KR20120010946A - Apparatus for joining plate-shaped members - Google Patents

Abstract

PURPOSE: A surface member junction apparatus is provided to connect a plate-shaped member in air pressure by providing a junction apparatus for effectively establishing the spread pattern of hardening resin. CONSTITUTION: A hardening resin(102) is previously arranged at the junction surface of a first and a second plate-shaped member(101). The first and the second end(101b, 101c) of the plate-shaped member are supported by the supporting unit of a first and a second pillow(7, 10). The height of the supporting unit is established to a target height which is higher than the junction surface of a first plate-shaped member. The hardening resin is pressed by the pressing unit of the second plate-shaped member(14) between the second and the first plate-shaped member.

Description

Plate member joining device {APPARATUS FOR JOINING PLATE-SHAPED MEMBERS}

This invention relates to the joining apparatus which joins two plate-shaped members via resin which has curability.

Background Art Conventionally, as a device for bonding a first plate-like member such as a touch panel disposed on the surface side of a liquid crystal panel and a second plate-like member such as a cover glass for protecting the surface thereof, bonding is performed via a double-sided tape (OCA). There exists a type which performs bonding through the type to perform and transparent resin which has sclerosis | hardenability like UV curable resin. Moreover, each said apparatus is further divided into the type which performs bonding in a reduced pressure atmosphere, and the type which performs bonding in atmospheric pressure atmosphere.

Which type of device is used is determined by the size of the plate-like member to be joined or the required joining quality. For example, when joining plate members having dimensions of 10 inches or more, it is known empirically that using a curable resin can improve the bonding quality rather than using a double-sided tape. The bonding apparatus of the type to perform is used abundantly.

As an apparatus which joins a plate-shaped member via curable resin, the thing of patent document 1 is known, for example. In this bonding apparatus, UV hardening resin is apply | coated to the bonding surface of one plate-shaped member, and it bonds in the reduced pressure atmosphere lower than 10 kPa. Moreover, the application pattern of UV curable resin is circular shape, dot shape, linear shape, and radial shape.

Patent Document 1: Japanese Patent Application Laid-Open No. 2009-31432 (in particular, FIG. 4)

However, the conventional bonding apparatus requires a pump, a vacuum chamber, and the like to create a reduced pressure atmosphere, which causes a problem that the apparatus is enlarged, complicated, and expensive.

Moreover, in order to solve the said problem, the bonding apparatus which joins using curable resin in atmospheric pressure atmosphere also had the following problem to be solved. That is, as shown in FIG. 9, after apply | coating curable resin 102 to the bonding surface of the 1st plate-shaped member 100, the bonding surface of the 2nd plate-shaped member 101 is crimped | bonded by curable resin 102, and When the two plate members 100 and 101 are bonded together, bubbles are formed in the curable resin 102 (hereinafter, referred to as the 'resin layer 102') that is spread by compression between the two plate members 100 and 101. There was a case to be mixed. In addition, this bonding apparatus needs to design an application pattern by predicting the spread of the curable resin 102 at the time of bonding, and this prediction is very difficult, so that "protrusion" or "lack" in the resin layer 102 'is difficult. It was easy to occur. If a “squeeze out” occurs, extra work is needed to remove the squeeze out. In addition, when "lack" occurs, the bonding strength is lowered, and when "bubbles" are mixed, the display quality is remarkably lowered.

In this bonding apparatus, the application pattern of the curable resin 102 needs to be redesigned from the beginning whenever the type, property, and size of the first plate-like member 100 of the curable resin 102 are changed, which is very cumbersome. .

This invention is made | formed in view of the said situation, As the subject, it is possible to join a plate-shaped member in atmospheric pressure atmosphere without generating bubble mixing, bleeding, and shortage in a resin layer, Furthermore, application of curable resin It is an object of the present invention to provide a bonding apparatus in which the design of a pattern is easy.

In order to solve the said subject, in the bonding apparatus which concerns on this invention, after performing the position adjustment of the 1st plate-shaped member mounted on the bonding stage and the 2nd plate-shaped member located above the said 1st plate-shaped member, a 2nd plate-shaped member Joining which joins a 2nd plate-shaped member to a 1st plate-shaped member by changing the relative position of the press means with respect to a 2nd plate-shaped member to a joining direction, while pressing a 2nd plate-shaped member by the press means located further upward. As an apparatus, curable resin which spreads by crimping | compression-bonding between the said 1st and 2nd plate-shaped member, and becomes a resin layer of preset thickness is previously arrange | positioned at the joining surface of a 1st plate-shaped member or a 2nd plate-shaped member, The 1st end part and the 2nd end part which are located in the joining direction both ends of a 2 plate-shaped member are the support parts of the 1st pillow and the 2nd pillow which an up-down position can control Are respectively supported at the bottom, and movement downward is regulated, and the height of at least one of the support portions of the first pillow and the second pillow is greater than the target height obtained by adding the preset thickness of the resin layer to the height of the bonding surface of the first plate-like member. By making it high, curable resin is not spread | diffused by crimping | compression-bonding between the part which is not yet pressed by the press means of a 2nd plate-shaped member, and a 1st plate-shaped member.

Curable resin of the said bonding apparatus can be made from photocurable resin or a thermosetting resin, for example.

In the bonding apparatus, the pressing position by the pressing means moves from the first end toward the second end, the height of the supporting portion of the first pillow is maintained at the target height, and the height of the supporting portion of the second pillow is selected by the pressing means. It can be configured to change from the height higher than the target height to the target height as the two ends.

Curable resin of the said bonding apparatus can be arrange | positioned in the shape which combined the some line parallel or perpendicular | vertical to a joining direction, for example.

The said bonding apparatus is a 1st light source which can irradiate light at arbitrary timing toward the vicinity of the position which is initially pressed by a pressing means from behind a bonding direction, and from the front of the bonding direction toward the vicinity of the position which is finally pressed by a pressing means. It is further provided with the 2nd light source which can irradiate light at arbitrary timings, and it is preferable that the said curable resin is photocurable resin hardened | cured by the light irradiated from a 1st and 2nd light source.

The bonding apparatus further includes a third light source for continuously irradiating light toward the vicinity of the pressing position while the pressing position by the pressing means moves from the first end toward the second end, and the curable resin further comprises: It is preferable that it is a photocurable resin hardened | cured by the light irradiated from a 3rd light source.

Further, in the bonding apparatus, the pressing position by the pressing means moves toward the first end from the intermediate position of the first end and the second end, and then moves toward the second end, and the height of the supporting portion of the first pillow is pressed. The height of the support of the second pillow changes from the height higher than the target height to the target height as the means close to the second end as the means approaches the first end. It can be configured to.

According to the present invention, it is possible to provide a bonding apparatus in which a plate-like member can be bonded in an atmospheric pressure atmosphere without causing bubble mixing, bleeding, and shortage in the resin layer, and can easily design a coating pattern of curable resin. .

1 is a side view of a bonding apparatus according to a first embodiment of the present invention.
2 is a block diagram of a bonding apparatus according to the first embodiment.
3 is a top view illustrating the coating pattern of the curable resin in the first embodiment.
4 is a view for explaining the bonding operation of the bonding apparatus according to the first embodiment, which proceeds in the order of (A) → (B) → (C).
5 is an enlarged side view of the vicinity of the pressing position of the bonding apparatus according to the first embodiment.
6 is a view for explaining the bonding operation of the bonding apparatus according to the second embodiment, which proceeds in the order of (A) → (B) → (C).
FIG. 7 is a diagram showing a light irradiation area in the second embodiment, in which (A) is the bonding start, (B) is the bonding operation, and (C) is the bonding finish.
8 is a side view showing a modification of the pillow.
It is a figure for demonstrating the bonding operation | movement of the conventional bonding apparatus which progresses in order of (A)-(B).

EMBODIMENT OF THE INVENTION Hereinafter, the preferred embodiment of the bonding apparatus which concerns on this invention is described with reference to an accompanying drawing.

[First Embodiment-Configuration]

1 is a side view of a bonding apparatus according to a first embodiment. The bonding apparatus 1a bonds the 2nd plate-shaped member 101 to the 1st plate-shaped member 100. FIG. In the present embodiment, the first plate member 100 is a touch panel disposed on the surface side of the liquid crystal panel, and the second plate member 101 is a cover glass made of soda glass having a thickness of 1.0 [mm]. As the first plate member 100, a liquid crystal panel may be used in addition to the above. As the second plate member 101, a soda glass having a thickness of about 0.5 to 2.0 [mm] or a resin (for example, polycarbonate or acrylic) having a thickness of about 1.0 to 3.0 [mm] can be used.

As shown in this figure, the second plate-like member 101 has a larger dimension in the joining direction than the first plate-like member 100. In addition, the second plate-like member 101 has a first end 101b and a second end 101c located at both ends in the joining direction, and the second plate-like member 101 has a first plate-like member 100 at either end. It is more protruding.

The bonding apparatus 1a is equipped with the stage moving means 4. On the stage moving means 4, the bonding stage 6, the first pillow 7 and the first pillow lifting means 8 for elevating it, the second pillow 10 and the second pillow lifting means for elevating it ( 11) is provided. Moreover, above the joining stage 6, the roller 14 (corresponds to the "pressing means" of the present invention) and the roller lifting means 15 for raising and lowering the same are provided.

The stage moving means 4 is capable of reciprocating at least in the joining direction along a predetermined guide. The stage moving means 4 moves under the control of the control unit 20 described later. When the stage moving means 4 moves in the opposite direction of the bonding, the bonding stage 6, the first pillow 7 and the second pillow 10 arranged on the stage moving means 4 also move together, The relative position of the roller 14 changes. That is, the roller 14 moves relative to the bonding stage 6, the 1st pillow 7, and the 2nd pillow 10 in a joining direction.

The bonding stage 6 has a horizontal mounting surface for mounting the 1st plate-shaped member 100 conveyed from the apparatus of the previous process, and the some adsorption nozzle 6a opened in this mounting surface. Each suction nozzle 6a is connected to the pump 21 which is not shown in figure, and when the pump 21 operates under the control of the control part 20, the 1st plate-shaped member 100 mounted on the mounting surface will join. Adsorption holding | maintenance is carried out with surface 100a facing upwards.

Curable resin 102 is coated on the bonding surface 100a of the first plate-shaped member 100. The curable resin 102 is spread between the first plate member 100 and the second plate member 101 by compression to form a resin layer 102 ′ having a predetermined thickness, and photocuring cured by irradiating light. A resin or a thermosetting resin that is cured by heating to a predetermined temperature can be used. In this embodiment, a UV curable resin that is cured by irradiating UV light is used. The resin layer 102 'serves as an adhesive layer for adhering the first plate-shaped member 100 and the second plate-shaped member 101, and also between the first plate-shaped member 100 and the second plate-shaped member 101. It serves as a filler to prevent scattering of light due to the presence of an air layer in the cell and to improve visibility.

In this embodiment, although curable resin 102 is apply | coated to the 1st plate-shaped member 100 mounted on the bonding stage 6, the 1st plate-shaped member 100 which apply | coated the curable resin 102 previously was bonded stage ( 6) You may mount on a phase. In addition, you may apply | coat curable resin 102 to the bonding surface 101a of the 2nd plate-shaped member 101. FIG. The application | coating pattern of curable resin 102 is mentioned later.

The first pillow 7 and the first pillow lifting means 8 are disposed behind the bonding direction of the bonding stage 6. Among them, the first pillow 7 supports the second plate-like member 101 by the supporting portion 7a protruding in the joining direction, and restricts the movement of the first end portion 101b downward. The second plate member 101 is sandwiched together with the pillow 10 on both sides in the joining direction to restrict the movement of the second plate member 101 in the joining direction. Moreover, the 1st pillow lifting means 8 raises and lowers the 1st pillow 7 under the control of the control part 20, and adjusts the height of the support part 7a to arbitrary heights.

The 2nd pillow 10 and the 2nd pillow lifting means 11 are arrange | positioned in front of the joining direction of the joining stage 6. Among these, the second pillow 10 supports the second plate-like member 101 by the supporting portion 10a protruding in the opposite direction to the bonding, and restricts the movement of the second end 101c in the downward direction. 2 plate member 101 is controlled to move in the joining direction. Moreover, the 2nd pillow lifting means 11 raises and lowers the 2nd pillow 10 under the control of the control part 20, and adjusts the height of the support part 10a to arbitrary heights.

The roller elevating means 15 is for elevating the roller 14 under the control of the control unit 20, and is disposed between the apparatus ceiling portion (not shown) and the roller 14. The roller raising and lowering means 15 may raise and lower the roller 14 so that the height of the roller 14 may become a predetermined height, and the roller 14 may be raised so that the pressing force with respect to the 2nd plate-like member 101 may become predetermined pressure. Although it may raise and lower, the former method is preferable from a viewpoint of controlling the thickness of the resin layer 102 'with high precision.

2 is a block diagram of the bonding apparatus 1a according to the present embodiment. As described above, the control unit 20 performs operations of the stage moving means 4, the first pillow lifting means 8, the second pillow lifting means 11, the roller lifting means 15, and the pump 21, respectively. To control.

The stage moving means 4 is, for example, the bonding stage 6 (more specifically, the first plate-like member 100 and the second plate-like member 101 on the bonding stage 6) and the roller 14. To change the relative position. The first pillow lifting means 8 changes the height of the first pillow 7. The second pillow lifting means 11 changes the height of the second pillow 10. The roller lifting means 15 raises and lowers the roller 14. Moreover, the pump 21 operates the adsorption nozzle 6a of the bonding stage 6, and makes the adsorption holding of the 1st plate-shaped member 100 to the mounting surface of the bonding stage 6. As shown in FIG.

The application pattern of the curable resin 102 is considered variously. For example, the application | coating pattern of FIG. 3A consists of four lines parallel to a joining direction, and one line perpendicular | vertical to the joining direction which connects the edge parts of the side of the line joined first of each line. In addition, in the application | coating pattern of FIG. 3 (B), four lines parallel to a joining direction are made into a base, and the curable resin 102 was apply | coated more than the other part to the edge part of the side by which the line is initially joined. It is supposed to be.

As will be described later, since the bonding apparatus 1a according to the present invention can control the thickness of the resin layer 102 'with high accuracy, the spreading of the curable resin 102 when pressed by the roller 14 is controlled. It is relatively easy. Therefore, according to the present invention, it is easy to design a coating pattern in which "protrusion" or "lack" does not occur, and the time required for application can be shortened by simplifying the coating pattern.

[Example 1-Bonding Operation]

Next, the bonding operation | movement of the bonding apparatus 1a which concerns on a 1st Example is demonstrated with reference to FIG. In addition, joining advances in order of (A)-(B)-(C) of FIG.

4A shows an initial state before the bonding is started. On the mounting surface of the bonding stage 6, the 1st plate-shaped member 100 is attracted and hold | maintained, and curable resin 102 is apply | coated to the bonding surface 100a of the 1st plate-shaped member 100. FIG. Moreover, on the support parts 7a and 10a of the 1st pillow 7 and the 2nd pillow 10, the 2nd plate-shaped member 101 after position adjustment with the 1st plate-shaped member 101 is made to join the joint surface 101a. It is mounted facing downward. In addition, as shown in this figure, the support part 7a and the support part 10a have the same height. Therefore, in the initial state shown in FIG. 4A, the second plate member 101 and the first plate member 100 are substantially parallel to each other.

In this embodiment, as an example, the thickness of the first plate-shaped member 100 is about 1.0 [mm], the coating thickness of the curable resin 102 is about 0.5 [mm], and the supporting portion 7a is placed on the mounting surface of the bonding stage 6. And the height up to the supporting portion 10a is about 6.5 [mm]. Therefore, in the initial state, the bonding surface 101a of the second plate member 101 and the curable resin 102 are separated by about 5 [mm].

4B shows a state in which the first pillow 7 is lowered, the roller lifting means 15 is extended, and the roller 14 is lowered. As shown in FIG. 5, the first pillow 7 descends to a position where the height of the supporting portion 7a becomes the target height h1. Here, "target height h1" is the height which added the thickness of the 1st plate-shaped member 100, and the thickness of the resin layer 102 '. For example, when the thickness of the resin layer 102 'is set to 0.3 [mm], the support portion 7a of the first pillow 7 is up to a position 1.3 [mm] higher than the mounting surface of the bonding stage 6. Descend. Then, when the roller 14 is lowered and the second plate member 101 is pressed, the curable resin 102 is applied by pressing between the second plate member 101 and the first plate member 100, and the thickness is reduced. Is changed from the original 0.5 [mm] to 0.3 [mm] (predetermined thickness).

On the other hand, the support part 10a of the 2nd pillow 10 is hold | maintained in the position (height h2) higher than target height h1. Therefore, the warpage shown in this figure occurs in the second plate member 101.

FIG. 4C shows a state in which the bonding operation is completed by moving the stage moving means 4 in the opposite direction to the bonding to move the pressing position by the roller 14 to the end in the bonding direction. When the pressing position by the roller 14 is moved in the joining direction, the curable resin 102 is spread by pressing between the first plate-shaped member 100 and the second plate-shaped member 101, and finally the curable resin ( 102 is a resin layer 102 'of 0.3 [mm].

While the joining operation is performed between (B) and (C) of FIG. 4, the second pillow lifting means 11 continuously lowers the second pillow 10 to set the height h2 of the supporting portion 10a as a target height. Let (h1) be.

In more detail, the 2nd pillow lifting means 11 lowers the 2nd pillow 10, ensuring the predetermined | prescribed joining angle (theta). Here, the "junction angle (theta)" means the angle which the line L1 and the horizontal line L2 which connect the pressing position by the roller 14 and the 2nd end 101c make (see FIG. 5). The joint angle θ needs to be 5 ° or more empirically. When the joining angle θ is less than 5 °, the curable resin 102 is squeezed between the first plate-like member 100 and the portion of the second plate-like member 101 not yet pressed by the roller 14. There is a fear that air bubbles are mixed in the resin layer 102 '.

Moreover, when the bending stress (amount of curvature) of the 2nd plate-shaped member 101 exceeds the allowable bending stress intrinsic to the 2nd plate-shaped member 101, there exists a possibility that the 2nd plate-shaped member 101 may be damaged or deteriorated. Accordingly, the second pillow elevating means 11 ensures a predetermined joining angle θ, and changes the height h2 within a range in which the bending stress of the second plate-like member 101 does not exceed the allowable bending stress. There is a need.

When the bonding operation is completed, the bonding stage 6 stops the suction holding of the first plate-shaped member 100. And the bonding body of the 1st plate-shaped member 100 and the 2nd plate-shaped member 101 is conveyed to the apparatus of a subsequent process, for example, the apparatus for hardening the resin layer 102 '.

As a result, according to the bonding apparatus 1a according to the first embodiment, since the second plate-like member 101 is bent, the portion and the first plate-shaped portion of the second plate-like member 101 which are not yet pressed by the rollers 14 are not. The curable resin 102 is spread by compression between the members 100, so that the two plate members 100 and 101 can be prevented from joining in a state in which bubbles are mixed. Further, according to the bonding apparatus 1a according to the first embodiment, since the thickness of the resin layer 102 'is determined by the heights of both pillows 7 and 10, the thickness of the resin layer 102' is easily and high precision. You can control the road.

[Second Embodiment-Configuration—Joint Operation]

Next, the configuration and the bonding operation of the bonding apparatus 1b according to the second embodiment will be described with reference to FIGS. 6 and 7. In addition, joining advances in the order of (A)-(B)-(C) of FIG.

The bonding apparatus 1b according to the present embodiment differs from the bonding apparatus 1a according to the first embodiment in that it includes a light source for irradiating UV light toward the curable resin 102. More specifically, the bonding apparatus 1b is a roller from the front of the joining direction and the first light source 16 which irradiates UV light at an arbitrary timing from the back of the joining direction toward the vicinity of the position initially pressed by the roller 14. Second light source 17 which irradiates UV light at an arbitrary timing toward the vicinity of the position finally pressed by 14, and continues to irradiate UV light toward the vicinity of a press position when a press position moves to a bonding direction. The third light sources 18 and 19 are further provided.

First, reference is made to FIG. 6A and FIG. 7A. The first light source 16 irradiates UV light for a few seconds before the roller 14 presses the second plate member 101 to slightly cure the curable resin 102. Thereby, when the 2nd plate-shaped member 101 is pressed, it can prevent more reliably that the curable resin 102 sticks out toward the 1st pillow 7 side.

Next, Figs. 6B and 7B are referred to. The third light sources 18 and 19 continue to irradiate UV light locally from both sides in the bonding direction toward the vicinity of the pressing position (more preferably, slightly ahead of the pressing position). Thereby, it can prevent more reliably that curable resin 102 sticks out from both sides of a joining direction when a press position moves to a joining direction. In addition, although the 3rd light source 18 and 19 continue irradiating UV light, since an irradiation area moves with movement of a press position, curable resin 102 does not fully harden | cure.

Next, FIGS. 6C and 7C are referred to. The second light source 17 is irradiated with UV light for a few seconds at a timing slightly earlier than the roller 14 reaches the pressing position closest to the second end portion 101c, thereby slightly applying the curable resin 102. Harden. Thereby, it can prevent more reliably that the curable resin 102 sticks out toward the 2nd pillow 10 side.

As a result, according to the bonding apparatus 1b which concerns on 2nd Example, by providing four light sources 16-19 which irradiate UV light, the curable resin 102 can be prevented from protruding from the whole direction more reliably. have.

[Modification]

As mentioned above, although the preferable Example of the bonding apparatus which concerns on this invention was described, this invention is not limited to these structures.

For example, the shape of the first pillow is not limited to the above, and various modifications are contemplated. As a modification, for example, there are first pillows 7 ', 7', 7 '' shown in Figs. 8A to 8C. In other words, the first pillow may be any shape as long as it is a shape capable of restricting the movement of the first end portion 101b of the second plate-like member 101 in the downward direction and the opposite direction to the joining. Similarly, the shape of the second pillow may be any shape as long as it is a shape capable of restricting the movement of the second end portion 101c in the downward direction and the joining direction, for example, shown in FIGS. 8A to 8C. It can be set as one 2nd pillow 10 ', 10 ", 10'".

Further, in the second embodiment, the curable resin 102 is slightly cured using four light sources 16 to 19 in total, but, for example, only the first light source 16 and the second light source 17 are used. The third light sources 18 and 19 may be omitted, or only the third light sources 18 and 19 may be used. In other words, when there is a portion where the curable resin 102 is not prone to protruding, or a portion which is not prone to protruding, the light source for irradiating UV light to the portion can be omitted. In addition, it is needless to say that when curable resin 102 is hardened by irradiating light of wavelength other than UV light, the light sources 16-19 which irradiate the light of the said wavelength are used.

Further, in each of the above embodiments, the stage moving means 4 moves in the opposite direction to the joining and the roller 14 moves relatively in the joining direction. On the contrary, the roller 14 remains fixed while the stage moving means 4 is fixed. You may perform bonding by moving to the joining direction. In any case, the pressing position moves in the joining direction.

In addition, in each of the above embodiments, the pressing position is moved only in one direction, but this may be done in both directions. That is, in the pressing position, in the second plate-like member 101 in which the intermediate position between the first end portion 101b and the second end portion 101c is pressed to form a U shape, first, from the intermediate position toward the first end portion 101b. It moves in the opposite direction of the joining, and then moves in the joining direction toward the second end 101c. In this case, the first pillow 7 is lowered to the target height h1 as the pressing position is closer to the first pillow 7, and the second pillow 10 is closer to the second pillow 10 at the pressing position. Accordingly, the target height h1 is lowered. Also in this configuration, since bonding is performed in a state in which the second plate member 101 is bent, bubbles can be prevented from mixing in the resin layer 102 '.

1a, 1b: bonding device
4: stage moving means
6: joining stage
6a: adsorption nozzle
7: first pillow
7a: support part
8: first pillow lifting means
10: second pillow
10a: support
11: second pillow lifting means
14 roller (pressing means)
15: roller lifting means
16: first light source
17: second light source
18, 19: third light source
20:
21: pump
100: first plate member (touch panel)
100a: joint surface
101: second plate member (cover glass)
101a: joint surface
101b: first end
101c: second end
102: curable resin
102 ': resin layer

Claims (7)

After the position adjustment of the 1st plate-shaped member mounted on the joining stage and the 2nd plate-shaped member located above the said 1st plate-shaped member, by the press means located above the said 2nd plate-shaped member A joining apparatus for joining the second plate member to the first plate member by changing the relative position of the pressing means with respect to the second plate member in the joining direction while pressing the second plate member,
Curable resin which spreads by crimping | compression-bonding between the said 1st plate-shaped member and said 2nd plate-shaped member, and becomes a resin layer of a predetermined thickness is previously arrange | positioned at the joining surface of a said 1st plate-shaped member or the said 2nd plate-shaped member, ,
The first end and the second end which are located at both ends of the joining direction of the second plate-like member are supported by the supporting portions of the first pillow and the second pillow, the upper and lower positions of which can be controlled, respectively, and at least downward. Movement is regulated,
The height of at least one of the support portions of the first pillow and the second pillow is made higher than a target height obtained by adding the height of the bonding surface of the first plate-like member to the predetermined thickness of the resin layer, thereby reducing the height of the second plate-shaped member. The bonding apparatus which prevented the said curable resin from spreading by crimping | compression-bonding between the part which has not yet been pressed by the said press means and the said 1st plate-shaped member.
The method of claim 1,
The said curable resin consists of photocurable resin or a thermosetting resin, The bonding apparatus characterized by the above-mentioned.
The method according to claim 1 or 2,
The pressing position by the pressing means is moved from the first end toward the second end,
The height of the support of the first pillow is maintained at the target height,
And the height of the supporting portion of the second pillow changes from the height higher than the target height to the target height as the pressing means approaches the second end.
The method of claim 3, wherein
The said curable resin is arrange | positioned in the shape which combined the some line parallel or perpendicular to the said bonding direction, The bonding apparatus characterized by the above-mentioned.
The method of claim 3, wherein
A first light source capable of irradiating light at an arbitrary timing toward the vicinity of the position initially pressed by the pressing means from the back in the bonding direction, and from the front in the bonding direction toward the vicinity of the position finally pressed by the pressing means. And a second light source capable of irradiating light at a timing of
Said curable resin is photocurable resin hardened | cured by the light irradiated from the said 1st and 2nd light source, The bonding apparatus characterized by the above-mentioned.
The method of claim 3, wherein
And a third light source for continuously irradiating light toward the vicinity of the pressing position while the pressing position by the pressing means is moving from the first end toward the second end,
Said curable resin is photocurable resin hardened | cured by the light irradiated from a said 3rd light source, The bonding apparatus characterized by the above-mentioned.
The method according to claim 1 or 2,
The pressing position by the pressing means moves toward the first end after moving toward the first end at an intermediate position between the first end and the second end,
The height of the support of the first pillow is changed from the height higher than the target height to the target height as the pressing means approaches the first end, and the height of the support of the second pillow is determined by the pressing means of the second end. Joining apparatus, characterized in that the change from the height higher than the target height as the closer to the target height.

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