KR20130073231A - Light emitting diode module and liquid crystal display apparatus having the same - Google Patents

Abstract

PURPOSE: A light emitting diode (LED) module and a liquid display apparatus comprising the same are provided to prevent the LED module and the liquid display apparatus from having defects by an unnecessary substance of a graphite. CONSTITUTION: A light emitting diode (LED) module comprises a flexible film (122), a heat generating layer (130), an anode electrode, a cathode electrode, light emitting diodes (LED) and a photo solder resist (PSR). The heat generating layer is formed on soft film. The anode electrode and cathode electrode are formed on the heat generating layer. The LED is formed on the heat generating layer so that the anode electrode and the cathode electrode are to be connected. The photo solder resist (PSR) covers the anode electrode and the cathode electrode.

Description

LIGHT EMITTING DIODE MODULE AND LIQUID CRYSTAL DISPLAY APPARATUS HAVING THE SAME}

The present invention relates to a liquid crystal display device, and more particularly, to an LED module and a liquid crystal display device including the same, which can improve heat dissipation performance and prevent manufacturing defects due to foreign substances.

As the display device is a visual information transmission medium, its importance is further emphasized. Recently, various types of flat panel display devices have been developed and applied to portable information devices and IT products.

Among flat panel display apparatuses, liquid crystal display apparatus (LCD) has advantages of mass production technology, ease of driving means, low power consumption, high definition, and large screen.

The liquid crystal display device is applied to various fields such as a portable computer such as a notebook PC, an office automation device, a portable multimedia device, an indoor / outdoor advertising display device, and an application field is continuously expanding.

The liquid crystal display device is composed of a liquid crystal panel displaying an image, a backlight unit for supplying light to the liquid crystal panel, a driving circuit portion for driving the liquid crystal panel and the light source, and a mechanism for mounting the above components.

The liquid crystal panel adjusts the arrangement of liquid crystals by using an electric field applied to pixels arranged in a matrix form, and displays an image by adjusting the amount of light transmitted according to the arrangement of liquid crystals. Since the liquid crystal panel does not generate light by itself, the liquid crystal panel receives light through a backlight unit including a plurality of light sources.

The backlight unit may be classified into a direct type method in which the light source is disposed on the rear surface of the liquid crystal panel and an edge type method in which the light source is disposed in the lateral direction of the liquid crystal panel according to the structure of the light source.

The edge type method may reduce the thickness of the backlight unit by disposing the backlight on the side of the liquid crystal panel, which is advantageous in slimming the liquid crystal display device.

Conventionally, a Cold Cathode Fluorescent Lamp (CCFL) or an Electrode Fluorescent Lamp (EEFL) is used as a light source. Recently, a light emitting diode (LED) is used as a light source. A plurality of LEDs supply light to the liquid crystal panel using an LED module configured in an array form.

LED modules can be largely divided into a hybrid type and an integrated method.

First, the hybrid LED module has a structure in which a main printed circuit board (PCB) and a flexible printed circuit (FPC) are combined.

In this mixed type, a solder is provided for contacting the main PCB and the FPC, and when the LED module is assembled, a crack is generated between the FPC and the solder due to an external force, thereby causing a defect in which the LED is not lit. There is this.

In order to improve the problems of the hybrid method, an integrated LED module has been developed. The integrated LED module improves the problem of cracking during assembly by integrating a plurality of LEDs into the FPC, but has a disadvantage in that heat dissipation is weak.

1 is a view showing an FPC integrated LED module according to the prior art. In FIG. 1, an LED module is illustrated among backlight units, and a plurality of optical members are not illustrated.

Referring to FIG. 1, the FPC integrated LED module according to the related art includes an FPC 20 having a flexible film 22, a metal electrode 24, a protective layer 26, and a solder 28, and the FPC 20. And a heat radiating layer 30 formed on the LED 10 to generate light, and a heat radiating layer 30 bonded to the lower portion of the FPC 20 to radiate heat generated from the LED 10.

Here, the flexible film 22 is formed of polyimide (PI), the metal electrode 24 is in contact with the anode electrode and the cathode electrode of the LED, the protective layer 26 is a photo solder resist (PSR) Is formed.

A heat sink tape is used as the heat dissipation layer 30, but recently, the heat dissipation layer 30 is formed of graphite having excellent heat dissipation performance.

Graphite has a low vertical (Z-axis) thermal conductivity of 6 W / mK, but has a high horizontal (X, Y-axis) thermal conductivity of 250 W / mK. However, since graphite has a hardness of 1.0 or less and a specific gravity of about 1.9 to 2.3, the graphite has a problem of generating a large amount of foreign substances.

If foreign matters are generated due to the soft characteristics of the graphite heat dissipation layer 30, defects are generated in the LED module, and foreign matters are generated in the liquid crystal display device due to the foreign matters.

When the graphite heat dissipation layer 30 is applied to the LED module, manufacturing efficiency is lowered due to defects due to foreign matters, and as a result, there is a problem of lowering the manufacturing process and manufacturing efficiency of the liquid crystal display device.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems, and an object of the present invention is to provide an LED module (Light Emitting Diode module) capable of improving heat dissipation performance and a liquid crystal display device including the same.

The present invention is to solve the above problems, to provide an LED module and a liquid crystal display device including the same that can prevent a defect caused by the foreign matter of the graphite during the manufacturing.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and the technical problem is to improve the manufacturing efficiency of the LED module and the liquid crystal display device.

Other features and advantages of the invention will be set forth in the description which follows, or may be obvious to those skilled in the art from the description and the claims.

An LED module according to an embodiment of the present invention is a LED module in which a plurality of light emitting diodes (LEDs) are integrated in a flexible printed circuit (FPC), the flexible film; A heat dissipation layer formed on the flexible film; An anode electrode and a cathode electrode formed on the heat dissipation layer; An LED formed on the heat dissipation layer so as to be connected to the anode electrode and the cathode electrode; And a photo solder resist formed to cover the anode electrode and the cathode electrode.

A liquid crystal display device according to an embodiment of the present invention includes a liquid crystal display device comprising a LED module in which a plurality of light emitting diodes (LEDs) are integrated in a flexible printed circuit (FPC); An LED module for supplying light to the liquid crystal panel; A plurality of optical members for guiding light from the LED module to the liquid crystal panel and improving light efficiency; And a cover bottom for mounting the LED module and the plurality of optical members, wherein the LED module includes a flexible film, a heat dissipation layer formed on the flexible film, an anode electrode and a cathode electrode formed on the heat dissipation layer, and the anode electrode And an LED formed on the heat dissipation layer to be connected to the cathode electrode.

According to an exemplary embodiment of the present invention, an LED module having improved heat dissipation performance and a liquid crystal display device including the same may be provided.

The LED module and the liquid crystal display device including the same according to an exemplary embodiment of the present invention may prevent the defect of the LED module and the defect of the liquid crystal display device due to the foreign matter of graphite during manufacturing.

An LED module and a liquid crystal display device including the same according to an exemplary embodiment of the present invention may reduce manufacturing costs by matching a plurality of LEDs to a flexible printed circuit (FPC).

The LED module and the liquid crystal display device including the same according to the embodiment of the present invention can simplify the manufacturing process of the liquid crystal display device by matching a plurality of LEDs to the FPC.

The present invention according to the embodiment can improve the manufacturing efficiency of the LED module and the liquid crystal display device.

In addition to the features and effects of the present invention mentioned above, other features and effects of the present invention may be newly grasped through the embodiments of the present invention.

1 is a view showing an FPC integrated LED module according to the prior art.
2 is a view showing a liquid crystal display device according to an embodiment of the present invention.
3 is a view illustrating a cover bottom of the liquid crystal display device according to the exemplary embodiment of the present invention.
4 is a view showing an LED module according to an embodiment of the present invention.
5 is a view showing that the end length of the heat dissipation layer in the LED module according to an embodiment of the present invention.
6 is a view showing that the end of the heat radiation layer is bent in the LED module according to an embodiment of the present invention.
7 and 8 are views showing a contact structure of the LED module and the cover bottom according to an embodiment of the present invention.

Hereinafter, an LED module and a liquid crystal display device including the same according to an exemplary embodiment of the present invention will be described with reference to the accompanying drawings.

2 is a view showing a liquid crystal display device according to an embodiment of the present invention, Figure 3 is a view showing a cover bottom of the liquid crystal display device according to an embodiment of the present invention. 2 illustrates that the LED module 100 is applied in an edge type manner.

2 and 3, the liquid crystal display device according to the embodiment of the present invention includes a cover bottom 200; A backlight unit; The guide panel 600 and the liquid crystal panel 700 are included.

The cover bottom 200 includes a bottom surface 210 and a sidewall 220 bent vertically from the bottom surface 210. A predetermined space is provided inside the cover bottom 200, and the liquid crystal panel 700 and the backlight unit are mounted inside the cover bottom 200.

As shown in FIG. 3, a hole 230 is formed at one side edge or a bottom of the cover bottom 200. The hole 230 may be formed on a surface on which the LED module 100 is disposed among four surfaces of the cover bottom 200. One side of the heat dissipation layer configured in the LED module 100 passes through the hole 230 to the outside.

On the other hand, the hole 230 may be formed on both side surfaces or the lower edge of the cover bottom 200. In this case, both sides of the heat dissipation layer configured in the LED module 100 pass through the hole 230 to the outside.

The liquid crystal panel 700 displays an image according to the input image data, and the lower substrate 710 (the TFT array substrate) and the upper substrate 720 (the color filter array substrate) are opposed to each other, and the two substrates 710 and 720 are bonded to each other. The liquid crystal layer is interposed in between.

The liquid crystal panel 700 controls the arrangement of liquid crystals according to image data applied through thin film transistors (TFTs) arranged in a matrix on the lower substrate 710, that is, an electric field formed by a data voltage and a common voltage. By controlling the arrangement of the liquid crystal to adjust the amount of light incident on the backlight unit to display an image.

The liquid crystal panel 700 is mounted on the guide panel 600 and mounted in the cover bottom 200. Although not shown in the drawings, a case top may be disposed above the liquid crystal panel 700. Meanwhile, in the case of a borderless liquid crystal display device, a reinforcing glass may be disposed on the liquid crystal panel 700.

Since the liquid crystal panel 700 does not generate light by itself, the liquid crystal panel 700 receives light through a backlight unit including a plurality of light sources.

The backlight unit includes an LED module 100, a light guide panel 300 (LGP), a reflector plate 400, and a plurality of optical sheets 500.

4 is a view showing an LED module according to an embodiment of the present invention, Figure 5 is a view showing the end length of the heat dissipation layer in the LED module according to an embodiment of the present invention.

Hereinafter, the LED module 100 according to the embodiment of the present invention will be described with reference to FIGS. 4 and 5.

LED module 100 according to an embodiment of the present invention is a plurality of LEDs (light emitting diode) 110 is integrated on the FPC (120, flexible printed circuit), the heat radiation to radiate heat generated from the LED 110 A layer (heat radiating layer) 130 is formed inside the FPC 120.

In detail, the FPC 120 includes the flexible film 122, the metal electrode 124, the protective layer 126, and the solder 128.

The flexible film 122 is formed of polyimide (PI), and the metal electrode 124 is contacted with the anode electrode and the cathode electrode of the LED 110 through the solder 128. The protective layer 126 is formed of a photo solder resist (PSR), and protects the solder 128 and the portion that does not require coating.

Here, the heat dissipation layer 130 is formed of graphite having excellent heat dissipation performance, and is formed between the flexible film 122 and the metal electrode 124 of the FPC 120. That is, the LED module 100 has a structure in which the heat dissipation layer 130 is inserted into the FPC 120.

As such, the LED module 100 according to the embodiment of the present invention has a structure in which the heat dissipation layer 130 formed of graphite is inserted into the FPC 120, so that foreign matters are generated due to soft graphite in the manufacturing process. To be suppressed.

The heat dissipation layer 130 may be formed of ceramic in addition to graphite. When the heat dissipation layer 130 is formed of ceramics, the physical properties thereof are hard and foreign matters are suppressed, and excellent heat dissipation performance can be obtained.

As shown in FIG. 5, the LED module 100 according to the embodiment of the present invention has an opening 150 formed at an end of the flexible film 122 so that one end or both ends of the heat dissipation layer 130 are exposed. It is.

One end or both ends of the heat dissipation layer 130 are exposed by the opening 150. One end or both ends of the heat dissipation layer 130 may be in contact with the cover bottom 200 of the liquid crystal display device to radiate heat generated by the LED 110 to the outside.

In addition, the LED module 100 according to an embodiment of the present invention may be formed such that one end 132 or both ends of the heat dissipation layer 130 are extended than the flexible film 122.

One end 132 or both ends of the heat dissipation layer 130 formed to extend in length than the flexible film 122 may be bent in a 'b' shape or 'c' shape from the outside of the cover bottom 200 to cover the bottom 200 ) Can be contacted.

Here, the LED module 100 may be attached to and fixed to the side wall 220 of the cover bottom 200 through the adhesive tape 140.

7 and 8 are views illustrating a contact structure between an LED module and a cover bottom according to an exemplary embodiment of the present invention.

Referring to FIG. 7, one end 132 or both ends of the heat dissipation layer 130 formed to extend the length of the flexible film 122 may be disposed outside the cover bottom 200 through the hole 230 shown in FIG. 3. To be discharged. In addition, one end 132 or both ends of the heat dissipation layer 130 may be bent into a 'b' shape or a 'c' shape from the outside of the cover bottom 200 to be in direct contact with the back or side of the cover bottom 200. Can be.

Here, one end 132 or both ends of the heat dissipation layer 130 may be attached to the back or side of the cover bottom 200 using a double-sided adhesive tape.

Meanwhile, one end 132 or both ends of the heat dissipation layer 130 may be attached to the back or side of the cover bottom 200 by using the thermal conductive tape 160.

As such, when the heat dissipation layer 130 directly contacts the cover bottom 200, the heat dissipation performance may be improved, and the heat dissipation layer 130 may be inserted into the FPC 120 to suppress generation of foreign matter.

5 and 8, as another example of the present invention, the LED module 100 has an opening 150 formed at an end of the flexible film 122 so that one end or both ends of the heat dissipation layer 130 are exposed. It is.

Here, one end or both ends of the heat dissipation layer 130 may be in contact with the inside of the cover bottom 200 without discharging one end or both ends of the heat dissipation layer 130 to the outside of the cover bottom 200. .

As an example, the thermal conductive tape 160 may be attached to one end or both ends of the heat dissipation layer 130 exposed by the opening 150 to contact the bottom surface of the cover bottom 200. As such, when the heat dissipation layer 130 directly contacts the cover bottom 200, heat generated from the LED 110 may be radiated to the outside.

Again, referring to FIG. 2, the light guide panel 300 is mounted in the inner space of the cover bottom 200, and the plurality of optical sheets 500 and the liquid crystal panel 700 are sequentially disposed thereon.

A reflector plate 400 for reflecting light emitted in the rear direction of the light guide panel 300 in the direction of the liquid crystal panel 700 is disposed on the rear surface of the light guide panel 300.

The light guide panel 300 is mounted in a predetermined space provided inside the cover bottom 200 and includes an incident surface on which light is incident.

The LED module 100 is attached to the side wall 220 of the cover bottom 200 through the adhesive tape 140, and the light incident surface on which the light generated by the plurality of LEDs 110 is formed on the side of the light guide panel 300. Incident.

When light from the plurality of LEDs 110 is incident on the incident surface of the light guide panel 300, the path of the incident light through the incident surface is changed to be emitted toward the liquid crystal panel 700. The light emitted from the light guide panel 300 is supplied to the liquid crystal panel 700 via the plurality of optical sheets 500.

Although not shown in the drawings, an LED driver for driving the plurality of LEDs 110 is formed, and the brightness of the light generated by the plurality of LEDs 110 is adjusted according to the magnitude or amount of current supplied from the LED driver. .

As described above, the plurality of LEDs 110 may be integrated with the FPC 120 to reduce the thickness of the LED module 100. When the thickness of the LED module 100 is reduced, the bezel size of the outer case can be reduced, thereby enhancing the design aesthetics of the liquid crystal display device.

The LED module and the liquid crystal display device including the same according to an exemplary embodiment of the present invention may improve the heat dissipation performance by directly contacting the heat dissipation layer 130 with the cover bottom 200.

In addition, the heat dissipation layer 130 may be formed inside the FPC 120 to form the LED module 100 to prevent the defect of the LED module and the defect of the liquid crystal display device due to the foreign matter.

In addition, by matching the plurality of LEDs 110 to the FPC 120, it is possible to reduce the manufacturing cost of the LED module 100 and the liquid crystal display device, and to simplify the manufacturing process.

It will be understood by those skilled in the art that the present invention can be embodied in other specific forms without departing from the spirit or essential characteristics thereof. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

The scope of the present invention is defined by the appended claims rather than the detailed description and all changes or modifications derived from the meaning and scope of the claims and their equivalents are to be construed as being included within the scope of the present invention do.

100: LED module 110: LED
120: FPC 122: flexible film
124: metal electrode 126: protective layer
128: solder 130: heat dissipation layer
132: heat dissipation end 140: adhesive tape
150: opening 160: thermal conductive tape
200: cover bottom 210: bottom surface
220: side wall 300: light guide panel
400: reflector 500: optical sheet
600: guide panel 700: liquid crystal panel

Claims (10)

In the LED module in which a plurality of light emitting diodes (LED) is integrated in a flexible printed circuit (FPC),
Flexible film;
A heat dissipation layer formed on the flexible film;
An anode electrode and a cathode electrode formed on the heat dissipation layer;
An LED formed on the heat dissipation layer so as to be connected to the anode electrode and the cathode electrode; And
And a photo solder resist formed to cover the anode electrode and the cathode electrode. The method of claim 1,
The heat dissipation layer is an LED module, characterized in that formed of graphite (cerite) or ceramic (ceramic). The method of claim 1,
An opening is formed in the flexible film so that one end or both ends of the heat dissipation layer are exposed.
LED module, characterized in that one end or both ends of the heat dissipation layer is in contact with the cover bottom of the liquid crystal display device through the opening. The method of claim 1,
One end or both ends of the heat dissipation layer is formed to extend the length than the flexible film,
LED module, characterized in that one end or both ends of the heat dissipation layer is in contact with the cover bottom of the liquid crystal display device. The method according to claim 3 or 4,
One end or both ends of the heat dissipation layer is in contact with the side or the back of the cover bottom LED module. A liquid crystal display device comprising a LED module in which a plurality of light emitting diodes (LEDs) are integrated in a flexible printed circuit (FPC),
A liquid crystal panel;
An LED module for supplying light to the liquid crystal panel;
A plurality of optical members for guiding light from the LED module to the liquid crystal panel and improving light efficiency; And
A cover bottom for mounting the LED module and the plurality of optical members;
The LED module,
A flexible film, a heat dissipation layer formed on the flexible film, an anode electrode and a cathode electrode formed on the heat dissipation layer, and an LED formed on the heat dissipation layer to be connected to the anode electrode and the cathode electrode. . The method according to claim 6,
The heat dissipation layer of the LED module is a liquid crystal display device, characterized in that formed of graphite (cerite) or ceramic (ceramic) The method of claim 7, wherein
An opening is formed in the flexible film so that one end or both ends of the heat dissipation layer are exposed.
One end or both ends of the heat dissipation layer is in contact with the cover bottom through the opening. The method of claim 7, wherein
One end or both ends of the heat dissipation layer is formed to extend the length than the flexible film,
One end or both ends of the heat dissipation layer is in contact with the cover bottom. 10. The method according to claim 8 or 9,
Holes are formed in the side or bottom edge of the cover bottom,
One end or both ends of the heat dissipation layer is bent while penetrating the hole and the liquid crystal display device, characterized in that the contact with the side or rear of the cover bottom.

Images