KR20110134756A - Electronic component transferring device and electronic component transferred method using the same - Google Patents

Electronic component transferring device and electronic component transferred method using the same Download PDF

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Publication number
KR20110134756A
KR20110134756A KR1020100054508A KR20100054508A KR20110134756A KR 20110134756 A KR20110134756 A KR 20110134756A KR 1020100054508 A KR1020100054508 A KR 1020100054508A KR 20100054508 A KR20100054508 A KR 20100054508A KR 20110134756 A KR20110134756 A KR 20110134756A
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KR
South Korea
Prior art keywords
rail
substrate
rails
electronic component
path
Prior art date
Application number
KR1020100054508A
Other languages
Korean (ko)
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KR101566301B1 (en
Inventor
반종억
Original Assignee
삼성테크윈 주식회사
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Priority to KR1020100054508A priority Critical patent/KR101566301B1/en
Publication of KR20110134756A publication Critical patent/KR20110134756A/en
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Publication of KR101566301B1 publication Critical patent/KR101566301B1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G17/00—Conveyors having an endless traction element, e.g. a chain, transmitting movement to a continuous or substantially-continuous load-carrying surface or to a series of individual load-carriers; Endless-chain conveyors in which the chains form the load-carrying surface
    • B65G17/30—Details; Auxiliary devices
    • B65G17/32—Individual load-carriers
    • B65G17/323—Grippers, e.g. suction or magnetic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G21/00—Supporting or protective framework or housings for endless load-carriers or traction elements of belt or chain conveyors
    • B65G21/20—Means incorporated in, or attached to, framework or housings for guiding load-carriers, traction elements or loads supported on moving surfaces
    • B65G21/22—Rails or the like engaging sliding elements or rollers attached to load-carriers or traction elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G23/00—Driving gear for endless conveyors; Belt- or chain-tensioning arrangements
    • B65G23/02—Belt- or chain-engaging elements
    • B65G23/20—Screws
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components

Abstract

PURPOSE: An electronic component transfer apparatus and an electronic component transfer method using the same are provided to supply different kinds of electronic components on a printed circuit board transferred in forward and backward directions, thereby significantly reducing a component mounting space. CONSTITUTION: A rail(110) transfers a plurality of substrates(120). The rail includes a first rail(111), a second rail(112), a third rail(113), a fourth rail(114), and a fifth rail. A first stage(S1), a second stage(S2), a third stage(S3), a fourth stage(S4), and a fifth stage(S5) are arranged on a substrate transfer path. A plurality of component supply parts(130) is installed in the outside of an outermost rail. A plurality of header parts(140) is located between the outermost rail and component supply part.

Description

Electronic component transferring device and electronic component transferred method using the same

The present invention relates to an electronic component transfer apparatus, and more particularly, an electronic component transfer apparatus and an electronic component transfer method using the same, which reduce mounting space when mounting electronic components on a substrate transferred on a conveyor and reduce interference between component supply units. It is about.

In general, in a line for mounting an electronic component on a printed circuit board, rails of a substrate transfer conveyor are arranged in a plurality of rows to transfer the substrate from one direction to another.

Conventionally, in order to increase the speed of mounting an electronic component on a printed circuit board, a structure in which two component supply parts are arranged before and after each in two rows of conveyor structures is adopted.

In a conventional method, the position of the printed circuit board is positioned adjacent to the component supply section by fixing the outermost rail of the plurality of rows of rails. The above-described structure can shorten the moving distance for mounting the electronic components and avoid the positional interference between the front and rear component supply portions, so that the speed of mounting the components is high, while the number of component supply portions for supplying the components is two. It takes a lot of time and takes a lot of time to prepare the parts supply. In addition, as the number of parts supply parts increases, much installation space therefor is required.

The conventional method of fixing a central rail among a plurality of rows of rails can reduce the number of parts supply parts by supplying all the electronic parts to the two rows of printed circuit boards while mounting the parts. At the time of interfering with each other between the front and rear parts supply, the waiting time increases, and the mounting efficiency of the parts decreases.

The present invention provides an electronic component transfer device capable of improving component mounting efficiency by mounting an electronic component in a process of transferring a printed circuit board forwarded on a conveyor in a forward direction and then forwarding it again in a forward direction, and an electronic device using the same. It is a main problem to provide a component transfer method.

Electronic component transfer method using the electronic component transfer apparatus according to an aspect of the present invention in order to achieve the above object,

Supplying a substrate from the inlet of the conveyor; and

Transferring the supplied substrate along a plurality of transfer paths formed between rails of a conveyor arranged in a plurality of rows; and

And discharging the substrate to the outlet of the conveyor.

The rail is characterized in that to adjust the interval of the transfer path in accordance with the size of the substrate to be supplied.

In addition, the inlet and outlet sides of the plurality of rails are provided with first and second guide rails having a transport path in a direction intersecting with them, and first and second shuttle rails coupled to and reciprocating with each other, The substrate is fed into the transfer path between the rails of the.

Furthermore, receiving the substrate to transfer in the forward direction of the first transfer path of the rail;

Receiving the substrate and transferring the substrate in a reverse direction of a second transfer path of a rail; And

And receiving the substrate again to transfer the substrate in the forward direction of the third transfer path of the rail.

In addition, the substrate transported in the forward direction of the first conveyance path of the rail and the reverse direction of the second conveyance path of the rail is classified and supplied, respectively, on the first shuttle rail provided on the inlet side between the plurality of rails. The substrate is supplied in the reverse direction of the second transfer path of the rail on the second shuttle rail provided on the outlet side.

Electronic component transfer method according to another aspect of the present invention,

The present invention relates to a method for transferring an electronic component for transferring a substrate on a transfer path between rails of a conveyor arranged in rows.

Transferring the substrate from the inlet of the conveyor in a forward direction along a first transfer path between rails;

Receiving the substrate and transferring the substrate in a reverse direction of a second transfer path between rails; And

And receiving the substrate again, transferring the substrate in the forward direction of the third transfer path of the rail and discharging the substrate to the exit of the conveyor.

In addition, the inlet and outlet sides of the plurality of rails are provided with first and second guide rails having a movement path in a direction intersecting with the first rails, and first and second shuttle rails reciprocatingly engaged with these, respectively,

The substrate conveyed from the forward direction of the first transport path of the rail is moved from the front rail to the rear rail by the second shuttle rail and supplied in the reverse direction of the second transport path of the rail,

The substrate conveyed from the reverse direction of the second conveying path of the rail is moved from the rear rail to the forward rail by the first shuttle rail and then fed back in the forward direction of the third conveying path of the rail.

In addition, each of the rails are at least one drive unit, a screw coupled thereto, a pulley system, or a gear system to close the gap to each other, widen together, or at least one rail to move independently It is characterized by.

In addition, a component supply part for supplying electronic parts and a header part for adsorbing the parts are positioned at the outermost part of the rail, and the electronic part adsorbed by the header part is mounted on a substrate that is moved on a transfer path.

Electronic component conveying apparatus according to another aspect of the present invention,

Has a plurality of transport paths between the rails arranged in a plurality of rows,

A plurality of rails of the conveyor having a rail arranged to have a conveying path for conveying the substrate along the forward direction, and a rail arranged to have a conveying path for conveying the substrate along the reverse direction; And

And a component supply unit installed at the outermost side of the rail and mounting the electronic component adsorbed by the header unit on the substrate.

As described above, the electronic component conveying apparatus and the electronic component conveying method using the same of the present invention can supply different kinds of electronic components on the printed circuit board to be transferred in the forward and reverse directions from the component supply unit installed before and after, The space in which components are mounted can be greatly reduced. In addition, since interference between the component supply parts can be avoided from each other, the mounting efficiency can be greatly improved.

1 is a configuration diagram schematically showing an electronic component transfer apparatus according to an embodiment of the present invention;
2 is a configuration diagram schematically showing an electronic component transport apparatus according to another embodiment of the present invention;
3 is a configuration diagram schematically showing an electronic component transport apparatus according to another embodiment of the present invention;
4 is a configuration diagram schematically showing an electronic component transport apparatus according to another embodiment of the present invention;
5 is a configuration diagram schematically showing an electronic component transport apparatus according to another embodiment of the present invention;
6 is a configuration diagram schematically showing an electronic component transport apparatus according to another embodiment of the present invention;
7 is a configuration diagram schematically showing an electronic component transport apparatus according to another embodiment of the present invention;
8 is a configuration diagram schematically showing an electronic component transport apparatus according to another embodiment of the present invention.

Hereinafter, preferred embodiments will be described in detail with reference to the accompanying drawings.

1 illustrates an electronic component transfer apparatus 100 according to an embodiment of the present invention.

The electronic component transfer device 100 of the present embodiment is a case where the substrate 120 is transferred between the rails 110 having three rows of transfer paths in the forward and reverse directions.

Referring to the drawings, the rail 110 of the conveyor having a plurality of transfer paths for transferring the plurality of substrates 120 is arranged in a plurality of rows in the electronic component transfer device 100. The rail 110 includes a first rail 111, a second rail 112, a third rail 113, and a fourth rail 114 arranged to be spaced apart from each other in a front-rear direction (up and down direction in the drawing). do. In this embodiment, the structure in which the rails 111 to 114 in four rows are arranged to be spaced apart from each other is described, but the number of rails is not limited thereto.

The first to fourth rails 111 to 114 may move together forward or rearward, or may have a structure in which either rail can move independently. To this end, the first to fourth rails 111 to 114 may include at least one driving unit, a lead screw, a pulley system, a gear system, and the like. Since it is a conventional moving means for moving 111-114), the description about these coupling relationship is abbreviate | omitted here.

The transfer paths to which the plurality of substrates 120 are transferred are provided between the plurality of rails 111 to 114. In this case, a first stage S1, a second stage S2, a third stage S3, a fourth stage S4, and a fifth stage S5 are provided on respective paths through which the substrate 120 is transferred. In each stage, different electronic components may be continuously mounted on the substrate 120.

A plurality of component supply parts 130 are provided on the outer side of the rails 111 and 114 arranged at the outermost side among the plurality of rails 111 to 114. The component supply unit 130 supplies different components for mounting on the substrate 120 for each of the first stage S1, the second stage S2, the third stage S3, and the fourth stage S4. . Between the outermost rails 111 and 114 and the plurality of component supply units 130, a plurality of header units 140 for absorbing and mounting the electronic components supplied from the component supply unit 130 onto the substrate 120. ) Is located.

Looking at the operation of the electronic component transfer device 100 having the configuration as described above are as follows.

The substrate 120 supplied to the inlet of the conveyor is conveyed in the first direction (ie, the forward direction) along the first transport path between the first rail 111 and the second rail 112, and from the component supply unit 130. The header part 140, which absorbs the electronic component, mounts different types of electronic components on the substrate 120 in the first stage S1 and the second stage S2.

Subsequently, the substrate 120 is transferred to the third rail 113 and the fourth rail 114 installed at the rear side using the guide rail and the shuttle rail (see FIG. 2) separately provided, and the third rail 113 and , By feeding the substrate 120 along the second transfer path between the fourth rails 114, the substrate 120 is transferred in the second direction (that is, the reverse direction), and the third stage S3 and the fourth stage S4. ) Will mount other electronic components. As described above, the second direction (ie reverse direction) of the second transfer path is the opposite direction with respect to the first direction (ie, positive direction) of the first transfer path.

The substrate 120 supplied from the second transfer path is again formed along the third transfer path between the second rail 112 and the third rail 113 corresponding to the first transfer path and the second transfer path. It is transported in one direction (ie, forward direction) and discharged to the exit of the conveyor.

Meanwhile, a fifth stage S5 for mounting an electronic component may be further installed on the third transfer path.

As such, the electronic component transfer apparatus 100 includes a third rail in which the substrate 120 transferred in the first direction (that is, in the forward direction) between the first rail 111 in the front row and the second rail 112 is in the rear row. The substrate 120 transported in the second direction (that is, in the reverse direction) between the rail 113 and the fourth rail 114 and supplied again in the reverse direction includes the second rail 112 and the third rail in the center row. It is conveyed in the first direction (i.e., in the forward direction) through the 113 and then fed to another device.

In addition, guide rails and shuttle rails, which will be described later, are installed at the inlet and outlet sides of the first to fourth rails 111 to 114 to allow the substrate 120 to be transported in the forward and reverse directions to be moved to another transport path. .

Accordingly, different types of electronic components can be supplied along the rails of the front row and the rear row, so that the space of the electronic component transfer device 100 can be reduced by half, and interference between the component supply units 130 can be avoided from each other. The efficiency can be greatly increased.

2 illustrates an electronic component transport apparatus 200 according to another embodiment of the present invention.

The electronic component transfer apparatus 200 of the present embodiment is a case where the substrate 120 is transferred between the rails 210 having three rows of transfer paths in the forward and reverse directions.

Referring to the drawings, the electronic component transfer apparatus 200 is arranged so that the rail 210 for transferring the plurality of substrates 220 forms a plurality of rows. The rail 210 may include a first rail 211, a second rail 212, a third rail 213, a fourth rail 214, and a fifth rail 215 arranged to be spaced apart from each other in the front-rear direction. Include.

In this case, the first rail 211 and the fifth rail 215 located farthest away from the first rail 211 are fixed (A), and the second rail positioned between the first rail 211 and the fifth rail 215. The 212, the third rail 213, and the fourth rail 214 are independently provided to be movable back and forth.

The manner in which the second to fourth rails 212 to 214 are variable may be any one of the means of transportation well known to those skilled in the art. For example, the lead screws having a plurality of spiral structures may be coupled to the second to fourth rails 212 to 214, and the gap may be adjusted by receiving rotational force from the at least one driving unit through the pulley system. It is not limited.

The respective paths through which the substrate 120 is transported are provided between the plurality of rails 211 to 215. A first conveyance path is formed between the first rail 211 and the second rail 212, and a second conveyance path is formed between the fourth rail 214 and the fifth rail 215, and the third rail A third transport path is formed between 213 and the fourth rail 214.

Meanwhile, as shown in FIG. 1, different types of electronic components are placed on the outermost surfaces of the first rail 211 and the fifth rail 215 on the substrate 220 transported along the respective transport paths. Of course, the header portion and the component supply portion for mounting are installed.

In this case, a pair of first guide rails 260 are installed at the inlet side of the first rail 211 and the second rail 212, and at the outlet sides of the first rail 211 and the second rail 212. A pair of 2nd guide rail 280 is provided. The first guide rail 260 and the second guide rail 280 are positioned in the direction crossing the first to fifth rails 211 to 215.

A pair of first shuttle rails 270 reciprocating along the pair of first guide rails 260 is installed, and a pair of second shuttle rails 290 on the pair of second guide rails 280. ) Is installed. The first shuttle rail 270 and the second shuttle rail 290 maintain the same height with respect to the first to fifth rails 211 to 215, and thus the first to fifth rails 211 to 215. Provides a path for supplying and discharging the substrate 220 to be transferred through the first to the third transfer path between).

Looking at the operation of the electronic component transfer device 200 having the configuration as described above are as follows.

The second to fourth rails 212 to 214 may be adjusted by being moved independently by moving means provided separately according to the size of the substrate 220.

Next, the first rail 211 and the pair of first shuttle rails 270 reciprocating on the first guide rail 260 on the inlet side of the second rail 212 are located, The substrate 220 supplied through the first shuttle rail 270 is transferred in a first direction (ie, a forward direction) along a first transfer path between the first rail 211 and the second rail 212. The substrate 220 transferred along the first transfer path mounts the electronic component by a header unit which sucks the electronic component from the component supply unit.

Subsequently, a pair of second shuttle rails 290 reciprocating are positioned on the first rail 211 and the second guide rail 280 on the outlet side of the second rail 212. The substrate 220 transferred to the second shuttle rail 290 may include the fourth rail 214 and the second shuttle rail 290 transferred from the front to the rear along the second guide rail 280. 5 is moved to the inlet side of the rail (215).

Next, the substrate 220 is supplied in the second transfer path between the fourth rail 214 and the fifth rail 215, and the supplied substrate 220 is transferred in the second direction (ie, reverse direction). In the transfer process, electronic components are mounted. At this time, the second direction (ie, reverse direction) of the second transfer path is opposite to the first direction (ie, positive direction) of the first transfer path.

The substrate 220 transferred along the second transfer path is transferred to a pair of first shuttle rails 270 positioned at an inlet side between the fourth rail 214 and the fifth rail 215, and The first shuttle rail 270 is transferred from the rear to the front along the first guide rail 260, so that the substrate 220 moves toward the inlet side of the third rail 213 and the fourth rail 214. Will be supplied.

The substrate 220 supplied from the second conveyance mirror is conveyed again in the first direction (ie, the forward direction) along the third conveyance path between the third rail 213 and the fourth rail 214 located at the center. do. Subsequently, it is discharged to the exit of the conveyor via the pair of second shuttle rails 290.

As such, the substrate 220 transferred in the first direction (ie, the forward direction) between the first rail 211 and the second rail 212 in the front row is forwarded by the pair of second shuttle rails 290. Is transferred rearward, and the transferred substrate 220 is transported in a second direction (ie, reverse direction) between the fourth rail 214 and the fifth rail 215 in the rear row, and the pair of first shuttles The substrate 220 transferred from the rear to the front by the rail 270 is transferred between the third rail 213 and the fourth rail 214 in the center row, and is then supplied to another device.

In addition, the outermost first rail 211 and the fifth rail 215 are fixed, and the second to fourth rails 212 to 214 located at the center are independent of the size of the substrate 220. By adjusting the intervals, the distance for supplying the electronic components can be reduced, and the component mounting time can be reduced. In addition, the space in which the electronic component transfer device 300 is installed can be reduced by half.

3 illustrates an electronic component transport apparatus 300 according to another embodiment of the present invention.

In the electronic component transfer apparatus 300 of the present embodiment, the substrate 320 is transferred in the forward and reverse directions, and the first rail 311 and the sixth rail 316 are fixed (A), and the second rail 312 , The third rail 313, the fourth rail 314, and the fifth rail 315 are independent.

Referring to the drawings, the electronic component transfer apparatus 300 is arranged in a plurality of rows of the rail 310 of the conveyor for transferring a plurality of substrates (320). The rail 310 may include a first rail 311, a second rail 312, a third rail 313, a fourth rail 314, a fifth rail 315, and spaced apart from each other in the front-rear direction. Sixth rail 316 is included.

The respective paths through which the substrate 320 is transferred are provided between the plurality of rails 311 to 316. A first conveyance path is formed between the first rail 311 and the second rail 312, and a second conveyance path is formed between the fifth rail 215 and the sixth rail 216. A third transfer path is formed between the rail 213 and the fourth rail 214.

At this time, the first rail 311 and the sixth rail 316 located farthest away from each other are fixed (A), and the second rail located between the first rail 311 and the sixth rail 316. The 312, the third rail 313, the fourth rail 314, and the fifth rail 315 are interlocked with each other.

The manner in which the second rail 312 to the fifth rail 315 interlock is the second rail 312 to the fifth rail 315 on the lead screw coupled thereto using a single driving unit, which is a conventional moving means. To move in conjunction with the pulley system.

Accordingly, the width W1 of the first transport path between the first rail 311 and the second rail 312 and the width of the second transport path between the fifth rail 315 and the sixth rail 316. (W2) and the width W3 of the 3rd conveyance path | route between the 3rd rail 313 and the 4th rail 314 can be space-controlled by the same width mutually.

A component supply unit 330 for mounting different types of electronic components on the first rail 311 positioned at the outermost side and the outside of the sixth rail 316 on the substrate 320 transferred along each transfer path. And a header portion 340 is provided.

Meanwhile, at the inlet and outlet sides of the first to sixth rails 311 to 316, as illustrated in FIG. 2, a pair of first guide rails and a pair of second guide rails are disposed in an intersecting direction. The pair of first shuttle rails and the pair of second shuttle rails which are positioned and reciprocate along them are installed on the first guide rail and the second guide rail.

In the electronic component transfer apparatus 300 having the above configuration, the substrate 320 transferred in the first direction (that is, in the forward direction) between the first rail 311 and the second rail 312 in the front row is transferred. After the electronic components have been mounted in the process, the pair of second shuttle rails are transferred from the front to the rear, and the transferred substrate 320 includes the fifth rail 315 and the sixth rail 316 in the rear row. The substrate 320, which is conveyed in the second direction (that is, the reverse direction) through the other, is mounted in the process of being conveyed, and is conveyed from the rear to the front by the pair of first shuttle rails. The gas is discharged between the third rail 313 and the fourth rail 314 and then supplied to another device.

In this case, the second to fifth rails 312 to 315 are moved in conjunction with each other by one driving unit, such that the first transfer path between the first rail 311 and the second rail 312 and the third rail. The third transfer path between 313 and the fourth rail 314 and the second transfer path between the fifth rail 315 and the sixth rail 316 are controllable to the same width.

4 illustrates an electronic component transport apparatus 400 according to another embodiment of the present invention.

The electronic component transfer apparatus 400 of the present embodiment is a case where the substrate 420 is transferred between the rails 410 having three rows of transfer paths in the forward and reverse directions.

Referring to the drawings, the electronic component transfer device 400 is arranged in a plurality of rows of rails 410 of the conveyor for transferring a plurality of substrates (420). The rail 410 may include a first rail 411, a second rail 412, a third rail 413, a fourth rail 414, and a fifth rail 415 arranged to be spaced apart from each other in the front-rear direction. Include.

The respective paths through which the substrate 420 is transported are provided between the plurality of rails 411 to 415, and a first transport path is formed between the first rail 411 and the second rail 412, and the fourth path A second transport path is formed between the rail 414 and the fifth rail 415, and a third transport path is formed between the third rail 413 and the fourth rail 414.

In this case, the first rail 411 and the fifth rail 415 located farthest away from each other are fixed (A), and the second rail located between the first rail 411 and the fifth rail 415 is provided. The 412 and the four rails 414 are installed to be narrower or wider in cooperation with each other according to the type of electronic component to be transferred, and the third rail 413 is installed to be movable independently.

To this end, a movement method in which the second rail 412 and the fourth rail 414 are interlocked, or a method in which the third rail 413 moves independently is known using at least one driving unit. By moving interlocked or independently on the joined lead screw.

A component supply unit 430 for mounting different types of electronic components on a substrate 420 to be transported along each transport path on the outer side of the first rail 411 and the fifth rail 415 located at the outermost side; The header part 440 is provided.

Meanwhile, as illustrated in FIG. 2, a plurality of guide rails and a plurality of shuttle rails linearly reciprocating on the guide rails are installed at the inlet and outlet sides of the first to fifth rails 411 to 415. Of course.

The electronic component transfer apparatus 400 having the above-described configuration includes a substrate 420 transferred in a first direction (that is, in a forward direction) between the first rail 411 and the second rail 412 in the front row. The substrate 420 is moved from the front to the rear by a pair of second shuttle rails, and the moved substrate 420 is in a second direction (ie, reverse direction) between the fourth rail 414 and the fifth rail 415 in the rear row. The substrate 420 transferred and moved from the rear to the front by the pair of first shuttle rails is again in a first direction (ie, a forward direction) between the third row 413 and the fourth rail 414 in the central row. ) And then supply it to another device.

At this time, the second rail 412 and the fourth rail 414 are moved in conjunction with each other by one driving unit, the third rail 413 is independently moved by another driving unit, the first rail 411 And a first conveyance path between the second rail 412, a fourth conveyance path between the fourth rail 414, and the fifth rail 415, and a third rail 413 and a fourth rail 414. It is possible to adjust the third transfer paths between the wafers at desired intervals according to the size of the substrate 420 to be transferred, the size and type of the electronic component.

5 illustrates an electronic component transport apparatus 500 according to another embodiment of the present invention.

The electronic component conveying apparatus 500 of this embodiment is a case where the large board | substrate 520 which is hard to supply by 2 rows is supplied to central row.

Referring to the drawings, the electronic component transport apparatus 500 is arranged in a plurality of rows of the rail 510 of the conveyor for transporting a plurality of substrates 520, the rail 510 is a first rail 511, A second rail 512, a third rail 513, a fourth rail 514, and a fifth rail 515 are included.

At this time, the first rail 511 and the fifth rail 515 located farthest away from each other are fixed (A), and the third rail 513 located in the center row is independently movable. Since the third rail 513 can be driven independently, the large substrate 520 can be supplied through a central column.

6 illustrates an electronic component transport apparatus 600 according to another embodiment of the present invention.

The electronic component transfer apparatus 600 of this embodiment is a case where the substrate 620 is transferred between the rails 610 having three rows of transfer paths in the forward and reverse directions.

Referring to the drawings, the electronic component transfer apparatus 600 is arranged such that a rail 610 for transferring a plurality of substrates 620 forms a plurality of rows. The rail 610 may include a first rail 611, a second rail 612, a third rail 613, a fourth rail 614, and a fifth rail 615 arranged to be spaced apart from each other in the front-rear direction. Include.

In this case, the first rail 611 and the fifth rail 615 located farthest away from the first rail 611 are fixed (A), and the second rail positioned between the first rail 611 and the fifth rail 615 is fixed. The rail 612, the third rail 613, and the fourth rail 614 are independently provided to be movable back and forth.

The respective paths through which the substrate 620 is transferred are provided between the plurality of rails 611 to 615. A first transport path is formed between the first rail 611 and the second rail 612, and a second transport path is formed between the third rail 613 and the fourth rail 614. A third conveyance path is formed between the four rails 614 and the fifth rail 615.

Meanwhile, a component supply unit for mounting different kinds of electronic components on a substrate 620 transported along each transport path on the outer side of the first rail 611 and the fifth rail 615 located at the outermost portion ( 630 and a header portion 640 are provided.

At this time, the pair of first guide rails reciprocating along the pair of first guide rails 660 and the first guide rails 660 on the inlet side of the first rail 611 and the second rail 612. 670 is installed. A pair of second guide rails 680 and a pair of second shuttle rails 690 reciprocating along the second guide rails 680 are located at the exit sides of the first rail 611 and the second rail 612. ) Is installed.

Looking at the operation of the electronic component transfer device 600 having the configuration as described above are as follows.

The second to fourth rails 612 to 614 are provided with a substrate 620 supplied by being moved independently by a moving means separately provided according to the size of the substrate 620, and the gap is adjusted according to the type of electronic component. do.

Next, the first rail 611 and a pair of first shuttle rails 670 reciprocating on the first guide rail 660 on the inlet side of the second rail 612 are located, The substrate 620 supplied through the first shuttle rail 670 is transferred in a first direction (ie, a forward direction) along a first transfer path between the first rail 611 and the second rail 612. The substrate 620 transferred along the first transfer path may mount the electronic component by the header portion 640 that sucks the electronic component from the component supply 630.

The substrate 620 is transferred by a pair of second shuttle rails 690 reciprocating on the second guide rail 680, and then, a third rail 613 and a fourth rail ( The substrate 620 supplied to the second transfer path between the 614 and the substrate 620 is transferred in the second direction (ie, the reverse direction), and mounts the electronic component in the transfer process.

The substrate 620 transferred along the second transfer path transfers the substrate 620 by a pair of first shuttle rails 670 reciprocating on the first guide rail 660, and then the fourth rail ( 614 is supplied to the third transfer path between the fifth rail 615, and the supplied substrate 620 is transferred in the first direction (ie, the forward direction). Subsequently, it is discharged to the exit of the conveyor via the pair of second shuttle rails 690.

As such, the substrate 620 transferred in the first direction (that is, the forward direction) between the first rail 611 and the second rail 612 in the front row is centered by the pair of second shuttle rails 690. And the transferred substrate 620 are transferred in a second direction (ie, reverse direction) between the third rail 613 and the fourth rail 614 in the central row, and the pair of first shuttle rails ( The substrate 620 transferred by the 670 has a structure that is transferred between the fourth rail 614 and the fifth rail 615 in the rear row and then supplied to another device.

7 illustrates an electronic component transport apparatus 700 according to another embodiment of the present invention.

The electronic component transfer apparatus 700 of this embodiment is a case where the board | substrate 720 which is hard to supply in 3 rows is supplied in 2 rows.

Referring to the drawings, the electronic component transfer apparatus 700 is arranged such that a rail 710 for transferring a plurality of substrates 720 forms a plurality of rows. The rail 710 may include a first rail 711, a second rail 712, a third rail 713, a fourth rail 714, and a fifth rail 715 arranged to be spaced apart from each other in the front-rear direction. Include. The first rail 711 and the fifth rail 715 located farthest away from each other are fixed (A).

In this case, the substrate 720 is supplied onto the pair of first shuttle rails 770 reciprocating along the first guide rails 760 on the inlet side of the first rail 711 and the second rail 712. Is transferred in a first direction (ie, a forward direction) between the first rail 711 and the second rail 712. The substrate 720 transferred along the first transfer path may mount the electronic component by the header part 740 that sucks the electronic component from the component supply part 730. Subsequently, it is discharged along the first rail 711 and the pair of second shuttle rails 790 reciprocating on the second guide rail 780 on the outlet side of the second rail 712.

The substrate 720 transported by the first shuttle rail 770 may be transported in a first direction (ie, a forward direction) between the fourth rail 714 and the fifth rail 715. An electronic component of the same or different type as the electronic component mounted on the substrate 720 transferred along the first transfer path may be mounted on the substrate 720 transferred along the second transfer path. The substrate 720 transferred along the second transfer path is discharged along the pair of second shuttle rails 790.

8 illustrates an electronic component transport apparatus 800 according to another embodiment of the present invention.

The electronic component transfer apparatus 800 of this embodiment transfers the board | substrate 820 between the rails 810 which have 3 rows of transfer paths in a forward direction and a reverse direction.

Referring to the drawings, the electronic component transfer apparatus 800 is arranged such that the rails 810 for transferring the plurality of substrates 820 form a plurality of rows. The rail 810 includes a first rail 811, a second rail 812, a third rail 813, a fourth rail 814, and a fifth rail 715 arranged to be spaced apart from each other in the front-rear direction. Include. The first rail 711 and the fifth rail 715 located farthest away from each other are fixed (A).

At this time, the substrate 820 supplied onto the pair of first shuttle rails 870 reciprocating along the first guide rail 860 on the inlet side of the first rail 811 and the second rail 812. Is transferred in the first direction (ie, the forward direction) between the first rail 811 and the second rail 812.

The pair of second shuttle rails reciprocating along the second guide rail 880 on the exit side of the first rail 811 and the second rail 812 is transferred along the first transfer path. It is moved by 890, and is transferred in a second direction (ie, reverse direction) between the third rail 813 and the fourth rail 814 corresponding to the center row.

The substrate 820 transferred along the second conveyance path is supplied to the third conveyance path between the fourth rail 814 and the fifth rail 815 by the first shuttle rail 870, and then again to the first direction ( That is, it is conveyed in the forward direction, and can be discharged to the outlet.

Although the present invention has been described with reference to one embodiment shown in the drawings, this is merely exemplary, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

200 ... Electronic component feeder 210 ... Rail
211 ... first rail 212 ... second rail
213 ... third rail 214 ... fourth rail
215 ... Fifth Rail 220 ... Substrate
230 ... Parts supply 240 ... Header
260 ... 1st guide rail 270 ... 1st shuttle rail
280 ... 2nd guide rail 290 ... 2nd shuttle rail

Claims (12)

Supplying a substrate from the inlet of the conveyor; and
Transferring the supplied substrate along a plurality of transfer paths formed between rails of a conveyor arranged in a plurality of rows; and
And discharging the substrate to the outlet of the conveyor.
The rail is an electronic component transfer method, characterized in that for adjusting the interval of the transfer path in accordance with the size of the substrate supplied. The method of claim 1,
On the inlet and outlet sides of the plurality of rails, first and second guide rails having a transfer path in a direction intersecting with the plurality of rails, and first and second shuttle rails coupled to and reciprocating with each other, are installed. An electronic component transfer method characterized by supplying the substrate in a transfer path therebetween. The method of claim 2,
Receiving the substrate and transferring the substrate in a forward direction of a first transfer path of a rail;
Receiving the substrate and transferring the substrate in a reverse direction of a second transfer path of a rail; And
Receiving the substrate again, and transferring the substrate in the forward direction of the third transfer path of the rail. The method of claim 3, wherein
On the first shuttle rail provided on the inlet side between the plurality of rails, the substrates conveyed in the forward direction of the first transport path of the rail and the reverse direction of the second transport path of the rail are classified and supplied, respectively, and the outlet side between the plurality of rails. And a substrate is supplied in a reverse direction of a second transfer path of the rail on a second shuttle rail installed in the second component. The present invention relates to a method for transferring an electronic component for transferring a substrate on a transfer path between rails of a conveyor arranged in rows.
Transferring the substrate from the inlet of the conveyor in a forward direction along a first transfer path between rails;
Receiving the substrate and transferring the substrate in a reverse direction of a second transfer path between rails; And
And receiving the substrate again, transferring the substrate in the forward direction of the third transfer path of the rail and discharging it to the exit of the conveyor. The method of claim 5, wherein
First and second guide rails having a movement path in a direction intersecting the plurality of rails are provided at the inlet and the outlet sides of the plurality of rails, and first and second shuttle rails reciprocatingly engaged with each other,
The substrate conveyed from the forward direction of the first transport path of the rail is moved from the front rail to the rear rail by the second shuttle rail and supplied in the reverse direction of the second transport path of the rail,
The substrate conveyed from the reverse direction of the second conveyance path of the rail is moved by the first shuttle rail from the rear rail toward the forward rail, and the electronic component conveying method characterized in that for feeding again in the forward direction of the third conveyance path of the rail . The method of claim 5, wherein
Rails arranged in the outermost of the plurality of rails is fixed,
A plurality of rails arranged in between are interlocked with each other, or the rails arranged in the center are moved independently to adjust the distance between each other. 6. The method according to claim 1 or 5,
Each of the rails may be at least one drive unit, a screw coupled thereto, a pulley system, or a gear system to narrow the gaps or widen them with respect to each other, or at least one rail moves independently. Electronic component conveyance method to use. 6. The method according to claim 1 or 5,
The component supply part for supplying an electronic component and the header part which adsorbs the said component are located in the outermost part of the rail, The electronic component which mounts the electronic component adsorbed by the said header part on the board | substrate moved on a conveyance path | route Conveying method. Has a plurality of transport paths between the rails arranged in a plurality of rows,
A plurality of rails of the conveyor having a rail arranged to have a conveying path for conveying the substrate along the forward direction, and a rail arranged to have a conveying path for conveying the substrate along the reverse direction; And
And a component supply unit installed at the outermost side of the rail and mounting the electronic component adsorbed by the header unit on the substrate. The method of claim 10,
First and second guide rails having first and second guide rails having movement paths in a direction crossing the plurality of rails, respectively, on the inlet and outlet sides of the plurality of rails, and the first and second shuttles which reciprocate with respect to the first and second guide rails, respectively. Electronic component transfer device, characterized in that the rail is installed. The method of claim 10,
The plurality of rails may include at least one drive unit for narrowing, widening or moving at least one rail independently of each other, a screw coupled to the drive unit, a pulley system, or a gear system. Electronic component transfer device, characterized in that installed.
KR1020100054508A 2010-06-09 2010-06-09 Electronic component transferring device and electronic component transferred method using the same KR101566301B1 (en)

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