242: second plate 250: fixed block

Claims (15)

In the manufacturing method of the probe film for probe blocks for inspecting a display panel,
(a) forming a sacrificial layer on a substrate,
(b) forming one or more contact bumps on top of the formed sacrificial layer,
(c) forming a release layer on an upper surface of the formed contact bumps and an upper surface of the sacrificial layer and exposing an upper surface of the contact bumps,
(d) forming at least one signal line on top of the release layer so as to be respectively connected to an upper surface of the contact bump,
(e) bonding the upper surface of the signal line to a film part; and
(f) removing the sacrificial layer and the release layer from the substrate
Method for producing a probe film for a probe block comprising a.
The method of claim 1,
In step (c),
Method of manufacturing a probe film for a probe block comprising the step of planarizing the upper surface of the release layer formed on the upper surface of the sacrificial layer.
The method of claim 2,
Flattening the upper surface of the release layer,
Method of producing a probe film for a probe block which is carried out by a chemical mechanical polishing (CMP) process.
The method of claim 1,
In step (d),
Patterning a first photoresist layer on the release layer to form a signal line portion region; and
And filling the conductive material in the signal line portion to form the signal line.
The method of claim 4, wherein
In step (e),
Removing the patterned first photoresist layer; and
A method of manufacturing a probe film for a probe block comprising applying the adhesive to the upper surface of the signal line to bond the film portion.
The method of claim 1,
The step (f)
The manufacturing method of the probe film for probe blocks which consists of a wet etching process or a dry etching process.
The method of claim 1,
In step (b),
Patterning a second photoresist layer on an upper surface of the sacrificial layer to form a contact bump region; and
And filling the contact bump region with a conductive material and removing the second photoresist layer to form the contact bumps.
The method according to claim 4 or 7,
The conductive material is a method for producing a probe film for a probe block, characterized in that it comprises at least one metal of Ni, NiCo, NiFe and NiW.
The method according to claim 4 or 7,
At least one of the first photoresist layer and the second photoresist layer is removed by any one of an ashing process, a wet removal process, and an O ₂ plasma method.
The method of claim 1,
The sacrificial layer and the release layer,
The manufacturing method of the probe film for probe blocks formed by a plating process.
The method of claim 1,
A method of manufacturing a probe film for a probe block further comprising the step of preparing the probe film for the probe block by performing the steps (a) to (f) on the substrate from which the sacrificial layer and the release layer are removed.
In the manufacturing method of the probe film for probe blocks for inspecting a display panel,
(a) forming a sacrificial layer on a substrate,
(b) patterning a first photoresist layer on the formed sacrificial layer, and forming a release layer on top of the patterned first photoresist layer and on top of the sacrificial layer,
(c) planarizing an upper surface of the release layer and removing the patterned first photoresist layer,
(d) patterning a second photoresist layer on the release layer to form a probe region;
(e) filling the probe area with a conductive material to form a probe including a signal line and a contact bump,
(f) removing the second photoresist layer,
(g) bonding the upper surface of the probe portion to the film portion;
(h) removing the sacrificial layer and the release layer from the substrate.
The manufacturing method of the probe film for probe blocks.
The method of claim 12,
The conductive material is a method for producing a probe film for a probe block, characterized in that it comprises at least one metal of Ni, NiCo, NiFe and NiW.
The method of claim 12,
The sacrificial layer and the release layer,
The manufacturing method of the probe film for probe blocks formed by a plating process.
The method of claim 12,
Producing a probe film for the probe block further comprising the step of (a) to the step (h) to the substrate to remove the sacrificial layer and the release layer to produce a probe film for the probe block.

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