KR20110090767A

KR20110090767A - Method for laser welding resin members and laser welded body of resin members

Info

Publication number: KR20110090767A
Application number: KR1020110002217A
Authority: KR
Inventors: 나오유키 마쯔오; 마유 시모다; 류타 키베
Original assignee: 닛토덴코 가부시키가이샤
Priority date: 2010-02-04
Filing date: 2011-01-10
Publication date: 2011-08-10
Also published as: TW201139026A; TWI492807B; JP2011178156A; KR101748879B1; JP5555613B2

Abstract

The present invention prevents the occurrence of product defects such as decomposition or carbonization of the resin member even when a process variation such as a laser output variation or a light collection density variation occurs when laser bonding the resin member through the light absorber. It aims at providing the laser bonding method of the resin member which can perform laser bonding, and the laser bonding body of a resin member.
This invention is the laser joining method of the resin member which contacts two or more resin members, irradiates a laser beam to the light absorber arrange | positioned in the vicinity of the contact surface, and welds and bonds a resin member, and at least any one of the said resin members , A thermoplastic resin having a glass transition point or melting point of less than 300 ° C., wherein the light absorbing agent is heated to 350 ° C. using a differential thermal balance to measure a weight loss of 40% or more. To provide.

Description

Laser bonding method of resin member and laser bonded body of resin member TECHNICAL FOR LASER WELDING RESIN MEMBERS AND LASER WELDED BODY OF RESIN MEMBERS

This invention relates to the joining method of the resin member which joins a resin member and a resin member, and the joined body of the resin member by which two or more resin members are joined.

Conventionally, the method of welding a resin member with a laser beam is employ | adopted as a method of joining a resin member and a resin member. When welding these resin members with a laser beam, resin superimposes these resin members and the surface of the resin member in the state which interviewed each other, and irradiates a laser beam to this overlapped part, and comprises resin which comprises the surface of a resin member. Resin which melt | dissolves a material and forms the weld part, or overlaps the other resin member so that the edge part and the edge part of a resin member may be matched, and overlaps, and irradiates a laser beam to the overlapped part, and comprises resin which comprises the surface of a resin member. The method of melting a material and forming a weld part, etc. are employ | adopted.

In joining of the resin member by such welding, a light absorber is arrange | positioned at the site | part to weld, a laser beam is irradiated toward the site | part where the said light absorber is arrange | positioned, and the irradiated laser light is directed from the back side of the resin member to the surface side. It transmits to a light absorber, and absorbs a laser beam with the said light absorber, and converts the light energy of a laser beam into thermal energy, and is performed by the method of welding the interview site | part of the said resin member. As the laser beam to be irradiated, for example, an infrared laser or a near infrared laser is used, and as the light absorber disposed at the surface contact portion of the resin member, absorption peaks are detected in the infrared region and near infrared region such as carbon black or polypyrine-based absorbent. Substances having the same have been used (see Patent Documents 1 and 2 below).

By using the laser welding method using such a light absorbing agent, welding is possible by heat-generating and melting only the interface of a resin member also in the welding of resin members which have high transparency with respect to a laser beam.

However, in the laser welding method using the light absorbing agent as described above, when fluctuations in the manufacturing process, such as fluctuations in the output of the laser oscillator which is a laser light source or fluctuation of the light condensing density due to surface irregularities of the workpiece, occur. The heat energy supplied from the laser beam may be excessive, and as a result, the resin member, which is the workpiece, becomes higher than the predetermined heating temperature, causing decomposition or carbonization reaction, thereby causing product defects. In particular, in the case where the glass transition temperature Tg or the resin member whose melting point is not very high is used as the bonding target and the laser output is increased to perform laser bonding quickly, the above problems have been remarkable.

Japanese Patent Publication No. 2002-526261 Japanese Patent No. 3682620

This invention is made | formed in view of such a problem of the prior art, and when carrying out the laser bonding of a resin member through a light absorbing agent, even when process variation, such as a laser output variation or a condensation density variation, occurs, It is an object of the present invention to provide a laser bonding method of a resin member and a laser bonded body of a resin member, which can prevent occurrence of product defects such as carbonization and can quickly perform laser bonding.

This invention is made | formed in order to solve the subject of said prior art, The laser joining method of the resin member which concerns on this invention makes two or more resin members contact, and a laser beam is made to the light absorber arrange | positioned in the vicinity of the contact surface. Is a laser bonding method of the resin member which welds and bonds a resin member, and at least any one of the said resin members is thermoplastic having a glass transition point (hereinafter, abbreviated as Tg) or melting point below 300 ° C. It is resin, The weight loss amount measured by heating the said light absorber to 350 degreeC using differential thermal balance is characterized by 40% or more.

Moreover, the laser bonding body of the resin member which concerns on this invention is a laser bonding body of the resin member by which two or more resin members are contacted and the resin member is welded and bonded by irradiating a laser beam to the light absorber arrange | positioned in the vicinity of the contact surface. And at least one of the resin members is a thermoplastic resin having a glass transition point or melting point of less than 300 ° C., and the weight loss amount measured by heating the light absorber to 350 ° C. using a differential thermal balance is 40% or more. It features.

According to the joining method and the joined body of the resin member which concern on this invention, since the weight loss amount measured by heating the light absorbing agent arrange | positioned in the vicinity of a contact surface to 350 degreeC using a parallax heat balance is 40% or more, it is partial by laser irradiation. Even when excess heat energy is supplied, the light absorber itself is decomposed by the excess heat energy. Therefore, when a thermoplastic resin having a glass transition point or melting point of less than 300 ° C. is employed as one of the resin members to be laser bonded, the output variation of the laser oscillator as a laser light source and the concentration of light collection density due to surface irregularities of the workpiece and Even when fluctuations other than the same assumptions occur, the thermal energy supplied from the laser beam does not become excessive, and the decomposition and the carbonization reaction of the resin member can be suppressed to prevent the occurrence of product defects.

1 is a side view showing a laser bonding method of a resin member according to a first embodiment.
FIG. 2 is a side view illustrating a bonded body of a resin member bonded by the laser bonding method of the first embodiment. FIG.
3 is a side view showing a laser bonding method of the resin member according to the second embodiment.
4 is a side view illustrating a bonded body of a resin member bonded by the laser bonding method of the second embodiment.
5 is a side view illustrating a laser bonding method of the resin member according to the third embodiment.
FIG. 6 is a side view illustrating a bonded body of a resin member bonded by the laser bonding method of the third embodiment. FIG.
7 is a graph showing the measurement results of weight loss amounts measured using differential thermal balance for light absorbers used in Examples and Comparative Examples.

EMBODIMENT OF THE INVENTION Below, preferred embodiment of this invention is described, referring an accompanying drawing.

1: is a side view which shows the laser bonding method of the resin member which concerns on 1st Embodiment of this invention, and 10a, 10b has shown the sheet-like resin member, and 50 has shown the laser beam. 2 is a side view which shows the bonding body of the resin member joined by the laser bonding method of the said 1st Embodiment.

As shown in FIG. 1, the laser joining method of the resin member which concerns on 1st Embodiment makes the resin member 10a the state where the edge part of each of the sheet-shaped resin members 10a and 10b overlapped up and down. And 10b) to melt the contact surface. Specifically, the light absorber 20 is applied to the contact surfaces of the resin members 10a and 10b, and the laser absorber 50 is irradiated to generate the light absorber 20 to generate heat. The contact surfaces of 10a and 10b are melted to join the resin members 10a and 10b.

As the resin members 10a and 10b to be joined, at least one may be a resin member provided with a thermoplastic resin having a Tg or melting point of less than 300 ° C. on its bonding surface, and the material is not particularly limited.

As the thermoplastic resin having a Tg or melting point of less than 300 ° C, for example, polycarbonate resin, polyvinyl alcohol resin, polyethylene resin, polypropylene resin, polyethylene terephthalate resin, polyvinyl chloride resin, triacetyl cellulose, poly Methyl methacrylate resin, cycloolefin polymer, norbornene resin, polyoxymethylene resin, polyetheretherketone resin, polyetherimide resin, polyamideimide resin, polybutadiene resin, polyurethane resin, polystyrene resin, polymethylpentene Resin, polyamide resin, polyacetal resin, polybutylene terephthalate resin, ethylene vinyl acetate resin and the like.

In addition, Tg calculate | requires a DSC curve by heating up at 10 degree-C / min using a differential scanning calorimeter (The Seiko Instruments Co., Ltd. product, DSC6220) based on JISK7121 (1987), From it, extrapolation glass transition start temperature It can be obtained by obtaining.

As thickness of the said resin member, 1 micrometer or more and 10 mm or less are preferable. When the thickness of the said resin member is less than 1 micrometer, handling of the said resin member becomes difficult, and when it is 10 mm or more, laser light will attenuate by light absorption of the said resin member, and the effect of reaching a light absorber will fall, and productivity It is concerned that this lowers.

In addition, the layer to be laser bonded, that is, the bonding surface of at least one of the resin members 10a and 10b may be the thermoplastic resin, so that the resin member may be a single layer or may be a laminated structure, or may be laminated to other layers. There is no restriction in the material. In addition, arbitrary additives, such as an antioxidant, a flame retardant, a crosslinking agent, an optical stabilizer, a pigment, and a filler, may be contained in the thermoplastic resin of a joining surface, and another layer laminated | stacked.

However, about the resin member arrange | positioned at the irradiation side of a laser beam, it is preferable to have a light transmittance of 30% or more as a whole, and it is more preferable to have a light transmittance of 50% or more.

As the light absorbing agent 20, a weight loss amount measured by heating to 350 ° C. using a differential thermal balance of 40% or more can be adopted, and a weight loss amount measured by heating to 400 ° C. becomes 60% or more. It is preferable to employ.

By using the light absorber of such a physical property, even if the fluctuation | variation outside the assumption in a manufacturing process, such as the output fluctuation of a laser oscillator and the condensing density fluctuation by the surface asperity of a to-be-processed object, a light absorber may be 400 degreeC or more. The heating can be prevented, and the decomposition and the carbonization reaction of the resin member can be prevented.

As said light absorber, what satisfy | fills the said conditions among a pigment, dye, etc. can be employ | adopted variously. Moreover, as a specific usage method of the said light absorber, the method of forming the layer containing the said light absorber on the bonding surface of the said resin member, or the method of containing the said light absorber in the bonding surface of the said resin member is mentioned. have. When forming a layer in the bonding surface of a resin member, the method of diluting a light absorber with an organic solvent etc., for example, and apply | coating by a suitable application | coating means can be employ | adopted. Moreover, 1 micrometer or less is preferable and, as for the thickness of the said layer after drying, 0.5 micrometer or less is more preferable. When the thickness of the layer containing a light absorber exceeds 1 micrometer, it is feared that the compatibility of the two resin members joined will be inhibited. Moreover, as light absorptivity by the layer containing the said light absorber, 20% or more is preferable and 30% or more is more preferable. The coating width of the layer containing the light absorber can be appropriately optimized in accordance with the laser irradiation area.

Examples of such light absorbers include carbon black, polypyrine absorbers, phthalocyanine absorbers, naphthalocyanine absorbers, polymethine absorbers, diphenylmethane absorbers, triphenylmethane absorbers, quinone absorbers, and azo absorbers. And diimmonium salts. As a specific example of these light absorbing agents, the light absorbing agent marketed under the brand name of "Clearweld" from Gentex, USA can be used suitably. "Clearweld" manufactured by Gentex, Inc., USA, is a weight loss amount of 60% measured by heating to 350 ° C using a differential thermal balance.

In addition, the weight reduction amount using the differential thermal balance in this invention is measured by the method as described in the following Example more specifically.

In addition, as a means for applying the absorbent, for example, a general method such as a needle chip dispenser, an inkjet printer, screen printing, a two-fluid type, a one-fluid type or an ultrasonic spray, a stamper, or the like can be used.

As a method of superimposing resin members, as shown in FIG. 1, on the stage 30, at least 2 resin members 10a and 10b used as a bonding object are arrange | positioned so that it may overlap, It is preferable to pressurize using the press means 40 from the top, and to irradiate the laser 50 in the state which fixed the said resin member.

As said pressurizing means, what provided with the glass which showed high transparency with respect to the laser beam to be used as a pressurizing member can be used suitably. As pressurization strength, 0.5-100 kgf / cm <2> is preferable and 1-20 kgf / cm <2> is more preferable. The shape of the pressing member is not particularly limited as long as a load is applied to the laser irradiation part, and for example, a flat plate, a cylinder, or a spherical shape can be used. Although the thickness of a press member is not specifically limited, When too thin, favorable press cannot be performed by distortion, and when too thick, the utilization efficiency of a laser beam will fall, Since 3 mm or more and less than 30 mm are preferable, 5 mm or more and less than 20 mm This is more preferable. As a material of a press member, fused quartz, an alkali free glass, tempax, Pyrex, bicore, D263, OA10, AF45 etc. can be used, for example. In order to raise the utilization efficiency of a laser beam, it is preferable that a glass member has high transparency with respect to the laser beam wavelength to be used, Specifically, it is preferable that light transmittance is 50% or more, and it is more preferable that it is 70% or more.

In addition, from the viewpoint of uniformly pressurizing a large area and achieving good bonding over the entire area, a rubber or a resin material having good light transmittance and cushioning properties (hereinafter, referred to as an interphase material) between the pressing member and the resin member. Is preferably inserted. As said interphase material, rubber-based materials, such as silicone rubber and a urethane rubber, resin materials, such as polyethylene, are mentioned, for example. 50 micrometers or more and less than 5 mm are preferable, and, as for the thickness of an interphase material, 1 mm or more and less than 3 mm are more preferable. If it is less than 50 micrometers, it is insufficient in cushioning property, and when it is 5 mm or more, there exists a possibility that the utilization efficiency of a laser beam may fall by absorption or scattering. It is preferable that the interphase material has a light transmittance of 30% or more, and more preferably 50% or more with respect to the laser light wavelength to be used.

As the material of the stage 30, metal, ceramics, resin, rubber, or the like can be used. In order to pressurize a large area uniformly and to obtain favorable joining state, it is preferable to use rubber | gum. Moreover, the surface of the said rubber may be surface-treated, or the other resin member etc. may be arrange | positioned on the said rubber in order to improve peelability with the sheet | seat after joining, and the purpose of improving heat resistance.

In addition, as the laser beam 50 for irradiation it is not particularly limited, and for example, may be a gas laser such as a solid state laser, CO ₂ laser, such as semiconductor lasers, fiber lasers, femtosecond lasers, YAG lasers.

Among these, a semiconductor laser and a fiber laser are preferable at the point which is inexpensive and it is easy to obtain the laser beam of in-plane uniform intensity | strength.

In addition, since it is easy to prompt melting while preventing the decomposition of the resin itself, continuous CW wave of continuous wave is more suitable than pulse laser which inputs high energy momentarily.

Further, the laser output, power density, spot size, number of irradiation times, scanning speed, and the like can be appropriately selected from the type, thickness, light absorption rate, and the like of the resin material.

In addition, by moving the position which irradiates the laser beam 50 in the surface direction of a contact surface, the contact surface of a large area can be welded. Specifically, welding of the spot beam focused by the condensing lens to a desired beam size, for example, by scanning the desired welding site, enables large area welding. It is also possible to scan only the beam in a state where the laser head is fixed by the galvano scanner, and the laser beam is shaped into a desired shape by the use of an optical element such as a diffractive optical element and collectively large area by no scanning. It is also possible to perform welding.

In addition, in the above-mentioned joining method of the resin member, it is preferable to adjust the irradiation conditions of the laser beam 50 and the said pressurization conditions, and to weld in the state which the interface of resin materials in a welding site | part is lost. . By dissipating the interface, sufficient commercialization can be achieved, the adhesive strength can be improved, and the light transmittance and the like can be made good.

According to the joining method of the resin member which concerns on this 1st Embodiment, the weight loss amount measured by heating to 350 degreeC using the differential thermal balance on the joining surface of the resin member 10a and the resin member 10b is 40% or more. Since the light absorber is disposed, even when the output of the laser transmitter is varied or the light density of the laser light is fluctuated and the laser beam is irradiated excessively, excessive temperature rise of the light absorber is suppressed, so that the decomposition of the resin member Or carbonization is prevented.

In addition, the laser bonding method and laser bonded body of the resin member of this invention are not limited to the said 1st Embodiment, A various deformation | transformation is possible with respect to the positional relationship of the resin member to bond, the arrangement place of a light absorber, etc. Hereinafter, as another embodiment, the second and third embodiments will be described.

Fig. 3 is a side view showing the joining method of the resin member according to the second embodiment of the present invention, and Fig. 4 is a side view showing the joined body of the resin member joined by the joining method of the second embodiment.

As shown in FIG. 3, this 2nd Embodiment arrange | positions so that each edge part of the sheet-shaped resin members 10a and 10b used as a bonding object may face on the same plane, and these resin members 10a and 10b The other resin member (third resin member) 10c is superimposed so that it may overlap on both sides, and the contact surface of this 3rd resin member 10c and the said resin member 10a, 10b is melted, respectively, and it bonds. Specifically, the light absorber 20 is disposed so as to be interposed between the resin member 10a and the third resin member 10c and between the resin member 10a and the third resin member 10c, and those light absorbers ( By irradiating the laser beam 50 to 20), the resin member in each bonding surface is welded, and the resin member 10a and the resin member 10b are bonded together through the resin member 10c.

Therefore, in this embodiment, at least any one of the resin members 10a and 10b arrange | positioned so that it may face on the same plane, or the 3rd resin member 10c arrange | positioned on them is Tg less than 300 degreeC to a joining surface, or What is necessary is just to provide the thermoplastic resin which has melting | fusing point.

In addition, in the said 2nd Embodiment, the thing similar to the said 1st Embodiment can be employ | adopted about the light absorber 20, the laser beam 50, the stage 30, and the pressurizing means 40. FIG.

5 is a side view which shows the laser bonding method of the resin member concerning 3rd Embodiment of this invention, and FIG. 6 shows the bonding body of the resin member joined by the laser bonding method of the said 3rd Embodiment. Side view.

As shown in FIG. 5, this 3rd Embodiment arrange | positions each edge part of the sheet-shaped resin members 10a and 10b to be joined on the same plane, but arrange | positions these resin members 10a and 10b. The heat generating medium 11 is superposed so as to overlap both sides, and the contact surface of the resin member 10a and the resin member 10b is melted and bonded by heat supplied from the heat generating medium 11, and thereafter, heat is generated. The medium 11 is peeled off. At least one of the resin members 10a and 10b is provided with a thermoplastic resin having a Tg or melting point of less than 300 ° C.

More specifically, in the laser bonding method of the third embodiment, the light absorbing agent 20 is interposed between the resin member 10a and the heat generating medium 11 and between the resin member 10a and the heat generating medium 11. And by irradiating the light absorbent 20 with the laser beam 50, the resin member in the joint surface of the resin member 10a and the resin member 10b is welded, and the resin member 10a and the resin member are welded. It joins (10b). Since the heat absorbing medium 11 is coated with the light absorbent 20 on the surface thereof, the energy of the irradiated laser light is converted into thermal energy by the light absorber 20 and transferred to the resin member. Peel off. As shown in FIG. 5, the heat generating medium 11 may be disposed so as to sandwich the resin member from both front and back sides, and may be disposed only on one side of the front and back.

Next, although an Example is given and this invention is demonstrated in detail, this invention is not limited to a following example, unless the summary is exceeded.

(Example 1)

The used material used in Example 1 is as follows.

ㆍ Resin member A material triacetyl cellulose (manufactured by Fujifilm, Tg 170 ° C, melting point 275 ° C)

Thickness 80㎛

Shape 10 mm x 50 mm

ㆍ Light absorbent A brand name "Clearweld LD120C" made by Gentex (60% weight loss measured by heating to 350 ° C using differential thermal balance)

Laser wavelength 940 nm

Output 30W

Spot 2mmφ

ㆍ Pressure member material fused quartz glass

10mm thick

ㆍ Laminated polyimide (manufactured by DuPont, 125 µm thick) on a stage silicon rubber (3 mm thick)

The amount of weight loss was measured using a parallax thermocouple (Thermo plus, manufactured by Rigaku, TG8120 series high temperature type). The measurement conditions were as follows.

ㆍ 10 ℃ / min temperature increase rate

Measuring atmosphere N ₂

Measurement temperature 30 to 500 ° C

Holding time 0 minutes

7 is a graph showing the measurement results of the weight loss amounts measured using the differential thermal balance of the light absorbing agent A used in Examples and Comparative Examples below.

The light absorber A was apply | coated to the area | region of width 10mm x length 10mm at the edge part of the resin member A, and it dried, and the coating layer of the light absorber A of thickness 100nm was formed. As for the coating layer of this light absorber A, the transmittance | permeability of the laser beam of wavelength 940nm was 40%. The resin member A in which the said application layer was formed was mounted on the stage, the other resin member A of the same material was overlapped so that the coating layer of the light absorber might be overlapped, and it pressurized with the pressure member at the pressure of 15 kgf / cm <2> from above. In the state which pressurized the said press member, the laser beam of the said conditions was adjusted to 30W and 70W, respectively, and scanned 1 line scan at the speed of 100 m / s, and laser bonding of the resin member A was performed.

As a result of visual observation of the resin member having undergone the laser bonding test, it was confirmed that even in all cases where the laser light was 30W and 70W, the resin was bonded in a good state without causing decomposition or carbonization.

(Example 2)

Light absorber B phthalocyanine-based dyes (weight loss measured by heating to 350 ° C. using a differential thermal balance of 42%)

Otherwise, the same material as in Example 1 was used.

A light absorbent solution was prepared by melting the light absorber B in toluene at a ratio of 1% by weight, and applying a light absorber solution at a coating amount of 20 mL / mm 2 to an area of 10 mm width x 10 mm length at the end of the resin member A. And toluene were volatilized and dried to form a coating layer of a light absorbent. Thereafter, laser bonding at laser powers of 30 W and 70 W was performed in the same manner as in the laser bonding test of Example 1.

(Example 3)

ㆍ Resin member B material Polyethylene terephthalate (PET, Tg 67 ℃, melting point 243 ℃)

Thickness 50㎛

Shape 10 mm x 50 mm

Otherwise, the same material as in Example 1 was used.

Except using the resin member B, the laser bonding to laser output 30W and 70W was performed similarly to the laser bonding test of the said Example 1.

(Example 4)

ㆍ Resin member C material polycarbonate (PC, Tg 146 ℃, melting point 253 ℃)

Thickness 70㎛

Shape 10 mm x 50 mm

Otherwise, the same material as in Example 1 was used.

Except using the resin member C, the laser bonding to laser output 30W and 70W was performed similarly to the laser bonding test of the said Example 1.

(Example 5)

ㆍ Resin member D material polyvinyl alcohol (Kuraray Co., Ltd., no Tg, melting point 210 ℃)

Thickness 75㎛

Shape 10 mm x 50 mm

Otherwise, the same material as in Example 1 was used.

The laser bonding was performed in the same manner as in the laser bonding test of Example 1, except that the laser power was changed to 90 W while using the resin member D.

As a result of visual observation of the resin member that passed the laser bonding test, it was confirmed that the resin was bonded in a good state without causing decomposition or carbonization.

(Comparative Example 1)

ㆍ A light absorbent C, manufactured by Yamamoto Kasei Co., Ltd., trade name "YKR" (30% of weight loss measured by heating to 350 ° C using a differential thermal balance)

The same material as in Example 1 was used except that the light absorbing agent was used.

Except using the said light absorbing agent C as a light absorbing agent, the laser bonding test by laser output 30W and 70W was performed similarly to Example 1 except having performed.

As a result of visual observation of the resin member having undergone the laser bonding test, it was confirmed that when the laser light was 30 W, satisfactory bonding without decomposition, carbonization, or the like of the resin member could be achieved. However, when the laser light was 70W, the part which turned black was dotted by the laser irradiation part, and the joined body produced the pressed smell. From this, in the test, it was confirmed that carbonization of the resin member occurred due to excessive irradiation of the laser.

(Comparative Example 2)

ㆍ Ink type prepared by blending a colorant containing an oil-soluble dye of the light absorbing agent D-methine with resin (Orient Chemical Co., Ltd., trade name "eBIND ink", differential weight loss measured by heating to 350 ℃ 37%)

Except using the said light absorber D as a light absorber, it carried out similarly to Example 1, and carried out the laser bonding test by laser output 30W and 70W.

As a result of visual observation of the resin member having undergone the laser bonding test, it was confirmed that when the laser light was 30 W, satisfactory bonding without decomposition, carbonization, or the like of the resin member could be achieved. However, when the laser light was 70W, the part which turned black was dotted by the laser irradiation part, and the joined body produced the pressed smell. From this, in the said test, it was confirmed similarly to the comparative example 1 that carbonization of the resin member occurred by the excessive irradiation of a laser.

(Comparative Example 3)

ㆍ Resin member E material thermoplastic polyimide (Tg: 315 ° C)

Thickness 50㎛

Shape 10 mm x 50 mm

The same material as in Example 1 was used except that the resin member was used.

A laser bonding test was conducted in the same manner as in Example 1 except that the resin member E was used as the resin member and the laser power was changed to 90 W.

As a result of the laser bonding test, the resin member could not be bonded. It is thought that this is because the resin member E is a high heat-resistant thermoplastic polyimide, and thus the amount of heat for melting it could not be obtained.

(Comparative Example 4)

ㆍ Resin member E (phase)

ㆍ Light absorber D (phase)

The same material as in Example 1 was used except that the resin member E and the light absorbing agent D were used.

The laser bonding test was performed similarly to Example 1 except having used the said resin member E as a resin member, the said light absorber D as a light absorber, and changing a laser output to 70W.

As a result of the laser bonding test, it was confirmed that the thermoplastic polyimide of high heat resistance could be bonded. However, as a result of visual observation of the resin member, it was confirmed that black discolored portions were scattered in the laser irradiation part. From this, in the test, it was confirmed that carbonization of the resin member occurred due to excessive irradiation of the laser.

10a, 10b, 10c: resin member
20: light absorber
30: stage
40: pressing member
50: laser light

Claims

It is a laser bonding method of the resin member which makes contact with 2 or more resin members, irradiates a laser beam to the light absorber arrange | positioned in the vicinity of the contact surface, and welds and bonds a resin member,
At least one of the resin members is a thermoplastic resin having a glass transition point or melting point of less than 300 ° C., and the weight loss amount measured by heating the light absorber to 350 ° C. using a differential thermal balance is 40% or more. The laser joining method of the resin member used.

It is a laser bonding body of the resin member by which two or more resin members are contacted, and the resin member is welded and bonded by irradiating a laser beam to the light absorber arrange | positioned in the vicinity of the contact surface,
At least one of the resin members is a thermoplastic resin having a glass transition point or melting point of less than 300 ° C., and the weight loss amount measured by heating the light absorber to 350 ° C. using a differential thermal balance is 40% or more. The laser bonding body of the resin member made into.