KR20110087779A - Vitrified curable material and process for manufacturing thereof, and package structure and process for forming sealing pattern - Google Patents

Abstract

PURPOSE: A vitrified curable material is provided to enable uniform vitrified curing within a closed space by completing the glass hardening and to improve corrosion resistance to a pentafluoropropionic acid liquid by forming the modified vitrified curing materials. CONSTITUTION: A vitrified curable material includes a silica reference liquid and silica particles of sub-micron size. The silica reference liquid comprises a base material and a catalyst. The silica particle of a submicron size is obtained through hydrophobic treatment. The silica particles of a submicron size are dispersed within the silica reference liquid. The silica reference liquid is an SIRAGUSITAL-B4373 silica liquid.

Description

Glass-hardened hardening material, its manufacturing method, package structure, and sealing pattern formation method {VITRIFIED CURABLE MATERIAL AND PROCESS FOR MANUFACTURING THEREOF, AND PACKAGE STRUCTURE AND PROCESS FOR FORMING SEALING PATTERN}

BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to a glass cured material formed at room temperature, a method for producing the glass cured material, a method of forming a sealing pattern of substrates facing each other, and a package structure having the pattern.

Sealing, chemical resistance, and light resistance can be obtained in the sealing of packages such as Micro Opt-Electro Mechanical System (MOEMS) devices, infrared detection devices, CCD imaging devices, and organic EL flat panel devices. Glass sealing method for bonding glass and glass, melt sealing method for bonding glass and metal, soldering sealing method for ceramic and metal, welding sealing method for joining metal and metal, etc. Laws are widely used.

In these sealing methods, there may be used a method of encapsulating a getter material inside a package, adsorbing and capturing a gas such as moisture or oxygen that hinders device operation and maintaining an atmosphere inside the package.

On the other hand, when maintaining the inside of a package in a reactive gas atmosphere, the package sealing material should not corrode in the above atmosphere.

From the following references, among the low temperature forming glass material technologies that have been put to practical use in the industry, the possibility of package sealing applications in the method disclosed in Patent Document 1 and the glass hardened material formed at room temperature described in Non-Patent Document 1 Can be evaluated.

Patent number2538527

Mineral Coating SIRAGUSITAL & HEATLESS GLASS Technical Manual, New Technology Creation Research Institute Low temperature curing coating material, OA series, SiO2 material that can be cured at low temperature below 150 ° C, Nissan Chemical Industries, Ltd. Display Materials OPSTAR PJ5000 Series, JSR Corporation Wet super high pressure atomization casebook, 2008101000TA1, Yoshida Kikai high school kabushikiisha

As a glass-hardened material which forms a glass material at normal temperature, SIRAGUSITAL-B4373 (heatless glass) silica liquid etc. are contained, for example. In particular, the SIRAGUSITAL-B4373 (Hitless Glass) silica liquid forms amorphous SiO ₂ composed of an inorganic bond of Si-O bond, and the amorphous SiO ₂ has excellent permeability and permeability to water, gas, and light resistance to ultraviolet rays. Properties and high potential as a material that enables high reliability package sealing.

In the process of filling SIRAGUSITAL-B4373 (heatless glass) silica liquid into a sealing pattern space formed between the substrates facing each other and advancing a glass-forming network reaction at normal temperature, the glass state material of an adhesive end is vacated from said space. A force to pull out acts, resulting in a lack of glass state material near the center of the space resulting in the formation of a cavity resulting in poor sealing.

The glass material which has undergone the glass-hardening process through the glass-networking process of SIRAGUSITAL-B4373 (heatless glass) silica liquid is corroded by the pentafluoropropionic acid liquid.

The silica liquid in which the particles are dispersed by using the effect of the interfacial tension due to the large specific surface area of the submicron-sized particle powder to control the interfacial tension of the entire SIRAGUSITAL-B4373 (heatless glass) silica liquid, The interfacial tension acting on the substrate surface and the point of the cross section of the boundary at the same time in contact with the atmosphere is set as the balance condition, and the glass-forming reaction of the silica liquid is performed to complete the glass-hardening of the silica liquid.

SIRAGUSITAL-B4373 (Hitless Glass) The particles are dispersed in a silica liquid, and the silica liquid is chemically bonded to the dispersed particle surface in the Si-O bonded glass network reaction process. The introduction of the material into the glass to complete the glass hardening to modify the glass cured material formed.

A glass-hardened material (e.g., SIRAGUSITAL-B4373 (heatless glass) silica liquid) in which particles of submicrometer size are dispersed is filled in an adhesive pattern space formed between substrates facing each other, and the glass-network reaction at room temperature. In the process of advancing, it is possible to complete the glass hardening in a state where the glass state material stably remains in the space, and to seal with a uniform glass hardening material throughout the sealing pattern space.

The glass-hardened material formed from the glass-hardened material (for example, SIRAGUSITAL-B4373 (heatless glass) silica liquid) which disperse | distributed the particle | grains of the submicrometer size, has the said dispersing and filling effect by the said particle | grain It is reflected in the cured material quality, and the corrosion resistance to the pentafluoropropionic acid liquid of the glass hardened material is improved.

1 shows an SiO ₂ network consisting of Si—O bonds.
FIG. 2 shows a glass reaction scheme of SIRAGUSITAL-B4373 (Hitless Glass). FIG.
Figure 3 shows a sealing process with SIRAGUSITAL-B4373 (heatless glass) silica liquid.
Fig. 4 is a graph showing the relationship between the interfacial tensions acting on the point of the cross section of a three-phase system in contact with a SIRAGUSITAL-B4373 (heatless glass) silica liquid surface, a substrate surface, and an atmosphere;
FIG. 5 illustrates a phenomenon in which a SIRAGUSITAL-B4373 (heatless glass) in the process of glassing network flows outward from the end of the sealing portion to bulge to form a cavity in the sealing layer.
6 is a diagram showing pentafluoropropionic acid.
The figure which shows the result of the immersion test of SIRAGUSITAL-B4373 (Hitless glass) silica liquid glass-hardened material in pentafluoropropionic acid solution for 24 hours.
Fig. 8 shows the interfacial tension acting on the SIRAGUSITAL-B4373 silica liquid surface in which submicrometer-sized particles are dispersed, the surface of the substrate, and the points of the cross-section of the three-phase system in contact with the atmosphere. Figure showing a state of stopping.
FIG. 9 shows a glass-hardened material sealing process of SIRAGUSITAL-B4373 (heatless glass) silica liquid in which particles of submicrometer size are dispersed.
Fig. 10 is a view showing a first embodiment of SIRAGUSITAL-B4373 (heatless glass) silica liquid glass-hardened cured material sealing of submicrometer-sized particle dispersion and filling.
Fig. 11 shows the results of a 24-hour immersion test of a SIRAGUSITAL-B4373 (Hytris glass) silica liquid glass-hardened material in which a submicrometer-sized silica particle was dispersed and filled in a pentafluoropropionic acid solution.
Fig. 12 is a diagram showing a second embodiment of a particle dispersing and filling SIRAGUSITAL-B4373 (heatless glass) silica liquid glass-hardened cured material sealing having a submicron size.
Fig. 13 is a view showing a third embodiment of the present invention in the sub-micrometer-sized particle dispersing and filling SIRAGUSITAL-B4373 (heatless glass) silica liquid glass-hardened cured material sealant.
Fig. 14 is a view showing a sealing example 4 of SIRAGUSITAL-B4373 (heatless glass) silica liquid glass-hardened cured material of submicrometer-sized particle dispersion and filling according to the present invention.
Fig. 15 shows Example 5 of SIRAGUSITAL-B4373 (heatless glass) silica liquid glass-hardened cured material sealing of submicron-sized particle dispersion and filling according to the present invention.
Fig. 16 is a view showing Example 6 of SIRAGUSITAL-B4373 (heatless glass) silica liquid glass-hardened cured material sealing of submicron-sized particle dispersion and filling according to the present invention;

In patent number "2538527", the method of obtaining a metal oxide glass in the normal temperature area | region is specified, and SIRAGUSITAL-B4373 (heatless glass) silica liquid which forms an inorganic glass material at normal temperature is commercialized.

1 shows an SiO ₂ network composed of Si—O bonds.

The theory of material formation is that ion-soluble organosilicon compounds and other metal compounds are ionized in a liquid, and a catalyst is used to form a SiO ₂ network consisting of Si-O bond 1 such as glass at room temperature (room temperature to 200 ° C). That's how.

2 shows a glass reaction scheme of SIRAGUSITAL-B4373 (heatless glass).

BX ₄ produced ^from-boron B ³⁺ and X a halogen, as shown in Scheme 2a and the _{n + 1} complex ions, ^- the complex ion MX very easily exchanged and M of M (OR) _n as shown in Scheme 2b It is estimated that metal oxide glass (heatless glass) can be obtained in the normal temperature region as a result of the acceleration of the hydrolysis reaction shown in Scheme 2c to generate a metal hydroxide and the dehydration reaction shown in Scheme 2d.

SIRAGUSITAL-B4373 (Hitless Glass) Silica liquids last 2-3 hours from room temperature to contact drying, 24 hours to standard cure (hardness H-2H) and 6 days or more to full cure (hardness 9H).

The material film formed at room temperature is a completely inorganic material containing no organic components that are environmentally concerned substances and exhibits characteristics such as pencil hardness 9H, excellent weather resistance, chemical resistance, water resistance, gas barrier resistance, and heat resistance.

The sealing process by SIRAGUSITAL-B4373 (heatless glass) silica liquid is shown in FIG.

The sealing step is to apply SIRAGUSITAL-B4373 (heatless glass) silica liquid to the lower substrate, SIRAGUSITAL-B4373 (heatless glass) bonding the upper substrate to the lower substrate coated with silica liquid, SIRAGUSITAL-B4373 ( Heatless glass) silicate liquid crystallization network process step 5, and SIRAGUSITAL-B4373 (heatless glass) silica liquid glassification step 6 of completion of curing.

The SIRAGUSITAL-B4373 (heatless glass) silica liquid 7 is applied to a predetermined place on the lower substrate 8 by a screen printing method or a dispensing method, and the upper substrate 9 is bonded to the lower substrate 8. The liquid 7 is filled in the space between the upper and lower substrates 11 set by the spacer 10 to a predetermined thickness, and the shapes 13a and 13b protrude from the sealing ends 12a and 12b. The shape is retained and the glass liquid undergoes a glassing process to complete the glass curing.

As for the SIRAGUSITAL-B4373 (heatless glass) silica liquid 7 in the upper and lower substrate spaces 11, the glass-forming network reaction proceeds in the state which is exposed to the external atmosphere at the edge part of an adhesion part, and the reaction is completed about one week. And glass-hardening hardening is completed.

Fig. 4 shows the relationship between the interfacial tension acting on the point of the cross section of the three-phase system in which the SIRAGUSITAL-B4373 (heatless glass) silica liquid surface, the substrate surface, and the atmosphere contact each other.

SIRAGUSITAL-B4373 (heatless glass) silica liquid 7 and lower substrate 8 between the interface tension 18 between the lower substrate 8 and the atmosphere 16 acting on the surface 15 of the lower substrate 8. The interfacial tension 19 between the surface 15 of c) and the interfacial tension 20 between the silica liquid 7 and the atmosphere acting on the normal of the surface 14 of the silica liquid 7 are respectively And the silica liquid 7 forms a contact angle θ (21) on the surface 15 of the lower substrate 8, and the point of the cross-section of the three phase system in which three tensions 18, 19, and 20 are applied ( The position of 17 moves with the passage of time according to the relationship of the forces of these three tensions 18, 19, 20.

FIG. 5 shows a phenomenon in which the SIRAGUSITAL-B4373 (heatless glass) in the process of glassing network flows outwardly from the end of the sealing portion to bulge to form a cavity in the sealing layer.

The ends of the sealing portions of the bonded substrates 8 and 9 are exposed to the external atmosphere 16 and the SIRAGUSITAL-B4373 (heatless glass) silica liquid 7 in the upper and lower substrate-to-substrate spaces 11 is a point of cross section of a three-phase system. Depending on the relationship of the three tensions 18, 19, and 20 acting on (23a, 23b, 23c, 23d), the position of the point of the cross section moves outward from the sealed ends 12a, 12b of the seal. In addition, even in the state of the silica liquid 7 in the glass-forming network process, a very slow flow phenomenon continues to bulge, and as a result, the portions 24a and 24b are formed, and as a result, in the space 11 near the center of the sealing pattern. In the process, the silica liquid 7 in the process is deficient, thereby forming a cavity 25. When the glass hardening is completed, the glass hardened sealing parts 26a and 26b and the glass hardened hardening protruding part 27a, 27b) is formed to seal the cross section It represents.

Thus, the sealing state becomes poor by the cavity 25 formed by the glass state substance in the glass-forming network process being deficient in the vicinity of the sealing pattern center part.

6 shows pentafluoropropionic acid 28.

Pentafluoropropionic acid (28) corrodes the structural discontinuities or organic components remaining in the glass hardened material formed by SIRAGUSITAL-B4373 (Hitless Glass) silica liquid, thereby insuring the integrity of the glass hardened material. It is used as a reagent for examining.

FIG. 7 shows the results of the SIRAGUSITAL-B4373 (heatless glass) silica liquid glass-hardened material immersed in the pentafluoropropionic acid solution 30 for 24 hours to examine its corrosion resistance.

The sealing parts 26a and 26b formed by completing glass-hardening from the SIRAGUSITAL-B4373 (heatless glass) silica liquid 7 and the board | substrates 8 and 9 sealed by the protruding parts 27a and 27b are examined. It was immersed in the pentafluoropropionic acid solution 30 in the container 29 for 24 hours, and the corrosion resistance of the said sealing part 26a, 26b and the protruding part 27a, 27b was examined, and the board | substrate 8, 9) The seals 26a and 26b sandwiched between the seals are kept in a complete state without being corroded from the seal ends 12a and 12b. However, the seals 26a and 26b are eluted from the protruding portions 27a and 27b. Defects 31a and 31b were observed.

In addition, the pentafluoropropionic acid solution 30 includes a substrate 8 and a substrate 9 sealed with a glass hardening material formed of SIRAGUSITAL-B4373 (heatless glass) silica liquid in which several percent of organic components are intentionally incorporated. When it immerses in the said liquid 30 for 24 hours, all the said glass-hardened hardening materials will elute, and the sealing property will show the corrosiveness to such a degree that a loss will be completely lost.

The contents of the present invention will be described below.

The specific surface area of the particles of the powder material by the particle size of the micrometer level is several m 2 / g, but when the particle size is reduced to a submicrometer, the number of atoms present on the surface increases with respect to the total number of atoms in the particles. The specific surface area of the particles reaches a number of 100 m 2 / g so that the interfacial effect on the properties of the particles is present.

Therefore, by dispersing submicrometer-sized particles in SIRAGUSITAL-B4373 (Hitless Glass) silica liquid, the interfacial tension of the whole silica liquid is dispersed by utilizing the interfacial effect due to the large specific surface area of the particle powder material. Can be controlled.

The interfacial tension acting on the point of the cross-section of the three-phase system in contact with the SIRAGUSITAL-B4373 silica liquid surface, the substrate, and the atmosphere in which submicrometer-sized particles are dispersed in FIG. It shows how.

SIRAGUSITAL-B4373 (heatless glass) silica liquid 33 having submicrometer-sized particles 32 dispersed therein, the surface 15 of the lower substrate 8, and the three-phase cross section of the three-phase system of the atmosphere 16. SIRAGUSITAL-B4373 (heatless glass) in which the particles 32 and the interfacial tension 35 between the lower substrate 8 and the atmosphere 16 acting on the surface 15 acting on the point 34 are dispersed. Interfacial tension 36 between the silica liquid 33 and the surface 15 of the lower substrate 8, the SIRAGUSITAL-B4373 (heatless glass) silica liquid 33 surface 37 in which the particles 32 are dispersed. The interfacial tension 38 between the liquid and the atmosphere acting on the normal line of each is in a balanced state at the contact angle ε 39, respectively, and is dispersed in the SIRAGUSITAL-B4373 (heatless glass). The position of the point 34 of the cross section of the three-phase system in which the silica liquid 33, the surface 15 of the lower substrate 8, and the three members of the atmosphere 16 contact each other is stopped. Moreover, also in the interfacial tension which acts in the point of the cross section of the three-phase system which the trivalent contact of the silica liquid 33 which disperse | distributed the upper board | substrate 9, the atmosphere 16, and the particle | grains 32 of the submicrometer size, respectively, Similarly, in the balance state, the point of the cross section of the three-phase system which the three parties contact is stopped.

9 shows a glass-hardened material sealing process of SIRAGUSITAL-B4373 (heatless glass) silica liquid in which particles are dispersed in submicrometer size.

The sealing process is a process of applying SIRAGUSITAL-B4373 (heatless glass) silica liquid 33 having submicrometer-sized particles 32 dispersed thereon to the lower substrate 8, and applying the upper substrate to the lower substrate of the silica liquid application. It comprises a bonding process 41, the process 42 of the said silica liquid glazing network process, and the process 43 of completion of the said silica liquid glass formation hardening.

A SIRAGUSITAL-B4373 (heatless glass) silica liquid 33 having submicrometer sized particles 32 dispersed thereon is applied onto the lower substrate 8 and the upper substrate 9 is bonded to disperse the particles 32. One of the silica liquids 33 fills in the sealing space 11 secured by the spacer 10 and protrudes from the sealing portions 12a and 12b to form portions 44a and 44b, and the glassy network reaction Even in the state of the silica liquid 45 in which the particles 32 in progress are dispersed, the liquid 45 remains stably in the space 11 to maintain the shape of the protruding portions 44c and 44d. As a result of the formation of SIRAGUSITAL-B4373 (heatless glass) glass-hardened material 46 and glass-hardened glass-finished portion 47a, 47b which dispersed and filled the particles 32 when the hardening was completed, Is shown from the sealing cross-sectional direction.

From the standpoint of a material capable of highly reliable package sealing, the SIRAGUSITAL-B4373 (heatless glass) glass-hardened hardened material 46, which has dispersed and filled the submicrometer-sized particles 32, is dispersed and filled. The material of the particles of submicrometer size is an inorganic compound, or an inorganic compound consisting of a bond having a bond energy equal to or higher than the Si-O bond energy resistant to photochemical reaction by ultraviolet rays, or a metal, ceramic, or metal Metal oxides, carbides, nitrides, phosphates, sulfides, carbonates, or silica, zirconia, titania, alumina, tin oxide, indium oxide, silicon nitride, boron nitride, titanium nitride, aluminum nitride, boron phosphate, lithium carbonate, Specific examples include silicon carbide, zinc sulfide, zinc oxide, graphite, silicon, and cerium oxide. In it not limited to the material.

In addition, the addition ratio of the particle | grains of the submicrometer size disperse | distributing to SIRAGUSITAL-B4373 (heatless glass) silica liquid 7 is required to control the interfacial tension in a glass-hardening material sealing process, and the glass-hardening completion material It is determined comprehensively from the reliability requirements required by the system.

<Examples>

FIG. 10 shows Example 1 of SIRAGUSITAL-B4373 (heatless glass) silica liquid glass-hardened cured material sealing of submicrometer-sized particle dispersion and filling.

Main body (49) of the SIRAGUSITAL-B4373 (heatless glass) silica liquid 48, a catalyst (50) (sales agency: Shingijutsu Sozo Co., Ltd.), manufacturer: Daitozan Bridge Co., Ltd., hydrophobization treatment Silica spherical fine particles 51 (average particle size distribution 0.1 µm) X-24-9163A (Shin-Etsu Chemical Co., Ltd.), cut out into a frame shape with a width of several millimeters. Shape processed interposer borosilicate glass 52 (e.g., glass plates 1.1㎜ thickness, the surface roughness Ra 1.3㎚), Al ₂ O ₃ two-sided coating the optical window flat borosilicate glass (53) subjected to a treatment (e.g., a glass sheet thickness 1.1㎜, surface Roughness Ra 0.8 nm) is prepared.

In step 54, the SIRAGUSITAL-B4373 (heatless glass) silica standard liquid is mixed by stirring and mixing the main body 49 of the SIRAGUSITAL-B4373 (heatless glass) silica liquid with the catalyst 50 at a ratio of 1 volume to 9 volumes. (55) were added, and in step 56, three volumes of submicrometer-sized silica particles 51 subjected to a hydrophobization treatment having a bulk density of about 0.5 g / cc were added to the silica standard liquid 55, and the mixture was sufficiently stirred. The dispersion | distribution is performed and the SIRAGUSITAL-B4373 (heatless glass) silica liquid 57 which disperse | distributed the said particle | grains 51 is combined.

In step 58, the inter-coated with a predetermined pattern (59, 60) by dispensing or screen printing on each lattice frame of the interposer glass 52 of the shape-processed interposer glass 52 repeatedly cut out by a grating of several centimeters in the width of several mm. The foamer glass 61 is prepared, the planar glass 53 subjected to the double-sided optical window coating treatment in step 62 is bonded at a predetermined position on the interposer glass 61, and the planar glass 53 and the interposer are bonded. When the silica liquid 57 is filled in the space 11 formed by the spacer 10 having a thickness of 5 μm formed between the glasses 61, the sealing of the interposer glass 52 shaped into the frame shape is performed. From the end, like the protruding portions 44a and 44b shown in Fig. 9, the protruding portions are formed on the flat glass surface subjected to the optical window coating treatment, but stably remain on the surface. The glass-hardening of the silica liquid 57 in which the silica particles 51 are dispersed in step 63 is carried out, and the glass-hardening is completed in step 64, and the silica particles are removed in the space 11. The protruding portion from the sealed end of the glass cured material 65 remains stably at the first position until the silica liquid glass cured material 65 dispersed and filled is formed, and the via shown in FIG. 9. The glass-hardened material 65 is not deficient in the vicinity of the center in the space because it is held in the same shape as the extruded portions 47a and 47b, and the planar glass and the interposer glass are uniform. Sealed by material 65.

FIG. 11 shows a SIRAGUSITAL-B4373 (heatless glass) silica liquid glass-hardened material in which silica particles having a size of submicrometer is dispersed and filled are immersed in a pentafluoropropionic acid liquid 30 for 24 hours. The test results are shown.

SIRAGUSITAL-B4373 (Hytris glass) silica liquid glass cured material in which the microparticle sized silica particles 51 formed in the space 11 between the interposer 52 and the planar glass 53 are dispersed and charged. ) Remains intact without corrosion from the sealing ends 12a and 12b and cracks on the surface of the protruding portions 66a and 66b at the sealing end directly exposed to the pentafluoropropionic acid solution 30). Although (67a, 67b) occurred, the protruding portions 66a, 66b did not reach the elution, and the dispersing and filling effect of the silica particles into the silica liquid glass-hardened cured material was obtained by pentafluoropropionic acid solution (30 This can be confirmed by the results reflected in the improvement of corrosion resistance to

FIG. 12 shows Example 2 of SIRAGUSITAL-B4373 (heatless glass) silica liquid glass-hardened cured material sealing of submicrometer-sized particle dispersion and filling.

SIRAGUSITAL-B4373 (Hitless Glass) in which a flat borosilicate glass substrate 68 subjected to a double-sided optical window coating treatment and a frame-shaped interposer borosilicate glass 69 are dispersed and filled with submicrometer-sized particles. The silicon substrate 72 which created the window unit sealed with the silica liquid glass-hardening hardening material 70, and formed the semiconductor integrated circuit, for example, the movable micromirror mirror element structure 71 which has a light modulation function, for example. And an internal atmosphere 74 from the external atmosphere 75 in which the silicon substrate 72 and the window unit are sealed with a sealing material 73 to operate the movable micromirror mirror structure 71. Separate.

The sealing material 73 can also be made into SIRAGUSITAL-B4373 (heatless glass) silica liquid glass-hardened material which disperse | distributes and filled the particle | grains of a submicrometer size.

Fig. 13 shows Example 3 of SIRAGUSITAL-B4373 (heatless glass) silica liquid glass-hardened cured material sealing of submicrometer-sized particle dispersion and filling according to the present invention.

Wire bond electrical wiring 79 for attaching elements 78 such as MEMS sensors, CCDs, etc. to the package substrate 76 in a package container in which the interposer 77 is sealed with the sealing material 73 on the package substrate 76. And the cover substrate 80 was finally sealed to the interposer 77 with a submicrometer-sized particle dispersing and filling SIRAGUSITAL-B4373 (heatless glass) silica liquid glass-hardened curing material 70. 74 is separated from the external atmosphere 75.

The sealing material 73 can also be made into SIRAGUSITAL-B4373 (heatless glass) silica liquid glass-hardened material which disperse | distributes and filled the particle | grains of a submicrometer size.

FIG. 14 shows Example 4 of SIRAGUSITAL-B4373 (heatless glass) silica liquid glass-hardened hardening material sealing according to the present invention.

Particle dispersing and charging of submicrometer size SIRAGUSITAL-B4373 (Hitless Glass) A silica liquid 33 is pattern-coated on the peripheral edge of the package cover substrate 83, for example, a solid element composed of a thin film such as an organic EL. By position-bonding bonding on the package substrate 82 on which the 81 is formed, the substrate 82 and the cover substrate 83 face each other and face each other in the space 85 secured by the spacer 84. Filling the peripheral edges of both substrates with the silica liquid 33, sealing the silica liquid 33 with the silica liquid glass-hardened material 70 formed through a process of performing a glass-network reaction, and the device 81 is separated from the external atmosphere 75.

FIG. 15 shows Example 5 of SIRAGUSITAL-B4373 (heatless glass) silica liquid glass-hardened cured material sealing of submicrometer-sized particle dispersion and filling according to the present invention.

Dispersing and Charging of Particles of Submicrometer Size SIRAGUSITAL-B4373 (Hitless Glass) A silica liquid 33 is applied to the entire surface of the package cover substrate 83, for example, a solid element composed of a thin film such as an organic EL ( Position bonding bonding on the package substrate 82 in which 81 is formed, the whole space 85 secured by the spacer 84 is filled with the said silica liquid 33, and the said silica liquid 33 is glazed. The entire space 85 is filled with the silica liquid glass-hardened curing material 70 formed through a network reaction process, and the device 81 is buried and separated from the external atmosphere 75.

FIG. 16 shows Example 6 of SIRAGUSITAL-B4373 (heatless glass) silica liquid glass-hardened curable material sealing of submicrometer-sized particle dispersion and filling.

For example, the SIRAGUSITAL-B4373 (heatless glass) silica liquid 33 in which particles of submicrometer size are dispersed on the element formation surface of the package substrate 82 on which the solid element 81 such as an organic EL is formed is uniform. The entire surface of the package substrate 82 on which the device 81 is formed by the silica liquid glass-hardening material 70 formed through a glass-forming network reaction process, and the protective coating is sealed. 81 is separated from the external atmosphere 75.

In addition, the SIRAGUSITAL-B4373 (Hitless Glass) silica liquid glass-hardened material 70 in which particles of submicrometer size are dispersed and filled is colorless and transparent and has a light transmittance of 10 µm in thickness of 90% or more.

SIRAGUSITAL-B4373 (Hitless Glass) Silica liquid glass cured materials, which disperse and fill submicrometer-sized particles, have high potential to enable highly reliable package sealing, and lighten MEMS wafer level packaging and organic EL flat panels. In the development of new packages such as packaging, the practical application of them has been examined.

1: Si-O bond
7: SIRAGUSITAL-B4373 (heatless glass) silica liquid
8: lower substrate
9: upper substrate
10: spacer
11: top and bottom board space
12a: sealed end
12b: sealed end
13a: protruding shape
13b: protruding shape
14: SIRAGUSITAL-B4373 (heatless glass) silica liquid surface
15: lower substrate surface
16: atmosphere
17: Point of cross section of three-phase system
18: interface tension between the underlying substrate and the atmosphere
19: SIRAGUSITAL-B4373 (heatless glass) Interface tension between silica liquid and lower substrate surface
20: SIRAGUSITAL-B4373 (Hitless glass) Interface tension between the silica liquid and the atmosphere acting on the normal of the silica liquid surface
21: Contact angle θ of SIRAGUSITAL-B4373 (Hitless Glass) silica liquid on the lower substrate surface
22a: SIRAGUSITAL-B4373 (heatless glass) silica liquid in the space between the upper and lower substrates
22b: SIRAGUSITAL-B4373 (heatless glass) silica liquid in the space between the upper and lower substrates
23a: point of cross section of a three-phase system
23b: point of cross section of three-phase system
23c: point of cross section of a three-phase system
23d: point of cross section of three-phase system
24a: protruding parts formed by continuing very slow flow phenomena even in the process of glazing network
24b: Outgrowth formed by continuing very slow flow in the process of glassing network
25: joint
26a: Seal formed by completing glass hardening
26b: Seal formed by completing glass hardening
27a: bulging part formed by completing glass-hardening
27b: bulging part formed by completing glass-hardening
28: pentafluoropropionic acid
29: inspection container
30: Pentafluoropropionic acid liquid in the test container
31: Defective part due to dissolution and peeling
32: submicron-sized particles
33: SIRAGUSITAL-B4373 (Hitless Glass) silica liquid with dispersed particles of submicrometer size
34: SIRAGUSITAL-B4373 (heatless glass) silica liquid in which particles of submicrometer size are dispersed, the surface of the lower substrate, and the point of the cross section of the three-phase system in which the triad of the atmosphere contacts
35: interfacial tension between lower substrate and atmosphere
36: Interfacial tension between SIRAGUSITAL-B4373 (heatless glass) silica liquid with submicrometer-sized particles dispersed therein
37: SIRAGUSITAL-B4373 (Hitless Glass) silica liquid surface with submicrometer-sized particles dispersed
38: Interfacial tension between SIRAGUSITAL-B4373 (heatless glass) silica liquid and atmosphere in which particles of submicrometer size are dispersed
39: Contact angle ε of SIRAGUSITAL-B4373 (heatless glass) silica liquid dispersed in submicrometer-sized particles on the lower substrate surface
44a: bulge
44b: bulge
44c: bulge
44d: bulge
45: SIRAGUSITAL-B4373 (heatless glass) silica liquid dispersed in submicrometer-sized particles undergoing a glassy network reaction
46: SIRAGUSITAL-B4373 (heatless glass) glass-hardened material which disperse | distributed and filled the particle | grains of the submicrometer size
47a: SIRAGUSITAL-B4373 (Heatless glass) glass-hardened hardened part which disperse | distributed and filled the particle | grains of the submicrometer size
47b: SIRAGUSITAL-B4373 (heatless glass) glass-hardened hardening part which disperse | distributed and filled submicrometer size particle | grains
59: SIRAGUSITAL-B4373 (heatless glass) silica liquid which disperse | distributed the silica particle of the submicrometer size apply | coated in a predetermined pattern on each lattice frame of interposer glass.
60: SIRAGUSITAL-B4373 (heatless glass) silica liquid which disperse | distributed the silica particle of the submicrometer size apply | coated in a predetermined pattern on each lattice frame of interposer glass.
61: Interposer glass which coated SIRAGUSITAL-B4373 (heatless glass) silica liquid which disperse | distributed the submicrometer size silica particle in predetermined pattern.
65: SIRAGUSITAL-B4373 (heatless glass) silica liquid glass-hardened material which disperse | distributed and filled the silica particle of the submicrometer size
66a: A protruding part at the sealing end of the glass cured film of SIRAGUSITAL-B4373 (heatless glass) silica solution which disperse | distributed and filled the silica particle of the submicrometer size.
66b: The protruding part at the sealing end of the glass cured film of SIRAGUSITAL-B4373 (heatless glass) silica solution which disperse | distributed and filled the silica particle of the submicrometer size.
67a: A crack which arose from the protruding surface at the sealing end of the glass cured film of the SIRAGUSITAL-B4373 (heatless glass) silica solution which disperse | distributed and filled the silica particle of the submicrometer size.
67b: The crack which arose from the protruding surface at the sealing end of the glass cured film of SIRAGUSITAL-B4373 (heatless glass) silica solution which disperse | distributed and filled the silica particle of the submicrometer size.
68: planar borosilicate glass substrate with double sided optical window coating
69: Cut out into frame shape Shaped interposer borosilicate glass
70: SIRAGUSITAL-B4373 (heatless glass) silica liquid glass-hardened material which disperse | distributed and filled the particle | grains of the submicrometer size
71: movable micromirror mirror element structure with, for example, light modulation
72: silicon substrate on which semiconductor integrated circuit is formed, for example
73: sealing material
74: interior atmosphere
75: outside atmosphere
76: package substrate
77: interposer
78: devices such as MEMS sensors and CCDs
79: wire bond electrical wiring
80: cover substrate
81: solid state device
82: package substrate
83: package cover substrate
84: spacer
85: space

Claims (12)

In the heatless glass silica liquid glazing cured material,
Silica standard liquid and
Submicrometer sized silica particles,
The silica standard liquid consists of a main agent and a catalyst,
The submicron sized silica particles are subjected to hydrophobization treatment,
And wherein said submicron sized silica particles are dispersed and comprised in said silica standard liquid. The heatless glass silica liquid glass hardened material according to claim 1, wherein the silica standard liquid is a SIRAGUSITAL-B4373 silica liquid. 3. The heatless glass silica liquid glass hardened material according to claim 1 or 2, wherein the submicron sized silica particles are inorganic compounds. 4. The heatless glass silica according to claim 3, wherein the submicron-sized silica particles are inorganic compounds composed of a bond having a bond energy equal to or greater than Si-O bond energy resistant to photochemical reactions caused by ultraviolet rays. Liquid glass hardening material. In the manufacturing method of the heatless glass silica liquid glass-ized hardening material which seals the sealing pattern of the board | substrate which mutually faces,
Forming a silica standard liquid by mixing the master and the catalyst;
Forming submicron sized silica particles subjected to hydrophobization treatment,
Adding the silica particles to the silica standard liquid and dispersing the silica particles in the silica standard liquid
Method for producing a heatless glass silica liquid glass-hardened curable material, characterized in that it has a. 6. The method of claim 5, wherein the silica standard liquid is SIRAGUSITAL-B4373 silica liquid. 7. The method of claim 5 or 6, wherein the submicron-sized silica particles are inorganic compounds. A package structure for sealing a package substrate and a package cover substrate with an interposer interposed therebetween,
At least one of the sealing of the package substrate and the interposer, and the sealing of the package cover substrate and the interposer is sealed with the heatless glass silica liquid glass-hardened curing material according to claim 1. In a package structure for sealing a package substrate and a package cover substrate with a spacer or the like interposed therebetween,
A peripheral structure of a pair of substrates in which a package substrate and a package cover substrate face each other to form a space is sealed with the heatless glass silica liquid glass hardened material according to claim 1. In a package structure for sealing a package substrate and a package cover substrate with a spacer or the like interposed therebetween,
The space in which the element formation surface side and the package cover substrate of the package substrate on which the solid element is formed are surrounded by being surrounded by each other is filled with the heatless glass silica liquid glass hardened material according to claim 1, and includes an element non-forming region. And sealed so as to completely cover the element formation region. In a package structure for sealing a package substrate and a solid element on the substrate,
The package structure is sealed with the heatless glass silica liquid glass-hardened curing material according to claim 1 so as to completely cover the solid element formation region including the solid element non-formation region in the package substrate. . In the formation method of the sealing pattern of the board | substrate which mutually faces,
Setting an interfacial tension acting on the point of the cross section of the three-phase system in which the three-members of the substrate, the atmosphere, and the silica liquid come into contact with each other under a balance condition;
Keeping the heatless glass silica liquid glass hardened material according to claim 1 within the space of the sealing pattern so as to satisfy the balance condition.
The method of forming a sealing pattern of the substrate facing each other characterized by having.

Images