KR20110064462A - Stacking type led and its manufacturing method - Google Patents

Abstract

PURPOSE: A stacking type LED package and manufacturing method thereof are provided to form an independent heat radiating structure at each unit package, thereby quickly and efficiency radiating heat. CONSTITUTION: A first step substrate comprises a first step package insulating layer(9) and a first step package conductive film(10). A heat radiating plate(15) with a heat radiating fin(14) is formed on the lower surface or a side of the first step substrate. A first light emitting diode is laminated on a fixed area of the first step substrate. At least two bump layers(5) are laminated on both ends of the first step substrate. A second step substrate is smaller than the size of the top of the first step substrate.

Description

Stacked LED package and its manufacturing method {Stacking Type LED and Its Manufacturing Method}

The present invention relates to a light emitting diode package formed by stacking a plurality of substrates and a method of manufacturing the same, and having a structure that emits heat independently for each package, thereby ensuring a heat dissipation effect and stacking a plurality of packages in a limited area. The present invention relates to a light emitting diode package capable of increasing a light beam density per unit area by taking a structure.

Recently, due to problems such as global warming and depletion of fossil fuel, research on eco-friendly green technology has been actively conducted. Representative examples of such eco-friendly technologies include solar cells, electric vehicles, and wind power generation facilities. In particular, in the lighting field, development and research on applications using light emitting diodes and light emitting diode packages are rapidly progressing. It's going on.

A light emitting diode (LED) is a semiconductor device that generates a small number of carriers (electrons or holes) injected using a PN junction structure of a semiconductor, and emits energy by recombination thereof. I) A conventional light source. Compared to small size, ii) longer lifespan, iii) high luminous efficiency because electric energy is directly converted to light energy, and iv) low power consumption, display device of automobile instrument, headlight of automobile, street lamp, fishing boat, light communication In almost all fields, from home lighting fixtures to industrial lighting fixtures, such as lighting sources, LED lighting sources are being replaced.

In order to apply light emitting diodes to applications such as display devices and lighting devices, light emitting diode packages having various structures that are easily mounted and used therein have been developed. In addition, research is being actively conducted to mount and utilize a plurality of light emitting diode packages on a printed circuit board (PCB) to form an application using a plurality of light emitting diode packages.

However, since the light emitting diode has a high light emitting efficiency, the heat generation amount is also considerable, and the light emitting diode package must be provided with heat dissipation means capable of dissipating chip heat to the outside. In this case, the temperature of the light emitting diode chip is so high that the chip itself or the packaging resin deteriorates, resulting in a decrease in luminous efficiency and shortening of the chip life.

In particular, in the case of a stacked light emitting diode package formed by stacking a plurality of packages in a limited space, thermal interaction between the packages occurs due to heat generated from the plurality of light emitting diodes, resulting in a high temperature of the chip, thereby widening the substrate itself. Since the formation of heat dissipation is inevitable, the structure of various application systems to which the light emitting diode package is applied has to be enlarged.

Accordingly, in the stacked light emitting diode package, i) take a heat dissipation structure to prevent heat interaction between a plurality of packages, and ii) configure a package having no heat dissipation effect even when laminating the package within a limited area, and iii There is a need for a stacked light emitting diode package capable of achieving miniaturization of various systems to which the light emitting diode package is applied and a manufacturing method thereof.

The present invention provides a stacked light emitting diode package, by forming an independent heat dissipation structure for each unit package, to prevent the interaction of heat between the packages to ensure the stability of the package, and to ensure fast and efficient heat dissipation effect and The purpose is to provide a manufacturing method.

In addition, the present invention by taking an independent heat dissipation structure for each package, it is possible to form a plurality of packages in a limited area, i) reducing the package manufacturing cost, ii) light emitting diode maximizing the beam flux density per unit area Another object is to provide a package and a method of manufacturing the same.

In addition, since the present invention can be formed by stacking a plurality of packages in a limited area iii) various applications to which the light emitting diode package is applied can be miniaturized and iv) to reduce the installation and manufacturing costs of the application application. There is a purpose.

The technical objects to be achieved by the present invention are not limited to the above-mentioned technical problems, and other technical subjects which are not mentioned can be clearly understood by those skilled in the art from the description of the present invention .

In order to solve the above-mentioned problems of the prior art, the present invention, in the light emitting diode package formed by stacking a plurality of substrates, the first stage package heat sink, the first stage package formed on the outside of the first stage package heat sink A first stage substrate (Substrate) having an insulating layer and a first stage package conductive film deposited on a predetermined region of the upper and side ends of the first stage package insulating layer and made of copper (Cu); A heat dissipation plate formed on a lower surface or a side surface of the first end substrate and having a heat dissipation fin; A first light emitting diode stacked on a predetermined region of the first end substrate; At least two bump layers stacked on both ends of the first substrate; A second stage package conductive layer formed on the bump layer and having a second stage package insulating layer and a second stage package conductive layer formed of copper (Cu) deposited on a predetermined region at upper and side ends of the second stage package insulating layer, wherein the first stage A second stage substrate formed smaller than an upper area of the substrate; At least two second light emitting diodes stacked on the second stage substrate; And a heat transfer member connecting the heat dissipation plate including the second stage substrate and the heat dissipation fins to transfer heat generated from the second light emitting diode to the heat dissipation plate. It provides a stacked light emitting diode package comprising a.

In the present invention, the first-stage package insulating layer or the second-stage package insulating layer includes a stacked light emitting diode package, characterized in that formed using a material having a thermal conductivity of 3 W / mK to 5000 W / mK. .

In the present invention, the single-stage package insulating layer or the second-stage package insulating layer, the lower surface is formed of a copper (Cu) layer or aluminum (Al) layer, the nickel (Ni) plated film on the upper surface of the lower surface And a layered light emitting diode package formed by depositing a layer made of any one material selected from gold (Au), silver (Ag), and tin (Sn) on the nickel plated film.

According to an embodiment of the present invention, a laminate type light emitting diode package is formed by bonding the first end substrate and the second end substrate using a bump layer so that an air layer is formed between the first and second end substrates. Include.

In the present invention, the bump layer includes a stacked light emitting diode package, which is formed using a material having a thermal conductivity of 0.03 W / mK to 0.3 W / mK.

In the present invention, the second end substrate includes a stacked LED package, characterized in that the end of the cross-section toward the first light emitting diode is formed in a triangular shape so that light generated in the first light emitting diode is not trapped. do.

The present invention includes a stacked LED package further comprising a heat transfer layer formed of a material having a thermal conductivity of 1,000 W / mK to 5,000 W / mK in the horizontal direction on the lower surface of the second light emitting diode. .

The present invention is coated with a material having a thermal conductivity of 1,000 W / mK to 5,000 W / mK in the horizontal direction on the outer surface of the bump layer and the predetermined region of the second-stage package insulating layer, further comprising a heat radiation fin in the horizontal direction It includes a stacked light emitting diode package, characterized in that provided.

In the present invention, the constituent material of the heat transfer layer or the coating material of the bump layer includes a stacked light emitting diode package, characterized in that formed of carbon nanotubes (CNT).

The present invention includes a stacked light emitting diode package further comprising a total reflection lens covering an upper portion of the first to second light emitting diodes.

According to an aspect of the present invention, a method of manufacturing a stacked LED package includes stacking a first substrate including a first stage package heat sink, a first stage package insulating layer, and a first stage package conductive layer on predetermined regions of upper and side surfaces of the heat sink. ; Stacking a first light emitting diode in a predetermined region on the first substrate and forming an encapsulant; Forming at least two bump layers on predetermined regions at both ends of the first end substrate; Stacking a second stage substrate having a second stage package insulating layer on the bump layer and a second stage package conductive film deposited on predetermined regions of upper and side ends of the second stage package insulating layer; Stacking at least two second light emitting diodes on the second stage substrate and forming an encapsulant; And forming a heat transfer member to connect the heat dissipation plate having the heat dissipation fin and the second end substrate to each other.

According to an embodiment of the present invention, after the laminating step of the second stage substrate, coating the outer surface of the bump layer and the side surface portion of the second stage package insulating layer using carbon nanotubes (CNT) in a horizontal direction; And forming heat dissipation fins in a horizontal direction on the side surfaces of the coded bump layer and the second stage package insulating layer.

The present invention includes a method of manufacturing a stacked light emitting diode package further comprising the step of laminating a heat transfer layer on a predetermined region of the second stage substrate after the lamination of the second stage substrate.

The present invention includes a method of manufacturing a stacked light emitting diode package after the step of forming the heat carrier, further comprising the step of forming a total reflection lens covering the upper portion of the first to second light emitting diodes. .

In the stacked light emitting diode package according to the present invention, an independent heat dissipation structure is formed for each unit package, i) ensuring fast and efficient heat dissipation effect, and ii) preventing thermal interaction between packages. There is an effect of providing a light emitting diode package and a method of manufacturing the same).

In addition, according to the present invention, by taking an independent heat dissipation structure for each package, it is possible to design to form a plurality of packages in a limited area, thereby maximizing the beam flux density per unit area, and a manufacturing method thereof Has the effect of providing.

In addition, since the present invention can be formed by stacking a plurality of packages in a limited area, the manufacturing cost of the light emitting diode package is reduced, and various applications such as street lamps and automobile headlights to which the light emitting diode package is applied are compact. Since it can be manufactured, the installation and production costs of the application is also reduced.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, terms or words used in the specification and claims should not be construed as having a conventional or dictionary meaning, and the inventors should properly explain the concept of terms in order to best explain their own invention. Based on the principle that can be defined, it should be interpreted as meaning and concept corresponding to the technical idea of the present invention. Therefore, the embodiments described in the specification and the drawings shown in the drawings are only one of the most preferred embodiments of the present invention and do not represent all of the technical idea of the present invention, various modifications that can be replaced at the time of the present application It should be understood that there may be equivalents and variations.

1 is a block diagram of a stacked light emitting diode package according to an embodiment of the present invention.

The present invention is i) by forming an independent cooling method or an independent heat dissipation structure for each unit package, maximizing the heat dissipation effect, ii) even if a plurality of packages stacked on a limited area there is no problem in the heat dissipation effect, iii) limited area Since more packages can be stacked on the substrate, the luminous flux density per unit area is maximized, and iv) there is no need to design a wide bottom substrate of the package, thereby providing a stacked LED package having high design efficiency and reducing manufacturing cost.

Referring to FIG. 1, the first stage substrate includes: i) a first stage package heat sink 8, ii) a first stage package insulating layer 9, and iii) a first stage package conductive film 10. . The lower surface or the side surface of the first stage substrate is formed with a heat sink having a heat radiation fin.

The first stage package insulating layer 9 may be coated on the outside of the first package heat sink 8, and the first stage made of copper (Cu) in a predetermined area outside the first stage package insulating layer 9. The first conductive substrate may be formed by coating the package conductive layer 10.

In the present invention, the first stage package insulating layer 9 may be formed using a material having a thermal conductivity of 3 W / mK to 5000 W / mK, which is not limited to one material but various kinds of materials. Of course, it can be formed by mixing or stacking in layers. The first stage package insulating layer 9 is not limited to a metal body, and any material may be used as long as the thermal conductivity is in the range of 3 W / mK to 5000 W / mK.

For example, one-stage package insulating layer may be formed in three stages, one stage is formed of a copper (Cu) layer or an aluminum (Al) layer, and a nickel (Ni) plated film is deposited in two stages thereon. The first stage package insulating layer 9 may be formed of a layer made of any one material selected from gold (Au), silver (Ag), and tin (Sn).

The first stage package conductive layer 10 may be formed on a portion of the top, side, and bottom surfaces of the first stage package insulating layer 9, which is a heat sink having heat radiating fins formed at a lower portion of the first stage package insulating layer 9. To discharge.

A first light emitting diode 1 (Light Emitting Diode) is stacked on a predetermined region of the first stage substrate. The stacking position of the first light emitting diode 1 should be designed in consideration of the stacking of the second light emitting diode 19 and the distribution of light.

The present invention may include at least two bump layers stacked on both ends of the first stage substrate. The bump layer 5 is preferably formed using a material having a thermal conductivity of 0.03 W / mK to 0.3 W / mK. This is because it is not preferable that heat generated in the second stage substrate is transferred to the first stage substrate because the heat dissipation structure is taken for each package such as the heat transfer body 4 to be described later.

In addition, the bump layer 5 is preferably formed using a material having good elasticity. This is to ensure the stability of the package by maintaining the bonding state at each stage even if the package is subjected to external shock.

A second stage substrate is stacked on the bump layer 5, and the second stage substrate may include i) a second stage package insulating layer 7 and ii) a second stage package conductive layer 21. have.

In the present invention, the second stage package insulating layer 7 may be formed using a material having a thermal conductivity of 3 W / mK to 5000 W / mK, which is the content of the first stage package insulating layer 9 described above. Is the same as In addition, the second stage package conductive film 21 made of copper may be provided.

Since the second stage substrate should be designed in consideration of the light distribution of the first light emitting diode 1 on the first stage substrate, it is preferable that the end of the cross section facing the first light emitting diode 1 is formed in a triangular shape.

In addition, in order to take an independent heat dissipation structure, an air layer should be formed between the first end substrate and the second end substrate. Therefore, the first stage substrate and the second stage substrate are insulated in the air layer, and heat is hardly transmitted even through the bump layer 5 as the bonding portion, so that each stage has a heat dissipation structure. Will be done.

In the present invention, at least two or more second light emitting diodes 19 stacked on the second stage substrate are stacked, and 1,000 W / mK to 5,000 W in a horizontal direction on the bottom surface of the second light emitting diodes 19. A heat transfer layer 20 formed of a material having a thermal conductivity of / mK may be further provided. For example, the heat transfer layer 20 may be formed using carbon nanotubes (CNT), and heat may be rapidly transferred in the horizontal direction by the heat transfer layer.

That is, the heat transfer layer 20 is not involved in the transfer of heat to the lower surface of the second end substrate, but maximizes the heat dissipation effect to transfer heat quickly to the heat transfer member 4 connecting the second substrate and the heat sink, which will be described later. It can be said that it plays a role.

The present invention includes a heat carrier (4), the heat carrier (4) serves to transfer the heat generated from the second light emitting diode (19) to the heat sink by connecting the heat sink having a second stage substrate and the heat radiation fins. can do. The heat carrier 4 may be used without limitation as long as any material having good thermal conductivity.

The present invention may further include a total reflection lens (2) covering the upper portion of the first to second light emitting diodes (19), the light flux density per unit area is further increased by the total reflection lens (2). Can be.

In addition, the present invention, if necessary, the encapsulant (3), the PCB insulating layer 11, the plunger lower body 12, the heat sink coating insulating film 13, the plunger spring 16, the plunger upper body 17 It is possible to construct the invention by adding the PCB conductive film 18 and the like. (See Fig. 1)

In addition, the present invention is not limited to only two-stage packages, and is not limited according to the necessity of the invention such as three-stages, four-stages, and five-stages, and a package having a plurality of stages can be formed.

2 is a simplified configuration diagram of a stacked light emitting diode package according to an embodiment of the present invention.

The second stage substrate is preferably formed so that light generated from the first light emitting diode 1 stacked on the first stage substrate is not trapped, which is a design for maximizing a beam flux density per unit area.

Considering the distance L between the center of the first light emitting diode 1 and the end of the second stage substrate and the light distribution of light generated by the first light emitting diode 1, the end portion of the second stage substrate has a triangular shape. It is preferable to form. At this time, it will be convenient to design a two-stage substrate in consideration of the angle Θ in the triangle.

3 is an enlarged view of a first stage substrate included in a stacked light emitting diode according to an embodiment of the present invention.

The first stage substrate may include a first stage package heat sink 8, a first package insulating layer, and a first stage package conductive layer 10. The first stage package insulating layer 9 may include a first However, the first stage package conductive layer 10 made of copper (Cu) may be coated on a predetermined region outside the first stage package insulating layer 9. Can be.

The first stage package insulating layer 9 may be formed using a material having a thermal conductivity of 3 W / mK to 5000 W / mK.

For example, one-stage package insulating layer may be formed in three stages, one stage is formed of copper (Cu) layer 26 or aluminum (Al) layer 26, and two stages of nickel ( Ni) plated film 27 is deposited, and the first stage package is insulated with a layer 28 made of any one material selected from gold (Au), silver (Ag), or tin (Sn) on top three stages thereof. Layer 9 can be constructed.

4 is a configuration of a stacked light emitting diode package having a heat radiation fin in a horizontal direction according to an embodiment of the present invention.

The present invention is coated with a material having a thermal conductivity of 1,000 W / mK to 5,000 W / mK in the horizontal direction on the outer surface of the bump layer 5 and a predetermined region of the second stage package insulating layer 7, The heat dissipation fin 25 in a horizontal direction may be further provided. The coating material 24 such as the bump layer 5 may be formed of carbon nanotubes (CNT).

Referring to FIG. 4, the surface of the bump layer 5 and the predetermined region of the second stage package insulating layer 7 are coated with a material such as carbon nanotubes and connected in a horizontal direction with the coating material 24. The heat dissipation fin is shown.

Carbon nanotubes having a thermal conductivity of 1,000 W / mK to 5,000 W / mK in the horizontal direction, that is, have a thermal conductivity of 1,000 W / mK or more in the X direction or the Y direction from the three-dimensional point of view, but in the Z direction Since it has a thermal conductivity of 3 to 10 W / mK, it quickly transfers heat in the horizontal direction on the package but does not transmit heat in the vertical direction. Therefore, the heat generated on the second stage substrate may be discharged to the outside through the heat radiation fin 25 in the horizontal direction and may not be transmitted to the first stage substrate.

In the present invention, the heat flux per unit area is 0.5W / mm ² In the above case, the coating material 24 and the heat radiation fins 25 in the horizontal direction are preferable, and the heat flux per unit area is 0.5 W / mm ^2. In the following case, it is preferable to use the heat transfer body 4 and to constitute the invention by using a heat sink having a heat dissipation fin in the vertical direction.

5 is a block diagram of a stacked LED package having a heat transfer layer according to an embodiment of the present invention.

Referring to FIG. 5, it can be seen that the heat transfer layer 20 is further provided on the lower surface of the second light emitting diode 19. In the present invention, at least two or more second light emitting diodes 19 stacked on the second stage substrate are stacked, and 1,000 W / mK to 5,000 W in a horizontal direction on the bottom surface of the second light emitting diodes 19. A heat transfer layer 20 formed of a material having a thermal conductivity of / mK may be further provided. That is, the heat transfer layer 20 may be formed using carbon nanotubes (CNTs) having high thermal conductivity in the horizontal direction, and thus heat may be rapidly transferred in the horizontal direction.

When the heat transfer layer 20 is further provided on the second stage substrate, heat is transferred in the horizontal direction and finally heat is rapidly transferred to the heat carrier 4, and heat is radiated more quickly through a heat sink provided with heat dissipation fins. As a result, it is possible to increase the efficiency of the package and to further ensure the stability.

6A to 6J are exemplarily diagrams illustrating a state according to a manufacturing procedure of a stacked LED package according to an embodiment of the present invention.

FIG. 6A shows a first stage substrate by depositing a first stage package insulating layer 9 and a first stage package conductive layer 10 on a first stage package heat sink 8, and defines a predetermined region of the first stage substrate. The first light emitting diode 1 is deposited on the substrate.

6B illustrates a state in which the first end substrate is stacked on a heat sink provided with heat dissipation fins.

FIG. 6C shows a state in which a second end substrate is laminated using the bump layer 5 on the first end substrate. The second stage substrate may include a second stage package insulating layer 7, a second stage package conductive layer 21, and a heat transfer layer 20, and the second light emitting diode 19 may be stacked thereon. .

FIG. 6D is a side view of a state in which a second stage substrate is laminated using the bump layer 5 on the first stage substrate. The present invention can increase the stability of the package by tightly coupling the heat sink and the first stage substrate using the flanger spring 16, as necessary.

6E shows a state in which the heat transfer body 4 is formed on the second stage substrate. By forming the heat transfer body 4 as described above, an independent heat dissipation structure is completed, and heat generated in the second stage substrate is transferred through the heat transfer body 4 through another heat sink separated from the heat sink connected to the first stage substrate. Heat may be released.

FIG. 6F shows the third stage substrate 23 formed on the second stage substrate. As described above, the present invention is not only limited to the formation of the second stage substrate, but also has the advantage that the package can be expanded to three stages, four stages, five stages, and the like according to the needs of the invention. However, when a plurality of stages are formed, it should be designed in consideration of light distribution of light generated from the light emitting diodes at the bottom.

6G is a side view of the third stage substrate 23 formed on the second stage substrate.

FIG. 6H shows a state in which the total reflection lens 2 covering the light emitting diodes, that is, the first light emitting diodes 1 to the third light emitting diodes 22, is formed on the first to third substrates 23. have. With such a total reflection lens 2, the focusing of light is further improved, so that the beam flux density per unit area is further improved.

FIG. 6I is a side view of a state in which a total reflection lens 2 is formed to cover the first to third light emitting diodes 22.

6J illustrates a completed form of a stacked light emitting diode package including a plurality of substrates.

In summary, the present invention is capable of constructing a package by i) stacking a plurality of substrates, not just the second stage substrate, and ii) providing a separate heat transfer member 4 for each stage to provide an independent heat dissipation structure. Iii) can be designed to stack more light emitting diodes compared to the prior art even in a limited area, and thus it can be said to provide a light emitting diode package having excellent light beam density and maximizing heat dissipation effect.

7 is a flowchart illustrating a method of manufacturing a stacked light emitting diode package according to an embodiment of the present invention.

First, a step (s701) of stacking a first substrate on predetermined regions of the upper and side surfaces of the heat sink is performed, and a step (s702) of laminating a first light emitting diode on a predetermined region of the first stage substrate and forming an encapsulant. do.

However, in the present invention, if necessary, a method of laminating the first light emitting diode on the first substrate and attaching it to the heat sink is also possible, and a method of laminating the first light emitting diode after attaching the first substrate to the heat sink. It is also possible.

Thereafter, at least two bump layers are formed on predetermined regions at both ends of the first end substrate (S703). The bump layer is formed of a material having low thermal conductivity so as not to transfer heat generated on the second stage substrate to the first stage substrate, and is formed of an elastic medium to ensure bonding and stability of the package. desirable.

Thereafter, a step S704 of stacking a second stage substrate including a second stage package insulating layer and a second stage package conductive layer on the bump layer is performed.

After the stacking step (S704) of the second stage substrate, the step (S705) of laminating a heat transfer layer on a predetermined region of the second stage substrate may be performed as needed. This heat transfer layer is intended to quickly and easily heat transfer in the horizontal direction.

In addition, after the lamination step (S704) of the second stage substrate, coating the carbon nanotube (CNT) in the horizontal direction in the horizontal direction on the outer surface of the bump layer and the side surface of the second insulation layer package and the coding The step of forming a heat radiation fin in a horizontal direction on the side of the bump layer and the second stage package insulating layer can be further stepped. Such a step is preferably formed when the heat flux per unit area is 0.5 w / mm ² or more.

After the heat transfer layer stacking step (S705), through the step (S706) of stacking at least two or more second light emitting diodes on the second stage substrate and forming an encapsulant, the heat transfer connecting the heat sink and the second stage substrate After passing through forming the sieve (S707), the independent heat dissipation structure is completed.

Finally, after the step of forming the heat carrier (S7070), the step of forming a total reflection lens covering the upper portion of the first light emitting diode to the second light emitting diode (S708) to manufacture the stacked light emitting diode package of the present invention The method is finished.

The present invention has been described above in connection with specific embodiments of the present invention, but this is only an example and the present invention is not limited thereto. Those skilled in the art can change or modify the described embodiments without departing from the scope of the present invention, and within the equivalent scope of the technical spirit of the present invention and the claims to be described below. Various modifications and variations are possible.

1 is a block diagram of a stacked light emitting diode package according to an embodiment of the present invention.

Figure 2 is a simplified schematic diagram of a stacked light emitting diode package according to an embodiment of the present invention.

3 is an enlarged view of a first stage substrate included in a stacked light emitting diode according to an embodiment of the present invention.

Figure 4 is a block diagram of a stacked light emitting diode package provided with a heat radiation fin in the horizontal direction according to an embodiment of the present invention.

5 is a block diagram of a stacked light emitting diode package having a heat transfer layer according to an embodiment of the present invention.

Figure 6a to Figure 6j is a step-by-step illustration showing a state according to the manufacturing procedure of the stacked light emitting diode package according to an embodiment of the present invention.

7 is a flow chart for a method of manufacturing a stacked light emitting diode package according to an embodiment of the present invention.

{Description of major symbols in the drawing}

1: first light emitting diode

2: total reflection lens

3: encapsulant

4: heat carrier

5: bump layer

6: via hole

7: second stage package insulation layer

8: first stage package heat sink

9: first stage package insulation layer

10: first stage package conductive film

11: PCB insulation layer

12: plunger underbody

13: heat sink coating insulation film

14: heat sink fin

15: heat sink with heat sink fin

16: plunger spring

17: Plunger Upper Body

18: PCB conductive film

19: second light emitting diode

20: heat transfer layer

21: second stage package conductive film

22: third light emitting diode

23: third stage substrate

24: coating material

25: horizontal heat dissipation fin

26: copper layer or aluminum layer

27: nickel plating film

28: layer consisting of any one material selected from gold, silver or tin

Claims (14)

In the light emitting diode package formed by stacking a plurality of substrates, A first end package heat sink, a first end package insulation layer formed on the outside of the first end package heat sink, and a first end made of copper (Cu) and deposited on predetermined regions at upper and side ends of the first end package insulation layer. A first substrate having a package conductive film; A heat dissipation plate formed on a lower surface or a side surface of the first end substrate and having a heat dissipation fin; A first light emitting diode stacked on a predetermined region of the first substrate; At least two bump layers stacked on both ends of the first substrate; A second stage package insulating layer stacked on the bump layer and having a second stage package insulating layer and a second stage package conductive layer formed of copper (Cu) deposited on predetermined regions at upper and side ends of the second stage package insulating layer. A second end substrate formed smaller than an upper area of the end substrate; At least two second light emitting diodes stacked on the second stage substrate; And A heat transfer member connecting the heat sink including the second stage substrate and the heat dissipation fins to transfer heat generated from the second light emitting diode to the heat sink; Stacked light emitting diode package comprising a. The method of claim 1, wherein the first stage package insulating layer or the second stage package insulating layer, Stacked light emitting diode package, characterized in that formed using a material having a thermal conductivity of 3 W / mK to 5000 W / mK. The method of claim 1, wherein the first stage package insulating layer or the second stage package insulating layer, The lower surface is formed of a copper (Cu) layer or an aluminum (Al) layer, a nickel (Ni) plating film is deposited on the upper surface of the lower surface, gold (Au), silver (Ag) on the upper portion of the nickel plating film Or tin (Sn) layered light emitting diode package, characterized in that formed by depositing a layer made of any one material. 2. The stacked type light emitting diode of claim 1, wherein the first end substrate and the second end substrate are bonded to each other using a bump layer so that an air layer is formed between the first and second end substrates. Diode package. The method of claim 1, wherein the bump layer, Stacked light emitting diode package, characterized in that formed using a material having a thermal conductivity of 0.03 W / mK to 0.3 W / mK. The method of claim 1, wherein the second stage substrate, Stacked LED package, characterized in that the end of the cross-section toward the first light emitting diode is formed in a triangular shape so that the light generated from the first light emitting diode is not trapped. The method of claim 1, Stacked LED package further comprises a heat transfer layer formed of a material having a thermal conductivity of 1,000 W / mK to 5,000 W / mK in the horizontal direction on the lower surface of the second light emitting diode. The method of claim 1, Coating the outer surface of the bump layer and the predetermined region of the second stage package insulating layer by using a material having a thermal conductivity of 1,000 W / mK to 5,000 W / mK in the horizontal direction, and further comprising a heat radiation fin in the horizontal direction Stacked light emitting diode package, characterized in that. The method of claim 7 or 8, wherein the constituent material of the heat transfer layer or the coating material of the bump layer, Stacked light emitting diode package, characterized in that formed of carbon nanotubes (CNT). The stacked light emitting diode package of claim 1, further comprising a total reflection lens covering an upper portion of the first to second light emitting diodes. In the manufacturing method of the stacked light emitting diode package, Stacking a first substrate having a first stage package heat sink, a first stage package insulating layer, and a first stage package conductive layer on predetermined regions of the top and side surfaces of the heat sink having the heat dissipation fins; Stacking a first light emitting diode in a predetermined region on the first substrate and forming an encapsulant; Forming at least two bump layers on predetermined regions at both ends of the first end substrate; Stacking a second stage substrate having a second stage package insulating layer on the bump layer and a second stage package conductive film deposited on predetermined regions of upper and side ends of the second stage package insulating layer; Stacking at least two second light emitting diodes on the second stage substrate and forming an encapsulant; And Forming a heat carrier connecting the heat dissipation plate including the heat dissipation fin and the second substrate; Method of manufacturing a stacked light emitting diode package comprising a. The method of claim 11, wherein after the lamination of the second stage substrate, Coating carbon nanotubes (CNTs) in a horizontal direction on an outer surface of the bump layer and on a side surface of the second end package insulating layer; And Forming heat dissipation fins in a horizontal direction on side surfaces of the coded bump layer and the second stage package insulating layer; Method of manufacturing a stacked light emitting diode package further comprising. The method of claim 11, wherein after the lamination of the second stage substrate, Stacking a heat transfer layer on a predetermined region of the second stage substrate. The method of claim 11, wherein after the heat carrier forming step, The manufacturing method of the stacked light emitting diode package further comprising the step of forming a total reflection lens covering the upper portion of the first light emitting diode to the second light emitting diode.

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