KR20110058570A - Apparatus and method for treating substrate - Google Patents

Abstract

PURPOSE: An apparatus and method for processing a substrate is provided to eliminate a process of transferring a substrate between a coating process and a decompression drying process, thereby shortening processing time. CONSTITUTION: A coating unit(100) coats a photosensitive solution onto a substrate(11). The coating unit comprises a processing chamber(110), a substrate supporting member(120), and a coating nozzle member(130). The substrate supporting member comprises a stage, a first vacuum line(125), and a first vacuum pump(126). An exhaust hole(124) is formed on the stage. A decompression drying unit(200) decompresses and dries the coated photosensitive solution.

Description

Substrate processing apparatus and method {APPARATUS AND METHOD FOR TREATING SUBSTRATE}

The present invention relates to an apparatus and method for treating a substrate, and more particularly, to an apparatus and method for applying a photosensitive liquid to a substrate and drying the applied photosensitive liquid.

Among the processes for manufacturing a flat panel display device, a photolithography process is a photoresist coating process for applying a photoresist liquid to a film formed on a substrate and drying the photoresist to volatilize an organic solvent of the photoresist. solvent drying).

In general, in the coating step, the coating nozzle is moved to apply a photoresist to the substrate, and in the drying step, the photoresist liquid is dried by reducing the internal space in which the substrate is placed. The coating process and the drying process are performed in different process chambers arranged in-line, and a transfer unit for transferring a substrate is installed between the respective process chambers.

As described above, since the coating process and the drying process are performed in separate process chambers, the facility area of the substrate processing equipment for performing the process increases, and the process time increases due to the substrate transfer between the process chambers.

The present invention provides a substrate processing apparatus and method capable of reducing a facility area.

In addition, the present invention provides a substrate processing apparatus and method that can reduce the process time.

The object of the present invention is not limited thereto, and other objects not mentioned will be clearly understood by those skilled in the art from the following description.

The present invention provides a substrate processing apparatus. The substrate processing apparatus includes a coating unit which performs a coating step of applying a photosensitive liquid to a substrate; It is installed in the coating unit, and includes a reduced pressure drying unit for drying the photosensitive liquid under reduced pressure.

The coating unit may include a process chamber in which a space in which the coating process is performed is formed; A stage in the process chamber, on which the substrate is placed; It includes a coating nozzle for applying a photosensitive liquid to the substrate.

The reduced pressure drying unit is located in the process chamber, the drying chamber is formed in the interior of the lower open space; A drying chamber driver for elevating the drying chamber so that the drying chamber is seated on the stage; And a pressure reducing member for depressurizing a drying space formed by an upper surface of the stage and an inner surface of the drying chamber while the drying chamber is seated on the stage.

An exhaust hole is formed in the stage, and the pressure reducing member comprises: a vacuum line connected to the exhaust hole; It includes a vacuum pump installed on the vacuum line.

The stage further includes a vacuum hole for vacuum suction of the substrate.

In another embodiment, a substrate processing apparatus includes a process chamber; A stage fixedly installed in the process chamber and on which the substrate is placed; An application nozzle having a slit-shaped discharge port and moving in one direction to apply a photosensitive liquid to the substrate; A drying chamber located at an upper portion of the stage in the process chamber and having an inner space having a lower open portion; A drying chamber driver for elevating the drying chamber such that the drying chamber is positioned between a drying position seated on the stage and a standby position spaced apart from the stage; And a decompression member for depressurizing a drying space formed by an upper surface of the stage and an inner surface of the drying chamber while the drying chamber is located at the drying position.

The present invention also provides a substrate processing method. In the substrate processing method, a photosensitive liquid is applied to a substrate placed on a stage by moving an application nozzle, and when the application of the photosensitive liquid is completed, a substrate is placed in the internal space by seating a drying chamber having an internal space having an open lower portion on the stage. The pressure-sensitive drying space formed by the upper surface of the stage and the inner surface of the drying chamber is reduced in pressure to dry the photosensitive liquid.

The drying space is reduced in pressure through an exhaust hole formed in the stage.

During the drying of the photosensitive liquid, the substrate is vacuum adsorbed on the stage.

According to the present invention, since the coating process and the reduced pressure drying process are performed in one process chamber, the substrate processing equipment area is reduced.

In addition, according to the present invention, the transfer process of the substrate between the coating step and the vacuum drying step is not required, the process time is shortened.

Hereinafter, exemplary embodiments of the present invention will be described in more detail with reference to FIGS. 1 to 6. The embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be construed as being limited to the following embodiments. This embodiment is provided to more completely explain the present invention to those skilled in the art. Therefore, the shape of the elements in the drawings are exaggerated to emphasize a more clear description.

In this embodiment, the substrate is a panel for thin film transistor-liquid crystal display (TFT-LCD), which is a kind of panel for flat panel display, or a panel flat panel display for organic light emitting diodes (OLED) display. Although a substrate used for manufacturing a panel has been described as an example, the substrate may be provided with a wafer used for manufacturing a semiconductor chip.

1 is a plan sectional view showing a substrate processing apparatus according to an embodiment of the present invention.

Referring to FIG. 1, the substrate processing apparatus 10 includes an application unit 100 and a reduced pressure drying unit 200. The coating unit 100 applies the photosensitive liquid to the substrate 11, and the reduced pressure drying unit 200 dries the applied photosensitive liquid under reduced pressure. The reduced pressure drying unit 200 is provided in the application unit 100 and sequentially performs the reduced pressure drying process after the application process is completed. Hereinafter, each structure is demonstrated in detail.

The application unit 100 includes a process chamber 110, a substrate support member 120, and an application nozzle member 130.

The process chamber 110 has a space 111 in which an application process is performed. An opening (not shown) is formed in the sidewall of the process chamber 110, and the opening is provided as a passage through which the substrate 11 is carried into the internal space 111. A door (not shown) for opening and closing the opening is provided on the sidewall on which the opening is formed. The door opens the opening while the substrate 11 is brought into the inner space 111, and closes the opening while the substrate 11 stays in the inner space 111.

The substrate support member 120 is installed in the internal space 111 of the process chamber 110. The substrate support member 120 includes a stage 121, a lift pin (not shown), a first vacuum line 125, and a first vacuum pump 126.

The stage 121 is provided in a rectangular plate and is fixedly installed in the process chamber 111. The upper surface of the stage 121 is provided with a larger area than the substrate 11, and the substrate 11 is placed on the upper surface. On the upper surface of the stage 121, a plurality of vacuum holes 122 are spaced apart. Each of the vacuum holes 122 is connected to an inner passage 123 formed in the stage 121. The inner passage 123 is connected to the first vacuum line 125 and is connected to the first vacuum pump 126 through the first vacuum line 125. The inside of the vacuum hole 122 is depressurized by the driving of the first vacuum pump 126 installed on the first vacuum line 125 so that the substrate 11 is vacuum-adsorbed on the upper surface of the stage 121. According to the embodiment, the substrate 11 is vacuum-adsorbed on the upper surface of the stage 121 during the coating process and the vacuum drying process.

In addition, a lift hole (not shown) penetrating the upper and lower surfaces is formed in the stage 121. A lift pin is located in the lift hole, and the lift pin is provided to be capable of lifting up and down along the lift hole. The lift pin lifts and loads the substrate 11 positioned on the stage 121 on the upper surface of the stage 121.

In addition, an exhaust hole 124 is formed in the stage 121. The plurality of exhaust holes 124 are spaced apart from the edge region of the stage 121. Specifically, the exhaust holes 124 are formed outside the region where the substrate 11 is placed. The exhaust holes 124 are connected to the pressure reducing member 230 to be described later, and are provided as a passage for reducing the drying space (DS of FIG. 6) in the vacuum drying process.

2 is a perspective view showing an application nozzle member according to an embodiment of the present invention.

1 and 2, the application nozzle member 130 applies a photosensitive liquid to the substrate 11 placed on the stage 121. The coating nozzle member 130 includes a coating nozzle 131, a nozzle driving member 132, and a photosensitive liquid supply line 139.

The coating nozzle 131 scans and moves the upper portion of the substrate 11 on the stage 121 and discharges the photosensitive liquid onto the substrate 11. At the bottom of the application nozzle 131, a discharge port for discharging the photosensitive liquid is formed in a slit shape. The discharge port is formed in a direction perpendicular to the moving direction of the coating nozzle 131. Inside the application nozzle 131, a slit space to which the photosensitive liquid provided from the photosensitive liquid supply line 139 is supplied and a buffer space to temporarily stay before the photosensitive liquid supplied to the slit space is discharged through the discharge port may be provided along the length direction. have.

The nozzle driving member 132 scan moves the application nozzle 131. The nozzle driving member 132 includes a guide rail 133, a nozzle support 134, a lifting shaft 135, a horizontal driver (not shown), and a vertical driver 136.

The guide rail 133 guides the movement of the application nozzle 131. The guide rails 133 are installed in one direction on both sides of the stage 121 in parallel with each other. The guide rail 133 is disposed side by side with the side of the stage 121, and is provided longer than the side of the side stage 121. As a result, the coating nozzle 131 moves from one side of the stage 121 to the other side.

The guide rail 133 is provided with a nozzle support 134 for supporting the application nozzle 131. The nozzle supporter 134 is installed on the guide rail 133 in the vertical direction, and is installed in the horizontal direction at the top of the vertical portion 133a and the vertical portion 133a moving along the guide rail 133, and the coating nozzle ( 131 has a horizontal portion 133b for supporting it. The horizontal portion 133b is positioned higher than the top surface of the stage 121.

An application nozzle 131 is positioned below the horizontal portion 133a, and a lifting shaft 135 is installed between the application nozzle 131 and the horizontal portion 134b. The application nozzle 131 is supported by the nozzle support 134 through the lifting shaft 135. The lifting shaft 135 moves up and down by the drive of the vertical driver. The distance between the bottom surface of the application nozzle 131 and the substrate 11 is adjusted by the lifting and lowering of the lifting shaft 135.

The horizontal driver 136 moves the nozzle support 134 along the guide rail 133. The application nozzle 131 scans and moves the upper part of the stage 121 along the guide rail 133 along with the nozzle support 134 by the horizontal driver 136 to discharge the photosensitive liquid onto the substrate 11. According to an embodiment, the horizontal driver 136 is located at one end of the guide rail 133.

The photosensitive liquid supply line 139 supplies the photosensitive liquid to the application nozzle 131. The photosensitive liquid supply line 139 connects the photosensitive liquid storage unit (not shown) and the application nozzle 131. The photoresist stored in the photoresist storage part is supplied to the slit space formed in the application nozzle 131 through the photoresist supply line 139. A valve is installed on the photosensitive liquid supply line 139, and the valve opens and closes the flow path of the photosensitive liquid supply line 139 to adjust the flow rate of the photosensitive liquid supplied to the application nozzle 131.

The reduced pressure drying unit 200 is installed in the application unit 100, and the pressure sensitive drying unit 200 is dried under reduced pressure. The reduced pressure drying unit 200 includes a drying chamber 210, a drying chamber driver 220, a pressure reducing member 230, and a boosting member 240.

3 is a cross-sectional view illustrating a drying chamber and a drying chamber driving unit of FIG. 1.

Referring to FIGS. 1 and 3, the drying chamber 210 is located within the process chamber 110. The drying chamber 210 is provided as a rectangular plate, and a space 211 having an open bottom is formed therein. The space 211 formed in the drying chamber 210 is provided as a drying space (DS of FIG. 6) in which a drying process of the photosensitive liquid is performed. The space 211 formed in the drying chamber 210 is formed to have a larger area than the substrate 11 so that the substrate 11 may be located in the space 211. Specifically, the exhaust hole 124 is formed in a sufficient space so that the exhaust hole 124 may be located in the region of the stage 121 corresponding to the open lower portion of the drying chamber 210.

The drying chamber driver 220 lifts the drying chamber 210 so that the drying chamber 210 is seated on the stage 121. According to an embodiment, the drying chamber driver 220 includes a drying chamber support 221, a lifting shaft 222, and a driver 223. The drying chamber supporter 221 has one end coupled to one side wall of the process chamber 110, and the other end coupled to the other side wall parallel to the one side wall. The drying chamber supporter 221 moves up and down along the guide rails 112 installed in the vertical direction on both side walls of the process chamber 110.

A drying chamber 210 is positioned below the drying chamber support 221, and a lifting shaft 222 is installed between the drying chamber support 221 and the drying chamber 220. The drying chamber 210 is supported by the drying chamber support 221 through the lifting shaft 222. The lifting shaft 222 moves up and down by the driving of the driver 223.

The drying chamber 210 is seated on the stage 121 by the lifting and lowering of the drying chamber support 221 and the lifting shaft 222. When the drying chamber 210 is seated on the stage 121, a drying space (DS of FIG. 6) is formed in which a reduced pressure drying process of the photosensitive liquid is performed. The drying space DS is formed by an upper surface of the stage 121 and an inner surface of the drying chamber 210. The substrate 11 is located in the drying space DS.

The decompression member 230 depressurizes the drying space DS through the exhaust hole 124 in a state where the drying chamber 210 is seated on the stage 121. The pressure reduction member 230 includes a second vacuum line 231 and a second vacuum pump 232. The second vacuum line 231 connects the exhaust hole 124 and the second vacuum pump 232. The second vacuum pump 232 is installed on the second vacuum line 231, and the drying space DS is decompressed by the driving of the second vacuum pump 232. On the second vacuum line 231, a valve 233 is provided to adjust the flow rate of the air exhausted through the second vacuum line 231. The drying space DS is decompressed by a first depressurization step of depressurizing to a first pressure at normal pressure and a second decompression step of depressurizing to a second pressure from the first pressure. The decompression member 230 controls the decompression speed to be decompressed to the first pressure at normal pressure and the decompression speed to be decompressed to the second pressure from the first pressure. According to the embodiment, the depressurization rate reduced to normal pressure from the first pressure is smaller than the decompression rate depressurized from the first pressure to the second pressure.

The boost member 240 increases the pressure of the reduced pressure drying space (DS). The boosting member 240 has a first nitrogen gas supply line 241 and a nitrogen gas storage unit 243. The first nitrogen gas supply line 241 connects the second vacuum line 231 and the nitrogen gas storage unit 243, and receives the nitrogen gas stored in the nitrogen gas storage unit 243 through the second vacuum line 231. Supply to the dry space (DS). Specifically, the first nitrogen gas supply line 241 is connected to the second vacuum line 231 in the section between the exhaust hole 124 and the valve 233. On the first nitrogen gas supply line 241, a valve 242 is provided to open and close the flow path of the first nitrogen gas supply line 241. When the reduced pressure drying process is completed, nitrogen gas is supplied to the drying space DS through the first nitrogen gas supply line 241 to increase the pressure of the drying space DS. When the drying space DS is raised to an atmospheric pressure state, the drying chamber 210 is raised to be spaced apart from the stage 121.

In addition, the boosting member 240 increases the pressure of the vacuum hole 122 that vacuum-adsorbs the substrate 11. The booster member 240 further includes a second nitrogen gas supply line 245 connecting the nitrogen gas storage unit 243 and the vacuum hole 122. When the coating process and the vacuum drying process is completed, the nitrogen gas stored in the nitrogen gas storage unit 243 is supplied to the vacuum hole 122 through the second nitrogen gas supply line 245. The substrate 11 is de-chucked from the stage 121 by the pressure rise of the vacuum hole 122.

The gas provided to the boost member 240 may be an inert gas as well as the nitrogen gas.

A method of processing a substrate using the substrate processing apparatus according to the present invention having the configuration as described above is as follows.

4 is a flowchart illustrating a substrate processing method according to an exemplary embodiment of the present invention, FIG. 5 is a diagram illustrating an application process of FIG. 4, and FIG. 6 is a diagram illustrating a vacuum drying process of FIG. 4.

4 to 6, the substrate treating method includes a coating step (S10) of applying a photosensitive solution to the substrate 11 and a reduced pressure drying step (S20) of drying the applied photosensitive solution under reduced pressure. The coating step S10 and the reduced pressure drying step S20 are performed in one process chamber. Hereinafter, each process is explained in full detail.

First, when the substrate 11 is transferred to the internal space 111 of the process chamber 110, the substrate 11 is seated on the upper surface of the stage 121 by lifting and lowering of the lift pins. The substrate 11 seated on the stage 121 is vacuum-resorbed on the upper surface of the stage 121 by depressurizing the inside of the vacuum hole 122 by the driving of the first vacuum pump 126.

The application nozzle 131 stands by on one side of the stage 121 while the process is in progress. When the substrate 11 is vacuum-adsorbed to the stage 121, the application nozzle 131 scans along the guide rail along with the nozzle support and applies the photosensitive liquid to the substrate 11. When the application of the photosensitive liquid is completed, the application nozzle 131 is located on one side of the stage 121.

The drying chamber 210 waits at the top of the stage 121 while the coating process is in progress, and is mounted on the stage 121 by the drying chamber driver 220 after the coating process is completed. The drying chamber 210 is mounted on the stage such that the substrate 11 is positioned in the inner space 211 in which the lower portion is opened. In addition, the drying chamber 210 is seated on the stage 121 so that the exhaust hole 124 formed in the stage 121 is located in the internal space 211. By the seating of the drying chamber 210, the drying space DS is formed by the inner surface of the drying chamber 210 and the upper surface of the stage 121. When the drying chamber 210 is seated on the stage 121, the pressure reducing member 230 depressurizes the drying space DS. The air remaining in the drying space DS is exhausted to the outside through the exhaust hole 124 and the second vacuum line 231 by the driving of the second vacuum pump 232, thereby reducing the drying space DS. The drying space DS is first decompressed at a first deceleration rate from the normal pressure to the first pressure and then decompressed at the second deceleration rate from the first pressure to the second pressure. The first deceleration speed is slower than the second deceleration speed. As described above, the present invention prevents rapid evaporation of the organic solvent and the like contained in the photosensitive liquid by slowly reducing the pressure of the drying space DS in the initial stage of the reduced pressure drying process. As a result, staining of the surface of the coating layer, which may occur due to rapid drying under reduced pressure, is prevented.

When the pressure-sensitive drying process of the photosensitive liquid is completed, the valve 233 is installed in the second vacuum line 231 to block the second vacuum line. In addition, nitrogen gas stored in the nitrogen gas storage unit 243 is supplied to the drying space DS through the first nitrogen gas supply line 241 and the second vacuum line 231. The pressure of the drying space DS is increased by the supply of nitrogen gas, and the pressure is raised to the normal pressure. Then, the valve 127 installed in the first vacuum line 125 is blocked, and the valve 246 installed in the second nitrogen gas supply line 245 is opened to open the second nitrogen gas supply line 245 and the first vacuum. Nitrogen gas is supplied to the vacuum hole 121 through the line 125. The internal pressure of the vacuum hole 122 rises to an atmospheric pressure state by supplying nitrogen gas, whereby the substrate 11 is dechucked from the stage 121.

When the drying space DS maintains an atmospheric pressure state, the drying chamber 210 is lifted from the stage 121 by the drying chamber driver 220 and moved to the standby position. The substrate 11, which has been coated and dried under reduced pressure, is unloaded from the stage 121 by the lift pins and transferred to the transfer robot. Thereafter, the substrate 11 is transferred to a baking unit.

As described above, since the present invention performs the coating process and the reduced pressure drying process in one process chamber, there is an advantage that the facility area can be reduced compared to the substrate processing equipment that performs the coating process and the reduced pressure drying process in separate process chambers. In addition, since the substrate transfer is not required between the coating process and the reduced pressure drying process, the process time is shortened.

The foregoing detailed description illustrates the present invention. Furthermore, the foregoing is intended to illustrate and describe the preferred embodiments of the invention, and the invention may be used in various other combinations, modifications and environments. That is, it is possible to make changes or modifications within the scope of the concept of the invention disclosed in this specification, within the scope of the disclosure, and / or within the skill and knowledge of the art. The embodiment described is to describe the best state for implementing the technical idea of the present invention, various modifications required in the specific application field and use of the present invention is possible. Thus, the detailed description of the invention is not intended to limit the invention to the disclosed embodiments. Also, the appended claims should be construed as including other embodiments.

1 is a plan sectional view showing a substrate processing apparatus according to an embodiment of the present invention.

2 is a perspective view showing an application nozzle member according to an embodiment of the present invention.

3 is a cross-sectional view illustrating a drying chamber and a drying chamber driving unit of FIG. 1.

4 is a flowchart illustrating a substrate processing method according to an embodiment of the present invention.

FIG. 5 is a diagram illustrating an application process of FIG. 4.

FIG. 6 is a view showing a reduced pressure drying process of FIG. 4.

Claims (9)

An application unit for performing an application process for applying the photosensitive liquid to the substrate; And a pressure reduction drying unit installed in the coating unit and configured to dry the pressure sensitive liquid under reduced pressure. The method of claim 1, The application unit A process chamber in which a space in which the coating process is performed is formed; A stage in the process chamber, on which the substrate is placed; And a coating nozzle for applying the photosensitive liquid to the substrate. The method of claim 2, The reduced pressure drying unit A drying chamber located in the process chamber and having an open space therein; A drying chamber driver for elevating the drying chamber so that the drying chamber is seated on the stage; And And a pressure reducing member for depressurizing a drying space formed by an upper surface of the stage and an inner surface of the drying chamber while the drying chamber is seated on the stage. The method of claim 3, wherein An exhaust hole is formed in the stage, The decompression member A vacuum line connected to the exhaust hole; And a vacuum pump installed on the vacuum line. The method of claim 4, wherein And a vacuum hole for vacuum absorbing the substrate in the stage. Process chambers; A stage fixedly installed in the process chamber and on which the substrate is placed; An application nozzle having a slit-shaped discharge port and moving in one direction to apply a photosensitive liquid to the substrate; A drying chamber located at an upper portion of the stage in the process chamber and having an inner space having a lower open portion; A drying chamber driver for elevating the drying chamber such that the drying chamber is positioned between a drying position seated on the stage and a standby position spaced apart from the stage; And a pressure reducing member for depressurizing a drying space formed by an upper surface of the stage and an inner surface of the drying chamber while the drying chamber is located at the drying position. The application nozzle is moved to apply a photoresist to the substrate placed on the stage, and when the application of the photoresist is completed, a drying chamber in which an inner space with an open bottom is formed is seated on the stage to position the substrate in the internal space. And drying the photosensitive liquid by depressurizing a drying space formed by an upper surface and an inner surface of the drying chamber. The method of claim 7, wherein And the drying space is depressurized through an exhaust hole formed in the stage. 9. The method according to claim 7 or 8, While the drying of the photosensitive liquid, the substrate is vacuum-absorbed on the stage, characterized in that the substrate processing method.

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