KR20110068202A - Seal pattern formed substrate and forming method of seal pattern and manufacturing method of liquid crystal display device using the same - Google Patents

Seal pattern formed substrate and forming method of seal pattern and manufacturing method of liquid crystal display device using the same Download PDF

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Publication number
KR20110068202A
KR20110068202A KR1020090125055A KR20090125055A KR20110068202A KR 20110068202 A KR20110068202 A KR 20110068202A KR 1020090125055 A KR1020090125055 A KR 1020090125055A KR 20090125055 A KR20090125055 A KR 20090125055A KR 20110068202 A KR20110068202 A KR 20110068202A
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KR
South Korea
Prior art keywords
seal pattern
panel
panel region
substrate
seal
Prior art date
Application number
KR1020090125055A
Other languages
Korean (ko)
Inventor
김현정
방규용
정동철
Original Assignee
주식회사 탑 엔지니어링
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Application filed by 주식회사 탑 엔지니어링 filed Critical 주식회사 탑 엔지니어링
Priority to KR1020090125055A priority Critical patent/KR20110068202A/en
Priority to PCT/KR2009/007976 priority patent/WO2011074734A1/en
Priority to TW98146463A priority patent/TW201119746A/en
Publication of KR20110068202A publication Critical patent/KR20110068202A/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1341—Filling or closing of cells

Abstract

PURPOSE: A seal pattern formed substrate and a method for forming the seal pattern are provided to easily cut each panel by reducing the size of the seal pattern. CONSTITUTION: A substrate comprises a seal pattern(330) which is placed on a first mother substrate(300) using a dispenser. The first mother substrate is defined by a plurality of panels. The seal pattern is formed about two or more panel domains through one time dispensing. The seal pattern comprises a first seal pattern unit(333) and a second seal pattern unit. The first seal pattern part is formed along the edge part of two or more panel regions. The second seal pattern is formed between panel regions.

Description

Seal pattern formed substrate and forming method of seal pattern and manufacturing method of liquid crystal display device using the same}

The present invention relates to a substrate on which a seal pattern is formed, a method of forming a seal pattern, and a method of manufacturing a liquid crystal display device using the same, wherein the seal pattern is formed on a cutting line for cutting each panel in a mother substrate for a plurality of panels. The present invention relates to a method of forming a substrate and a seal pattern on which a seal pattern is formed to reduce the cross-sectional area and to facilitate cutting of each panel, and a method of manufacturing a liquid crystal display device using the same.

As the information society develops, the demand for display devices is increasing in various forms.In recent years, liquid crystal display (LCD), plasma display panel (PDP), electro luminescent display (ELD), and VFD have been developed. Various flat panel display devices such as Vacuum Fluorescent Display have been researched and developed.

Among them, the liquid crystal display device, which has improved performance by the rapidly developing semiconductor technology, replaces the existing cathode ray tube (CRT) due to the advantages such as high image quality, small size, light weight, and low power. While being used a lot.

Therefore, the liquid crystal display, which is one of the flat panel displays, is not only a small product such as a portable cellular phone, a personal digital assistant (PDA) and a portable multimedia player (PMP), but also a medium and large product such as a monitor of a TV and a computer that receives and displays broadcast signals. It is used in various ways.

The liquid crystal display device is a display device in which a desired image is displayed by individually supplying data signals according to image information to liquid crystal cells arranged in a matrix to adjust light transmittance of the liquid crystal cells.

Such a liquid crystal display determines whether light is transmitted as an electrical signal is applied between a thin film transistor (TFT) substrate having a plurality of pixel patterns and a color filter substrate having a color filter layer. A liquid crystal layer is provided.

The TFT substrate may include a plurality of gate lines arranged in one direction, a plurality of data lines arranged in a direction perpendicular to the gate lines, and a plurality of pixel electrodes formed in each pixel region defined by crossing each gate line and data line. And a plurality of TFTs which are switched by the signals of the gate lines and transfer the signals of the data lines to each pixel electrode.

In addition, the color filter substrate is provided with a black matrix for blocking light in portions other than the pixel region, an RGB color filter layer for expressing color colors, and a common electrode for implementing an image.

The TFT substrate and the color filter substrate are sealed by a sealant formed on the outer side thereof. As a method of forming the sealant on the substrate, a dispensing method using a dispenser is widely used.

The dispensing method is a scanning method capable of selectively forming a seal pattern only at a desired position. The dispensing method fills a sealant in a dispenser using the same principle as a syringe and forms a seal pattern at a desired height and cross section at a predetermined pressure.

1 illustrates an example of seal patterns 3 formed in a conventional manner on a mother substrate 1 including a plurality of panel regions P1 to P6.

The seal pattern 3 is formed in a predetermined direction (① → ④) at the edge of the panel region P1 starting from a specific panel region (for example, P1) and repeats the rest of the panel regions P2 to P6. .

At this time, the height of the dispenser nozzle is measured and kept constant for each panel region, and the sealant coating pressure and the coating speed are also kept constant to apply.

However, in this conventional method, since the seal patterns 3 of the panel areas P1 to P6 are formed independently of each other, the start part 5 and the finish part of the seal pattern 3 of each panel area P1 to P6 are formed. In (7), the height of the nozzle, the application pressure and the application speed must be reset every time, so there is a problem that the work takes a long time and the productivity is lowered.

Meanwhile, referring to FIG. 1, each of the panel regions P1 to P6 is separated to form a liquid crystal display device, in which case the seal pattern 3 is formed on the cutting line 9 (circular shape). There is a problem in that cutting is not easy due to the seal pattern 3).

FIG. 2 shows another example of seal patterns 3 formed in a conventional manner on a mother substrate 1 including a plurality of panel regions P1 to P6.

The seal pattern 3 is formed along a predetermined direction (① → ④) at the edge of the panel region P1 starting from a specific panel region (for example, P1), wherein the start portion 5 of the seal pattern 3 is formed. In this case, breakage of the seal pattern 3 occurs, and agglomeration of the seal pattern 3 occurs in the end portion 7 of the seal pattern 3.

If the seal pattern 3 is cut off, the liquid crystal may leak through the broken portion. If the seal pattern 3 is formed, both substrates may be bonded together to form the liquid crystal display device. There is a fear that the cell gap is not constant after being set.

The present invention has been made to solve the above problems, a method of forming a substrate and a seal pattern to form a seal pattern that can significantly shorten the working time, improve productivity and a method of manufacturing a liquid crystal display device using the same The purpose is to provide.

In addition, an object of the present invention is to provide a method of forming a substrate and a seal pattern and a method of manufacturing a liquid crystal display device using a seal pattern is formed in the mother substrate for a plurality of panels to facilitate the cutting of each panel. It is done.

Another object of the present invention is to provide a substrate on which a seal pattern capable of forming a seal pattern having a constant cross-sectional area, a method of forming a seal pattern, and a method of manufacturing a liquid crystal display device using the same.

In order to achieve the object of the present invention as described above, a substrate in which a failure turn of the present invention is formed includes a seal formed on the first mother substrate having a plurality of panel regions spaced apart from each other to have a constant height and a cross-sectional area using a dispenser. In the pattern, the seal pattern is formed by dispensing once for the at least two panel regions, and the first seal pattern portion and the at least two panel regions formed along the edges of the at least two panel regions. And a second seal pattern portion formed therebetween, wherein at least one portion of the second seal pattern portion is formed with a seal pattern having a small cross-sectional area.

Here, the seal pattern includes an intersection portion and a straight portion, and the intersection portion is formed by applying the sealant twice, and when forming the seal pattern of the intersection portion, the height of the nozzle, the application speed, or the application pressure may be changed.

The first mother substrate may include a cutting line for separating the panel regions, and a cross-sectional area of the second seal pattern portion is small at a portion where the second seal pattern portion meets the cutting line.

In addition, the seal pattern may include a start portion and a finish portion, and the seal portion may be formed so that the start portion and the finish portion are formed outside the plurality of panel regions.

On the other hand, the seal pattern forming method of the present invention for achieving the object of the present invention, a method of forming a seal pattern to have a constant height and cross-sectional area using a dispenser on the first mother substrate in which a plurality of panel regions are spaced apart from each other. The method of claim 1, further comprising: preparing the first mother substrate and dispensing the at least two panel regions once, and forming a first seal pattern portion along at least two edges of the at least two panel regions; And a second seal pattern portion formed between the two panel regions, wherein at least one portion of the second seal pattern portion includes forming a seal pattern to have a small cross-sectional area.

Here, the seal pattern includes an intersection portion and a straight portion, and the intersection portion is formed by applying the sealant twice, and when forming the seal pattern of the intersection portion, the height of the nozzle, the application speed, or the application pressure may be changed.

The intersection may be formed at a boundary of the panel region, formed in the panel region, or formed at the center of the second seal pattern portion.

In addition, the seal pattern may include a start portion and a finish portion, and the seal portion may be formed so that the start portion and the finish portion are formed outside the plurality of panel regions.

Furthermore, the method may further include forming a cutting line for separating the panel regions on the first mother substrate, wherein a cross-sectional area of the second sealing pattern portion is formed to be small at a portion where the second sealing pattern portion meets the cutting line. It is done.

In addition, the second seal pattern portion may include a straight portion parallel to at least one side of the panel regions, and at least one portion of the straight portion may include forming a seal pattern to have a small cross-sectional area.

Preferably, the plurality of panel regions includes a first panel region of a left side of the first mother substrate and a second panel region of a right side of the first mother substrate, and the forming of the seal pattern may include: Forming a seal pattern to enter the first panel region by changing the direction of travel of the seal pattern at an intermediate point of the left side, starting at an outer side of the panel region and changing along the left side of the first mother substrate; Forming a seal pattern along an edge of the first panel area to a right middle point of the first panel area; and changing a direction of travel of the seal pattern at the right middle point of the first panel area to the second panel area. Forming a seal pattern to enter, forming a seal pattern along an edge of the second panel region, and at a middle left point of the second panel region. The method may further include forming a seal pattern to an outer portion of the first panel region by changing a direction in which the seal pattern travels, and removing the dispenser from the first mother substrate.

Here, it is preferable that the first panel region and the second panel region are repeated.

On the other hand, the manufacturing method of the liquid crystal display device of the present invention for achieving the object of the present invention, preparing a first mother substrate and a second mother substrate in which a plurality of panel regions are spaced apart from each other and the first mother substrate Forming a seal pattern in the method of any one of claims 5 to 14, the step of bonding the first mother substrate and the second mother substrate and curing the seal pattern and the bonded first and second mosquito And cutting the plate for each panel region through a cutting process.

Here, the method may further include dropping liquid crystal onto the first mother substrate or the second mother substrate.

According to the present invention, by forming the seal pattern for the plurality of panels by one dispensing, the working time is drastically shortened and productivity is improved.

In addition, the present invention has an advantage in that the cutting of each panel can be facilitated by reducing the cross-sectional area of the seal pattern formed on the cutting line for cutting each panel in the mother substrate for the plurality of panels.

Furthermore, according to the present invention, the seal patterns formed in the plurality of panel regions can have a uniform cross-sectional area, and the constant cross-sectional area at the intersections generated by forming the seal patterns for the plurality of panel regions by one dispensing. There is an effect that can form a seal pattern having.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the embodiments of the present invention described below are provided to enable those skilled in the art to more easily understand the present invention, and the scope of the present invention is not limited to the described embodiments.

3 is a perspective view showing an example of a dispenser for forming a seal pattern according to the present invention.

Referring to FIG. 3, the dispenser 100 includes a frame 110, a stage 120, a head support 130, a dispenser head 140, a guide mechanism 150, and a controller (not shown).

The stage 120 is disposed above the frame 110 and formed to seat the substrate S supplied from one side of the frame 110.

The stop 120 may be horizontally moved on the X axis or the Y axis by an actuator (not shown).

The head support 130 is disposed above the stage 120.

The head support 130 is formed to extend in the X-axis direction, both ends are supported by the frame 110.

The head support 130 may be horizontally moved in the Y-axis direction by an actuator, and a guide mechanism 150 is provided to enable horizontal movement of the head support 130.

The guide mechanism 150 may include a guide block 160 formed on both ends of the guide rail 160 and the head support 130 formed in the Y-axis direction on the frame 110 so as to be horizontally moved along the guide rail 160. 170).

A plurality of dispenser heads 140 are formed along the X axis in the head support 130, and may be horizontally moved in the X axis direction by the actuator.

4 is a perspective view of the dispenser head shown in FIG. 3.

Referring to FIG. 4, the dispenser head 140 is coupled to the vertical transfer mechanism 210 and configured to move in the vertical direction according to the operation of the vertical transfer mechanism 210.

By moving the dispenser head 140 up and down through the vertical transfer mechanism 210, the gap between the nozzle 220 mounted on the dispenser head 140 and the substrate S mounted on the stage 120 can be adjusted. do.

The dispenser head 140 is provided with a displacement sensor 230 in which the nozzle 220 is inserted and supported, and measures a distance between the substrate S and the nozzle 220.

The displacement sensor 230 measures the distance between the nozzle 220 and the substrate S and provides it to the controller.

The controller controls the distance between the nozzle 220 and the substrate S based on the measured distance, and controls the actuator and the vertical transfer mechanism 210.

In addition, the dispenser head 140 is configured such that a syringe 240 for receiving the sealant may be mounted to apply the sealant.

The syringe 240 is configured to be connected to an air pressure supply device (not shown) for feeding liquid crystal to the nozzle at a predetermined pressure.

Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. 5A to 6.

5A to 5E are plan views sequentially illustrating a seal pattern forming method according to a first embodiment of the present invention, and FIG. 6 is a schematic cross-sectional view of a liquid crystal display using the seal pattern forming method according to the present invention.

As shown in FIG. 5A, a first mother substrate 300 is prepared, and a plurality of panel regions P1 to P6 for forming a plurality of liquid crystal panels on the first mother substrate 300 are defined.

Subsequently, the stage 120, the head support 130, or the dispenser head 140 of the dispenser 100 is moved to change the moving direction of the nozzle 220 to form the seal pattern 330, as shown in FIG. 5B. The seal pattern 330 is formed in the first direction ① starting from the outside of the left panel region P1 of the first mother substrate 300.

At this time, the opening of the seal pattern 330 is broken at the start 350 of the seal pattern 330.

However, since the start portion 350 of the seal pattern 330 is located outside the panel region P1, there is no problem such as the outflow of liquid crystal after the panel is completed.

Subsequently, the advancing direction of the nozzle 220 is changed by 45 ° clockwise in the vicinity of the boundary line of the panel region P1 to enter the panel region P1.

After the nozzle 220 enters the panel region P1, the direction of rotation is changed by 45 ° clockwise to form the seal pattern 330 up to the lower left corner of the panel region P1.

Subsequently, the direction of movement of the nozzle 220 is changed by 90 ° counterclockwise at the lower left corner of the panel region P1, and a seal pattern is formed to the lower corner of the right side of the panel region P1, and then the direction of travel is reversed again. By changing 90 ° clockwise, a seal pattern is formed to the middle point of the right side of the panel region P1.

Subsequently, the moving direction of the nozzle 220 is changed by 45 ° clockwise to leave the panel region P1, and then the moving direction of the nozzle 220 is changed by 45 ° clockwise again to form a seal pattern in a straight line.

Thus, when the panel region P1 is divided into upper and lower portions, all the seal patterns of the lower region are formed.

Next, near the boundary line of the panel region P2, the nozzle 220 is changed in the clockwise direction by 45 ° to enter the panel region P2, and after entering the panel region P2, the clockwise direction is changed again. 45 degrees in the direction to form the seal pattern 330 to the lower left vertex of the panel region P2.

Subsequently, the direction of movement of the nozzle 220 is changed by 90 ° counterclockwise at the lower left corner of the panel region P2, and a seal pattern is formed to the lower corner of the right side of the panel region P2, and then the direction of travel is reversed again. The seal pattern is formed to the middle point of the right side of the panel region P2 by changing 90 degrees clockwise.

Subsequently, the direction of movement of the nozzle 220 is changed by 45 ° clockwise to leave the panel region P2. Then, the direction of movement of the nozzle 220 is changed by 45 ° clockwise again and the seal pattern 330 is straight. Form.

Thus, when the panel region P2 is divided into upper and lower portions, all the seal patterns 330 of the lower region are formed.

Next, near the boundary line of the panel area P3, the nozzle 220 is changed in the clockwise direction by 45 ° to enter the panel area P3, and after entering the panel area P3, the clock is moved again. 45 degrees in the direction to form the seal pattern 330 to the lower left corner of the panel region P3.

Subsequently, the direction of movement of the nozzle 220 is changed by 90 ° counterclockwise at the lower left corner of the panel region P3, and a seal pattern is formed to the lower corner of the right side of the panel region P3. The seal pattern 330 is formed to the upper right vertex of the panel region P3 by changing 90 ° clockwise.

Thus, when the panel region P3 is divided into upper and lower portions, all the seal patterns 330 of the lower region are formed.

As shown in FIG. 5C, the direction of movement of the nozzle 220 is changed by 90 ° counterclockwise to form a seal pattern 330 up to the upper left corner of the panel region P3, and the direction of movement of the nozzle 220 is counterclockwise. The seal pattern 330 is formed to the middle point of the left side of the panel region P3 by changing by 90 ° in the direction.

Subsequently, the moving direction of the nozzle 220 is changed by 45 ° clockwise to move out of the panel region P3. Then, the moving direction of the nozzle 220 is changed by 45 ° clockwise again and the seal pattern 330 is straightened. Form.

Thereby, all the seal patterns 330 of the panel area P3 are completed.

Next, near the boundary line of the panel region P2, the nozzle 220 is changed in the clockwise direction by 45 ° to enter the panel region P2, and after entering the panel region P2, the clockwise direction is changed again. 45 degrees in the direction to form the seal pattern 330 up to the upper right corner of the panel region P2.

Subsequently, the direction of movement of the nozzle 220 is changed by 90 ° counterclockwise at the upper right corner of the panel region P2, and a seal pattern is formed to the upper left corner of the panel region P2. By changing 90 ° clockwise, a seal pattern is formed to the middle point of the left side of the panel region P2.

Subsequently, the direction of movement of the nozzle 220 is changed by 45 ° clockwise to leave the panel region P2. Then, the direction of movement of the nozzle 220 is changed by 45 ° clockwise again and the seal pattern 330 is straight. To form.

As a result, all the seal patterns 330 of the panel region P2 are completed.

Next, near the boundary line of the panel region P1, the direction of nozzle 220 is changed by 45 ° clockwise to enter the panel region P1, and after entering the panel region P1, the direction of rotation is clocked again. 45 degrees in the direction to form the seal pattern 330 to the upper right corner of the panel region P1.

Subsequently, the direction of movement of the nozzle 220 is changed by 90 ° counterclockwise at the lower right corner of the panel region P1, and a seal pattern is formed to the upper left corner of the panel region P1. The seal pattern is formed to the middle point of the left side of the panel region P1 by changing 90 degrees clockwise.

Subsequently, the direction of movement of the nozzle 220 is changed by 45 ° clockwise to leave the panel region P1. Then, the direction of movement of the nozzle 220 is changed by 45 ° counterclockwise again and the seal pattern 330 is straight. To form.

As a result, all of the seal patterns 330 of the panel region P1 are completed, and all of the seal patterns 330 of the panel regions P1 to P3 on the first mother substrate 300 are completed.

In the present exemplary embodiment, three panel regions P1 to P3 are formed on the first mother substrate 300, but the present invention is not limited thereto, and any panel region may be formed.

As shown in FIG. 5C, the seal pattern 330 is disposed between the first seal pattern portion 333 and the panel regions (eg, between P1 and P2) formed along an edge in the panel region (eg, P1). It has a second seal pattern portion 335 formed.

In addition, the seal pattern 330 has an intersection portion 337 formed at a boundary line of the panel region and a straight portion 339 which is part of the second seal pattern portion 335.

Next, the seal pattern 330 descends in a straight line from the outside of the panel region P1 and is formed to a middle point of the left side of the panel region P4.

Subsequently, as shown in FIG. 5D, the direction of movement of the nozzle 220 is changed by 45 ° in the counterclockwise direction to form the seal pattern 330 in a straight line, and then 45 ° in the clockwise direction near the boundary line of the panel region P4. The area P4 is entered.

5D and 5E, the method of forming the seal pattern 330 in the panel regions P4 to P6 is the same as the method of forming the seal pattern 330 in the panel regions P1 to P3, and thus a detailed description thereof will be omitted. .

As shown in FIG. 5E, all of the seal patterns 330 are completed and a point at which the nozzle 220 is removed from the first mother substrate 300 becomes the finish portion 370 of the seal pattern 330.

In the finish portion 370 of the seal pattern 330, the agglomeration phenomenon of the seal pattern 330 occurs, but according to the present invention, since the finish portion 370 is formed at the outside of the panel region P4, The agglomeration phenomenon does not cause a problem such as a failure turn failure.

According to the present invention mentioned above, by forming the seal pattern 330 for the plurality of panel regions P1 to P6 by one dispensing, the work time is drastically shortened and productivity is improved. have.

Next, a second mother substrate (not shown) facing the first mother substrate 300 is prepared, the liquid crystal is dropped on the first mother substrate 300 or the second mother substrate, and both substrates are mutually separated. Stick together.

Next, the first mother substrate 300 and the second mother substrate are bonded by curing the seal pattern 330 by UV irradiation through a UV irradiation apparatus.

Here, the seal pattern uses a UV (ultraviolet) curable seal material. In particular, UV (ultraviolet) curable seal material is used to make a liquid crystal drop type liquid crystal display device. When using a thermosetting seal material in the liquid crystal drop method, liquid crystals formed between both substrates may be contaminated while the seal pattern 330 is heated. Because it can.

As shown in FIG. 5E, the two bonded mother substrates are cut along the cutting line 390 indicated by a dotted line for each of the panel areas P1 to P6.

At this time, the cutting process is made of a diamond pen having a strength higher than that of the glass substrate, and a scribing process of forming a cutting line on the surface of the substrate, and a break process of applying force to cut.

Each panel is completed after the scribe process and the brake process are completed.

Here, the portion indicated by a dotted line in FIG. 5E indicates a portion where the seal pattern 330 is formed on the cutting line 390, and the seal pattern 330 on the cutting line 390 may be formed. In this case, the cross-sectional area of the seal pattern 330 is made small by changing the height, the application speed, or the application pressure of the nozzle 220.

In this case, a portion where the cutting line 390 and the seal pattern 330 cross each other is a straight portion 339 or upper panel regions P1 to P3 and lower panel regions P4 to the second seal pattern portion 335. It may be formed at the portion connecting P6).

The method of changing the height, the application speed or the application pressure of the nozzle 220 to form a small cross-sectional area of the seal pattern 330, the method of lowering the height of the nozzle 220, increase the application speed or decrease the application pressure This can be.

When the cross-sectional area of the seal pattern 330 is formed on the cutting line 390 in the same manner as described above, there is an advantage that is easily cut when cutting the substrate along the cutting line 390 in the cutting process.

In addition, the intersection point in the intersection portion 337 of the seal pattern 330 is formed by two sealant coatings, in which the overall seal of the intersection portion 337 formed by changing the height, the application speed, or the application pressure of the nozzle 220. The cross-sectional area of the pattern 330 is uniform.

That is, the intersection portion 337 of the seal pattern 330 is formed by lowering the height of the nozzle 220, increasing the application speed, or decreasing the application pressure.

In this case, the intersection 337 may be formed by lowering the height of the nozzle 220, increasing the application speed, or lowering the application pressure in only one application, only two applications, or both applications.

In the present exemplary embodiment, the intersection 337 of the seal pattern 330 is preferably formed at the boundary line of each panel region P1 to P6.

Therefore, according to the present invention, the seal patterns formed in the plurality of panel regions can have a uniform cross-sectional area, and a constant cross-sectional area can be obtained even at intersections generated by forming the seal patterns for the plurality of panel regions by one dispensing. There is an effect that can form a seal pattern to have.

Referring to FIG. 6, the liquid crystal display device includes a TFT pattern 400 and a color filter substrate 500 facing each other, and a seal pattern 330 formed along inner edges of the TFT substrate 400 and the color filter substrate 500. And a liquid crystal layer 600 formed between the TFT substrate 400 and the color filter substrate 500.

In the liquid crystal display, a method for forming the liquid crystal layer 600 between the TFT substrate 400 and the color filter substrate 500 is conventionally a capillary tube after the TFT substrate 400 and the color filter substrate 500 are bonded. The vacuum injection method of injecting the liquid crystal between both substrates using the phenomenon and the pressure difference was used.

However, since the method requires a long time to inject the liquid crystal, there is a problem that productivity decreases as the substrate becomes larger.

Therefore, in recent years, the liquid crystal dropping method of dropping liquid crystal onto the TFT substrate 400 or the color filter substrate 500 to form the liquid crystal layer 600, and then bonding the TFT substrate 400 and the color filter substrate 500 to each other. I use it a lot.

Hereinafter, a second embodiment of the present invention will be described with reference to FIG.

In the second embodiment, only the characteristic parts distinguished from the first embodiment will be described and described for convenience of description, and the same components will be described with the same reference numerals.

That is, the same reference numerals refer to the same members having the same function.

Referring to FIG. 7, FIG. 7 is a plan view illustrating a seal pattern formed according to a second exemplary embodiment of the present invention.

In the present embodiment, the method of forming the seal pattern 330 is the same as that of the first embodiment described with reference to FIGS. 5A through 5E.

However, it is preferable that the intersection portion 337 of the seal pattern 330 is formed in each panel region P1 to P6, and the intersection point in the intersection portion 337 of the seal pattern 330 is formed by applying two sealants. .

Accordingly, the cross-sectional area of the entire seal pattern 330 of the intersection portion 337 formed by changing the height, the application speed, or the application pressure of the nozzle 220 is uniform so that a problem such as a cell gap defect when completing the panel does not occur.

That is, the intersection portion 337 of the seal pattern 330 is formed by lowering the height of the nozzle 220, increasing the application speed, or decreasing the application pressure.

In this case, the intersection 337 may be formed by lowering the height of the nozzle 220, increasing the application speed, or lowering the application pressure in only one application, only two applications, or both applications.

Hereinafter, a third embodiment of the present invention will be described with reference to FIGS. 8A to 8E. In the third embodiment, only the characteristic parts distinguished from the first embodiment will be described and described, and for the convenience of description, the same components will be described with the same reference numerals.

8A to 8E are plan views sequentially illustrating a method of forming a seal pattern according to a third exemplary embodiment of the present invention.

As shown in FIG. 8A, a first mother substrate 300 is prepared, and a plurality of panel regions P1 to P6 for forming a plurality of liquid crystal panels on the first mother substrate 300 are defined.

Subsequently, as shown in FIG. 8B, the sealing pattern 330 is formed by changing the traveling direction of the nozzle 220 of the dispenser 100, starting from the outside of the left panel region P1 of the first mother substrate 300. The seal pattern 330 is formed in the first direction ①.

Subsequently, the advancing direction of the nozzle 220 is changed by 45 ° clockwise in the vicinity of the boundary line of the panel region P1 to enter the panel region P1.

After the nozzle 220 enters the panel region P1, the direction of rotation is changed by 45 ° clockwise to form the seal pattern 330 up to the lower left corner of the panel region P1.

Subsequently, the direction of movement of the nozzle 220 is changed by 90 ° counterclockwise at the lower left vertex of the panel region P1, and the seal pattern 330 is formed to the lower right vertex of the panel region P1, and then proceeds again. The seal pattern 330 is formed to the middle point of the right side of the panel region P1 by changing the direction by 90 ° counterclockwise.

Subsequently, the direction of movement of the nozzle 220 is changed by 45 ° clockwise to form the seal pattern 330 until the panel region P2 is entered.

Thus, when the panel region P1 is divided into upper and lower portions, all the seal patterns of the lower region are formed.

Next, after the nozzle 220 enters the panel region P2, the direction of movement of the nozzle 220 is changed by 45 ° counterclockwise, so that the seal pattern 330 is extended to the upper left vertex of the panel region P2. Form.

Subsequently, the direction of movement of the nozzle 220 is changed by 90 ° clockwise to form a seal pattern to the upper right corner of the panel area P2, and the direction of movement of the nozzle 220 is changed by 90 ° clockwise again. The seal pattern 330 is formed to the middle point of the right side of the region P2.

Subsequently, the direction of movement of the nozzle 220 is changed by 45 ° counterclockwise to form the seal pattern 330 until entering the panel region P3.

Thus, when the panel region P2 is divided into upper and lower portions, all the seal patterns of the upper region are formed.

Next, after the nozzle 220 enters the panel region P3, the direction of travel is changed again by 45 ° clockwise to form the seal pattern 330 up to the lower left corner of the panel region P3.

Subsequently, the direction of movement of the nozzle 220 is changed by 90 ° counterclockwise at the lower left corner of the panel region P3, and a seal pattern is formed to the lower corner of the right side of the panel region P3. The seal pattern is formed on the right side of the panel region P3 by changing 90 degrees clockwise.

Thus, when the panel region P3 is divided into upper and lower portions, all the seal patterns of the lower region are formed.

As shown in FIG. 8C, the direction of movement of the nozzle 220 is changed by 90 ° counterclockwise to form the seal pattern 330 up to the upper left vertex of the panel region P3, and then the direction of the nozzle 220 is reversed. The seal pattern 330 is formed to the middle point of the left side of the panel region P3 by changing the clockwise direction by 90 °.

Subsequently, the direction of movement of the nozzle 220 is changed by 45 ° clockwise to form the seal pattern 330 until the panel region P2 is entered.

Thereby, all the seal patterns 330 of the panel area P3 are completed.

Next, after the nozzle 220 enters the panel region P2, the direction of rotation is changed by 45 ° counterclockwise to form the seal pattern 330 up to the lower right corner of the panel region P2.

Subsequently, the direction of movement of the nozzle 220 is changed by 90 ° clockwise at the lower right corner of the panel region P2, and a seal pattern is formed to the lower left corner of the panel region P2. 90 degrees to form a seal pattern 330 up to the middle point of the left side of the panel region P2.

Subsequently, the direction in which the nozzle 220 travels is changed by 45 ° counterclockwise to form the seal pattern 330 until the panel region P1 enters the panel region P1.

As a result, all the seal patterns 330 of the panel region P2 are completed.

Next, after the nozzle 220 enters the panel region P1, the direction of movement is changed again by 45 ° clockwise to form the seal pattern 330 up to the upper right corner of the panel region P1.

Subsequently, the direction of movement of the nozzle 220 is changed by 90 ° counterclockwise at the upper right vertex of the panel region P1, and the seal pattern 330 is formed to the upper left vertex of the panel region P1, and then proceeds again. The seal pattern 330 is formed to an intermediate point of the left side of the panel region P1 by changing the direction by 90 ° counterclockwise.

Subsequently, the moving direction of the nozzle 220 is changed by 45 ° clockwise to leave the panel region P1, and then the moving direction of the nozzle 220 is changed by 45 ° counterclockwise again and the seal pattern 330 is straight. ).

As a result, all of the seal patterns 330 of the panel region P1 are completed, and all of the seal patterns 330 of the panel regions P1 to P3 on the first mother substrate 300 are completed.

In the present exemplary embodiment, three panel regions P1 to P3 are formed on the first mother substrate 300, but the present invention is not limited thereto, and any panel region may be formed.

As shown in FIG. 8C, the seal pattern 330 is disposed between the panel region (eg, between P1 and P2) and the first seal pattern portion 333 formed along an edge in the panel region (eg, P1). It has a second seal pattern portion 335 formed.

Here, the second seal pattern portion 335 includes an intersection portion 337.

Next, referring to FIG. 8D, the seal pattern 330 descends in a straight line from the panel region P1 to a middle point of the left side of the panel region P4.

Subsequently, the traveling direction of the nozzle 220 is changed by 45 ° counterclockwise to enter the panel region P4.

8D and 8E, the method of forming the seal pattern 330 in the panel areas P4 to P6 is the same as the method of forming the seal pattern 330 in the panel areas P1 to P3, and thus a detailed description thereof will be omitted. .

As shown in FIG. 8E, all of the seal patterns 330 are completed and a point at which the nozzle 220 is removed from the first mother substrate 300 becomes the finish portion 370 of the seal pattern 330.

As shown in FIG. 8E, the two bonded mother substrates are cut along the cutting line 390 indicated by a dotted line for each of the panel areas P1 to P6.

Here, the portion indicated by the dotted dotted line in FIG. 8E indicates a portion where the seal pattern 330 is formed on the cutting line 390, and the seal pattern 330 on the cutting line 390 may be formed. In this case, the cross-sectional area of the seal pattern 330 is made small by changing the height, the application speed, or the application pressure of the nozzle 220.

In this case, a portion where the cutting line 390 and the seal pattern 330 cross each other may be formed in the center of the second seal pattern portion 335 or between the panel regions P1 to P6 or the upper panel regions P1 to P3 and the lower portion. The panel regions may be formed at portions connecting the panel regions P4 to P6.

In this embodiment, since the portion of the seal pattern 330 that intersects the cutting line 390 is the intersection of the intersection 337 where the sealant is applied twice, the nozzle 220 is particularly applied when the sealant is applied to the intersection 337. It is necessary to form the cross-sectional area of the seal pattern 330 to be considerably small by changing the height, the application speed, or the application pressure.

That is, the cross-sectional area of the seal pattern 330 of the cross section 337 is reduced by lowering the height of the nozzle 220, increasing the application speed, or lowering the application pressure. In both applications, the height of the nozzle 220 may be lowered, the application speed may be increased, or the application pressure may be lowered.

However, in this embodiment, since the portion of the seal pattern 330 that intersects the cutting line 390 is the intersection portion of the intersection 337 where the sealant is applied twice, the height of the nozzle 220 is lowered in both applications. It is preferable that the seal pattern 330 is hardly formed by increasing the application speed or decreasing the application pressure.

Hereinafter, a fourth embodiment of the present invention will be described with reference to FIGS. 9A to 9E. In the fourth embodiment, only characteristic parts distinguished from the first embodiment will be described and described for convenience of description, and the same components will be described with the same reference numerals.

9A to 9E are plan views sequentially illustrating a method of forming a seal pattern according to a fourth exemplary embodiment of the present invention.

As shown in FIG. 9A, a first mother substrate 300 is prepared, and a plurality of panel regions P1 to P6 for forming a plurality of liquid crystal panels on the first mother substrate 300 are defined.

Subsequently, as shown in FIG. 9B, the seal pattern 330 is formed by changing the moving direction of the nozzle 220 of the dispenser 100, starting from the outside of the left panel region P1 of the first mother substrate 300. The seal pattern 330 is formed in the first direction ①.

Subsequently, the traveling direction of the nozzle 220 is changed by 45 ° clockwise at the boundary line of the panel region P1 to enter the panel region P1.

After the nozzle 220 enters the panel region P1, the direction of rotation is changed by 45 ° clockwise to form the seal pattern 330 up to the lower left corner of the panel region P1.

Subsequently, the direction of movement of the nozzle 220 is changed by 90 ° counterclockwise at the lower left corner of the panel region P1, and a seal pattern is formed to the lower corner of the right side of the panel region P1, and then the direction of travel is reversed again. By changing 90 ° clockwise, a seal pattern is formed to the middle point of the right side of the panel region P1.

Subsequently, the direction of movement of the nozzle 220 is changed by 45 ° clockwise to form a seal pattern up to the boundary line of the panel region P1. Then, the direction of movement of the nozzle 220 is changed by 45 ° clockwise and then in a straight line. Form a seal pattern.

Thus, when the panel region P1 is divided into upper and lower portions, all the seal patterns of the lower region are formed.

Next, after the seal pattern 330 is formed in a straight line to the boundary line of the panel region P2, the traveling direction of the nozzle 220 is changed by 45 ° counterclockwise at the boundary line of the panel region P2 so that the panel region ( After entering P2), the direction of movement of the nozzle 220 is again changed by 45 ° counterclockwise to form the seal pattern 330 to the upper left vertex of the panel region P2.

Subsequently, the direction of movement of the nozzle 220 is changed by 90 ° clockwise at the upper left vertex of the panel region P2, and a seal pattern is formed to the upper right corner of the panel region P2, and then the clockwise direction is clockwise again. 90 degrees to form a seal pattern to the middle point of the right side of the panel region P2.

Subsequently, the advancing direction of the nozzle 220 is changed by 45 ° counterclockwise to form the boundary line of the panel region P2, and then the advancing direction of the nozzle 220 is changed by 45 ° counterclockwise, and the straight line is The seal pattern 330 is formed.

Thus, when the panel region P2 is divided into upper and lower portions, all the seal patterns 330 of the upper region are formed.

Next, after the seal pattern 330 is formed in a straight line to the boundary line of the panel region P3, the direction of movement of the nozzle 220 is changed by 45 ° clockwise from the boundary line of the panel region P3 to the panel region P3. ), The direction of movement of the nozzle 220 is again changed by 45 ° clockwise to form the seal pattern 330 to the lower left corner of the panel region P3.

Subsequently, the direction of movement of the nozzle 220 is changed by 90 ° counterclockwise at the lower left corner of the panel region P3, and a seal pattern is formed to the lower corner of the right side of the panel region P3. The seal pattern 330 is formed on the right side of the panel region P2 by changing 90 ° clockwise.

Thus, when the panel region P3 is divided into upper and lower portions, all the seal patterns 330 of the lower region are formed.

As shown in FIG. 9C, the direction of movement of the nozzle 220 is changed by 90 ° counterclockwise to form a seal pattern 330 up to the upper left corner of the panel region P3, and the direction of movement of the nozzle 220 is counterclockwise. The seal pattern 330 is formed to the middle point of the left side of the panel region P3 by changing by 90 ° in the direction.

Subsequently, the direction of movement of the nozzle 220 is changed by 45 ° clockwise to form the seal pattern 330 up to the boundary of the panel region P3, and then the direction of movement of the nozzle 220 is changed by 45 ° clockwise again. And the seal pattern 330 is formed in a straight line.

At this time, the sealant is applied twice to the second seal pattern portion 335 of the seal pattern 330 formed in a straight line between the panel regions P2 and P3.

Thereby, all the seal patterns 330 of the panel area P3 are completed.

Next, the direction of the nozzle 220 is changed by 45 ° counterclockwise at the boundary of the panel area P2 to enter the panel area P2, and then the direction of travel is changed 45 ° counterclockwise again. The seal pattern 330 is formed to the lower right corner of the region P2.

Subsequently, the direction of movement of the nozzle 220 is changed by 90 ° clockwise from the lower right corner of the panel region P2 to form the seal pattern 330 up to the lower left corner of the panel region P2, and then again the traveling direction. Is changed by 90 ° clockwise to form the seal pattern 330 to the middle point of the left side of the panel region P2.

Subsequently, the direction of movement of the nozzle 220 is changed by 45 ° counterclockwise to form the seal pattern 330 up to the boundary line of the panel region P2, and then the direction of movement of the nozzle 220 is counterclockwise 45. ° change and form the seal pattern 330 in a straight line.

As a result, all the seal patterns 330 of the panel region P2 are completed.

Next, at the boundary line of the panel area P1, the traveling direction of the nozzle 220 is changed by 45 ° clockwise to enter the panel area P1, and then the traveling direction is changed by 45 ° clockwise again to change the panel area ( The seal pattern 330 is formed to the upper right vertex of P1).

Subsequently, the direction of movement of the nozzle 220 is changed by 90 ° counterclockwise from the upper right corner of the panel region P1 to form the seal pattern 330 from the upper left corner of the panel region P1, and then proceeds again. The seal pattern 330 is formed to an intermediate point of the left side of the panel region P1 by changing the direction by 90 ° counterclockwise.

Subsequently, the direction of movement of the nozzle 220 is changed by 45 ° clockwise to form the seal pattern 330 up to the boundary line of the panel region P1, and then the direction of movement of the nozzle 220 is changed by 45 ° clockwise again. The seal pattern 330 is formed, and the direction of the nozzle 220 is changed by 90 ° clockwise to form the seal pattern 330 in a straight line.

As a result, all of the seal patterns 330 of the panel region P1 are completed, and all of the seal patterns 330 of the panel regions P1 to P3 on the first mother substrate 300 are completed.

In the present exemplary embodiment, three panel regions P1 to P3 are formed on the first mother substrate 300, but the present invention is not limited thereto, and any panel region may be formed.

As shown in FIG. 9C, the seal pattern 330 is disposed between the panel region (eg, between P1 and P2) and the first seal pattern portion 333 formed along an edge in the panel region (eg, P1). It has a second seal pattern portion 335 formed.

Here, the second seal pattern portion 335 includes a straight portion 339.

Next, the seal pattern 330 descends in a straight line from the panel region P1 to a middle point of the left side of the panel region P4.

Subsequently, the advancing direction of the nozzle 220 is changed by 90 ° counterclockwise to form the seal pattern 330 up to the boundary line of the panel region P4, and then the advancing direction of the nozzle 220 is changed by 45 ° clockwise. To enter panel region P4.

9D and 9E, the method of forming the seal pattern 330 in the panel regions P4 to P6 is the same as the method of forming the seal pattern 330 in the panel regions P1 to P3, and thus a detailed description thereof will be omitted. .

As shown in FIG. 9E, all of the seal patterns 330 are completed and a point at which the nozzle 220 is removed from the first mother substrate 300 becomes the finish portion 370 of the seal pattern 330.

As shown in FIG. 9E, the two bonded mother substrates are cut along the cutting line 390 indicated by a dotted line for each of the panel areas P1 to P6.

Here, the portion indicated by the dotted dotted line in FIG. 9E represents a portion where the seal pattern 330 is formed on the cutting line 390, and the seal pattern 330 on the cutting line 390 may be formed. In this case, the cross-sectional area of the seal pattern 330 is made small by changing the height, the application speed, or the application pressure of the nozzle 220.

That is, the cross-sectional area of the second seal pattern portion 335 to which the sealant is applied twice is reduced by lowering the height of the nozzle 220, increasing the application speed, or lowering the application pressure, which is applied only once or twice. It is possible to lower the height of the nozzle 220, increase the application rate or lower the application pressure only at the time of application or in both applications.

However, in this embodiment, the portion where the cutting line 390 and the seal pattern 330 cross each other is a straight portion 339 of the second seal pattern 330, and the sealant is applied twice to the straight portion 339. do.

Therefore, it is preferable that the seal pattern 330 is hardly formed by lowering the height of the nozzle 220, increasing the application speed, or lowering the application pressure in both applications.

The foregoing description is merely illustrative of the technical idea of the present invention, and various changes and modifications may be made by those skilled in the art without departing from the essential characteristics of the present invention. Therefore, the embodiments described in the present invention are not intended to limit the technical idea of the present invention but to explain, and the technical idea of the present invention is not limited by these embodiments. The protection scope of the present invention should be interpreted by the following claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention.

1 is a view showing an example of a seal pattern formed in a conventional manner,

2 is a view showing another example of the seal patterns formed in a conventional manner,

3 is a perspective view showing an example of a dispenser for forming a seal pattern according to the present invention,

4 is a perspective view of the dispenser head shown in FIG. 3,

5A to 5E are plan views sequentially illustrating a method of forming a seal pattern according to a first embodiment of the present invention.

6 is a schematic cross-sectional view of a liquid crystal display using the seal pattern forming method according to the present invention;

7 is a plan view showing a seal pattern formed according to a second embodiment of the present invention,

8A to 8E are plan views sequentially illustrating a method of forming a seal pattern according to a third exemplary embodiment of the present invention.

9A to 9E are plan views sequentially illustrating a method of forming a seal pattern according to a fourth exemplary embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

300: mother substrate 330: seal pattern

350: starting portion 333: first seal pattern portion

335: second seal pattern portion 337: cross section

339: straight portion 370: finish portion

390: cutting line 400: TFT substrate

500: color filter substrate 600: liquid crystal layer

Claims (19)

A substrate comprising a seal pattern formed using a dispenser on a first mother substrate in which a plurality of panel regions are spaced apart from each other, The seal pattern is formed by dispensing once for the at least two panel regions, and is formed between the first seal pattern portion formed along the edge of the at least two panel regions and the at least two panel regions. It includes a second seal pattern portion, At least one portion of the second seal pattern portion is a substrate having a seal pattern, characterized in that the cross-sectional area is formed small. The method of claim 1, The seal pattern includes an intersection portion and a straight portion, the intersection portion is formed by applying two sealants, When the seal pattern is formed in the cross section, the substrate having the seal pattern formed thereon, wherein the height of the nozzle, the application speed or the application pressure is changed. The method of claim 1, The first mother substrate includes a cutting line for separating each panel region, And a cross-sectional area of the second seal pattern portion at a portion where the second seal pattern portion meets the cutting line. The method of claim 1, And the seal pattern includes a start portion and a finish portion, and the seal pattern is formed such that the seal portion is formed at an outer side of the plurality of panel regions. A method of forming a seal pattern on a first mother substrate having a plurality of panel regions spaced apart from each other using a dispenser to have a constant height and cross-sectional area, Preparing the first mother substrate; A second seal pattern formed between the at least two panel regions and a first seal pattern portion formed by dispensing the at least two panel regions once along the edges of the at least two panel regions; And a seal pattern, wherein at least one portion of the second seal pattern portion comprises a seal pattern having a small cross-sectional area. The method of claim 5, The seal pattern includes an intersection portion and a straight portion, the intersection portion is formed by applying two sealants, Seal pattern forming method characterized in that for changing the seal pattern of the intersection portion, the height of the nozzle, the application speed or application pressure. The method of claim 6, And the intersection portion is formed at a boundary of the panel region. The method of claim 6, And the intersection portion is formed in the panel region. The method of claim 6, And the intersection portion is formed at the center of the second seal pattern portion. The method of claim 5, The seal pattern includes a start portion and a finish portion, the seal pattern forming method characterized in that the seal pattern is formed to be formed on the outside of the plurality of panel areas. The method of claim 5, Forming a cutting line for separating the panel regions on the first mother substrate; And the cross-sectional area of the second seal pattern portion is formed at a portion where the second seal pattern portion meets the cutting line. The method of claim 5, The second seal pattern portion includes a straight portion parallel to at least one side of the panel regions, And forming a seal pattern such that at least one portion of the straight portion has a small cross-sectional area. The method of claim 5, The plurality of panel regions may include a first panel region on a left side of the first mother substrate and a second panel region on a right side of the first mother substrate. Forming the seal pattern, Forming a seal pattern starting from the outer side of the first panel region along the left side of the first mother substrate and changing the direction of travel of the seal pattern at the middle point of the left side to enter the first panel region; Forming a seal pattern along an edge of the first panel region to a right middle point of the first panel region; Forming a seal pattern to enter the second panel region by changing a direction of travel of the seal pattern at a right middle point of the first panel region; Forming a seal pattern along an edge of the second panel region; Forming a seal pattern to an outer portion of the first panel region by changing a direction of travel of the seal pattern at a middle left point of the second panel region; And Removing the dispenser from the first mother substrate; Seal pattern forming method comprising a. The method of claim 13, And the first panel region and the second panel region are repeated. Preparing a first mother substrate and a second mother substrate, the plurality of panel regions being spaced apart from each other; Forming a seal pattern on the first mother substrate by the method of any one of claims 5 to 14; Bonding the first mother substrate and the second mother substrate and curing the seal pattern; And Cutting the bonded first and second mother substrates for each panel region through a cutting process; Method of manufacturing a liquid crystal display device comprising a. The method of claim 15, And dropping a liquid crystal onto the first mother substrate or the second mother substrate. A first substrate on which a thin film transistor is formed; A second substrate facing the first substrate; A liquid crystal layer formed between the first substrate and the second substrate; And And a seal pattern formed inside the first and second substrates, the seal pattern being at least partially in contact with edges of the first and second substrates. The seal pattern in contact with the edges of the first and second substrates may have a smaller cross-sectional area than the seal patterns formed inside the first and second substrates. The method of claim 17, And the second substrate comprises a color filter layer. The method of claim 17, And forming a seal pattern in contact with edges of the first substrate and the second substrate.
KR1020090125055A 2009-12-15 2009-12-15 Seal pattern formed substrate and forming method of seal pattern and manufacturing method of liquid crystal display device using the same KR20110068202A (en)

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PCT/KR2009/007976 WO2011074734A1 (en) 2009-12-15 2009-12-30 Substrate on which a seal pattern is formed and a method for forming a seal pattern, and a production method for a liquid crystal display device employing the same
TW98146463A TW201119746A (en) 2009-12-15 2009-12-31 Substrate having seal pattern, method for forming seal pattern and method for manufacturing liquid crystal display device using the same

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KR101333951B1 (en) * 2011-12-20 2013-11-27 하이디스 테크놀로지 주식회사 Sealant dispenser of Liquid crystal display panel and dispensing method using the same
KR101333972B1 (en) * 2011-12-28 2013-11-27 하이디스 테크놀로지 주식회사 Dispensing method of sealant and liquid crystal display using the same

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CN104007582B (en) * 2014-04-29 2016-07-06 京东方科技集团股份有限公司 The coating process of frame adhesive and substrate motherboard

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KR20040061337A (en) * 2002-12-30 2004-07-07 엘지.필립스 엘시디 주식회사 Apparatus for forming seal pattern of liquid crystal display and forming method of seal pattern using them
KR20050056799A (en) * 2003-12-10 2005-06-16 엘지.필립스 엘시디 주식회사 Seal pattern structure for liquid crystal display panel
KR101271522B1 (en) * 2006-06-09 2013-06-05 엘지디스플레이 주식회사 dispence apparatus for liquid crystal display device and dispense method using thereof
KR101274694B1 (en) * 2006-11-29 2013-06-12 엘지디스플레이 주식회사 Method for forming seal pattern, liquid crystal display using the same, and method for manufacturing liquid crystal display using the same

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Publication number Priority date Publication date Assignee Title
KR101333951B1 (en) * 2011-12-20 2013-11-27 하이디스 테크놀로지 주식회사 Sealant dispenser of Liquid crystal display panel and dispensing method using the same
KR101333972B1 (en) * 2011-12-28 2013-11-27 하이디스 테크놀로지 주식회사 Dispensing method of sealant and liquid crystal display using the same

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