KR20110096429A - Wafer plating basket - Google Patents

Wafer plating basket Download PDF

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Publication number
KR20110096429A
KR20110096429A KR1020100015867A KR20100015867A KR20110096429A KR 20110096429 A KR20110096429 A KR 20110096429A KR 1020100015867 A KR1020100015867 A KR 1020100015867A KR 20100015867 A KR20100015867 A KR 20100015867A KR 20110096429 A KR20110096429 A KR 20110096429A
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KR
South Korea
Prior art keywords
basket
wafer
support
basket body
opening
Prior art date
Application number
KR1020100015867A
Other languages
Korean (ko)
Inventor
박경이
Original Assignee
박경이
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 박경이 filed Critical 박경이
Priority to KR1020100015867A priority Critical patent/KR20110096429A/en
Publication of KR20110096429A publication Critical patent/KR20110096429A/en

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C23C18/1628—Specific elements or parts of the apparatus
    • C23C18/163—Supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1642—Substrates other than metallic, e.g. inorganic or organic or non-conductive semiconductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Disclosed are a wafer plating basket capable of easily performing a plating operation of a metal plate for wafer production.
Such a wafer plating basket is composed of two side members spaced apart from each other and is placed therein, and a basket body having a receiving space therebetween, in which a metal plate for manufacturing a wafer is placed between the side members, and a side member of the basket body. And a support part configured to support the edges of the metal plate for manufacturing the wafer between the contacts, and an opening and closing part configured to open and close one side of the storage space of the basket body while moving the support parts of the support part.

Description

Wafer plating basket

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a wafer plating basket that can be used in a semiconductor wafer manufacturing process, and in particular, to perform a plating operation of a metal plate for wafer manufacturing.

In general, a semiconductor wafer is manufactured by applying a metal thin film layer for imparting electrical characteristics to a metal plate for manufacturing a wafer. The coating of the metal thin film layer is mainly performed by electroless plating (or electrolytic plating).

The electroless plating is performed by immersing a plurality of wafer fabrication metal plates in a plating bath. As a means of supporting the wafer fabrication metal plates in a plating bath with a plateable state, a plating of a box or magazine type is performed. Dragon baskets are widely known.

That is, the box-type plating basket is composed of an upper case and a lower case formed in a state in which the outer surface is almost blocked, and when the metal plates for manufacturing wafers are erected in a standing state, the edges of the box are supported while being spaced at a slight interval. It is formed to be.

However, the above-described box-type plating basket has a structure in which the outer surface is blocked, so that the entire surface of the metal plates for wafer manufacturing is hard to contact the plating solution uniformly.

In addition, the box-type plating basket is not only heavy, but also can be easily contaminated by foreign matters sticking to the outer surface, and contaminants in the case may cause secondary contamination as they stick to the metal plate side for wafer manufacture.

In particular, the box-type plating basket is inconvenient to operate and may take an excessive amount of time since the upper case and the lower case must be opened or closed each time when storing or removing the metal plates for manufacturing the wafer.

These problems are because the above-described conventional wafer plating baskets are formed in a box type structure.

The present invention has been proposed to solve the above problems,

SUMMARY OF THE INVENTION An object of the present invention is to provide a wafer plating basket which improves the problems with box-type plating baskets used in particular for wafer plating operations.

In order to achieve the object as described above,

A basket body including two side members disposed spaced apart from each other and having a receiving space formed between the side members in a state in which metal plates for manufacturing wafers are placed;

A support part comprising support members disposed between the side members of the basket body to support the edge of the metal plate for wafer fabrication by a latching contact;

An opening and closing portion formed to open and close one side of a storage space of the basket body while moving the supports of the support portion;

It provides a wafer plating basket comprising a.

Such the present invention can be easily and quickly stored in a state in which the metal plates for wafer manufacturing are placed in the storage space provided inside the basket body.

In particular, the basket body is composed of two side members spaced apart in the lateral direction is provided in a state in which the receiving space is mostly opened to the outside according to such a structure, for example, the outer surface is mostly blocked Problems with the box type plating baskets can be improved.

1 and 2 are diagrams schematically showing the external and internal structure of the wafer plating basket according to an embodiment of the present invention.
3 and 4 are views for explaining the operation of the opening and closing portion of the wafer plating basket according to an embodiment of the present invention.
5 is a view for explaining a wafer plating basket structure according to another embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

The embodiments of the present invention will be described by those skilled in the art to which the present invention is applicable.

Therefore, since the embodiments of the present invention can be modified in various other forms, the claims of the present invention are not limited to the embodiments described below.

1 and 2 are views schematically showing the external and internal structure of the wafer plating basket according to an embodiment of the present invention, 2 denotes a basket body.

The basket body (2) has a storage space (S) that can be held in a state in which the metal plate (B) for manufacturing a wafer (wafer) is standing, in particular, this storage space (S) has a structure of the type that the outer surface is mostly open It is formed to have.

The basket body 2 may be composed of two side members (R).

The side members (R) may be used in a ring-shaped metal plate or a synthetic resin plate in the center of the entire surface as shown in FIG.

That is, the basket main body 2 is, for example, arranged in a state in which the two side members (R) are spaced apart as shown in Figure 1, the storage space (S) between the side members (R) Can be provided.

According to the structure of the basket body 2, the storage space (S) is provided between the two ring-shaped side members (R) is formed with the side and the circumferential surface mostly open.

In addition, the support protrusions R1 may be formed below the side members R as shown in FIG. 1. Then, the bottom of the basket body 2 can be stably supported at the bottom surface.

The wafer plating basket according to the embodiment of the present invention includes a support part 4 for supporting the metal plate B for manufacturing a wafer.

The support part 4 is formed to support the edges of the metal plates B for wafer manufacture in the receiving space S of the basket body 2 by the latching contact.

Referring back to FIGS. 1 and 2, the support 4 may be composed of a plurality of supports C, and has a length corresponding to the spacing of the side members R. FIG.

The supporters C are installed at a plurality of points along the circumference of the side members R in the storage space S of the basket body 2.

For example, one end of the support (C) may be fixed to the inner surface of one side member (R) of the two side members (R), the other end may be fixed to the inner surface of the other side member (R). .

That is, the supporters (C) are installed in a state of connecting the two side members (R) while surrounding the storage space (S).

Therefore, the supporters C may support the edges of the metal plates B for wafer manufacturing, which are held in the standing state on the receiving space S side on the basket body 2, by a latching contact.

And, it is good to form the locking groove (C1) on the outer surface of the support (C).

The locking grooves C1 are formed such that, for example, the edge of the metal plate B for wafer manufacture, which is erected in a standing state in the receiving space S of the basket body 2, may be slightly caught.

That is, the engaging grooves C1 may be formed in a slit type at a plurality of points with a slight gap as shown in FIG. 1 toward the other side from one side of the outer surface of the support C.

Then, the edges of the metal plate (B) for manufacturing a wafer can be easily accommodated in the receiving space (S) side of the basket body 2 in a state that can prevent the flow by inserting the edge of the locking groove (C1) respectively.

In particular, suppressing the flow of the metal plate B for wafer manufacture can improve the problems that may occur due to contact between the metal plates B for wafer manufacture, for example, during plating or transport.

The basket for manufacturing a wafer according to the embodiment of the present invention includes an opening and closing part 6 that can open and close the storage space S.

The opening and closing part 6 is for opening and closing one side of the circumference of the storage space S so as to contain or pull out the metal plate B for manufacturing a wafer on the basket body 2 side.

The opening and closing part 6 is formed so as to open and close the upper portion of the circumference of the storage space (S) of the basket body 2 while moving the support (C) of the support (4).

That is, the opening and closing part 6 may be provided with a rotation opening and closing opening (D1) to be able to open and close the storage space (S) in a rotational manner on the basket body (2).

For example, when the rotation opening and closing hole D1 is based on FIG. 1, one end may be connected to an upper side of a ring-shaped side member R by a conventional hinge coupling (eg, a hinge pin).

And, the support opening (C) corresponding to the upper portion of the storage space (S) of the support (C) of the support portion 4 is provided on the rotation opening and closing (D1) side.

The other end (free end) of the rotation opening and closing hole (D1) may be formed so as to be caught by the engaging contact with one side of the side member (R).

For example, as shown in FIG. 2, a fixing groove H1 is formed at the other end of the rotation opening and closing hole D1, and a fixing protrusion H2 corresponding to the fixing groove H1 is formed at the side member R side. can do.

Then, when the rotation opening and closing hole D1 is rotated to one side to close the storage space S, the fixing protrusion H2 is caught by the fixing groove H1 to maintain the rotation opening and closing hole D1 closed. Can be.

According to the structure of the opening and closing part 6, one side of the circumference of the storage space (S) of the basket main body 2 can be easily opened or closed while rotating the rotation opening and closing hole D1 around the hinge coupling point.

3 and 4 are views for explaining the operation of the opening and closing part (6).

That is, when the rotation opening and closing hole D1 is rotated in the same direction as in FIG. 3, since the upper portion of the storage space S of the basket body 2 is opened, for example, the metal plates B for manufacturing wafers are baskets. It can be contained in the storage space (S) side in the upright state from the top of the main body 2 or taken out.

When the rotation opening and closing hole D1 is rotated in the same direction as in FIG. 4, since the storage space S of the basket body 2 is closed, for example, the metal plate B for manufacturing a wafer may be stored in the storage space ( It can be fixed in the storage state at the S) side.

The metal plate for manufacturing a wafer according to the embodiment of the present invention may further include a rinsing machine 8 corresponding to the basket body 2.

The rinsing (8), when based on Figure 1 one end is connected to the basket body (2), the other end may be installed in an extended form toward the top.

The upper end of the rinsing 8 may be of a conventional form, for example, by which the basket body 2 can be fixed by hooking the hook side of a hoist (not shown) during the plating operation.

And, the lower end of the rinsing (8), for example, may be connected by a conventional fitting coupling (for example, protrusions and grooves) to be coupled or separated with one side of the side member (R) of the basket body (2). .

Then, the rinsing (8) can be used on the basket body (2) in a state that is appropriately attached and detached according to the working environment or use environment.

Therefore, the wafer plating basket according to an embodiment of the present invention, the metal plate (B) for manufacturing the wafer is opened while opening or closing the storage space (S) of the basket body (2) by the opening and closing portion (6). Can be stored easily and quickly in a state.

In particular, the storage space (S) is formed between the ring-shaped side member (R) on the basket body (2) side, as well as the side and the circumferential surface is provided in the most open state, for example, Inflow and discharge of the plating liquid can be made smoothly during the plating operation it is possible to ensure an improved plating quality.

In addition, the basket body 2 is provided with a support part 4 composed of supporters C for supporting in a state capable of preventing the flow of the metal plate (B) for manufacturing wafers contained in the storage space (S) is plated operation Alternatively, improved storage stability can be ensured during transportation.

Next, Figure 5 is a view for explaining another structure of the wafer plating basket according to an embodiment of the present invention. This embodiment has a difference that is composed of a plurality of rotation opening and closing hole (D2) when compared to the above-described embodiment, the portion not described below is the same as the above embodiment.

That is, the plurality of rotation opening and closing holes (D2) may be composed of two, for example, as shown in Figure 5 is connected to the hinge coupling in the upper portion of the basket body 2, respectively, the upper portion of the storage space (S) It can be formed to open and close by dividing.

Supports C of the support part 4 are installed at the two pivot openings D2.

Therefore, the two rotation opening and closing holes D2 are rotatably installed at the upper portion of the basket body 2 and rotated in the same direction as in FIG. 5 to open or close the upper circumference of the storage space S. FIG. Can be.

In addition, the opening-closing part 6 is not limited to the structure which can be rotated.

For example, although not shown in the drawing, the upper and lower openings of the storage space S of the basket body 2 may be opened and closed by moving the supports C of the support part 4 in a normal slide operation on the basket body 2. It may be provided in a structure present.

Such a slide operation method can open and close the storage space S of the basket main body 2 easily and quickly, and in particular, even when the operating space (radius) is not secured in comparison with the rotation opening and closing structure described above. There is an advantage that can easily open and close the storage space (S).

2: basket body 4: support portion 6: opening and closing portion
8: Rinse B: Metal Plate for Wafer Fabrication

Claims (6)

A basket body including two side members disposed spaced apart from each other and having a receiving space formed between the side members in a state in which metal plates for manufacturing wafers are placed;
A support part comprising support members disposed between the side members of the basket body to support the edge of the metal plate for wafer fabrication by a latching contact;
An opening and closing portion formed to open and close one side of a storage space of the basket body while moving the supports of the support portion;
Wafer plating basket comprising a. The method according to claim 1,
The two side members,
Wafer plating basket, characterized in that consisting of a ring-shaped plate in the center of the entire surface. The method according to claim 1,
The support portion,
The basket for wafer plating is characterized in that the support is spaced apart at a plurality of points along the circumference of the receiving space of the basket body. The method according to claim 1 or 3,
The supports are
And a slit-type locking grooves into which edges of the metal plates for manufacturing the wafer are fitted, and the locking grooves are spaced apart at a plurality of points from one side of the support toward the other side. The method according to claim 1,
The opening /
Consists of a rotating opening and closing door that can be rotated,
The rotation opening and closing port,
One end of the basket is connected to the hinge coupling on the basket body and is rotated around the hinge coupling point is set so as to move the supports corresponding to the upper portion of the storage space from the support of the support in the rotation operation Wafer plating basket. The method according to claim 5,
The rotation opening and closing door,
The basket for wafer plating on the basket body is installed at one or a plurality of points to enable the opening and closing of the storage space.
KR1020100015867A 2010-02-22 2010-02-22 Wafer plating basket KR20110096429A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020100015867A KR20110096429A (en) 2010-02-22 2010-02-22 Wafer plating basket

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100015867A KR20110096429A (en) 2010-02-22 2010-02-22 Wafer plating basket

Publications (1)

Publication Number Publication Date
KR20110096429A true KR20110096429A (en) 2011-08-30

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100015867A KR20110096429A (en) 2010-02-22 2010-02-22 Wafer plating basket

Country Status (1)

Country Link
KR (1) KR20110096429A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101389505B1 (en) * 2012-02-23 2014-04-25 박경이 plating basket assembly
KR101389504B1 (en) * 2012-02-23 2014-04-25 박경이 plating basket

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101389505B1 (en) * 2012-02-23 2014-04-25 박경이 plating basket assembly
KR101389504B1 (en) * 2012-02-23 2014-04-25 박경이 plating basket

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