KR20110112670A

KR20110112670A - Multi- layer printed circuit board and method of manufacturing the same

Info

Publication number: KR20110112670A
Application number: KR1020100031917A
Authority: KR
Inventors: 타카유키 하재
Original assignee: 삼성전기주식회사
Priority date: 2010-04-07
Filing date: 2010-04-07
Publication date: 2011-10-13

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer printed circuit board, comprising: a land having an opening to be divided into a plurality of areas, and electrically divided into a plurality of lands formed on the land and divided by a patterning part corresponding to the opening of the land. Including blind vias to be separated, and according to the present invention, by forming one blind via to be implemented as an independent circuit, the design density of the printed circuit board can be improved and manufacturing cost can be reduced. A multilayer printed circuit board may be provided, and when the blind via is divided, an opening is formed in the land of the inner layer circuit so as to correspond to the pattern to be divided, thereby facilitating the division of the blind via, as well as the inner layer circuit. Advantages of Providing a Method for Manufacturing a Multi-layer Printed Circuit Board That Can Be Easily Processed on Lands There.

Description

Multilayer printed circuit board and its manufacturing method {MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME}

The present invention relates to a multilayer printed circuit board and a method of manufacturing the same.

In recent years, in semiconductor mounting products, as the density of semiconductor chips and signal transmission speeds have been increased at higher speeds and higher performances, they have become more compact as mobile electronic devices. Increasingly, there is a demand for lower prices for the spread of mobile electronic devices.

In addition, the demand for semiconductor mounting products has increased dramatically in recent years due to the spread of mobile electronic devices, and in order to mount many functions in a limited space, increasing the semiconductor chip density and increasing the semiconductor mounting density has become a challenge.

Therefore, even in semiconductor mounting boards, there is a demand for lower cost as well as higher density and thickness, and development of new technologies and new methods for higher density and lower cost is required.

Hereinafter, the problems of the prior art through the multilayered printed circuit board according to the prior art will be described in more detail.

1 is a flow chart schematically showing a manufacturing process of a multilayer printed circuit board according to the prior art. As shown in the drawing, a core material 110 having copper foils formed on both surfaces thereof is prepared, and a through hole 111 is formed (S110). An inner circuit 120 including lands is formed (S120), a resin insulating layer 130 is laminated on the inner circuit 120, and a blind via hole 131 is formed (S130). Next, an outer circuit 140 is formed on the resin insulating layer 130 to form a blind via 141 (S140). As such, the blind via hole 131 needs to be formed in order to implement the outer circuit 140, which is one interlayer connection circuit.

Therefore, since the number of processing holes of the via holes must be increased in order to realize high performance of the semiconductor chip, the total number of substrates or the size of the substrates must be increased, thereby increasing the manufacturing cost.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to improve the design density of a printed circuit board by dividing one blind via into a plurality of independent circuits. In addition, to provide a multi-layer printed circuit board that can reduce the manufacturing cost.

Another object of the present invention is to reduce the processing cost of the blind via hole of the multilayer printed circuit board by the build-up method by dividing one blind via to have a plurality of interlayer connection circuit to implement a plurality of independent interlayer connection circuit. In order to provide a multilayer printed circuit board with high density.

Another object of the present invention is that when the blind via is divided, the opening is formed in the land of the inner layer circuit so as to correspond to the pattern to be divided, so that the blind via can be easily divided, and the land of the inner layer circuit can be divided. It is to provide a method of manufacturing a multilayer printed circuit board that can be easily processed.

A multilayer printed circuit board according to an exemplary embodiment of the present invention is divided into a plurality of lands having an open portion to be divided into a plurality of regions, and formed by a divider of patterns formed on the lands and corresponding to the open portions of the lands. And blind vias that are electrically separated from each other.

In addition, the opening of the land is formed such that the land is separated at least two or more with respect to the circumferential direction, and the division portion of the blind via is formed such that the blind via is separated by at least two or more with respect to the circumferential direction.

The blind via is formed by selecting one of etching, laser, and machining.

In addition, the outer layer circuit is electrically divided by the division of the blind via.

According to a preferred embodiment of the present invention, there is provided a method of manufacturing a multilayer printed circuit board, the method comprising: (A) providing a base substrate having an inner layer circuit including lands on both surfaces thereof, and (B) opening portions to divide the lands into a plurality of parts; Forming (C) laminating a resin insulating layer on the base substrate, (D) forming a blind via hole in the insulating layer, and (E) forming an outer layer circuit including a blind via. And (F) dividing the blind via by removing the blind via for the region corresponding to the opening of the land.

In addition, the open portion of the land is formed in a split pattern for dividing the blind via.

When the blind vias for the areas corresponding to the openings of the lands are removed, the outer layer circuit is electrically divided, and the removal of the blind vias is performed by selecting one of etching, laser, and machining.

According to another aspect of the present invention, there is provided a method of manufacturing a multilayer printed circuit board, the method comprising: (A) providing a base substrate having an inner layer circuit including lands on both surfaces thereof, and (B) resin insulating on the base substrate. Laminating a layer, (C) forming a blind via hole in the insulating layer, (D) forming an outer layer circuit including a blind via, and (E) removing a predetermined portion of the blind via Dividing the blind via, and (F) dividing the land by removing an area of the land corresponding to the region from which the blind via is removed.

The outer layer circuit is electrically divided by the division of the blind via and the land, and the division of the blind via and the land is performed by selecting one of etching, laser, and machining.

The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings.

Prior to that, terms and words used in the present specification and claims should not be construed in a conventional and dictionary sense, and the inventor may properly define the concept of the term in order to best explain its invention It should be construed as meaning and concept consistent with the technical idea of the present invention.

According to the present invention, since the interlayer connection circuit is implemented as a plurality of independent circuits by dividing one blind via, not only can the design density of the printed circuit board be improved, but also the manufacturing cost can be reduced, and the plurality of interlayer connections By dividing one blind via into a plurality of independent interlayer interconnection circuits, it is possible to reduce the processing cost of the blind via hole of the multilayer printed circuit board by the build-up method, to achieve high density, and to achieve the blind via. In the case of dividing, by forming an opening in a land of an inner layer circuit so as to correspond to a pattern to be divided, the multilayer via circuit may not only easily divide blind vias but also process the land of the inner layer circuit. There is an advantage that can provide a method of manufacturing a substrate.

1 is a flow chart schematically showing a manufacturing process of a multilayer printed circuit board according to the prior art.
2 is a schematic view of a multilayer printed circuit board according to an exemplary embodiment of the present invention. FIG. 2A is a cross-sectional view and FIG. 2B is a plan view.
3 is a configuration diagram schematically illustrating a step of forming a through hole in a core material in a manufacturing process of a multilayer printed circuit board according to an exemplary embodiment of the present invention.
4 is a schematic diagram illustrating an inner layer circuit forming step in a manufacturing process of a multilayer printed circuit board according to an exemplary embodiment of the present invention.
5 is a configuration diagram schematically illustrating a step of forming an insulating layer and a blind via hole in a manufacturing process of a multilayer printed circuit board according to an exemplary embodiment of the present invention.
6 is a configuration diagram schematically illustrating a step of forming a blind via according to the formation of an outer layer circuit in a manufacturing process of a multilayer printed circuit board according to an exemplary embodiment of the present invention.
7 is a schematic diagram illustrating an etching resist coating step in a manufacturing process of a multilayer printed circuit board according to an exemplary embodiment of the present invention.
8 is a configuration diagram schematically illustrating an exposure and development step in a manufacturing process of a multilayer printed circuit board according to an exemplary embodiment of the present invention.
9 is a schematic diagram illustrating a blind via division step by etching in a manufacturing process of a multilayer printed circuit board according to an exemplary embodiment of the present invention.
FIG. 10 is a schematic view illustrating a state of use of a multilayer printed circuit board according to the present invention, in which FIG. 10 (a) is a structural diagram of a conventional blind via, and FIG. The schematic of the blind via is according.

The objects, specific advantages and novel features of the present invention will become more apparent from the following detailed description and the preferred embodiments associated with the accompanying drawings. In the present specification, in adding reference numerals to the components of each drawing, it should be noted that the same components as possible, even if displayed on different drawings have the same number as possible. In addition, terms such as “first”, “second”, “one side”, “other side”, etc. are used to distinguish one component from another component, and a component is limited by the terms. no. In the following description, detailed descriptions of related well-known techniques that may unnecessarily obscure the subject matter of the present invention will be omitted.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 is a schematic view of a multilayer printed circuit board according to an exemplary embodiment of the present invention. FIG. 2A is a cross-sectional view and FIG. 2B is a plan view. As shown, the printed circuit board 200 has an inner layer circuit 220 including a land having an open portion 221 on the core material 210 is formed, the upper portion of the inner layer circuit 220 The resin insulating layer 230 is formed, and a blind via hole 231 is formed in the insulating layer. A blind via 241 having a splitter 242 is formed in the outer circuit 240 formed on the insulating layer 230.

In addition, the open portion 221 of the land is formed in the same pattern as the divided portion 242 of the blind via 241, and the divided portion 242 of the blind via selects one of etching, laser, and machining. By removing a predetermined area of the via.

In addition, the open portions 221 of the land and the divided portions 242 of the blind vias are formed to be separated at least two or more with respect to the circumferential direction, respectively, in the embodiment of FIG. The outer circuit of the multilayer printed circuit board 200 is divided into four independent outer circuits 240a, 240b, 240c, and 240d that are electrically divided.

Hereinafter, a manufacturing process of a multilayer printed circuit board according to the present invention will be described in detail with reference to FIGS. 3 to 9.

As shown in FIG. 3, the core material 310 which laminated | stacked copper foil on both surfaces is prepared, and the through hole 311 is processed. As shown in FIG. 4, the inner circuit 320 including lands is formed on the top or both sides of the core material 310. In this case, the openings 321 are formed to be divided into a plurality of lands. The opening 321 of the land is formed in advance in order to implement the blind via more efficiently. The blind via is formed in a predetermined division pattern to divide the blind via.

In this manner, a base substrate is formed, and as shown in FIG. 5, a resin insulating layer 320 is laminated on the base substrate, and a blind via hole 321 is formed in the resin insulating layer 320. As shown in FIG. 6, the outer circuit 340 including the blind via 341 is formed in the insulating layer 320. Next, as illustrated in FIG. 7, the etching resist 350 is coated on the outer layer circuit 340, and as illustrated in FIGS. 8 and 9, the exposed, developed and etched lands are separated by a predetermined division pattern. The blind via of the region corresponding to the opening 321 of the gate is removed to form the partition 342 of the blind via, and the blind via 341 is divided.

As the blind vias 341 are divided in this manner, the outer layer circuit 340 is electrically divided to form a plurality.

In addition, the method of removing the predetermined region of the blind via may be performed by processing a predetermined pattern using a laser capable of arbitrarily processing metals and organic materials, such as a high frequency laser such as a YAG laser or an excimer laser, in addition to the above-described etching. Processing can also be used.

The method of manufacturing a multilayer printed circuit board according to another exemplary embodiment of the present invention may be implemented by a method of removing the openings in the land and removing the blind vias together.

FIG. 10 is a schematic view illustrating a state of use of a multilayer printed circuit board according to the present invention, in which FIG. 10 (a) is a structural diagram of a conventional blind via, and FIG. The schematic of the blind via is according. As shown, four blind vias 400 according to the prior art are formed, the diameter of the inner circle 410 is 60㎛, the pitch is designed to 150㎛, blind via 500 according to the present invention is Four are formed, and the inner circle 510 is designed to have a diameter of 150 μm, a pitch of 240 μm, and a quadrant divided by the division part 520 to increase the design density by 44%.

In addition, since the blind via is divided into 4 parts and implemented as an independent circuit, the processing cost is reduced to about 1/4.

Although the present invention has been described in detail through specific embodiments, this is for explaining the present invention in detail, and the multilayered printed circuit board and the manufacturing method thereof according to the present invention are not limited thereto, and the present invention is applicable within the spirit of the present invention. It will be apparent that modifications and improvements are possible by those skilled in the art.

All simple modifications and variations of the present invention fall within the scope of the present invention, and the specific scope of protection of the present invention will be apparent from the appended claims.

100, 200: multilayer printed circuit board
120, 220, 320: inner circuit 221, 321: opening
130, 230, 330: insulating layer 231, 360: partition

Claims

A land having an opening to be divided into a plurality of regions; And
And a blind via formed on the land and electrically separated to be divided into a plurality of parts by a division part of a pattern corresponding to an opening of the land.

The method according to claim 1,
And the opening of the land is formed so that the land is separated at least 2 with respect to the circumferential direction, and the division portion of the blind via is formed so that the blind via is separated with at least 2 with respect to the circumferential direction.

The method according to claim 1,
The division portion of the blind via is formed by selecting one of etching, laser, machining.

The method according to claim 1,
The multilayer printed circuit board of claim 1, wherein the outer circuit is electrically divided by the partitioning portion of the blind via.

(A) providing a base substrate having an inner layer circuit including lands on both sides;
(B) forming an opening such that the land is divided into a plurality;
(C) laminating a resin insulating layer on the base substrate;
(D) forming blind via holes in the insulating layer;
(E) forming an outer layer circuit comprising blind vias; And
(F) dividing the blind via by removing the blind via for the region corresponding to the opening of the land.

The method according to claim 5,
And the opening of the land is formed in a split pattern for dividing the blind via.

The method according to claim 5,
And removing the blind vias for the areas corresponding to the openings of the lands, wherein the outer layer circuit is electrically divided.

The method according to claim 5,
The method of claim 1, wherein the blind via is removed by etching, laser, or machining.

(A) providing a base substrate having an inner layer circuit including lands on both sides;
(B) laminating a resin insulating layer on the base substrate;
(C) forming blind via holes in the insulating layer;
(D) forming an outer circuit comprising blind vias;
(E) dividing the blind via by removing a predetermined portion of the blind via; And
(F) dividing the land by removing an area of the land corresponding to the area where the blind via is to be removed.

The method according to claim 9,
And the outer layer circuit is electrically divided by dividing the blind via and the land.

The method according to claim 9,
The method of manufacturing a multilayer printed circuit board, wherein the blind via and the land are divided by selecting one of etching, laser, and machining.