KR20110053057A - Cutting wheel for glass and manufacturing method for cutting wheel - Google Patents

Cutting wheel for glass and manufacturing method for cutting wheel Download PDF

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Publication number
KR20110053057A
KR20110053057A KR1020090109859A KR20090109859A KR20110053057A KR 20110053057 A KR20110053057 A KR 20110053057A KR 1020090109859 A KR1020090109859 A KR 1020090109859A KR 20090109859 A KR20090109859 A KR 20090109859A KR 20110053057 A KR20110053057 A KR 20110053057A
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KR
South Korea
Prior art keywords
cutting
glass
cutting wheel
cutting blade
cermet
Prior art date
Application number
KR1020090109859A
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Korean (ko)
Inventor
강성찬
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강성찬
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Publication date
Application filed by 강성찬 filed Critical 강성찬
Priority to KR1020090109859A priority Critical patent/KR20110053057A/en
Publication of KR20110053057A publication Critical patent/KR20110053057A/en

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)

Abstract

PURPOSE: A glass cutting wheel and a method for manufacturing the same are provided to reduce cost required for manufacturing processes using a circular plate body based on tungsten carbide, cermet, ceramic, or cubic boron nitride. CONSTITUTION: A glass cutting wheel includes a circular plate body(10) based on tungsten carbide, cermet, ceramic, or cubic boron nitride. Downwardly inclined sides(11) are formed on both edges of the body. A cutting blade(12) with a plurality of grooves(121) is arranged along the outer circumference of the body. A diamond particle film with the thickness of 1 to 8um is formed on the surface of the cutting blade.

Description

Cutting wheel for glass and manufacturing method {Cutting wheel for glass and manufacturing method for cutting wheel}

The present invention relates to a cutting wheel for glass cutting and a manufacturing method thereof, and more particularly, to a glass cutting cutting wheel capable of cutting a glass or semiconductor wafer through a cutting blade having a plurality of grooves formed along an outer circumference thereof. It is about a method.

Generally, cutting wheels for glass cutting are made of diamond and are mounted on machines and used for cutting glass, semiconductor wafers, and wafers for solar cells.

However, in the prior art, since the cutting wheel material formed of artificial diamond material is processed using a tool such as a grinding wheel made of diamond, the cost of the cutting wheel is greatly increased due to the long time required for processing the cutting wheel due to the basic problem of diamond processing with diamond. There was a problem.

In addition, due to brittleness, which is the biggest disadvantage of diamond, chipping of the end of the diamond cutting edge is frequently caused, which reduces the life of the diamond material tool, thereby shortening the replacement cycle.

In order to solve the above problems, in the present invention, tungsten carbide, cermet, ceramic, or cubic boron nitride (CBN) materials are selected to facilitate processing and effectively reduce production costs. It is an object of the present invention to provide a cutting wheel for cutting glass and a method of manufacturing the same, which is processed into a disk-shaped body.

In addition, diamond particles are coated on the surface of the cutting blade with a disc body formed of cemented carbide, cermet, ceramic or CBN material to prevent chipping and extend the life of the cutting wheel. Another object is to provide a cutting wheel for cutting glass and a method of manufacturing the same.

The present invention is a cutting wheel used for cutting a glass or semiconductor wafer, the inclined surface is inclined downward on both sides of the edge, diamond particles are coated on the surface of the cutting blade formed with a plurality of grooves along the outer periphery, cemented carbide, It consists of a structure in which a body made of any one of cermet, ceramic or CBN material is formed.

In addition, the cutting blade is formed of a diamond particle film of 1 ~ 8㎛ thickness.

In addition, while processing the body selectively formed of cemented carbide, cermet, ceramic or CBN material in the form of a disk, the cutting step of processing a cutting blade formed with a plurality of grooves on the outer periphery; The cutting blade surface is formed by a coating step in which diamond particles having a thickness of 1 to 8 μm are coated in the reactor by either CVD or PVD.

As described above, the cutting wheel for cutting glass and the method of manufacturing the same according to the present invention use a disc-shaped body selectively formed of tungsten carbide, cermet, ceramic, or cubic boron nitride (CBN) material. By doing so, it is easy to process, thereby effectively reducing the production cost.

In addition, by selectively coating diamond particles on the cutting blade surface using CVD (Chemical Vapor Deposition) or PVD (Physical Vapor Deposition) method, diamond particles are coated on the surface of tough cemented carbide, cermet, ceramic or CBN material, The contribution surface is so hard that it has another effect of prolonging the life of the cutting wheel by preventing the chipping phenomenon that occurs when cutting glass or wafers.

Hereinafter, a preferred embodiment according to the construction and operation of a cutting wheel for cutting a glass and a method of manufacturing the same according to the present invention will be described in detail with the accompanying drawings.

1 is a perspective view of a cutting wheel for cutting glass according to the present invention, Figure 2 is a plan view of a cutting wheel for cutting glass according to the present invention, Figure 3 is a flow chart for manufacturing a cutting wheel for cutting glass according to the present invention, shown in the figure 1 is to indicate a cutting wheel according to the present invention.

The cutting wheel for cutting glass of the present invention has a structure in which a disc-shaped body 10 formed of tungsten carbide, cermet, ceramic, or CBN (cubic boron nitride) material is selectively formed.

As shown in Figures 2 and 3, the body 10 is formed with an inclined surface 11 inclined downwardly toward the outer periphery of both sides, respectively, and saw blade shape on the outer periphery so as to be cut in close contact with the glass or semiconductor wafer The cutting blade 12 is formed with a plurality of grooves 121 is formed along the outer circumference.

In particular, the cutting blade 12 is a diamond particle film having a thickness of 1 ~ 8㎛ on the surface is formed to protect the cutting blade 12 when cutting the glass, semiconductor wafer, etc. is to extend the life of the cutting wheel, preferably To minimize the occurrence of chipping (chipping) by forming a diamond particle film on the surface of the cutting blade 12 to 3 ~ 4㎛, the grinding time compared to the artificial diamond is 1/3 reduced to improve productivity more than three times.

In addition, the body 10, as described above, is tougher than diamond and is selectively formed of a cemented carbide, cermet, ceramic, or CBN material, which is a hard material, so that the interior thereof becomes tough, and the exterior is hardened by diamond particles, and thus, glass or semiconductor. The chipping that can occur during wafer cutting is prevented and the production / manufacturing cost of cutting blade 12 processing, which accounts for the largest part of the production / manufacturing cost, can be reduced to less than 1/3.

Hereinafter, a method of manufacturing a cutting wheel for cutting glass according to the present invention will be described in detail.

As shown in Figure 4, according to the manufacturing method of the cutting wheel of the present invention, the body 10 selectively formed of cemented carbide, cermet, ceramic or CBN material is processed into a disc shape in the machining step (S10), the edge Both sides are processed so that the inclined surface 11 is formed to be inclined downward toward the outer circumferential center. The inclined surface 11 is to allow chips generated during cutting of glass or semiconductor wafers to be distributed to the left and right sides along the inclined surface 11.

In addition, in the processing step (S10), the cutting edge 12 in which the plurality of grooves 121 are formed is processed using a tool generally used for machining, cutting, and grinding on the outer circumference of the body 10, and the groove ( 121 and the cutting blade 12 can be processed into various shapes.

In addition, the cutting blade 12 processed as described above 1 in the coating step (S20) of coating the diamond particles by a CVD (Chemical Vapor Deposition) method using a filament (filament) as a heat source in the reactor (not shown). It is to coat the diamond particles to a thickness of ~ 8㎛. The CVD method forms a suitable roughness value on the surface of the cutting blade 12 and then heats the filament as a heat source to 2000 ° C. At this time, the starting gas is a carbon-based hydrogen gas CH 4 , C 2 H 2. Alternatively, C 6 H 6 may be selectively introduced into the reactor (not shown) to decompose and grow diamond crystals on the surface of the cutting blade 12.

In the coating step (S20), in addition to the above-described CVD method PVD (Physical Vapor Deposition) coating method can be selectively used, PVD is a method of depositing diamond on the base material at a much lower temperature than CVD, the detailed description thereof will be omitted do.

As described above, the cutting wheel is easy to process by processing the disk-shaped body selectively formed of cemented carbide, cermet, ceramic or CBN material can effectively reduce the production cost.

In addition, by coating the diamond particles on the cutting blade surface, the diamond particles are coated on the surface of the tough carbide, cermet, ceramic, or CBN material, which is tough inside and very hard, which prevents chipping from glass or wafer cutting. Another effect is that the life of the cutting wheel is extended.

The present invention is not limited to the preferred embodiments of the above-described features, and various modifications can be made by those skilled in the art without departing from the gist of the present invention as claimed in the claims. Of course, such changes will fall within the scope of the claims.

1 is a perspective view of a cutting wheel for cutting glass according to the present invention

Figure 2 is a plan view of the cutting wheel for cutting glass according to the present invention

Figure 3 is a flow chart for manufacturing a cutting wheel for cutting glass according to the present invention

Description of the Related Art [0002]

10 body 11: slanted surface

12: cutting blade 121: semicircle groove

Claims (3)

For cutting wheels used for cutting glass or semiconductor wafers, Downwardly inclined surfaces 11 are formed at both edges, and diamond particles are coated on the surface of the cutting blade 12 in which a plurality of grooves 121 are formed along the outer circumference thereof, and among cemented carbide, cermet, ceramic, or CBN materials. Cutting wheel for glass cutting, characterized in that the body 10 formed of any one is formed. The method of claim 1, The cutting blade 12 is a cutting wheel for glass cutting, characterized in that the diamond particles of 1 ~ 8㎛ thickness formed. Machining step (S10) for processing the body selectively formed of cemented carbide, cermet, ceramic or CBN material in the form of a disk, the cutting blade formed with a plurality of grooves on the outer periphery; Method for producing a cutting wheel for cutting glass, characterized in that the cutting blade surface is formed by a coating step (S20) is coated with diamond particles of 1 ~ 8㎛ thickness in any one of the CVD or PVD method in the reactor.
KR1020090109859A 2009-11-13 2009-11-13 Cutting wheel for glass and manufacturing method for cutting wheel KR20110053057A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020090109859A KR20110053057A (en) 2009-11-13 2009-11-13 Cutting wheel for glass and manufacturing method for cutting wheel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090109859A KR20110053057A (en) 2009-11-13 2009-11-13 Cutting wheel for glass and manufacturing method for cutting wheel

Publications (1)

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KR20110053057A true KR20110053057A (en) 2011-05-19

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103342459A (en) * 2013-06-24 2013-10-09 句容骏成电子有限公司 High-permeability knife wheel
CN104609717A (en) * 2014-12-08 2015-05-13 福州大学 Simple manual-cutting method for glass bottle
US20150136276A1 (en) * 2012-05-04 2015-05-21 Green Manufacturing, Inc. Stump cutting apparatus
US10045491B2 (en) 2015-10-15 2018-08-14 Green Manufacturing, Inc. Stump grinding wheel with reverse spiral teeth
US10219451B2 (en) 2012-05-04 2019-03-05 Green Manufacturing, Inc. Rotary stump cutting wheel
KR20200045708A (en) * 2018-10-23 2020-05-06 배영규 Tempered glass cutting tools
CN116377416A (en) * 2023-03-08 2023-07-04 北京爱克瑞特金刚石工具有限公司 Scribing cutter and manufacturing method thereof

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150136276A1 (en) * 2012-05-04 2015-05-21 Green Manufacturing, Inc. Stump cutting apparatus
US10219451B2 (en) 2012-05-04 2019-03-05 Green Manufacturing, Inc. Rotary stump cutting wheel
CN103342459A (en) * 2013-06-24 2013-10-09 句容骏成电子有限公司 High-permeability knife wheel
CN103342459B (en) * 2013-06-24 2015-11-04 句容骏成电子有限公司 A kind of High-permeability knife wheel
CN104609717A (en) * 2014-12-08 2015-05-13 福州大学 Simple manual-cutting method for glass bottle
US10045491B2 (en) 2015-10-15 2018-08-14 Green Manufacturing, Inc. Stump grinding wheel with reverse spiral teeth
KR20200045708A (en) * 2018-10-23 2020-05-06 배영규 Tempered glass cutting tools
CN116377416A (en) * 2023-03-08 2023-07-04 北京爱克瑞特金刚石工具有限公司 Scribing cutter and manufacturing method thereof
CN116377416B (en) * 2023-03-08 2023-12-12 北京爱克瑞特金刚石工具有限公司 Scribing cutter and manufacturing method thereof

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