KR20110071634A - Printed circuit board mounting ic chip for driving display device - Google Patents

Printed circuit board mounting ic chip for driving display device Download PDF

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Publication number
KR20110071634A
KR20110071634A KR1020090128256A KR20090128256A KR20110071634A KR 20110071634 A KR20110071634 A KR 20110071634A KR 1020090128256 A KR1020090128256 A KR 1020090128256A KR 20090128256 A KR20090128256 A KR 20090128256A KR 20110071634 A KR20110071634 A KR 20110071634A
Authority
KR
South Korea
Prior art keywords
bolt hole
pcb
liquid crystal
display device
printed circuit
Prior art date
Application number
KR1020090128256A
Other languages
Korean (ko)
Inventor
강병수
김태군
Original Assignee
엘지디스플레이 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지디스플레이 주식회사 filed Critical 엘지디스플레이 주식회사
Priority to KR1020090128256A priority Critical patent/KR20110071634A/en
Publication of KR20110071634A publication Critical patent/KR20110071634A/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/13306—Circuit arrangements or driving methods for the control of single liquid crystal cells
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure

Abstract

PURPOSE: A PCB(Printed Circuit Board) for a driving IC(Integrated Circuit) of a display device is provided to minimize the size of a bolt supporting area. CONSTITUTION: A PCB for a driving IC of a display device comprises a rectangular substrate(200) for receiving the driving IC, first bolt holes(BH1) which are formed on two or more edges, and a second bolt hole(BH2) which is formed on the central part of the PCB. The locations of the first bolt holes are identical with each edge of the PCB. The first bolt holes are formed on every four edges of the PCB.

Description

Printed Circuit Board Mounting Integrated Circuit for Driving Display Device {PRINTED CIRCUIT BOARD MOUNTING IC CHIP FOR DRIVING DISPLAY DEVICE}

The present invention relates to a printed circuit board (PCB) on which an integrated circuit (IC) for driving a display device is mounted. In particular, the present invention relates to a structure of a PCB that mounts a display device driver IC and is attached to the back of the display device.

In today's information society, display elements are more important than ever as visual information transfer media. Cathode ray tubes or CRT tubes, which were once mainstream, had problems with weight and volume. In order to overcome the limitations of the cathode ray tube, many kinds of flat panel displays have been developed.

The flat panel display includes a liquid crystal display (LCD), a field emission display (FED), a plasma display panel (PDP), and an electro-luminescence (EL). And most of them are commercially available and commercially available.

Among these, in particular, liquid crystal display devices tend to be gradually widened due to their light weight, thinness, and low power consumption. In accordance with this trend, liquid crystal displays are being used as portable computers such as notebook PCs, office automation equipment, audio / video equipment, indoor and outdoor advertising display devices, and the like. In the liquid crystal display, the amount of light transmitted is adjusted according to an image signal applied to a plurality of control switches arranged in a matrix to display a desired image on a screen. The liquid crystal display is rapidly developing in large size and high resolution due to the recent mass production technology and the achievement of R & D. In addition, the liquid crystal display device is showing a large demand even in the small and medium sized by the development of the mobile display industry.

Such a liquid crystal display includes a liquid crystal panel having liquid crystal molecules having dielectric anisotropy between two glass substrates, a backlight unit for irradiating light to the liquid crystal panel, and a driving signal for applying a driving signal to signal lines formed in the liquid crystal panel. Integrated circuits (hereinafter referred to as 'IC') and a printed circuit board for generating a driving signal for driving the liquid crystal panel.

The method of mounting the driving ICs is Chip On Board (hereinafter referred to as 'COB'), Tape Automated Bonding (hereinafter referred to as 'TAB'), and Chip On Glass (hereinafter referred to as 'TAB'). COG '). The COB method is mainly used in a monochrome liquid crystal display having a pixel pitch of 300 µm or more. In the TAB method, ICs are mounted on a tape carrier package (hereinafter referred to as 'TCP') and the TCP is connected between the PCB and the glass substrate of the liquid crystal panel. The COG method directly mounts IC chips on a glass substrate of a liquid crystal panel. This COG method has been widely used in small and medium sized liquid crystal display devices in accordance with the trend of reduction of mounting area and low cost due to the recent increase in demand for small and medium sized displays. In the COG type liquid crystal display, a flexible printed circuit (FPC) is used to transfer driving signals between the PCB and the driving ICs.

The PCB is manufactured as a thin film substrate by interposing a copper foil layer between the solder resist layer and the substrate, and mounting various circuit parts connected to the copper foil layer by partially penetrating the solder resist layer. Circuit components include a power supply IC for supplying power to the liquid crystal panel, and a timing controller (T-CON) for controlling image realization.

In order to meet the recent miniaturization and high resolution market demands in recent small and medium sized liquid crystal display devices, the size of the PCB mounting the IC for driving the display device as well as the display device is increasingly required.

An object of the present invention is to provide a printed circuit board for mounting an integrated circuit for driving a display device to maximize the utilization efficiency of the substrate. Another object of the present invention is to place a center of a bolt hole for attaching a printed circuit board to a display device on a corner point and a line segment of four sides, and to mount the integrated circuit for driving a display device with minimized bolt support area. To provide. It is still another object of the present invention to provide a small printed circuit board having a maximum space for mounting an IC for driving a display device.

In order to achieve the above object, a printed circuit board for mounting an integrated circuit for driving a display device according to the present invention includes a rectangular substrate for mounting an IC; And a quarter-shaped first bolt hole formed in at least two or more of four corners of the substrate.

The center of the first bolt hole is characterized by coinciding with each corner point of the substrate.

The first bolt hole is characterized in that formed in all four corners.

The first bolt hole is formed at two neighboring corners of the four corners; The second bolt hole further comprises a half circle formed in the center of the side opposite the two corners.

The center of the first bolt hole coincides with an edge point of the substrate; The center of the second bolt hole is located on the line segment of the opposite side.

And a ground thin film formed concentrically around the bolt hole.

In a printed circuit board for mounting an integrated circuit for driving a display device according to the present invention, the position of the bolt hole used to fix the printed circuit board is positioned on the corner point of the substrate or the line segment of four sides, and the size of the bolt hole is 1/4. It was limited to the size of one or half circle. Therefore, the size of the printed circuit board can be reduced to a very small size. In addition, PCBs of the same size have more IC mounting area. As a result, the PCB can be miniaturized and the PCB cost can be further reduced.

Other objects and features of the present invention in addition to the above objects will become apparent from the description of the embodiments with reference to the accompanying drawings. Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to FIGS. 1 to 4. 1 is a cross-sectional view of a liquid crystal display device which is an example of a display device according to the present invention.

Referring to FIG. 1, a liquid crystal display according to the present invention includes a liquid crystal panel LCDP, a backlight unit BLU for irradiating light to the liquid crystal panel LCDP, and a backlight unit BLU for storing and supporting the liquid crystal panel LCDP. A PCB 200 disposed on a cover bottom CB, a rear surface of the cover bottom CB to generate driving signals required for driving the liquid crystal panel LCDP, and a timing controller TCON mounted on the PCB 200. Or a high heat generating IC 500 such as a power IC. The liquid crystal display further includes a panel guide PG for covering the edge of the liquid crystal panel LCDP and the side surface of the cover bottom CB.

The liquid crystal panel LCDP includes a spacer (not shown) interposed between the lower substrate 102 and the upper substrate 104 to maintain a constant gap between the upper substrate 104 and the lower substrate 102. ). In the upper substrate 104 of the liquid crystal panel LCDP, a color filter, a black matrix, and the like, which are not illustrated, are formed. Signal lines such as data lines and gate lines (not shown) are formed on the lower substrate 102 of the liquid crystal panel LCDP, and thin film transistors (TFTs) are formed at intersections of the data lines and the gate lines. The TFT switches the data signal to be transmitted from the data line toward the liquid crystal cell in response to the scan signal from the gate line. The pixel electrode is formed in the pixel region between the data line and the gate line. The common electrode facing the pixel electrode is formed on the upper substrate 104 in the vertical electric field driving method such as twisted nematic (TN) mode and vertical alignment (VA) mode, in plane switching (IPS) mode, and fringe field (FFS). In a horizontal electric field driving method such as a switching mode, the pixel electrode is formed on the lower glass substrate together with the pixel electrode. One side of the lower substrate 102 is formed with a pad area to which data lines and gate lines are connected, and in this pad area, drive ICs 400 for applying a drive signal to the TFT are mounted by a COG method. do. The data driver IC supplies the data signal to the data lines in response to the data control signal from the PCB 200. The gate driver IC receives the gate control signal from the PCB 200 from the data driver IC through drive lines mounted in a line on glass method (not shown), and scans the gate control signal in response to the gate control signal. Supply a signal to the gate lines. An upper polarizing sheet is attached to the upper substrate 104 of the liquid crystal panel (LCDP), and a lower polarizing sheet is attached to the bottom of the lower substrate 102, and a pre-tilt angle of the liquid crystal is provided at an interface in contact with the liquid crystal. An alignment film for setting is formed.

The backlight unit BLU is disposed on a plurality of light sources LS that irradiate light to the liquid crystal panel LCDP, a reflective sheet REF positioned below the light source LS, and an upper portion of the liquid crystal panel LCDP. It includes a plurality of optical sheets (OPT). As the light source LS, a fluorescent lamp or a white light emitting diode (LED) may be used. In FIG. 1, only a fluorescent lamp is shown. The reflective sheet REF guides the light generated from the light source LS toward the liquid crystal panel LCDP.

The cover bottom CB includes a bottom surface and four side surfaces extending from the bottom surface to accommodate and support the backlight unit BLU. The PCB 200 is attached to the rear surface of the cover bottom CB as a fixing member.

The FPC 100 includes a base film layer formed of polyamide at its lower portion, a conductive layer formed of a conductor having a constant width on the top of the base film layer, and a cover film layer formed of polyamide on the conductive layer. It consists of. The FPC 100 is electrically connected to the pad electrodes of the driving ICs 400 via the ACF after the liquid crystal panel LCDP and the cover bottom CB are fastened. In addition, the FPC 100 is bent twice on the side of the fastened liquid crystal panel LCDP and the cover bottom CB and then electrically connected to the PCB 200 disposed on the rear surface of the cover bottom CB.

The PCB 200 is manufactured as a thin film substrate by mounting various circuit components connected to the copper foil layer by partially interposing the copper resist layer between the solder resist layer and the substrate. Then, the PCB 200 is fixed to the rear surface of the cover bottom (CB) by a fixing member such as bolt (B). Circuit components mounted on the PCB 200 include a power IC, which is a power supply unit for supplying power to the liquid crystal panel, and a timing controller (T-CON) for controlling image realization. The PCB 200 is electrically connected to the FPC 100 that is bent toward the rear surface of the cover bottom CB through the connector to supply signals for driving the liquid crystal panel LCDP to the driving IC 400.

In such a structure, the PCB 200 has a substantially rectangular flat plate square structure, as shown in FIG. 2 is a view showing the structure of a PCB according to the first embodiment of the present invention. At four corners of the flat PCB 200, a bolt hole BH capable of supporting the bolt B, which is a means for fixing the PCB 200 to the rear surface of the cover bottom CB, is formed. It is preferable that the center P of the bolt hole BH is formed to coincide with the corner point. A ground thin film GND formed in a concentric circle is formed around the bolt hole BH to ground the PCB 200 through the bolt B. Here, the bolt holes BH are preferably formed in a quarter circle instead of having a perfect circle. As a result, the bolt holes BH occupy less than half the length in the transverse and longitudinal directions, respectively.

When the bolt hole BHC is configured in a perfect circle, as shown in FIG. 3, considering the ground thin film GNDC in the periphery, the PCB 20 has at least "{bolt hole BHC area + ground thin film GNDC. ) Area} X 4 "is consumed in an area that cannot be used for IC 50 mounting and circuit wiring formation. However, according to the present invention, as shown in FIG. 2, only the area of the PCB 200 by "{bolt hole (BH) area + ground thin film (GND) area} X 4" is the IC 500 mounting and circuit. It becomes an area which cannot be used for wiring formation. That is, the unused area in FIG. 2 occupies only 1/4 of the unused area in FIG. 3. 3 is a view showing a PCB structure according to the prior art.

As another method, with reference to FIG. 4, Embodiment 2 according to the present invention will be described. 4 is a view showing a PCB structure according to a second embodiment of the present invention.

At two corners of the flat plate PCB 200, a first bolt hole BH1 through which a bolt B, which is a means for fixing the PCB 200 to the rear surface of the cover bottom CB, may be inserted. Here, it is preferable to form the 1st bolt hole BH <w> in a quarter circle instead of a perfect circle. The center P of the first bolt hole BH1 preferably coincides with a corner point. Moreover, the 2nd bolt hole BH2 is formed in the center part of the edge | side which opposes these two edge | corners. Here, the second bolt hole BH2 is preferably formed in a half circle instead of a perfect circle. The center P of the second bolt hole BH2 is preferably located on the line segment of the side opposite to the two corners. As a result, it occupies only one quarter of the area as compared with the case where the bolt hole BH is formed in a perfect circle. A ground foil film GND formed in a concentric manner is formed around the first and second bolt holes BH1 and BH2 to ground the PCB 200 through the bolt B. FIG.

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the technical spirit of the present invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification but should be defined by the claims.

1 is a cross-sectional view of a liquid crystal display device which is an example of a display device according to the present invention.

2 is a view showing the structure of a PCB according to the first embodiment of the present invention.

3 is a view showing a PCB structure according to the prior art.

4 is a view showing a PCB structure according to a second embodiment of the present invention.

<Description of Symbols for Main Parts of Drawings>

102: lower substrate 104: upper substrate

106: liquid crystal 200, 20: PCB

500, 50: integrated circuit (IC) 400: driver IC

100: FPC

OPT: Optical Film LS: Light Source

REF: Reflective Film CB: Cover Bottom

BLU: backlight unit LCDP: liquid crystal display panel

PG: Panel Guide CS: Cover Shield

GND, GNDC: Ground Thin Film B: Bolt

BH, BHC: Bolt hole P: Center point of the bolt hole

Claims (6)

A rectangular substrate on which the IC is mounted; And a quarter-shaped first bolt hole formed in at least two or more of four corners of the substrate. The method of claim 1, The center of the first bolt hole coincides with the corner point of the substrate. The method of claim 1, The first bolt hole is formed in all four corners of the printed circuit board. The method of claim 1, The first bolt hole is formed at two neighboring corners of the four corners; And a second circular bolt hole formed in a central portion of a side opposite to the two corners. The method of claim 4, wherein The center of the first bolt hole coincides with an edge point of the substrate; The center of the second bolt hole is located on the line segment of the opposite side, the printed circuit board. The method of claim 1, The printed circuit board further comprises a ground thin film formed concentrically around the bolt hole.
KR1020090128256A 2009-12-21 2009-12-21 Printed circuit board mounting ic chip for driving display device KR20110071634A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020090128256A KR20110071634A (en) 2009-12-21 2009-12-21 Printed circuit board mounting ic chip for driving display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090128256A KR20110071634A (en) 2009-12-21 2009-12-21 Printed circuit board mounting ic chip for driving display device

Publications (1)

Publication Number Publication Date
KR20110071634A true KR20110071634A (en) 2011-06-29

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107300795A (en) * 2017-08-09 2017-10-27 深圳市华星光电技术有限公司 Lcd control circuit plate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107300795A (en) * 2017-08-09 2017-10-27 深圳市华星光电技术有限公司 Lcd control circuit plate
CN107300795B (en) * 2017-08-09 2020-06-26 深圳市华星光电技术有限公司 LCD control circuit board

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