KR20110053031A - Integrating sphere unit with probe card, led chip testing apparatus, and led chip sorting apparatus having the same - Google Patents

Abstract

PURPOSE: An integrating sphere unit with a probe card, and an LED chip testing apparatus therewith, and an LED chip sorting apparatus therewith are provided to accurately measure the light properties of a light source. CONSTITUTION: An integrating sphere unit with a probe card comprises an integrating sphere body(110), a probe card(150), and a transfer member. The integrating sphere body has a hollow unit and a light receiving hole for transferring light to the hollow unit. The probe card is integrally formed in the integrating sphere body and has an insertion hole for transferring light. The transfer member is integrally formed in the bottom of the probe card and transfers light toward the hollow unit.

Description

INTEGRATING SPHERE UNIT WITH PROBE CARD, LED CHIP TESTING APPARATUS, AND LED CHIP SORTING APPARATUS HAVING THE SAME}

The present invention relates to an integrating sphere unit having a probe card, an LED chip testing apparatus having the same, and an LED chip sorting apparatus.

The integrating sphere is a spherical device having a hollow portion inside, and is a device that receives light into the hollow portion and measures its characteristics. In order to measure the light emitted by an LED using an integrating sphere, for example, a power source must be connected to the LED to emit light. A probe card can be used for this purpose. Here, an LED (Light Emitting Diode) is a kind of light emitting device using a semiconductor that converts electricity into light and is also referred to as a light emitting diode.

Looking at the process of measuring the optical characteristics of the LED using the integrating sphere in detail as follows. First, place the integrating sphere above the LED and place the probe card between the integrating sphere and the LED. In this state, the probe card is lowered and brought into contact with the LED chip to emit the LED, and the optical characteristic is measured by receiving the light through the light receiving hole of the integrating sphere.

However, in the process of lowering the probe card, a gap is generated between the probe card and the integrating sphere, and light loss occurs due to the gap. This hinders the accurate measurement of the optical properties, which makes it difficult to accurately classify the LEDs, for example.

On the other hand, the LED is manufactured through an epi process (EPI), a chip process (Fabrication) and a package process (Package), etc., and is subjected to a test process in a packaged state through the package process. In the test process, the LEDs which are not normally operated (hereinafter referred to as 'defective products') are excluded, and the LEDs which are normally operated (hereinafter referred to as 'goods') are classified and classified according to their performance and shipped.

The LED may be classified as a low grade even if it is excluded or defective in the test process due to a problem occurring during the packaging process, but manufactured in a chip state (hereinafter referred to as 'LED chip') before the packaging process. Due to a problem occurring during the process, it may be excluded as a defective product in the test process or classified as a low grade product. Therefore, it is necessary to accurately measure and classify the performance in the state of the LED chip so as not to go through unnecessary packaging and testing processes. As described above, in order to measure the optical characteristics of the LED chip, it is necessary to prevent the optical loss from being received by the integrating sphere.

The present invention has been made to solve the above problems, an object of the present invention is to provide an integrating sphere unit that does not cause light loss in the light receiving process, and to provide an LED chip test device and LED chip sorting apparatus having the same will be.

In order to achieve the above-mentioned object, the present invention can include the following configuration.

First, the present invention is an integrating sphere unit for measuring the optical characteristics of the light source, the hollow portion is formed inside, the integrating sphere body having a light receiving hole for transmitting light to the hollow portion; And a probe card integrally formed in the integrating sphere body and having an insertion hole for transmitting light toward the light receiving hole.

In another aspect, the present invention, the LED chip test apparatus for measuring the characteristics of the LED chip, the support for the LED chip, the rotating member for rotating the LED chip to a test position for measuring the characteristic of the LED chip; And a test unit installed next to the rotating member and measuring a characteristic of the LED chip at the test position, wherein the test unit includes an integrating sphere unit measuring the optical characteristics of the LED chip. Silver, the hollow portion is formed on the inside, the integral sphere having a light receiving hole for transmitting light to the hollow portion; And a probe card integrally formed in the integrating sphere body and having an insertion hole for transmitting light toward the light receiving hole.

In another aspect, the present invention is a LED chip sorting apparatus for classifying the LED chip by measuring the characteristics of the LED chip, comprising a mounting member on which the LED chip is mounted, the loading position in which the LED chip is loaded on the mounting member A supply unit for rotating the seating member to a test position at which the LED chip is tested and to an unloading position at which the LED chip is unloaded from the seating member; A loading unit installed beside the supply unit and supplying an LED chip to be tested to the seating member in the loading position; A test unit installed beside the supply unit and measuring a characteristic of the LED chip at the test position; And an unloading unit installed next to the supply unit and collecting the LED chip tested from the seating member in the unloading position, wherein the test unit includes an integrating sphere unit for measuring optical characteristics of the LED chip. The integrating sphere unit, the hollow portion is formed on the inside, the integrating sphere body having a light receiving hole for transmitting light to the hollow portion; And a probe card integrally formed in the integrating sphere body and having an insertion hole for transmitting light toward the light receiving hole.

Here, the rotating member may include a plurality of support frames extending in a radial direction about the rotation shaft, and a plurality of seating members respectively installed at end portions of the plurality of support frames and for seating the LED chip. .

In addition, all or part of the seating member may be made of a material having high conductivity and hardness. Specifically, the whole or part of the seating member may be made of a material including any one of sapphire, quartz, glass, iron alloy, copper alloy, aluminum alloy, stainless steel, cemented carbide, gold, platinum. In addition, all or part of the seating member may be Teflon coating, mirror coating, gold plating, or platinum plating.

In addition, the seating member may include a seating body coupled to the rotating member, and a contact member in contact with the LED chip. The contact member may be formed of sapphire, and a surface of the contact member facing the seating body may be mirror coated.

The test unit may further include a measuring raising and lowering unit for raising and lowering the integrating sphere.

In addition, the unloading unit may be located on the opposite side of the loading unit with respect to the supply unit.

In the present invention, the probe card may be formed integrally with the lower side of the probe card, and may further include a transmission member for transmitting the light emitted from the light source to the hollow part side.

In the present invention, the transmission member includes a transmission surface for reflecting the light emitted from the light source toward the hollow portion, the transmission surface is formed with a through hole through which the light emitted by the light source is passed, the light source is It may be located inside or below the transfer surface.

In addition, in the present invention, the through hole may be formed to gradually decrease in size toward the light source from the integrating sphere body.

In addition, in the present invention, the transfer surface may be made of a material having a constant high reflectance in the wavelength band 200nm ~ 1000nm.

The probe card may include a probe pin in contact with a light source, and a probe body connected to the integrating sphere body and supporting the probe pin, and the insertion hole may be formed in the probe body.

In addition, in the present invention, a plurality of probe pins may be provided.

In addition, in the present invention, the probe body may include a terminal electrically connected to the probe pin.

In addition, in the present invention, one end of the probe pin is connected to the terminal, the other end of the probe pin may protrude in the insertion hole.

In addition, in the present invention, the light receiving hole and / or the insertion hole may be circular. In addition, the light receiving hole and the insertion hole may be circular having the same diameter.

In addition, in the present invention, a blocking member may be provided between the light receiving hole and the probe card to block a part of the light transmitted to the light receiving hole.

In addition, in the present invention, the blocking member may adjust the blocking amount of light. In addition, the blocking member includes a through hole for passing a portion of the light, it can adjust the size of the through hole.

Finally, the present invention may further include a measurement lifting unit for lifting up and down the integrating sphere body.

According to the integrating sphere unit, the LED chip testing apparatus and the LED chip sorting apparatus having the same according to the present invention, the light loss does not occur in the light receiving process to the integrating sphere. This makes it possible to accurately measure the optical characteristics of light sources such as LED chips.

Hereinafter, an embodiment of an integrating sphere unit having a probe card according to the present invention, an LED chip test apparatus having the same, and an LED chip sorting apparatus will be described in detail with reference to the accompanying drawings.

[Integral sphere unit]

First, an embodiment of an integrating sphere unit with a probe card according to the present invention will be described. 1 and 2 are a perspective view and a cross-sectional view of the integrating sphere unit according to the present invention. 3 is a perspective view of the reinforcing plate and the probe card of the integrating sphere unit according to the present invention.

The integrating sphere unit 100 according to the present invention includes an integrating sphere body 110 and a probe card unit 130 which is integrally coupled with the integrating sphere body 110. As such, the integral sphere body 110 and the probe card unit 130 are integrally coupled to prevent the loss of light through the gap between the integrating sphere and the probe card.

As shown in FIG. 1, the integrating sphere body 110 is generally spherical and has a neck portion at which a probe card portion 130 is integrally connected to a lower end thereof. On the side of the integrating sphere main body 110, an optical characteristic measuring instrument 116 capable of measuring the characteristics of light collected in the integrating sphere main body 110 is mounted. The probe card unit 130 is generally flat rectangular parallelepiped, and the receiving groove is provided in the reinforcing plate 140 and the probe card 150 to be inserted from one side thereof. A fixing screw 170 is provided at each corner of the upper side of the probe card 130 so that the inserted reinforcing plate 140 and the probe card 150 can be fixed.

2 is a cross-sectional view of an integrating sphere unit according to an embodiment of the present invention. Referring to FIG. 2, the integrating sphere main body 110 includes a spherical integrating sphere housing 111, and a hollow portion 112 for condensing is provided inside the integrating sphere housing 111. A through hole 115 is formed at one point inside the integrating sphere housing 111, and the through hole 115 is connected to the optical characteristic measuring instrument 116 provided at the outside of the integrating sphere housing 111 so that the optical characteristic measuring instrument ( 116) to transmit light. The optical characteristics may be, for example, luminance, wavelength, luminous flux, luminous intensity, illuminance, spectral distribution, color temperature, and color coordinates, and the optical characteristic analyzer 116 may be, for example, a spectrometer or a photodetector.

A substantially cylindrical main body neck 113 is provided at the lower end of the integrating sphere housing 111, and a light receiving hole 114 for transmitting light to the hollow part 112 is provided inside the main body neck 113. The inner side of the body neck 113 and the inner side of the integrating sphere housing 111 are preferably coated with a material in which light is uniformly reflected or a coating of such a material, such as PTFE. The main body neck 113 provided at the lower end of the integrating sphere body 110 is integrally connected to the probe card housing 131 of the probe card unit 130.

The probe card unit 130 includes a probe card housing 131 having a substantially rectangular parallelepiped shape connected to the main neck 113. The upper surface of the probe card housing 131 is a rectangular plate extending in a planar direction from the lower end of the main body neck 113, and extends downward from the remaining three sides except for one side of the four sides of the plate. Inside the probe card housing 131, as shown in FIG. 2, the upper jaw portion 132 and the inner lower flange portion 133 are provided, and a groove portion is provided between the jaw portion 132 and the flange portion 133. 135 is formed. The reinforcement plate 140 and the probe card 150 are inserted into the groove 135 on the one side in a plane. As a result, the probe card 150 may be integrally coupled with the integrating sphere main body 110, and if necessary, the probe card 150 may be separated from the integrating sphere main body 110.

The insertion hole 134 is provided at the center of the probe card 150 to transmit light toward the light receiving hole 114 of the integrating sphere body 110. The light receiving hole 114 is circular in cross section, and the insertion hole 134 is also formed in a circular shape having a diameter substantially the same as that of the light receiving hole 114.

The reinforcement plate 140 serves to prevent deformation of the probe card 150 and at the same time serves as a guide when the probe card 150 is inserted into the probe card housing 131. Referring to Figure 3, the reinforcing plate 140 is formed of a plate having a large diameter hole 143 in the center, the flange portion 141 of the "b" shaped on both sides of the lower end of the longitudinal direction is long Is formed. The flange portion 141 is inserted into the groove portion 135 inside the probe card housing 131. Four corners of the upper surface of the reinforcing plate 140 is formed with a screw hole 142 for coupling with the probe card 150.

The probe card 150 includes, for example, a probe pin 152 in contact with a light source such as an LED chip, and a probe body 151 supporting the probe pin 152, and having an insertion hole in the probe body 151. 134 is formed. The insertion hole 134 formed in the probe body 151 serves as a space for transmitting the light from the light source toward the light receiving hole 114 formed in the integrating sphere body 110.

The probe body 151 includes a substantially rectangular plate having a size that fits into the flange portion 141 of the reinforcing plate 140 at the lower side of the reinforcing plate 140, and the upper surface of the plate protrudes upwardly. Circular protrusions 154 are provided. The protrusion 154 is inserted into and fixed in the hole 143 of the reinforcing plate 140. An insertion hole 134 penetrates to a lower surface of the upper portion of the upper surface of the protrusion 154, and a groove is formed on an inner surface of the protrusion 154 to form the insertion hole 134. It protrudes toward the center of this insertion hole 134. As illustrated in FIG. 3, the probe pin 152 may be provided in plural, for example, three or more.

The probe body 152 is provided with a terminal 153 for electrical connection with the probe pin 152, and a pin on one side of the upper surface of the plate 151 to electrically connect the plurality of terminals 153 to the outside. An adapter 155 of the form is provided. One end of the probe pin 152 is connected to the terminal 153, and the other end thereof protrudes into the insertion hole 134 to be in contact with the light source.

As described above, in the integrating sphere unit 100 according to the present invention, the probe card 150 is integrally combined with the integrating sphere main body 110 so that the loss of light does not occur when the optical characteristic is measured. In addition, if necessary, by separating the probe card 150 from the integrating sphere body 110, the probe card 150 can be appropriately replaced according to the light source to be measured, and maintenance is also convenient. In addition, by providing a reinforcing plate 140 to prevent the deformation of the probe card 150 and at the same time serves as a guide when coupling the probe card 150 to the integral sphere body (110).

4 shows an integrating sphere unit according to another embodiment of the present invention. In the present embodiment, the transfer member 160 is provided below the probe card 150 of the integrating sphere unit 100, and the rest of the configuration is the same as the above-described embodiment, and a description thereof will be omitted.

The transmission member 160 is integrally coupled to the lower side of the probe card 150, the hollow portion of the integrating sphere body 110 through the insertion hole 134 of the probe card 150 for the light emitted from the light source such as the LED chip It serves as a reflector reflecting to the (112) side.

The transmission member 160 has a flat rectangular parallelepiped plate shape, and a through hole 161 is formed at the center thereof. The through hole 161 is a substantially circular hole, and the light emitted from the light source passes through the through hole 161. As shown in FIG. 4, the through hole 161 may be formed to gradually decrease in size from the upper side to the lower side, that is, in the direction toward the light source from the integrating sphere body 110. This can reduce the amount of light lost from the light source to the outside.

The inner surface of the transmission member 160 constituting the through hole 161 forms a transmission surface 162 for reflecting light emitted from the light source toward the hollow part 112. The transfer surface 162 is preferably formed of or coated with a material having a high reflectance. In particular, the transfer surface 162 is preferably formed of or coated with a material having a constant high reflectance in the measurement wavelength band and the wavelength band adjacent thereto, that is, 200nm to 1000nm. For example, the transfer surface 162 may be PTFE (Teflon) coated or mirror coated.

As shown in FIG. 5, the light source L such as an LED chip is fixed on the mounting member 18 by a method such as adsorption. In order to measure the optical characteristics of the light source L, first, the light source L is positioned inside or below the transmission member 160, and light is emitted by bringing the probe pin 152 into contact with the light source L. To lose. The light from the light source L is condensed through the insertion hole 134 and the light receiving hole 114 to the hollow part 112 inside the integrating sphere body 110, and the collected light is passed through the through hole 115. The optical characteristic measurement device 116 is delivered to thereby measure the optical characteristic. On the other hand, the light transmitted or reflected to the side or downward with respect to the light source (L) is transmitted to the hollow portion 112 side through the transmission surface 162 of the transmission member 160 to suppress the light loss, thereby measuring optical characteristics The reliability of is improved.

6 and 7 show an integrating sphere unit according to another embodiment of the present invention. In the present embodiment, the blocking member 170 for blocking a part of the light transmitted to the light receiving hole 114 between the light receiving hole 114 and the probe card 150 of the integral sphere body 110 of the integrating sphere unit 100; ), And the rest of the configuration is the same as in the above-described embodiment, the description thereof will be omitted.

6A and 6B, the blocking member 170 is provided above the probe card 150 in the probe card housing 130. The blocking member 170 includes a frame 171 and a blocking material 172 housed inside the frame 171, and the blocking material 172 includes a plurality of light passing holes 172 through which light emitted by the light source passes. It includes. The blocking material 172 reduces the passage area for the light emitted from the light source to be incident into the integrating sphere main body 110. That is, only the light passing through the light passing hole 172 among the light emitted by the light source is transmitted to the hollow part 112 inside the integrating sphere body 110 through the light receiving hole 114. By providing the blocking member 170 as described above, when the light characteristic device 116 or more light is introduced into the hollow portion 112, it is possible to block it at a constant rate. As the blocking material 172, a fabric or a knitted fabric may be used. In addition, a non-reflective metal, an anti-reflective metal, an anti-reflective plastic, or a photomask may be used.

7a to 7c show another embodiment of the blocking member. The blocking member 180 is provided above the probe card 150 in the probe card housing 130. The blocking member 180 includes a frame 181, an upper first blocking material 182 accommodated inside the frame 181, and a second blocking material 184 below the first blocking material 182. Each of the first and second blocking members 182 and 184 includes a plurality of first and second light passing holes 183 and 185 through which light emitted by the light source passes. These first and second blocking members 182 and 184 reduce the passage area for the light emitted from the light source to enter the integrating sphere body 110. Unlike the blocking member 170 illustrated in FIG. 6, the blocking member 180 may overlap the blocking material up and down to adjust the rate at which light emitted by the light source passes. For example, when the first blocking member 182 and the second blocking member 184 have the same shape and the first and second light passing holes 183 and 185 have the same orientation, only one blocking member is installed as shown in FIG. 7B. As in the case, a passage area of light is formed. However, when the first blocking material 182 and the second blocking material 184 are oriented at a predetermined angle, as shown in FIG. 7C, some regions of the first light passing hole 183 are again blocked by the second blocking material 184. Therefore, compared with the case of FIG. 7B, the light passage area is reduced. In this way, by adjusting the angle formed by the first blocking member 182 and the second blocking member 184, it is possible to appropriately adjust the rate at which the light emitted by the light source passes.

[LED chip test apparatus and sorting apparatus including integrating sphere unit]

Next, an embodiment of an LED chip test apparatus and a classification apparatus including an integrating sphere unit according to the present invention will be described. 8 and 9 are a perspective view and a plan view of the LED chip test apparatus and the LED chip sorting apparatus having an integrating sphere unit according to the present invention. 10 is a front view of an LED chip test apparatus having an integrating sphere unit according to the present invention. 11 is an enlarged perspective view of a supply unit according to the present invention. Since the configuration and function of the integrating sphere unit 100 are the same as in the above-described embodiment, a description thereof will be omitted, and the above-described object L becomes the LED chip in this embodiment.

The LED chip sorting apparatus 1 having the integrating sphere unit 100 according to the present invention is a device for classifying good and defective goods according to their performance by testing the characteristics of the LED chip at the chip stage before the packaging process. . As shown in FIG. 8 and FIG. 9, the LED chip sorting apparatus 1 includes a supply unit 10, a loading unit 20, a test unit 30, and an unloading unit 40. Meanwhile, the LED chip testing apparatus 2 includes only the supply unit 10 and the test unit 30 in the above configuration (see FIG. 10).

As shown in FIG. 11, the supply unit 10 includes a rotating unit 11 for rotating the LED chip to be tested, and a rotating member 15 rotatably coupled to the rotating unit 11. do. A motor 12 for rotating the rotating member 15 is attached to the lower side of the rotating unit 11.

The rotating member 15 includes a plurality of, for example, eight cantilever-shaped support frames 17 extending radially about the rotation shaft 16. Each end side of the support frame 17 is provided with a seating member 18 on which the LED chip is seated. As the rotating member 15 rotates, the seating member 18 includes a loading position LP at which the LED chip is loaded on the seating member 18, a test position TP at which the LED chip is tested, and a seating member 18. ) Rotates to the unloading position (ULP) where the LED chip is unloaded.

The seating member 18 serves to absorb and fix the LED chip. Since a plurality of LED chips are continuously attached to the seating member 18, the seating member 18 is preferably formed of a material having excellent wear resistance and excellent hardness, or coated with such a material. In addition, when the light emitted from the LED chip is transmitted or reflected to the seating member 18 side, the light is transmitted to the integrating sphere unit 100 side so that the light loss does not occur, the seating member 18 is a material with high reflectance It is preferred to be formed of or coated with such a material. In particular, the seating member 18 is preferably formed of a material having a high reflectance at the measurement wavelength band and a wavelength band adjacent thereto, that is, 200 nm to 1000 nm, or coated with such a material. To this end, all or part of the seating member 18 is formed of a material including sapphire, quartz, glass, iron alloy, copper alloy, aluminum alloy, stainless steel, cemented carbide, or the whole or the seating member 18 Portions may be PTFE (Teflon) coated or mirror coated.

On the other hand, although not shown, the seating member 18 may be composed of a seating body coupled to the rotating member 15 and a contact member positioned on the seating body and in contact with the LED chip. In this case, the contact member in direct contact with the LED chip is formed of sapphire, the surface facing the seating body in this contact member may be mirror-coated.

On the other hand, the seating member 18 is in contact with the LED chip can be electrically connected to them, it is preferably formed of a material having excellent conductivity, or is coated with such a material. To this end, all or a portion of the seating member 18, such as a seating body, may be formed of gold or platinum, or may be coated with gold or platinum.

The loading unit 20 is installed next to the supply unit 10, and when the seating member 18 is located at the loading position LP, the loading unit 20 supplies the LED chip to be tested to the seating member 18. The loading unit 20 moves the holding member from the first storage unit 21 holding the holding member on which the LED chip is held to the loading unit 22 via the first moving mechanism 23, and then the loading unit ( 22, the LED chip is loaded from the loading unit 20 to the seating member 18 side of the supply unit 10.

The test unit 30 is installed next to the supply unit 10, and when the seating member 18 is located at the test position TP, the characteristics of the LED chip placed on the seating member 18 are measured. The characteristics of the LED chip may be optical characteristics such as luminance, wavelength, luminous flux, luminous intensity, illuminance, spectral distribution, color temperature, and color coordinates, and the test unit 30 may measure the integrating sphere unit 100 to measure such optical characteristics. It will include. Since the configuration and function of the integrating sphere unit 100 are the same as in the above-described embodiment, description thereof will be omitted.

Referring to FIG. 9, the LED chip test apparatus 2 includes a supply unit 10 having a rotating member 11 and a test unit 30 including an integrating sphere unit 100. The rotating member 11 supports the LED chip L and rotates the LED chip L to a test position for measuring the characteristics of the LED chip L. The test unit 30 is installed next to the rotating member 11 and measures the characteristics of the LED chip (L) at the test position. In this embodiment, the rotating member 11 includes a plurality of support frames 17 extending radially about the rotation axis, and the seating members 18 are provided at end portions of the plurality of support frames 17, respectively. . The LED chip L is seated on the seating member 18 by adsorption or the like.

The test unit 30 includes a base unit 31, a plane moving unit 32 coupled to the base unit 31 so as to be movable in the X direction and the Y direction, on the plane moving unit 32 in the Z direction, that is, vertically. And a measuring lifting unit 33 movably coupled in a direction, a vertical frame 34 connected to the measuring lifting unit 33, and a horizontal frame 35 connected to an upper end of the vertical frame 34. . An integrating sphere unit 100 having a probe card is fixedly installed on the bottom or side surface of the horizontal frame 35. Therefore, the integrating sphere unit 100 having the probe card is integrally moved by the driving of the plane moving unit 32 and the measuring raising and lowering unit 33.

Referring again to FIGS. 8 and 9, the unloading portion 40 is installed next to the supply portion 10 and from the seating member 18 when the seating member 18 is positioned at the unloading position ULP. The LED chips are collected, and these LED chips are sorted and loaded on the holding member. The unloading unit 40 sorts the buffer unit 50 which collects and stores the tested LED chips from the seating member 18, and classifies the LED chips stored in the buffer unit 50 according to the test results. The unit 60 is included. The buffer unit 50 moves the LED chip from the mounting member 18 to the holding member by the unloading unit 51, and then moves the holding member to the second storage unit 53 through the second moving mechanism 52. Will be kept. The stored holding member is transferred to the sorting loading unit 61 and then loaded on a separate holding member for each grade by the sorting unit 62 according to the LED chip test result. The holding members classified according to the grades are moved and stored in the third storage unit 64 through the third moving mechanism 63, and are automatically or manually discharged from the third storage unit 64 according to the worker's request. do.

The LED chip sorting apparatus 1 according to the present invention generally has a straight arrangement (layout). That is, the unloading part 40 is located on the opposite side of the loading part 20 with respect to the supply part 10. This makes it easy to see the flow of the process and to simplify maintenance.

By using the LED chip sorting apparatus 1 according to the present invention, it becomes possible to test and classify the LED chips at the chip stage before packaging, and in particular, by providing the integrating sphere unit 100 integrally including the probe card, By suppressing the loss, it becomes possible to measure the optical characteristics of the LED chip more stably and reliably.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. It will be clear to those who have knowledge.

By adopting the above-described configuration, the present invention does not generate light loss in the process of receiving light into the integrating sphere, and thus an integrating sphere unit and LED having the same can accurately measure optical characteristics of a light source such as an LED chip. Provides chip tester and LED chip sorter.

1 is a perspective view of an integrating sphere unit according to the present invention.

2 is a cross-sectional view of the integrating sphere unit according to the present invention.

3 is a perspective view of the reinforcing plate and the probe card according to the present invention.

4 is a cross-sectional view of an integrating sphere unit with a reflecting plate according to the present invention.

5 is a cross-sectional view showing the operation of the integrating sphere unit according to the present invention.

Figure 6a is a cross-sectional view of the integrating sphere unit with a blocking member according to the present invention, Figure 6b is a perspective view and an enlarged view of the blocking member.

7A is a cross-sectional view of an integrating sphere unit with another blocking member according to the present invention, and FIGS. 7B and 7C are enlarged views of the blocking member.

8 is a perspective view of an LED chip test apparatus and an LED chip sorting apparatus having an integrating sphere unit according to the present invention.

9 is a plan view of an LED chip test apparatus and an LED chip sorting apparatus having an integrating sphere unit according to the present invention.

10 is a front view of an LED chip test apparatus having an integrating sphere unit according to the present invention.

11 is an enlarged perspective view of a supply unit according to the present invention.

Claims (63)

An integrating sphere unit for measuring optical characteristics of a light source, An integrating sphere body having a hollow portion formed therein and having a light receiving hole for transmitting light to the hollow portion; And Probe card integrally formed in the integrating sphere body and having an insertion hole for transmitting light toward the light receiving hole Integrating sphere unit comprising a. The integrating sphere unit of claim 1, further comprising a transmission member integrally formed at a lower side of the probe card and transmitting the light emitted from the light source to the hollow portion. According to claim 2, The transmission member includes a transmission surface for reflecting the light emitted from the light source toward the hollow portion, the transmission surface is formed with a through hole through which the light emitted by the light source passes, the light source is Integrating sphere unit, characterized in that located on the inner side or the lower side of the transfer surface. The integrating sphere unit according to claim 3, wherein the through hole is gradually reduced in size in the direction toward the light source from the integrating sphere body. The integrating sphere unit according to claim 3 or 4, wherein the transfer surface is coated with a material having a constant high reflectance in the wavelength band of 200 nm to 1000 nm. 5. The insertion hole of claim 1, wherein the probe card comprises a probe pin in contact with a light source, and a probe body connected to the integrating sphere body and supporting the probe pin. The integrating sphere unit, characterized in that formed on the probe body. The integrating sphere unit according to claim 6, wherein a plurality of the probe pins is provided. The integrating sphere unit of claim 6, wherein the probe body comprises a terminal electrically connected to the probe pin. The integrating sphere unit of claim 8, wherein one end of the probe pin is connected to the terminal, and the other end of the probe pin protrudes into the insertion hole. The integrating sphere unit according to any one of claims 1 to 4, wherein the light receiving hole is circular. The integrating sphere unit according to any one of claims 1 to 4, wherein the insertion hole is circular. The integrating sphere unit according to any one of claims 1 to 4, wherein the light receiving hole and the insertion hole have a circular shape having the same diameter. The integrating sphere unit according to any one of claims 1 to 4, wherein a blocking member for blocking a part of light transmitted to the light receiving hole is provided between the light receiving hole and the probe card. The integrating sphere unit according to claim 13, wherein the blocking member can adjust the blocking amount of light. The integrating sphere unit of claim 13, wherein the blocking member includes a passage hole through which a part of the light passes, and the size of the passage hole can be adjusted. The integrating sphere unit according to any one of claims 1 to 4, further comprising a measuring raising and lowering unit for elevating the integrating sphere body. In the LED chip test apparatus for measuring the characteristics of the LED chip, A rotating member which supports the LED chip and rotates the LED chip to a test position for measuring characteristics of the LED chip; And Is installed next to the rotating member, including a test unit for measuring the characteristics of the LED chip in the test position, The test unit includes an integrating sphere unit for measuring the optical characteristics of the LED chip, The integrating sphere unit, An integrating sphere body having a hollow portion formed therein and having a light receiving hole for transmitting light to the hollow portion; And LED chip test apparatus is formed integrally with the integrating sphere body, the probe card having an insertion hole for transmitting light toward the light receiving hole. 18. The LED chip testing apparatus of claim 17, further comprising a transmission member integrally formed under the probe card and transmitting the light emitted from the light source to the hollow part. 19. The method of claim 18, wherein the transmission member includes a transmission surface for reflecting the light emitted from the light source toward the hollow portion, the transmission surface is formed with a through hole through which the light emitted by the light source is passed, the light source is LED chip test apparatus characterized in that located on the inner or lower side of the transfer surface. 20. The LED chip test apparatus according to claim 19, wherein the through hole is gradually reduced in size in the direction toward the light source from the integrating sphere body. 21. The LED chip testing apparatus according to claim 19 or 20, wherein the transfer surface is coated with a material having a constant high reflectance in the wavelength band of 200 nm to 1000 nm. The rotating member according to any one of claims 17 to 20, A plurality of support frames extending radially about the axis of rotation, and LED chip testing apparatus, characterized in that provided on each end side of the plurality of support frames, comprising a plurality of seating members for mounting the LED chip. 23. The LED chip testing apparatus according to claim 22, wherein all or part of the seating member is made of a material having a constant high reflectance in the wavelength band of 200 nm to 1000 nm. 23. The LED chip testing apparatus according to claim 22, wherein all or part of the seating member is made of a material having high conductivity and hardness. The method of claim 22, wherein all or part of the seating member is made of a material comprising any one of sapphire, quartz, glass, iron alloy, copper alloy, aluminum alloy, stainless steel, cemented carbide, gold, platinum LED chip testing device. 23. The LED chip testing apparatus according to claim 22, wherein all or part of the seating member is Teflon coated, mirror coated, gold plated, or platinum plated. 23. The LED chip testing apparatus according to claim 22, wherein the seating member comprises a seating body coupled to the rotating member, and a contact member in contact with the LED chip. 28. The LED chip testing apparatus according to claim 27, wherein the contact member is formed of sapphire, and a surface of the contact member facing the seating body is mirror coated. 21. The LED chip testing apparatus according to any one of claims 17 to 20, wherein the test unit further comprises a measuring raising and lowering unit for raising and lowering the integrating sphere unit. 21. The insertion hole according to any one of claims 17 to 20, wherein the probe card includes a probe pin in contact with a light source, and a probe body connected to the integrating sphere body and supporting the probe pin. LED chip test apparatus, characterized in that formed on the probe body. 31. The LED chip testing apparatus according to claim 30, wherein the probe pin is provided in plurality. 32. The LED chip testing apparatus of claim 30, wherein the probe body comprises a terminal electrically connected to the probe pin. 33. The LED chip testing apparatus according to claim 32, wherein one end of the probe pin is connected to the terminal, and the other end of the probe pin protrudes into the insertion hole. 21. The LED chip testing apparatus according to any one of claims 17 to 20, wherein the light receiving hole is circular. 21. The LED chip testing apparatus according to any one of claims 17 to 20, wherein the insertion hole is circular. 21. The LED chip testing apparatus according to any one of claims 17 to 20, wherein the light receiving hole and the insertion hole have a circular shape with the same diameter. 21. The LED chip testing apparatus according to any one of claims 17 to 20, wherein a blocking member is provided between the light receiving hole and the probe card to block a part of the light transmitted to the light receiving hole. 38. The LED chip testing apparatus according to claim 37, wherein the blocking member can adjust the blocking amount of light. 38. The LED chip testing apparatus of claim 37, wherein the blocking member includes a through hole through which a part of the light passes, and the size of the through hole can be adjusted. In the LED chip sorting apparatus for classifying the LED chip by measuring the characteristics of the LED chip, And a seating member on which the LED chip is seated, a loading position at which the LED chip is loaded on the seating member, a test position at which the LED chip is tested, and an unloading position at which the LED chip is unloaded from the seating member. A supply unit for rotating the seating member; A loading unit installed beside the supply unit and supplying an LED chip to be tested to the seating member in the loading position; A test unit installed beside the supply unit and measuring a characteristic of the LED chip at the test position; And It is installed next to the supply portion, and includes an unloading portion for collecting the LED chip tested from the seating member in the unloading position, The test unit includes an integrating sphere unit for measuring the optical characteristics of the LED chip, The integrating sphere unit, An integrating sphere body having a hollow portion formed therein and having a light receiving hole for transmitting light to the hollow portion; And LED chip sorting apparatus is formed integrally with the integrating sphere body, the probe card having an insertion hole for transmitting light toward the light receiving hole. 41. The LED chip sorting apparatus of claim 40, further comprising a transmitting member integrally formed under the probe card and transmitting the light emitted from the light source to the hollow part. 42. The method of claim 41, wherein the transmission member includes a transmission surface for reflecting the light emitted from the light source toward the hollow portion, the transmission surface is formed with a through hole through which the light emitted by the light source is passed, LED chip sorting apparatus which is located inside or below the transfer surface. 43. The LED chip sorting apparatus according to claim 42, wherein the through hole is gradually reduced in size in the direction toward the light source from the integrating sphere body. 44. The LED chip sorting apparatus according to claim 42 or 43, wherein the transfer surface is coated with a material having a constant high reflectance in the wavelength band of 200 nm to 1000 nm. 44. The apparatus of any one of claims 40 to 43, wherein the supply part includes a plurality of support frames extending radially about a rotation axis, and the seating members are respectively provided at end sides of the plurality of support frames. LED chip sorting apparatus, characterized in that. 46. The LED chip sorting apparatus according to claim 45, wherein all or part of the seating member is formed of a material having a high reflectance at a wavelength band of 200 nm to 1000 nm. 46. The LED chip sorting apparatus according to claim 45, wherein all or part of the seating member is made of a material having high conductivity and hardness. 46. The method of claim 45, wherein all or part of the seating member is made of a material comprising any one of sapphire, quartz, glass, iron alloy, copper alloy, aluminum alloy, stainless steel, cemented carbide, gold, platinum LED chip sorting device. 46. The LED chip sorting apparatus according to claim 45, wherein all or part of the seating member is Teflon coated, mirror coated, gold plated, or platinum plated. 46. The LED chip sorting apparatus according to claim 45, wherein the seating member includes a seating body coupled to the supply unit, and a contact member in contact with the LED chip. 51. The LED chip sorting apparatus according to claim 50, wherein the contact member is formed of sapphire, and a surface of the contact member facing the seating body is mirror coated. 44. The LED chip sorting apparatus according to any one of claims 40 to 43, wherein the test unit further includes a measuring raising and lowering unit for raising and lowering the integrating sphere unit. 44. The LED chip sorting apparatus according to any one of claims 40 to 43, wherein the unloading part is located on the opposite side of the loading part about the supply part. 44. The method of any one of claims 40 to 43, wherein the probe card comprises a probe pin in contact with a light source, and a probe body connected to the integrating sphere body and supporting the probe pin. LED chip sorting apparatus is formed on the probe body. 55. The LED chip sorting apparatus according to claim 54, wherein a plurality of the probe pins is provided. 55. The LED chip sorting apparatus of claim 54, wherein the probe body comprises a terminal electrically connected to the probe pin. 59. The LED chip sorting apparatus according to claim 56, wherein one end of the probe pin is connected to the terminal, and the other end of the probe pin protrudes into the insertion hole. 44. The LED chip sorting apparatus according to any one of claims 40 to 43, wherein the light receiving hole is circular. 44. The LED chip sorting apparatus according to any one of claims 40 to 43, wherein the insertion hole is circular. 44. The LED chip sorting apparatus according to any one of claims 40 to 43, wherein the light receiving hole and the insertion hole have a circular shape with the same diameter. The LED chip sorting apparatus according to any one of claims 40 to 43, wherein a blocking member is provided between the light receiving hole and the probe card to block a part of the light transmitted to the light receiving hole. 64. The LED chip sorting apparatus according to claim 61, wherein the blocking member can adjust the blocking amount of light. 63. The LED chip sorting apparatus of claim 61, wherein the blocking member includes a through hole through which a part of the light passes, and the size of the through hole can be adjusted.

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