KR20110128373A - Led head light for vehicle - Google Patents

Led head light for vehicle Download PDF

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Publication number
KR20110128373A
KR20110128373A KR1020100047766A KR20100047766A KR20110128373A KR 20110128373 A KR20110128373 A KR 20110128373A KR 1020100047766 A KR1020100047766 A KR 1020100047766A KR 20100047766 A KR20100047766 A KR 20100047766A KR 20110128373 A KR20110128373 A KR 20110128373A
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KR
South Korea
Prior art keywords
led
heat
heat pipe
plate
led module
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KR1020100047766A
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Korean (ko)
Inventor
최유진
김병호
장혁
이성봉
공유찬
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티티엠주식회사
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Priority to KR1020100047766A priority Critical patent/KR20110128373A/en
Publication of KR20110128373A publication Critical patent/KR20110128373A/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/505—Cooling arrangements characterised by the adaptation for cooling of specific components of reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

PURPOSE: An LED headlight for a vehicle is provided to use a reflecting plate formed on the headlight as a heat sink, thereby smoothly emitting heat. CONSTITUTION: A reflecting plate(20) is made of metal materials. An LED module(10) is formed on the rear side of the reflecting plate. A heat emitting device(30) is formed in the rear part of the LED module. A flat heat pipe(40) is formed on the rear part of the LED module. The reflecting plate and the heat emitting device contact each other by the heat pipe.

Description

자동차용 엘이디전조등{LED HEAD LIGHT FOR VEHICLE}LED headlights for automobiles {LED HEAD LIGHT FOR VEHICLE}

본 발명은 자동차용 엘이디전조등에 관한 것으로, 더욱 상세하게는 엘이디로 형성된 전조등에 형성되는 반사판을 열싱크(heat-sink)로 활용할 수 있도록 하여 열방출을 원활히 함과 동시에 부품의 개수를 줄여서 생산비를 절감할 수 있는 자동차용 엘이디전조등에 관한 것이다. The present invention relates to an LED headlamp for an automobile, and more particularly, a reflector plate formed on an LED headlamp can be utilized as a heat-sink to facilitate heat dissipation and to reduce the number of parts and reduce the production cost. It relates to an LED headlamp for automobile that can be saved.

일반적으로 자동차용 전조등은 운전시 전방에 물체들을 살피거나, 자신의 주행상태를 알리기 위해서 사용되는 것으로, 자동차의 가장 전면에 양측으로 부착되어있다. Generally, headlights for automobiles are used to look at objects in front of the driver or to notify one's driving condition, and are attached to both sides of the front of the vehicle.

상기 자동차용 전조등은 광원으로 벌브(bulb)를 사용하고 있는데, 상기 벌브(bulb)는 조도가 매우 높고 가격이 저렴한 등의 장점이 있다. The headlamps for automobiles use a bulb as a light source, and the bulb has advantages such as high illumination and low price.

그러나, 상기 벌브(bulb)는 그 사용수명이 짧고 내충격성이 떨어져서 최근에는 사용수명이 길고 내충격성이 뛰어난 고휘도 엘이디(LED, Light Emitting Diode)를 광원으로 사용하고 있다.However, since the bulb has a short service life and a low impact resistance, recently, a high brightness LED (Light Emitting Diode) having a long service life and excellent impact resistance is used as a light source.

상기 엘이디전조등의 기술은 엘이디광원에서 발생하는 열에너지를 어떻게 효율적으로 관리하는 방법에 관한 연구에 초점이 맞춰져 있다.The LED headlamp technology is focused on the research on how to efficiently manage the thermal energy generated from the LED light source.

종래의 엘이디전조등은 도4와 같이 자동차의 전면의 양 측면으로 형성되고, 합성수지재의 반사판(2)이 형성되며, 상기 반사판(2)의 가운데에 엘이디모듈(1)이 형성되고, 상기 엘이디모듈(1)의 후방에 팬이 형성된 방열핀(3)이 형성되는 것을 특징으로 구성된다. Conventional LED headlights are formed on both sides of the front surface of the vehicle as shown in FIG. It is characterized in that the heat radiation fin (3) is formed on the rear of the fan 1).

상기 종래의 엘이디전조등에 관한 기술은 대한민국 특허청 등록특허공보 제711241호, 제765995호, 제791569호 등에 개시된 바 있다.The conventional LED headlight technology has been disclosed in the Republic of Korea Patent Office Publication No. 711241, 765995, 791569, and the like.

그러나, 종래의 엘이디전조등은 다음과 같은 문제점이 있었다. However, the conventional LED headlamp has the following problems.

(1) 엘이디모듈의 후방에 형성된 방열기로만 방열하기 때문에 열을 충분하게 방출하지 못한다. (1) Because it radiates only the radiator formed at the rear of the LED module, it does not emit enough heat.

(2) 반사판이 합성수지재로 형성되어 엘이디모듈의 전방에 별도로 조립해야하므로 생산성이 떨어진다. (2) Since the reflector is formed of synthetic resin material and needs to be assembled separately in front of the LED module, productivity is low.

(3) 열전달이 제대로 이루어지지 않아서 방열기의 효율을 최대로 이끌어내지 못한다.(3) The heat transfer is not done properly, so the efficiency of the radiator cannot be maximized.

상기한 문제점을 해결하기 위해서 본 발명은, 전방에 반사판이 형성되고, 상기 반사판의 후방에 엘이디모듈이 형성되며, 상기 엘이디모듈의 후방에는 'ㄷ'자 형상의 평판형 히트파이프가 형성되고, 상기 히트파이프에는 팬이 형성된 방열기가 면접촉하여 형성되되, 상기 엘이디모듈은 고휘도엘이디가 금속피시비에 부착되어 형성되고, In order to solve the above problems, the present invention, the reflection plate is formed in the front, the LED module is formed on the rear of the reflecting plate, the 'c' shaped flat heat pipe is formed on the rear of the LED module, In the heat pipe, a radiator having a fan is formed in surface contact, and the LED module is formed by attaching a high brightness LED to a metal PCB.

상기 반사판은 고휘도엘이디가 노출되도록 삽입구가 형성되며, 상기 삽입구의 빛을 반사하여 전방으로 비출수 있도록 곡면의 반사면이 형성되고, 상기 반사판의 후방은 히트파이프와 면접촉할 수 있도록 형성되며, 상기 반사판의 상하면에는 다수개의 방열핀이 형성된다.
The reflective plate is formed with an insertion hole so that the high brightness LED is exposed, a curved reflective surface is formed to reflect the light of the insertion hole to the front, and the rear of the reflecting plate is formed to be in surface contact with the heat pipe, A plurality of heat radiation fins are formed on the upper and lower surfaces of the reflecting plate.

본 발명의 또다른 실시예로는 'ㄴ'자 형상의 히트파이프의 하부상단표면에 엘이디모듈이 형성되고, 상기 엘이디모듈에 대응되도록 반사판이 형성되며, 상기 반사판의 후방에는 히트파이프의 측면이 삽입결합되고, 상기 히트파이프의 하부하단표면에는 팬이 형성된 방열기가 면접촉하여 형성되되, 상기 엘이디모듈은 고휘도엘이디가 금속피시비에 부착되어 형성되고, In another embodiment of the present invention, the LED module is formed on the lower upper surface of the 'b' shaped heat pipe, a reflector is formed to correspond to the LED module, and the side of the heat pipe is inserted behind the reflector. Is coupled to, the lower bottom surface of the heat pipe is formed with a fan radiator is in surface contact, the LED module is formed by attaching a high brightness LED to the metal PCB,

상기 반사판은 고휘도엘이디와 대응되는 면에 곡면으로 형성된 반사면이 형성되며, 상기 반사면의 후방으로 히트파이프의 측면이 삽입되는 끼움홈이 형성되며, 상기 끼움홈의 후방으로 다수개의 방열핀이 형성된 것을 특징으로 구성된다.The reflective plate has a reflective surface formed in a curved surface on the surface corresponding to the high brightness LED is formed, the fitting groove for inserting the side of the heat pipe is formed to the rear of the reflective surface, a plurality of heat radiation fins are formed in the rear of the fitting groove It consists of features.

본 발명에 의한 엘이디전조등에 의하면 다음과 같은 효과가 발생한다.According to the LED headlamp according to the present invention, the following effects occur.

(1) 방열기 뿐만 아니라 반사판으로도 방열이 이루어지므로 고휘도엘이디의 효율이 좋아진다.(1) Since the heat is radiated not only the radiator but also the reflector, the efficiency of high brightness LED is improved.

(2) 반사판이 금속재로 형성되고 열싱크로 활용할 수 있으므로 히트파이프에 직접 부착할 수 있어서 조립이 간단하여 생산성이 향상된다. (2) Since the reflecting plate is formed of a metal material and can be utilized as a heat sink, it can be directly attached to a heat pipe, thereby simplifying assembly and improving productivity.

(3) 평판형 히트파이프의 채용으로 열전달이 원활하게 이루어지므로 방열기의 효율이 증가할 뿐만 아니라 반사판을 열싱크로 활용할 수 있다.(3) The heat transfer is smoothly carried out by the adoption of a flat plate heat pipe, which not only increases the efficiency of the radiator but also allows the reflector to be used as a heat sink.

도 1은 본 발명의 바람직한 실시예로 형성된 엘이디전조등의 측단면도.
도 2는 본 발명의 바람직한 실시예로 형성된 엘이디전조등의 정면도.
도 3은 본 발명의 또다른 실시예로 형성된 엘이디전조등의 측단면도.
도 4는 종래의 엘이디전조등의 사시도. 1 is a side cross-sectional view of an LED headlamp formed in a preferred embodiment of the present invention.
Figure 2 is a front view of the LED headlamp formed in a preferred embodiment of the present invention.
Figure 3 is a side cross-sectional view of the LED headlamp formed in another embodiment of the present invention.
4 is a perspective view of a conventional LED headlamp.

본 발명은 일반적인 엘이디전조등에 있어서, 전방에 반사판(20)이 형성되고, 상기 반사판(20)의 후방에 엘이디모듈(10)이 형성되며, 상기 엘이디모듈(10)의 후방에는 'ㄷ'자 형상의 평판형 히트파이프(40)가 형성되고, 상기 히트파이프(40)에는 팬(35)이 형성된 방열기(30)가 면접촉하여 형성되되, The present invention is a general LED headlight, the reflecting plate 20 is formed in the front, the LED module 10 is formed in the rear of the reflecting plate 20, the 'C' shape in the rear of the LED module 10 The flat heat pipe 40 is formed, the heat pipe 40 is formed in the surface contact with the radiator 30 having a fan 35,

상기 엘이디모듈(10)은 고휘도엘이디(11)가 금속피시비(12)에 부착되어 형성되고, The LED module 10 is formed by attaching a high brightness LED 11 to the metal PCB 12,

상기 반사판(20)은 고휘도엘이디(11)가 노출되도록 삽입구(21)가 형성되며, 상기 삽입구(21)의 빛을 반사하여 전방으로 비출수 있도록 곡면의 반사면(22)이 형성되고, 상기 반사판(20)의 후방은 히트파이프(40)와 면접촉할 수 있도록 형성되며, 상기 반사판(20)의 상하면에는 다수개의 방열핀(25)이 형성된다.
The reflective plate 20 is formed with an insertion hole 21 so that the high brightness LED 11 is exposed, the reflective surface 22 of the curved surface is formed to reflect the light of the insertion hole 21 to the front, the reflection plate The rear of the 20 is formed to be in surface contact with the heat pipe 40, a plurality of heat radiation fins 25 are formed on the upper and lower surfaces of the reflecting plate 20.

본 발명의 또다른 실시예는 도 3과 같이, 일반적인 엘이디전조등에 있어서, 'ㄴ'자 형상의 히트파이프(40)의 하부상단표면에 엘이디모듈(10)이 형성되고, 상기 엘이디모듈(10)에 대응되도록 반사판(20)이 형성되며, 상기 반사판(20)의 후방에는 히트파이프(40)의 측면이 삽입결합되고, 상기 히트파이프(40)의 하부하단표면에는 팬(35)이 형성된 방열기(30)가 면접촉하여 형성되되, In another embodiment of the present invention, as shown in Figure 3, in the general LED headlight, the LED module 10 is formed on the lower upper surface of the 'b' shaped heat pipe 40, the LED module 10 Reflector 20 is formed so as to correspond to the side of the heat pipe 40 is inserted into the rear of the reflecting plate 20, the heat radiator having a fan 35 formed on the lower lower surface of the heat pipe 40 ( 30) is formed in surface contact,

상기 엘이디모듈(10)은 고휘도엘이디(11)가 금속피시비(12)에 부착되어 형성되고, The LED module 10 is formed by attaching a high brightness LED 11 to the metal PCB 12,

상기 반사판(20)은 고휘도엘이디(11)와 대응되는 면에 곡면으로 형성된 반사면(22)이 형성되며, 후방으로 히트파이프(40)의 측면이 삽입되는 끼움홈(26)이 형성되며, 상기 끼움홈(26)의 후방으로 다수개의 방열핀(25)이 형성된다. The reflective plate 20 has a reflective surface 22 formed in a curved surface on the surface corresponding to the high brightness LED 11, the fitting groove 26 is inserted into the side of the heat pipe 40 is formed in the rear, A plurality of heat dissipation fins 25 are formed at the rear of the fitting grooves 26.

본 발명의 전자의 구성은 고휘도엘이디(11)가 직접 전면으로 비추는 다이렉트타입(DIRECT TYPE)의 엘이디전조등이고, 본 발명의 후자의 구성은 고휘도엘이디(11)를 반사면(22)에 반사시켜 전방으로 비추는 인다이렉트타입(INDIRECT TYPE)의 엘이디전조등이다. The former configuration of the present invention is a direct type LED headlight that the high brightness LED 11 directly shines on the front surface, and the latter configuration of the present invention reflects the high brightness LED 11 to the reflecting surface 22 to the front. LED headlights of type INDIRECT.

상기 엘이디모듈(10)은 고휘도엘이디(11)가 금속피시비(12)에 안착되어 형성되고, 상기 금속피시비(12)는 외부전원을 통해 전원을 인가받아 고휘도엘이디(11)가 발광하도록 형성된다. The LED module 10 is formed by the high brightness LED 11 is seated on the metal PCB 12, the metal PCB 12 is formed so that the high brightness LED 11 is emitted by receiving power through an external power source.

상기 히트파이프(40)는 내부에 작동유체가 채워진 평판형 히트파이프로 열소스와 열싱크사이의 열전달을 매우 원활하게 할 수 있는 것이다. The heat pipe 40 is a plate-type heat pipe filled with a working fluid therein, which enables the heat transfer between the heat source and the heat sink to be very smooth.

상기 방열기(30)는 히트파이프(40)와 면접촉할 수 있도록 형성되고, 상기 방열기(30)는 팬(35)을 활용하여 강제대류를 일으켜 열을 빠르게 방출할 수 있도록 한다.The radiator 30 is formed so as to be in surface contact with the heat pipe 40, the radiator 30 by using the fan 35 to cause forced convection to quickly dissipate heat.

상기 반사판(20)은 금속재로 형성되고, 특히 열전달이 좋은 알루미늄과 같은 소재를 사용하는 것이 적당하다.The reflecting plate 20 is formed of a metal material, and it is particularly suitable to use a material such as aluminum having good heat transfer.

상기 반사판(20)의 반사면(22)은 반사율이 좋을 수 있도록 열처리한 후에 코팅을 한다.The reflecting surface 22 of the reflecting plate 20 is coated after the heat treatment so that the reflectance is good.

상기 반사판(20)은 다이렉트타입과 인다이렉트타입의 두가지 타입으로 형성될 수 있는데, 다이렉트타입은 고휘도엘이디(11)가 전방으로 노출되도록 삽입구(21)가 형성되고, 상기 삽입구(21)의 전방으로 반사면(22)이 형성된다. The reflection plate 20 may be formed in two types, a direct type and an indirect type. In the direct type, an insertion hole 21 is formed to expose the high brightness LED 11 forward, and the front of the insertion hole 21 is forward. Reflecting surface 22 is formed.

상기 반사판(20)은 반사면(22)의 외주연으로 다수개의 방열핀(25)이 상하단으로 형성되고, 후방은 히트파이프(40)의 주연부와 면접촉하도록 형성된다.The reflective plate 20 has a plurality of heat dissipation fins 25 formed at upper and lower ends of the outer circumference of the reflective surface 22, and the rear surface of the reflective plate 20 is in surface contact with the peripheral edge of the heat pipe 40.

상기 반사판(20)의 인다이렉트타입은 'ㄴ'자 형상의 히트파이프(40)의 하단상부표면에 엘이디모듈(10)이 형성되고, 상기 엘이디모듈(10)과 대응되도록 반사판(20)이 형성된다.  In the direct type of the reflective plate 20, the LED module 10 is formed on the upper surface of the lower end of the 'b' shaped heat pipe 40, and the reflective plate 20 is formed to correspond to the LED module 10. do.

상기 반사판(20)은 반사면(22)의 후방을 끼움홈(26)이 형성되는데, 상기 끼움홈(26)에는 히트파이프(40)의 측면이 삽입된다. The reflecting plate 20 has a fitting groove 26 formed at the rear of the reflecting surface 22, and the side surface of the heat pipe 40 is inserted into the fitting groove 26.

상기 끼움홈(26)의 후방으로는 다수개의 방열핀(25)이 형성되는데, 상기 방열핀(25)의 후방에는 또 다른 2차팬(25a)이 형성될 수 있다.
A plurality of heat dissipation fins 25 are formed at the rear of the fitting groove 26, and another secondary fan 25 a may be formed at the rear of the heat dissipation fins 25.

본 발명의 바람직한 실시예로 형성된 엘이디전조등의 작동 및 열전달경로 등을 설명하면 다음과 같다.
Referring to the operation and heat transfer path of the LED headlamp formed in a preferred embodiment of the present invention.

(1) 다이렉트타입 엘이디전조등(1) Direct type LED headlamp

엘이디모듈(10)의 후방에 'ㄷ'자 형상의 평판형 히트파이프(40)을 부착하고, 상기 히트파이프(40)에는 방열기(30)를 면접촉하여 부착한다.   The 'c' shaped flat heat pipe 40 is attached to the rear of the LED module 10, and the heat radiator 30 is attached to the heat pipe 40 by surface contact.

상기 방열기(30)에는 팬(35)이 형성되고, 상기 팬(35)에 의해서 방열기(30)에 강제대류가 일어난다.   A fan 35 is formed in the radiator 30, and forced convection occurs in the radiator 30 by the fan 35.

상기 엘이디모듈(10)의 전방에 반사판(20)을 삽입하되, 삽입구(21)을 통해서 고휘도엘이디(11)가 노출되도록 형성하고, 상기 반사판(20)의 후방은 히트파이프(40)의 상하면이 면접촉하도록 결합한다.   Insert the reflector plate 20 in front of the LED module 10, the high brightness LED 11 is exposed through the insertion hole 21, the rear of the reflector plate 20 is the upper and lower surfaces of the heat pipe (40) Join to face contact.

이후, 상기 엘이디모듈(10)에 전원이 공급되면, 고휘도엘이디(11)가 빛을 발하게되고, 금속피시비(12)에 열이 발생한다.   Then, when power is supplied to the LED module 10, the high brightness LED 11 emits light, and heat is generated in the metal PCB 12.

이때, 열은 히트파이프(40)를 따라서 반사판(20)과 방열기(30)로 전달되고, 이렇게 전달된 열은 방열기(30)의 핀과 반사판(20)의 방열핀(25)으로 전달되면서 방열된다.   At this time, heat is transmitted to the reflector plate 20 and the radiator 30 along the heat pipe 40, and the heat transmitted is radiated while being transferred to the fin of the radiator 30 and the radiator fin 25 of the reflector plate 20. .

상기와 같이 히트파이프(40)에 의해서 금속피시비(12)에서 발생하는 열이 빠르게 반사판(20)과 방열기(30)로 전달되므로 신속하게 방열되는데, 반사판(20)이 열싱크의 기능을 하므로 보다 빠르게 방열된다.
As described above, heat generated from the metal PCB 12 is quickly transferred to the reflector 20 and the radiator 30 by the heat pipe 40, so that the heat is dissipated quickly. The reflector 20 functions as a heat sink. It dissipates quickly.

(2) 인다이렉트타입 엘이디전조등(2) indirect LED headlight

'ㄴ'자 형상의 평판형 히트파이프(40)의 하단상부표면에 엘이디모듈(10)을 형성하고, 상기 히트파이프(40)의 하단하부표면에는 방열기(30)를 면접촉하여 부착한다.   The LED module 10 is formed on the upper surface of the lower end of the 'b' shaped flat heat pipe 40, and the radiator 30 is attached to the lower surface of the heat pipe 40 by surface contact.

상기 방열기(30)에는 팬(35)이 형성되고, 상기 팬(35)에 의해서 방열기(30)에 강제대류가 일어난다.   A fan 35 is formed in the radiator 30, and forced convection occurs in the radiator 30 by the fan 35.

상기 엘이디모듈(10)과 대응되는 위치에 반사판(20)의 반사면(22)을 위치시키고, 반사판(20)의 끼움홈(26)에는 히트파이프(40)의 측면을 삽입하여 형성한다.   The reflective surface 22 of the reflective plate 20 is positioned at a position corresponding to the LED module 10, and the side surface of the heat pipe 40 is inserted into the fitting groove 26 of the reflective plate 20.

상기 반사판(20)의 끼움홈(26)의 후방에 형성된 방열핀(25)에는 2차팬(25a)을 형성하여 방열이 보다 빠르게 이루어지도록 형성한다.
A secondary fan 25a is formed in the heat dissipation fin 25 formed at the rear of the fitting groove 26 of the reflection plate 20 to form heat dissipation faster.

이후, 상기 엘이디모듈(10)에 전원이 공급되면, 고휘도엘이디(11)가 빛을 발하게되고, 금속피시비(12)에 열이 발생한다.   Then, when power is supplied to the LED module 10, the high brightness LED 11 emits light, and heat is generated in the metal PCB 12.

이때, 열은 히트파이프(40)를 따라서 반사판(20)과 방열기(30)로 전달되고, 이렇게 전달된 열은 방열기(30)의 핀과 반사판(20)의 방열핀(25)으로 전달되면서 방열된다.   At this time, heat is transmitted to the reflector plate 20 and the radiator 30 along the heat pipe 40, and the heat transmitted is radiated while being transferred to the fin of the radiator 30 and the radiator fin 25 of the reflector plate 20. .

상기와 같이 히트파이프(40)에 의해서 금속피시비(12)에서 발생하는 열이 빠르게 반사판(20)과 방열기(30)로 전달되므로 열이 신속하게 전달되고, 반사판(20)이 열싱크의 기능을 하므로 보다 빠르게 방열된다.    As described above, the heat generated from the metal PCB 12 is rapidly transferred to the reflector 20 and the radiator 30 by the heat pipe 40, so that the heat is quickly transmitted, and the reflector 20 functions as a heat sink. Therefore, it dissipates faster.

또한, 인다이렉트타입의 엘이디전조등은 고휘도엘이디에서 비취는 빛의 형상을 조절할 수 있는 효과가 있다.
In addition, the LED headlight of the indirect type has the effect of adjusting the shape of the light shining from the high brightness LED.

본 발명은 첨부된 도면을 참조하여 바람직한 실시예를 중심으로 기술되었지만, 당업자라면 이러한 기재로부터 후술하는 특허청구범위에 의해 포괄되는 본 발명의 범주를 벗어남이 없이 다양한 변형이 가능하다는 것은 명백하다.While the invention has been described with reference to the accompanying drawings, preferred embodiments of the invention, it will be apparent to those skilled in the art that various modifications are possible without departing from the scope of the invention covered by the following claims.

10 : 엘이디모듈 11 : 고휘도엘이디
12 : 금속피시비 20 : 반사판
21 : 삽입구 22 : 반사면
25 : 방열핀 25a : 2차팬
26 : 끼움홈 30 : 방열기
35 : 팬 40 : 히트파이프10: LED module 11: high brightness LED
12: metal PCB 20: reflector
21: insertion hole 22: reflecting surface
25: heat sink fin 25a: secondary fan
26: fitting groove 30: radiator
35 fan 40 heat pipe

Claims (5)

전방에 반사판(20)이 형성되고, 상기 반사판(20)의 후방에는 엘이디모듈(10)이 형성되며, 상기 엘이디모듈(10)의 후방에는 방열기(30)가 형성되는 엘이디전조등에 있어서,
상기 반사판(20)은 금속재로 형성되고, 외주연으로 방열핀(25)이 형성되며, 상기 엘이디모듈(10)의 후방에는 평판형 히트파이프(40)가 형성되어 상기 반사판(20) 및 방열기(30)와 면접촉할 수 있도록 형성된 것을 특징으로 하는 엘이디전조등. In the LED headlamp having a reflector 20 is formed in the front, the LED module 10 is formed at the rear of the reflector 20, the radiator 30 is formed at the rear of the LED module 10,
The reflecting plate 20 is formed of a metal material, the heat dissipation fins 25 are formed on the outer circumference, and a flat plate heat pipe 40 is formed at the rear of the LED module 10 to form the reflecting plate 20 and the radiator 30. LED headlights, characterized in that the surface contact is formed. 엘이디전조등에 있어서, 전방에 반사판(20)이 형성되고, 상기 반사판(20)의 후방에 엘이디모듈(10)이 형성되며, 상기 엘이디모듈(10)의 후방에는 'ㄷ'자 형상의 평판형 히트파이프(40)가 형성되고, 상기 히트파이프(40)에는 팬(35)이 형성된 방열기(30)가 면접촉하여 형성되되,
상기 엘이디모듈(10)은 고휘도엘이디(11)가 금속피시비(12)에 부착되어 형성되고,
상기 반사판(20)은 고휘도엘이디(11)가 노출되도록 삽입구(21)가 형성되며, 상기 삽입구(21)의 빛을 반사하여 전방으로 비출수 있도록 곡면의 반사면(22)이 형성되고, 상기 반사판(20)의 후방은 히트파이프(40)와 면접촉할 수 있도록 형성되며, 상기 반사판(20)의 상하면에는 적어도 하나의 방열핀(25)이 형성되는 것을 특징으로 하는 엘이디전조등.In the LED headlamp, the reflection plate 20 is formed in the front, the LED module 10 is formed in the rear of the reflecting plate 20, the 'c' shaped flat heat in the rear of the LED module 10 A pipe 40 is formed, and the heat pipe 40 has a radiator 30 having a fan 35 formed in surface contact.
The LED module 10 is formed by attaching a high brightness LED 11 to the metal PCB 12,
The reflective plate 20 is formed with an insertion hole 21 so that the high brightness LED 11 is exposed, the reflective surface 22 of the curved surface is formed to reflect the light of the insertion hole 21 to the front, the reflection plate The rear of the (20) is formed to be in surface contact with the heat pipe (40), LED headlights, characterized in that at least one heat radiation fin (25) is formed on the upper and lower surfaces of the reflecting plate (20). 엘이디전조등에 있어서, 'ㄴ'자 형상의 히트파이프(40)의 하부상단표면에 엘이디모듈(10)이 형성되고, 상기 엘이디모듈(10)에 대응되도록 반사판(20)이 형성되며, 상기 반사판(20)의 후방에는 히트파이프(40)의 측면이 삽입결합되고, 상기 히트파이프(40)의 하부하단표면에는 팬(35)이 형성된 방열기(30)가 면접촉하여 형성되되,
상기 엘이디모듈(10)은 고휘도엘이디(11)가 금속피시비(12)에 부착되어 형성되고,
상기 반사판(20)은 고휘도엘이디(11)와 대응되는 면에 곡면으로 형성된 반사면(22)이 형성되며, 후방으로 히트파이프(40)의 측면이 삽입되는 끼움홈(26)이 형성되며, 상기 끼움홈(26)의 후방으로 적어도 하나의 방열핀(25)이 형성되는 것을 특징으로 하는 엘이디전조등. In the LED headlamp, the LED module 10 is formed on the lower upper surface of the 'b' shaped heat pipe 40, the reflector plate 20 is formed to correspond to the LED module 10, and the reflector plate ( The rear side of the heat pipe 40 is inserted and coupled to the rear of the 20, the radiator 30 having a fan 35 is formed in the bottom contact surface of the heat pipe 40 is in surface contact,
The LED module 10 is formed by attaching a high brightness LED 11 to the metal PCB 12,
The reflective plate 20 has a reflective surface 22 formed in a curved surface on the surface corresponding to the high brightness LED 11, the fitting groove 26 is inserted into the side of the heat pipe 40 is formed in the rear, LED headlight, characterized in that at least one heat radiation fin (25) is formed in the rear of the fitting groove (26). 제1항 내지 제3항 중 어느한 항에 있어서,
상기 반사판(20)은 알루미늄으로 형성되는 것을 특징으로 하는 엘이디전조등.The method according to any one of claims 1 to 3,
LED headlamp, characterized in that the reflector plate 20 is formed of aluminum. 제3항에 있어서,
상기 반사판(20)의 방열핀(25)의 후방에는 2차팬(25a)이 형성된 것을 특징으로 하는 엘이디전조등.The method of claim 3,
LED headlights, characterized in that the secondary fan (25a) is formed in the rear of the heat radiation fin (25) of the reflecting plate (20).
KR1020100047766A 2010-05-22 2010-05-22 Led head light for vehicle KR20110128373A (en)

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101310362B1 (en) * 2011-12-30 2013-10-14 주식회사 포스코엘이디 Optical semiconductor based illuminating apparatus
KR101446122B1 (en) * 2013-03-15 2014-10-07 한국광기술원 Improved hit sink and led lighting device using the same
KR101533231B1 (en) * 2013-10-08 2015-07-02 에스엘 주식회사 Heat radiating apparatus for automotive lamp
KR20150142838A (en) * 2014-06-12 2015-12-23 한국광기술원 Led lamp for automobile head light
KR20160104473A (en) 2015-02-26 2016-09-05 주식회사 제이케이에이 Intelligent LED headlight for railway vehicles
KR101658869B1 (en) * 2015-08-28 2016-09-22 김도현 Illuminating apparatus with radian heat function
KR101707890B1 (en) * 2016-07-25 2017-02-17 김도현 Illuminating apparatus with radian heat function
KR20170132297A (en) * 2015-03-31 2017-12-01 코닌클리케 필립스 엔.브이. LED lighting module with heat sink and how to replace LED module
CN108700270A (en) * 2016-02-02 2018-10-23 Zkw集团有限责任公司 Lighting unit for motor vehicle

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101310362B1 (en) * 2011-12-30 2013-10-14 주식회사 포스코엘이디 Optical semiconductor based illuminating apparatus
KR101446122B1 (en) * 2013-03-15 2014-10-07 한국광기술원 Improved hit sink and led lighting device using the same
KR101533231B1 (en) * 2013-10-08 2015-07-02 에스엘 주식회사 Heat radiating apparatus for automotive lamp
KR20150142838A (en) * 2014-06-12 2015-12-23 한국광기술원 Led lamp for automobile head light
KR20160104473A (en) 2015-02-26 2016-09-05 주식회사 제이케이에이 Intelligent LED headlight for railway vehicles
KR20170132297A (en) * 2015-03-31 2017-12-01 코닌클리케 필립스 엔.브이. LED lighting module with heat sink and how to replace LED module
KR101658869B1 (en) * 2015-08-28 2016-09-22 김도현 Illuminating apparatus with radian heat function
CN108700270A (en) * 2016-02-02 2018-10-23 Zkw集团有限责任公司 Lighting unit for motor vehicle
CN108700270B (en) * 2016-02-02 2021-09-14 Zkw集团有限责任公司 Lighting unit for a motor vehicle
KR101707890B1 (en) * 2016-07-25 2017-02-17 김도현 Illuminating apparatus with radian heat function

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