KR20110063042A - Organic light emitting display device and manufacturing method of the same - Google Patents

Abstract

PURPOSE: An organic electroluminescent light emitting display device and a method for manufacturing the same are provided to sinter a sealing layer by implementing a heating and sintering process at low operational temperature. CONSTITUTION: A first substrate(110) faces a second substrate(111). An organic electroluminescent light emitting diode(120) is arranged between the first substrate and the second substrate. A driving circuit(130) applies a driving signal to a cell driving array for an organic layer. An insulating layer(140) is formed on the front surface of the first substrate including the driving circuit. A part of a sealing layer(150) is overlapped with the driving circuit on the rear side of the second substrate. A metal pad(160) is formed at a part of the insulating layer corresponding to the driving circuit. The sealing layer faces the metal pad.

Description

Organic electroluminescent display and its manufacturing method {ORGANIC LIGHT EMITTING DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic light emitting display device and a method of manufacturing the same, and more particularly, to an organic light emitting display device and a method of manufacturing the same, which can reduce a bezel width.

In recent years, as the information age has entered, the display field for visually expressing electrical information signals has been rapidly developed, and various flat panel display devices having excellent performance of thinning, light weight, and low power consumption have been developed. Flat Display Device has been developed and is rapidly replacing the existing Cathode Ray Tube (CRT).

Specific examples of such a flat panel display include a liquid crystal display (LCD), a plasma display panel (PDP), a field emission display (FED), and an electroluminescent display. (Electro luminescence Display Device (ELD), Electro-Wetting Display (EWD), and Organic Light Emitting Display (OLED)).

Among the organic light emitting display devices (hereinafter, referred to as "OLEDs"), electrons and holes are injected into the light emitting layer from the electron injection electrode (cathode electrode) and the hole injection electrode (anode electrode), respectively. Excitons are generated due to the combination of holes, and light is generated by energy emitted as the excitons fall from the excited state to the ground state, thereby displaying an image. As such, the OLED which emits light by itself does not need a separate light source, unlike a liquid crystal display (LCD), and thus has the advantage of reducing the volume and weight of the device, and the reaction speed is 1000 times higher than that of the liquid crystal display. Since it is faster, there is an advantage that no afterimage remains when displaying a video. Therefore, OLED has been applied to small display devices that require high definition of mobile communication terminals, personal information terminals, camcorders, digital cameras, and the like. Such OLEDs may be classified into an active matrix driving method and a passive matrix driving method. Here, in the active matrix organic light emitting diode (AMOLED) of the active matrix driving method, pixels composed of three color (R, G, B) sub-pixels are arranged in a matrix to display an image.

1 is a cross-sectional view of an organic light emitting display device according to the prior art, and FIG. 2 is a plan view showing a part of the organic light emitting display device shown in FIG. 1.

As shown in FIG. 1, the OLED 10 according to the related art has a region (L, hereinafter, referred to as a display region) for displaying an image and a non-display region corresponding to an outer portion of the display region (L). An organic light emitting diode array defined as D) and disposed between the lower substrate 11a, the upper substrate 11b, and the display area L, which are disposed between the lower substrate 11a and the upper substrate 11b to face each other. 12, hereinafter referred to as an "organic layer", a drive signal disposed on a portion of the lower substrate 11a corresponding to at least a portion of the non-display area D and driving to a cell array (not shown) for driving the organic layer 12. An insulating layer 14 formed on the front surface of the lower substrate 11a including the driving circuit 13 and the driving circuit 13 to protect the driving circuit 13 so that the driving circuit 13 is electrically stable. It is formed to correspond to a part of the non-display area D, and the lower substrate 11a and the upper substrate 11b are bonded to each other, and the inside of the organic layer 12 is disposed. It comprises a sealing layer 15 for sealing. Here, the sealing layer 15 seals the inside of the OLED 10 in order to block the organic layer 12 easily deteriorated by external moisture or oxygen from the outside.

According to the prior art, the sealing layer 15 is generally provided with frit paste, which is known to be excellent for preventing moisture permeation. These frit pastes contain a frit powder, a filler to match the difference in coefficient of thermal expansion between the frit and the substrates 11a and 11b, a binder to generate adhesion, and a viscosity. It consists of a mixture of solvents (solvents) to control.

However, when the sealing layer 15 is provided as a frit paste, the moisture permeation into the OLED 10 can be properly prevented, but since the sealing layer 15 is baked at a process temperature of 300 degrees Celsius or more, the lower substrate 11a and Since the bonding process of the upper substrate 11b becomes complicated and the protection margin 16 must be provided between the driving circuit 13 and the sealing layer 15 in order to protect the driving circuit 13, the bezel width is increased. There is an increasing problem.

In more detail, when the sealing layer 15 is provided as a frit paste, the bonding process of the lower substrate 11a and the upper substrate 11b does not overlap the driving circuit 13 in the non-display area D. Patterning the frit paste on the rear surface of the upper substrate 11b so as to correspond to a portion of the upper substrate 11b, sintering the patterned frit paste, and aligning the upper substrate 11b and the lower substrate 11a to face each other. And firing the frit paste by irradiating a laser on the upper portion of the upper substrate 11b corresponding to the portion where the frit paste is formed. As such, when the sealing layer 15 is prepared as a frit paste, the step of sintering and firing the frit paste with a laser should be included, thereby making the bonding process of the upper substrate 11b and the lower substrate 11a complicated. There is a problem.

In addition, the step of sintering the frit paste is performed at a process temperature of 300 degrees Celsius, and the step of firing the frit paste is performed at a process temperature of 400 degrees Celsius or more, during the bonding process of the lower substrate 11a and the upper substrate 11b. The drive circuit 13 may be damaged by heat of high temperature. Accordingly, in order to protect the drive circuit 13 from heat of high temperature, a protection margin 16 at a predetermined interval is provided between the drive circuit 13 and the sealing layer 15.

Accordingly, the bezel of the conventional OLED 10 including the sealing layer 15 provided as the frit paste, as shown in Figure 2, the firing of the drive circuit 12, the sealing layer 15, the frit paste and Protection margin 16 to protect the drive circuit 13 from high temperature heat for sintering and to prevent breakage of the OLED 10 by the scribing process to separate the OLED 10 individually Since the scribing margin 17 should be included, it has a width WB_10 corresponding to (W12 + W16 + W15 + W17).

Therefore, the OLED 10 of the prior art includes a sealing layer 15 formed of a frit paste, and as the bonding process of the lower substrate 11a and the upper substrate 11b becomes complicated, the manufacturing method becomes complicated, and the bezel There is a limit in reducing the width of the slim (slim) has a problem that there is a limit.

Accordingly, the present invention provides an organic light emitting display device and a method of manufacturing the same, which may facilitate a manufacturing process and reduce a bezel width.

In order to solve the above problems, the present invention, the display area and the non-display area corresponding to the outside of the display area is displayed, the first substrate and the second substrate facing each other; An organic light emitting diode array disposed between the first substrate and the second substrate to correspond to the display area; A driving circuit formed on the first substrate so as to correspond to a portion of the non-display area and generating a driving signal corresponding to the image; An insulating layer formed on an entire surface of the first substrate including the driving circuit; And a sealing layer formed on a rear surface of the second substrate facing the driving circuit, the sealing layer bonding the first substrate and the second substrate to each other.

In addition, the present invention includes the steps of: providing a first substrate on which a driving circuit is disposed so as to correspond to a non-display area corresponding to an outside of a display area in which an image is displayed and generates a driving signal; Forming an insulating layer on an entire surface of the first substrate including the driving circuit; Forming a metal pad on the insulating layer corresponding to the driving circuit; Forming a sealing layer with a metal paste on a rear surface of the second substrate facing the first substrate so as to face the driving circuit; Aligning the first substrate and the second substrate such that the metal pad contacts the sealing layer; And heat-treating the aligned first substrate and the second substrate to bond the first substrate and the second substrate to cause the sealing layer to be fired on the metal pad. It provides a method of manufacturing.

As described above, the organic light emitting display device according to the present invention includes a sealing layer formed of a metal paste having a lower melting temperature than a frit paste, and is a lower process than a laser firing process performed at a high process temperature of 300 degrees Celsius or more. The sealing layer may be fired only by a heating firing step performed at a temperature.

As a result, the manufacturing process of the organic light emitting display device may be easier. In addition, since the driving circuit is not damaged by the firing process of the sealing layer, a protection margin for protecting the driving circuit can be excluded. In addition to this, the driving circuit and the sealing layer can be superposed. Therefore, since the bezel width can be reduced, the organic light emitting display device can be designed to be slimmer.

In addition, by further including a metal pad disposed on the upper portion of the driving circuit, by improving the interface characteristics of the sealing layer, the upper substrate and the lower substrate can be more firmly bonded and sealed, the life of the organic light emitting display device Can be increased. In addition, the conductive metal pad is maintained at the ground voltage level, so that the driving circuit can be driven more stably.

Hereinafter, an organic light emitting display device and a manufacturing method thereof according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

3 is a cross-sectional view of an organic light emitting display device according to a first embodiment of the present invention. 4 is a plan view illustrating a part of the organic light emitting display device illustrated in FIG. 3.

As shown in FIG. 3, the organic light emitting display device 100 according to the first embodiment of the present invention (hereinafter, referred to as OLED, hereinafter referred to as “OLED”) is an area (L, hereinafter) in which an image is displayed. The first substrate 110, the second substrate 111, and the display region L, which are defined as non-display regions D corresponding to the periphery of the display region L). An organic light emitting diode array 120, hereinafter referred to as an organic layer, disposed between the first substrate 110 and the second substrate 111, and at least a portion of the non-display area D. A first circuit including a driving circuit 130 and a driving circuit 130 formed on a portion of the first substrate 110 corresponding to the driving circuit to apply a driving signal to a cell driving array (not shown) driving the organic layer 120. The driving circuit 130 and the rear surface of the second substrate 111 corresponding to a portion of the insulating layer 140 and the non-display area D formed on the entire surface of the 110. And a metal pad 160 formed on a portion of the insulating layer 140 corresponding to the driving circuit 130 and the sealing layer 150 formed to overlap at least a portion thereof and in contact with the sealing layer 150. Here, the sealing layer 150 and the metal pad 160 are attached to face each other, the first substrate 110 and the second substrate 111 are bonded to each other, the first substrate 110 and the second substrate 111. Seal the inside of the organic layer 120 disposed between).

The first substrate 110 and the second substrate 111 are transparent insulating substrates made of glass, quartz, ceramic, or plastic.

The cell driving array (not shown) disposed on a portion of the first substrate 110 corresponding to the display area L includes a plurality of sub-pixel driving units. Each of the plurality of subpixel drivers includes a gate line, a data line, a switching transistor, a driving transistor, and a capacitor connected to the driving circuit 130. Here, the switching transistor supplies a data signal from the data line in response to the scan signal of the gate line. The driving transistor includes a gate electrode, a semiconductor layer overlying the gate electrode with the gate insulating film interposed therebetween, and a source / drain electrode using the semiconductor layer as a channel, and electrically connected to the organic layer 130, thereby reducing the voltage from the switching transistor. The amount of current flowing through the organic layer 130 is controlled according to the data signal. The capacitor serves to allow a constant current to flow through the driving transistor even when the switching transistor is turned off.

The organic layer 130 includes a plurality of subpixels. Each of the plurality of subpixels includes a first electrode connected to the driving transistor, a second electrode insulated from the first electrode and opposed to the first electrode, and an organic light emitting layer disposed between the first electrode and the second electrode to emit light. .

In this case, the first electrode is used as an anode electrode and is formed to be insulated from the first electrode of an adjacent sub pixel by being spaced a predetermined distance from the boundary of the sub pixel. When the OLED 100 is designed for back emission, the first electrode is formed of a transparent conductor, and when the OLED 100 is designed for top emission, the first electrode is formed of Cr, Al, AlNd, Mo, Cu, W, Au, It may be formed of a single metal such as Ni, Ag, or an alloy thereof, an oxide, or a multilayer.

The second electrode is used as a cathode and is formed to correspond to the display area L. FIG. When the OLED 100 is designed for back emission, the second electrode may be formed of a single metal such as Cr, Al, AlNd, Mo, Cu, W, Au, Ni, Ag, or an alloy thereof, an oxide, or a multilayer thereof. When the OLED 100 is designed for top emission, the second electrode is formed of a transparent conductor so that light generated in the organic light emitting layer can be emitted to the outside.

The organic light emitting layer includes a hole injection layer (HIL), a hole transporting layer (HTL), an emission layer (EML), an electron transporting layer (ETL), and an electron injection layer (electron injection layer) EIL). The organic light emitting layer is a layer in which exciton is formed by combining holes and electrons injected from the first electrode and the second electrode, and light is generated as the exciton falls from the excited state to the ground state. R, G, B (RED, GREEN, BLUE) light is generated in pixel units.

The organic layer 130 configured as described above applies light having a different polarity to the organic light emitting layer through the first electrode and the second electrode, thereby allowing light in a wavelength band corresponding to any one of R, G, and B (RED, GREEN, and BLUE). Image information is displayed by emitting the.

The driving circuit 130 may include a gate driving circuit applying a scan signal to a gate line of a cell driving array (not shown), a data driving circuit applying a data signal to a data line of a cell driving array (not shown), and the organic layer 130. Aging driving circuit for aging of the battery, a driving line for applying a reference voltage Vref or a driving voltage VDD to a cell driving array (not shown), and a ground for applying a ground voltage to a cell driving array (not shown) It comprises at least one of the lines. In particular, a simply designed gate driving circuit or an aging driving circuit, a ground line, or the like may be formed on the first substrate 110, similarly to a cell driving array (not shown). In addition, the driving circuit of a complicated structure may be formed on the first substrate 110 or may be connected to a cell driving array (not shown) in the form of an IC chip mounted on a tape carrier package (TCP). The driving circuit 130 formed on the first substrate 110 is disposed in a portion of the non-display area D as shown in FIG. 4.

The insulating layer 140 makes the driving circuit 130 and the cell driving array (not shown) formed on the first substrate 110 electrically stable, and the driving circuit 130 is prevented from external stress factors such as impact and bending. ) And a cell driving array (not shown) are formed on the front surface of the first substrate 110 including the driving circuit 130. In this case, the display area L may be disposed in a state where a portion of the insulating layer 140 corresponding to a portion of the cell driving array (not shown) is removed so that the organic layer 130 and the cell driving array may be contacted. The organic layer 130 is disposed correspondingly.

The sealing layer 150 joins the first substrate 110 and the second substrate 111 together with the metal pad 160, and the organic layer 120 between the first substrate 110 and the second substrate 111. This is for sealing the arranged interior. The sealing layer 150 is made of metal paste and is disposed on the first substrate 110 corresponding to a part of the non-display area D. The gold paste is prepared as a mixture of a metal having a low melting temperature of 300 degrees Celsius or less, or an alloy containing the same and a flux, such as indium (In) or bismuth (Bi). do. As described above, since the metal paste provided as the sealing layer 150 has a moisture permeability close to the moisture permeability of the frit paste, the organic layer 130 may be minimized from deterioration and the metal paste may have a ductility. Due to the material properties, cracks can be minimized during external impact. The metal paste may be fired by a firing process performed at a process temperature of 300 degrees Celsius or less. Accordingly, the firing process of the metal paste is relatively easy compared to the firing process of the frit paste, and thus, the manufacturing process of the OLED 100 may be facilitated. In addition, since the baking process of the metal paste does not affect the organic layer 120 and the driving circuit 130, as shown in FIG. 4, the driving circuit may be formed from the high temperature heat necessary for the baking process of the sealing layer 150. Not only does it need to provide a protection margin for protecting the 130, but also the sealing layer 150 and the driving circuit 130 can be disposed to overlap each other, the bezel width can be reduced.

The metal pad 160 improves the interfacial properties of the sealing layer 150, so that the first substrate 110 and the second substrate 111 are firmly bonded to each other, and the first substrate 110 and the second substrate are bonded to each other. It is for sealing so that the inside in which the organic layer 120 between 111 is arrange | positioned is firmly blocked from the outside. The metal pad 160 is formed on a portion of the insulating layer 140 corresponding to the sealing layer 150 to be in contact with the sealing layer 150.

A method of manufacturing the OLED 100 according to the first embodiment described above is as follows.

5 is a flowchart illustrating a method of manufacturing an organic light emitting display device according to a first embodiment of the present invention.

In the method of manufacturing the OLED 100 according to the first embodiment of the present invention, as shown in FIG. 6, a cell driving array (not shown) is disposed corresponding to the display area L on which the screen is displayed, and the screen Preparing a first substrate 110 on which the driving circuit 130 is disposed in correspondence with the non-display area D, which is not displayed (S100), of the first substrate 110 including the driving circuit 130. Forming an insulating layer 140 on the front surface (S110), forming a metal pad 160 on a portion of the insulating layer 140 at least partially overlapping the driving circuit 130 (S120), and driving circuit ( Forming a sealing layer 150 formed of a metal paste on a rear surface of the second substrate 111 opposite to the driving circuit 130 at least partially (S130), and the sealing layer 150 and the metal. Aligning the first substrate 110 and the second substrate 111 so that the pad 160 contacts (S140) and firing the sealing layer 150, the aligned first substrate 110 and the second substrate ( 111) Heat-treating, and bonding the first substrate and the second substrate (S150). In this case, in the method of manufacturing the OLED 200, after the forming of the insulating layer 140 (S110), removing the insulating layer 140 corresponding to a part of the cell driving array (not shown) and driving the cell. The method may further include forming the organic layer 120 on the insulating layer 140 corresponding to the display area D so as to contact the array (not shown).

In addition, since the sealing layer 150 provided as the metal paste may be baked at 300 degrees C or less, the bonding of the first substrate and the second substrate (S150) may be performed at a process temperature of 300 degrees Celsius or less.

As described above, the OLED 100 according to the first embodiment of the present invention includes a metal pad 160 that improves the interfacial properties of the sealing layer 150 and the sealing layer 150 provided with the metal paste. Since the firing of the sealing layer 150 may be performed at a process temperature of 300 degrees C or less, the manufacturing process of the OLED 100 may be facilitated, and the driving circuit 130 may be damaged by the firing process of the sealing layer 150. Since the protection margin for protecting the driving circuit 130 can be removed by eliminating, the driving circuit 130 and the sealing layer 150 may be overlapped. Accordingly, the bezel of the OLED 100 is scribing to separate the driving circuit 130, the metal pad 160, the sealing layer 150 and the OLED 100 individually, as shown in FIG. While including a scribing margin 170 to protect the OLED 100 from the process, the drive circuit 130, the metal pad 160 and the sealing layer 150 are arranged to overlap, the width of the bezel (WB) ) May be determined as a sum (W130 + W170) of the sum of the width W130 of the driving circuit 130 and the width W170 of the scribing margin 170, and thus may be designed to be slimmer than a conventional OLED.

Next, an OLED according to a second embodiment of the present invention will be described.

6 is a plan view illustrating an organic light emitting display device according to a second exemplary embodiment of the present invention, and FIG. 7 is a cross-sectional view taken along line AA ′ of FIG. 6.

As illustrated in FIGS. 6 and 7, the OLED 200 according to the second exemplary embodiment of the present invention includes a first substrate 110 defined as a display area L and a non-display area D and facing each other. And an organic layer 120 disposed between the first substrate 110 and the second substrate 111 to correspond to the second substrate 111 and the display area L, and a portion corresponding to a portion of the non-display area D. FIG. 1 The driving circuit 130 disposed on a portion of the substrate 110, the insulating layer 140 disposed on the front surface of the first substrate 110 including the driving circuit 130, and the insulating layer corresponding to the driving circuit 130. Including the sealing layer 150 disposed on a part of the 140 is the same as the OLED 100 according to the first embodiment described above. The OLED 200 according to the second embodiment is formed on a part of the insulating layer 140 corresponding to the driving circuit 130, contacts the sealing layer 150, and applies a ground voltage to the metal pad 161. More). Here, the sealing layer 150 and the metal pad 161 are attached to face each other, the first substrate 110 and the second substrate 111 are bonded to each other, the first substrate 110 and the second substrate 111. Seal the inside of the organic layer 120 disposed between).

The first substrate 110, the second substrate 111, the organic layer 120, the cell driving array (not shown), the driving circuit 130, the insulating layer 140, and the sealing layer 150 are described in detail. Since it is the same as the OLED 100 according to the first embodiment, a redundant description will be omitted below.

The metal pad 161 is disposed on a portion of the insulating layer 140 corresponding to the non-display area D so that at least a portion of the metal pad 161 overlaps the driving circuit 130, and the sealing layer 150 disposed on the second substrate 111. Contact with the first substrate 110 and the second substrate 111. The metal pad 161 is in contact with the ground line GND line 131 from which the insulating layer 140 is removed to apply a ground voltage. That is, the driving circuit 130 includes a ground line 131 for applying a ground voltage to the cell driving array (not shown), and the metal pad 161, as shown in FIG. 7, the ground line 131. A portion of the insulating layer 140 corresponding to is removed and disposed to contact the exposed ground line 131. Therefore, since the metal pad 161 is made of a conductive metal, a ground voltage is applied from the ground line 131 that is in contact, and maintained at the ground voltage level.

A method of manufacturing the OLED 200 according to the second embodiment is as follows.

8 is a flowchart illustrating a method of manufacturing an organic light emitting display device according to a second embodiment of the present invention.

In the method of manufacturing the OLED 200 according to the second embodiment of the present invention, as shown in FIG. 8, a cell driving array (not shown) is disposed corresponding to the display area L on which the screen is displayed, and the screen Preparing the first substrate 110 on which the driving circuit 130 is disposed in correspondence with the non-display area D (S200), and of the first substrate 110 including the driving circuit 130. Forming an insulating layer 140 on the front surface (S210), removing a part of the insulating layer 140 corresponding to the ground lead 131 included in the driving circuit 130 (S220), and driving circuit 130. Forming a metal pad 161 in contact with the ground lead 131 on a portion of the insulating layer 140 at least partially overlapping with the driving circuit 130 (S230). Forming a sealing layer 150 formed of a metal paste on a rear surface of the second substrate 111 at least partially overlapping (S240), the sealing layer 150 and the metal pad 161. ) Aligning the first substrate 110 and the second substrate 111 so as to contact each other (S250) and firing the sealing layer 150 to form the aligned first substrate 110 and the second substrate 111. The heat treatment is performed, including the step of attaching the first substrate and the second substrate (S260). In this case, in the method of manufacturing the OLED 200, after the forming of the insulating layer 140 (S110), removing the insulating layer 140 corresponding to a part of the cell driving array (not shown) and driving the cell. The method may further include forming the organic layer 120 on the insulating layer 140 corresponding to the display area D so as to contact the array (not shown).

As described above, according to the second embodiment of the present invention, the metal pad 160 is in contact with the ground lead 131, the conductive metal pad 160 is floating while the driving circuit 130 and the cell drive array ( It is possible to minimize the influence on the driving voltage (not shown). Accordingly, the driving circuit 130 and the cell driving array (not shown) can be driven more stably.

The present invention described above is not limited to the above-described embodiment and the accompanying drawings, and various substitutions, modifications, and changes may be made without departing from the technical spirit of the present invention.

1 is a cross-sectional view of an organic light emitting display device according to the prior art.

FIG. 2 is a plan view illustrating a part of the organic light emitting display device illustrated in FIG. 1.

3 is a cross-sectional view of an organic light emitting display device according to a first embodiment of the present invention.

4 is a plan view illustrating a portion of the organic light emitting display device illustrated in FIG. 3.

5 is a flowchart illustrating a method of manufacturing an organic light emitting display device according to a first embodiment of the present invention.

6 is a plan view of an organic light emitting display device according to a second embodiment of the present invention.

FIG. 7 is a cross-sectional view taken along line BB ′ shown in FIG. 7.

8 is a flowchart illustrating a method of manufacturing an organic light emitting display device according to a second embodiment of the present invention.

<Description of identification numbers for the main parts of the drawings>

100 and 101: organic light emitting display device 110: lower substrate

111: upper substrate 120: drive circuit

121: ground line of the driving circuit 130: insulating layer

140: display area 150: metal sealing body

151: metal pad 160: scribing margin

Claims (11)

A first substrate and a second substrate defined by a display area in which an image is displayed and a non-display area corresponding to the outside of the display area and facing each other; An organic light emitting diode array disposed between the first substrate and the second substrate to correspond to the display area; A driving circuit formed on the first substrate so as to correspond to a portion of the non-display area and generating a driving signal corresponding to the image; An insulating layer formed on an entire surface of the first substrate including the driving circuit; And And a sealing layer formed of a metal paste on a rear surface of the second substrate opposite to the driving circuit and bonding the first substrate and the second substrate to each other. The method of claim 1, And a metal pad formed on a portion of the insulating layer corresponding to the driving circuit and in contact with the sealing layer. The method of claim 2, The driving circuit includes a ground line to which a ground power source is applied. The metal pad is in contact with the ground line. The method of claim 2, The metal paste is formed of a metal having a melting temperature of less than 300 degrees Celsius or a mixture of the metal and the flux. The method of claim 2, And a cell driving array formed corresponding to the display area and configured to drive the organic light emitting diode array by receiving the driving signal from the driving circuit. Providing a first substrate on which a driving circuit is disposed so as to correspond to a non-display area corresponding to an outer portion of the display area in which an image is displayed and generates a driving signal; Forming an insulating layer on an entire surface of the first substrate including the driving circuit; Forming a metal pad on the insulating layer corresponding to the driving circuit; Forming a sealing layer with a metal paste on a rear surface of the second substrate facing the first substrate so as to face the driving circuit; Aligning the first substrate and the second substrate such that the metal pad contacts the sealing layer; And And heat-treating the aligned first and second substrates to bond the first and second substrates so that the sealing layer is fired on the metal pads. Manufacturing method. The method of claim 6, After forming the insulating layer, And removing a portion of the insulating layer corresponding to the ground lead to which the ground power is applied among the driving circuits. The method of claim 7, wherein And forming the metal pad so that the metal pad is in contact with the ground lead from which the insulating layer is removed. The method of claim 6, The preparing of the first substrate may include forming a cell driving array on the first substrate, the cell driving array corresponding to the display area and driven by receiving the driving signal. After forming the insulating layer, Removing an insulating layer corresponding to a portion of the cell drive array; And forming an organic light emitting diode array on the insulating layer corresponding to the display area so as to be in contact with a portion of the cell driving array. The method of claim 6, In the forming of the sealing layer, the metal paste is a metal having a melting temperature of less than 300 degrees Celsius or a mixture of the metal and the flux, the manufacturing method of the organic light emitting display device. The method of claim 10, In the step of bonding the first substrate and the second substrate, the heat treatment is a method of manufacturing an organic light emitting display device, characterized in that performed at a temperature of less than 300 degrees Celsius.

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