KR20110052097A

KR20110052097A - Flexible printed circuit board, method of manufacturing the same, method of testing an object and probe unit having the same

Info

Publication number: KR20110052097A
Application number: KR1020090109005A
Authority: KR
Inventors: 송병학
Original assignee: 티에스씨멤시스(주)
Priority date: 2009-11-12
Filing date: 2009-11-12
Publication date: 2011-05-18

Abstract

PURPOSE: A flexible printed circuit board, manufacturing method thereof, testing method of an object, and probe unit are provided to function wires as a probe by selecting a section having pitch of electrode pads of an inspection target object. CONSTITUTION: An insulating substrate(112) has ductility. A wiring(114) is formed on the insulating substrate. The wirings have signal changed pitches in a longitudinal direction. The wiring pitches linearly change. The pitch of the wirings comprises sub pitches of the different multiplicity. A fixed block(174) is fixed to a base block(172).

Description

Flexible printed circuit board, method for manufacturing the same, method for inspecting an object using the same, and probe unit including the same {Flexible printed circuit board, method of manufacturing the same, method of testing an object and probe unit having the same}

Embodiments of the present invention relate to a flexible printed circuit board, a method of manufacturing the same, a method of inspecting an object using the same, and a probe unit including the same. More specifically, a flexible printed circuit board configured to be in contact with the electrode pads of the flat panel display panel for inspection of the flat panel, a method of manufacturing the same, a method of inspecting the flat panel using the same and the same It relates to a probe unit.

Liquid crystal display panel (hereinafter referred to as LCD panel), plasma display panel (hereinafter referred to as PDP panel) used as a panel of a general video display device, active matrix organic display panel A plurality of electrode pads for applying an electrical signal may be provided at an edge portion of the image display panel such as a light emitting diode display panel (hereinafter referred to as an AMOLED panel).

An inspection object such as the image display panel may be inspected by using a probe unit having a plurality of probes provided to contact the electrode pads. The general probe unit may include a base block, a circuit board disposed on a bottom surface of the base block, and a plurality of probes connected to the circuit board and configured to contact the electrode pads.

In addition, a separate mounting block for mounting the probes to the base block may be used. However, it is very difficult to precisely arrange and fix the probes to correspond to the electrode pads, and it is very difficult to replace damaged probes if the probes are damaged during the inspection process.

As a result, it is very difficult to reduce the manufacturing cost and the maintenance cost of the probe unit, and thus development of a new type of probe unit is required.

Embodiments of the present invention are to provide a flexible printed circuit board that can directly contact the electrode pads of the inspection object to simplify the structure of the probe unit and to reduce the manufacturing cost and maintenance cost of the probe unit.

Embodiments of the present invention have another object to provide a method for manufacturing a flexible printed circuit board as described above.

Embodiments of the present invention have another object to provide a method for inspecting an object using a flexible printed circuit board as described above.

Embodiments of the present invention have another object to provide a probe unit having a flexible printed circuit board as described above.

A flexible printed circuit board according to an aspect of the present invention for achieving the above object is in the longitudinal direction so as to correspond to the pitch of the insulating pad and the electrode pads formed on the insulating substrate and formed on the inspection object, respectively, It can include wires with varying pitches. The flexible printed circuit board may have a plurality of sections each corresponding to the pitches of the wirings, and the wirings of the sections selected from the sections are contacted with electrode pads of the inspection target to be inspected among the inspection objects. It can be preferably used in the process of electrically inspecting the inspection object.

According to an embodiment of the present invention, the pitches of the wires may be changed linearly.

According to another embodiment of the present invention, the pitches of the wires may be changed non-linearly.

According to another embodiment of the present invention, the pitches of the wirings in the respective sections may include a plurality of different sub pitches.

According to another embodiment of the present invention, the wirings may be composed of a plurality of groups, and the groups may be electrically connected to each other. For example, connection wirings may be formed on the second surface opposite to the first surface of the insulating substrate on which the wirings are formed to connect the wirings forming each of the groups to each other through the insulating substrate.

According to another embodiment of the present invention, second wirings connected to the connection wirings through the insulating substrate may be formed on the first surface of the insulating substrate.

According to another embodiment of the present invention, contact tips for contacting the electrode pads may be formed on the wires in the respective sections.

According to another aspect of the present invention for achieving the above another object, in the method of manufacturing a flexible printed circuit board in contact with the electrode pads of the inspection object to be electrically inspected among the inspection objects each having electrode pads, An insulating substrate may be provided, and then wirings having pitches that are changed in the longitudinal direction may respectively be formed on the insulating substrate so as to correspond to the pitches of the electrode pads formed on the inspection objects.

According to an embodiment of the present invention, the wirings may be formed of a plurality of groups, and the groups may be electrically connected to each other. For example, the interconnections may be formed on a first surface of the insulating substrate, and on the second surface opposite to the first surface, connection wirings connecting the wires forming each of the groups to each other through the insulating substrate. Can be formed simultaneously with the wirings.

According to another embodiment of the present invention, second wirings respectively connected to the connection wirings through the insulating substrate may be simultaneously formed on the first surface of the insulating substrate.

According to another aspect of the present invention for achieving the above another object, the flexible substrate is changed in the longitudinal direction to correspond to the pitch of the electrode pads formed on the insulating substrate and formed on the inspection objects, respectively A method of electrically inspecting one of the inspection objects by using a flexible printed circuit board including wirings having pitches and having a plurality of sections respectively corresponding to the pitches of the wirings. The wirings may be in contact with electrode pads of the inspection target to be inspected among the inspection objects, and then a test signal may be applied to the inspection object through the wirings to electrically inspect the inspection object.

According to an embodiment of the present invention, the remaining portion of the flexible printed circuit board disposed behind the selected section may be folded in a direction opposite to the direction in which the wires contact the electrode pads.

According to another embodiment of the present invention, the front end portion of the flexible printed circuit board disposed in front of the selected section may be folded in a direction opposite to the direction in which the wires contact the electrode pads.

According to another embodiment of the present invention, the front end portion of the flexible printed circuit board disposed in front of the selected section can be removed.

According to an embodiment of the present invention, the printed circuit board may be pressed by the elastic member so that the wires contact the electrode pads of the inspection object.

Probe unit according to another aspect of the present invention for achieving the above another object is a longitudinal direction so as to correspond to the pitch of the electrode pads formed on the insulating substrate and the insulating substrate having a flexible and formed on various inspection objects, respectively A flexible printed circuit board including interconnections having varying pitches and having a plurality of sections respectively corresponding to the pitches of the interconnections, and the sections corresponding to the pitches of the electrode pads of the inspected object to be inspected among the inspected objects. The flexible printed circuit board may include a block assembly to which the wires in the section selected from among the plurality of wires may contact the electrode pads.

According to an embodiment of the present invention, the wires may be composed of a plurality of groups, and the groups may be electrically connected to each other. For example, the flexible printed circuit board is formed on a second surface facing the first surface of the insulating substrate on which the wirings are formed and is connected to connect the wirings forming each of the groups to each other through the insulating substrate. The wirings may further include.

According to another embodiment of the present invention, the flexible printed circuit board may further include second wirings formed on the first surface of the insulating substrate and connected to the connection wirings through the insulating substrate, respectively.

According to an embodiment of the present invention, the block assembly includes a test block having a base block, a fixed block fixed to the base block, and a lower surface mounted to the fixed block and to which a selected section of the flexible printed circuit board is attached. It may include.

According to an embodiment of the present invention, the fixing block may have a side on which the inspection block is mounted and a protrusion formed on an upper portion of the side, and the block assembly may move the inspection block in a vertical direction. A linear motion guide for mounting to the side of the, and disposed between the protrusion of the inspection block and the fixed block and may further include an elastic member for providing an elastic restoring force in the vertical direction to the inspection block.

According to another embodiment of the present invention, the block assembly includes a base block, a fixed block fixed to the base block, an inspection block mounted on the fixed block, and a lower surface of the inspection block and attached to the flexible printed circuit. It may have a lower surface to which the selected section of the substrate is attached and may include an elastic block for contacting the wires of the selected section with the electrode pads of the inspection object.

According to another embodiment of the invention, the block assembly is a base block, a test block fixed to the base block, a lower portion attached to the lower surface of the test block and the selected section of the flexible printed circuit board is attached It may include an elastic block having a surface and for contacting the wires of the selected section with the electrode pads of the inspection object.

According to an embodiment of the present invention, the flexible printed circuit board may be attached to the lower surface of the inspection block or the elastic block such that the selected section is adjacent to the front edge of the lower surface of the inspection block or the elastic block.

According to an embodiment of the present invention, the remaining portion of the flexible printed circuit board disposed behind the selected section is folded in a direction opposite to the direction in which the wires contact the electrode pads and is located on the front side of the inspection block. Can be attached.

According to another embodiment of the present invention, the front end portion of the flexible printed circuit board disposed in front of the selected section is folded in the opposite direction to the direction in which the wires contact the electrode pads and is located on the front side of the inspection block. Can be attached.

According to an embodiment of the present invention, the base block may be formed with a slit through which the flexible printed circuit board passes.

According to an embodiment of the present invention, alignment marks for alignment with the front edge of the lower surface of the inspection block or the elastic block may be formed in sections of the flexible printed circuit board.

According to another embodiment of the present invention, an alignment mark for aligning the flexible printed circuit board may be formed on a lower surface of the inspection block or the elastic block, and sections of the flexible printed circuit board may include the inspection block or Alignment marks corresponding to the alignment marks of the elastic block may be formed, respectively.

According to the embodiments of the present invention as described above, the flexible printed circuit board may include wires having pitches that are changed in the longitudinal direction so as to correspond to the pitches of the electrode pads formed on the inspection objects, respectively. There may be a plurality of sections each corresponding to the pitches.

Among the sections of the flexible printed circuit board, a section having the same pitch as that of the electrode pads of the object to be inspected may be selected, and the selected section may be formed on the lower surface of the inspection block for contact with the electrode pads. Can be attached. That is, the wires of the selected section may function as probes for inspecting the object.

Since the wirings of the flexible printed circuit board have a plurality of pitches as described above, one of the sections may be selected and used according to the electrode pad pitch of the object to be inspected. Since one flexible printed circuit board may be commonly used to inspect various types of inspection objects as described above, a manufacturing process of the probe unit may be greatly simplified, and a manufacturing cost of the probe unit may be greatly reduced. .

In addition, if the flexible printed circuit board is damaged, it can be easily replaced, so that the cost of maintenance of the probe unit can be greatly reduced.

The invention is now described in more detail with reference to the accompanying drawings showing embodiments of the invention. However, the present invention should not be construed as limited to the embodiments described below, but may be embodied in various other forms. The following examples are provided to fully convey the scope of the invention to those skilled in the art, rather than to allow the invention to be fully completed.

When an element is described as being disposed or connected on another element or layer, the element may be placed or connected directly on the other element, and other elements or layers may be placed therebetween. It may be. Alternatively, where one element is described as being directly disposed or connected on another element, there may be no other element between them. Terms such as first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or parts, but the items are not limited by these terms. Will not.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Also, unless stated otherwise, all terms including technical and scientific terms have the same meaning as would be understood by one of ordinary skill in the art having ordinary skill in the art. Such terms, such as those defined in conventional dictionaries, will be construed as having meanings consistent with their meanings in the context of the related art and description of the invention, and ideally or excessively intuitional unless otherwise specified. It will not be interpreted.

Embodiments of the invention are described with reference to cross-sectional illustrations that are schematic illustrations of ideal embodiments of the invention. Accordingly, changes from the shapes of the illustrations, such as changes in manufacturing methods and / or tolerances, are those that can be expected. Accordingly, embodiments of the invention are not to be described as limited to the particular shapes of the areas described as the illustrations, but include deviations in the shapes, and the areas described in the figures are entirely schematic and their shapes. Are not intended to describe the precise shape of the region nor are they intended to limit the scope of the invention.

1 is a schematic side view for explaining a probe unit according to an embodiment of the present invention, Figure 2 is a schematic front view for explaining the probe unit of FIG.

1 and 2, the probe unit 100 according to an embodiment of the present invention may be used to contact the test object and electrically inspect the object. For example, it may be used for inspection of the image display panel 10 such as an LCD panel, a PDP panel, an AMOLED panel, and the like. In particular, the electronic device may be configured to apply an electrical signal in contact with the electrode pads 12 of the image display panel 10.

The probe unit 100 may include a flexible printed circuit board 110 and a block assembly 170 on which the flexible printed circuit board 110 is mounted.

The flexible printed circuit board 110 may include a flexible insulating substrate 112 and wirings 114 formed on the insulating substrate 112. The wirings 114 may have a pitch P2 (see FIG. 3) corresponding to the pitch P1 of the electrode pads 12 of the image display panel 10. In particular, for inspection of various types of image display panels, pitches P2 changed in the length direction of the wirings 114 may correspond to the pitches of electrode pads of each of the image display panels. The test signal may be transmitted to the image display panel 10 by directly contacting the electrode pads 12 of the image display panel 10.

FIG. 3 is a schematic diagram illustrating an unfolded form of the flexible printed circuit board of FIG. 1.

Referring to FIG. 3, the flexible printed circuit board 110 may have a plurality of sections 110A, 110B, 110C, and 110D corresponding to the pitches P2 of the interconnections 114. The pitches P2 of the teeth 114 may vary linearly. The flexible printed circuit board 110 may be preferably used when the electrode pads of each of the image display panels have one pitch, that is, spaced apart at regular intervals.

For example, the pitches P2 of the wirings 114 may increase linearly from the front end to the rear end of the flexible printed circuit board 110 as shown. Here, the portions of the wiring 114 of the section having the pitch P1 of the electrode pads 12 of the image display panel 10 to be inspected and the pitch P2 corresponding to the image display panels are included in the image. In order to inspect the display panel 10, the electrode pads 12 of the image display panel 10 may be directly contacted. Meanwhile, a method of directly contacting the wires 114 with the electrode pads 12 will be described later.

4 to 8 are schematic diagrams for describing other examples of the flexible printed circuit board illustrated in FIG. 3.

Referring to FIG. 4, the illustrated flexible printed circuit board 120 may have a plurality of pitches P2 that are changed non-linearly in the longitudinal direction of the wirings 124 formed on the insulating substrate 122. In addition, the pitches P2 may have a plurality of sections 120A, 120B, 120C, and 120D. That is, in each of the sections 120A, 120B, 120C, and 120D, the pitches P2 of the wires 124 may be different from each other, and the sections 120A, 120B, 120C, and 120D may be examined. The electrode pad pitch P1 of the display panel 10 may be selectively used.

The flexible printed circuit boards 110 and 120 as shown in FIGS. 3 and 4 may be used when the inspection object has the electrode pads 12 regularly arranged. That is, the electrode pads 12 of the image display panel 10 to be inspected may be used when the interval between the electrode pads 12 is regular. In this case, the wirings 114 and 124 of the flexible printed circuit boards 110 and 120 may have pitches P1 and P2 that increase or decrease at a predetermined ratio, and the image display panel to be inspected ( Since the intervals between the electrode pads 12 of 10 are constant, even if there is no design information of the image display panels 10, that is, the arrangement of the electrode pads 12 formed in the image display panels 10 is unknown. Also in the flexible printed circuit board (110, 120) can be manufactured.

As described above, the flexible printed circuit boards 110 and 120 including the wirings 114 and 124 having the pitches P1 and P2 that increase or decrease at a constant rate are irrespective of the design information about the inspection objects. Since it can be manufactured, it is possible to simplify the manufacturing process of the flexible printed circuit boards 110 and 120, thereby reducing the manufacturing cost, and also to quickly respond to a plurality of inspection objects having different pitches. have.

5 and 6, the illustrated flexible printed circuit boards 130 and 140 may include a plurality of wirings 134 and 144 formed on the insulating substrates 132 and 142, and a plurality of sections. It may have the (130A, 130B, 130C, 130D, 140A, 140B, 140C, 140D). In each of the sections 130A, 130B, 130C, 130D, 140A, 140B, 140C, and 140D, the pitches of the wires 134 and 144 may include different sub pitches P3, P4, and P5.

For example, the first, second and third sub pitches P3, P4, and P5 may be different from each other in the first period 130A and 140A, and the first, second and third sub pitches may be different. P3, P4, and P5 may be changed linearly or nonlinearly in the length direction of the wires 134 and 144.

The flexible printed circuit boards 130 and 140 may be used when the image display panel 10 to be inspected has electrode pads 12 having irregular or multiple sub pitches. That is, even when the electrode pad pitch P1 of the image display panel 10 is not constant, the arrangement form of the wires 134 and 144 may be determined according to the arrangement form of the electrode pads 12.

The flexible printed circuit boards 130 and 140 as shown in FIGS. 5 and 6 may be used when the test object has electrode pads 12 arranged irregularly. That is, the electrode pads 12 of the image display panel 10 to be inspected may be used when the electrode pads 12 are irregular, that is, the intervals between the electrode pads 12 are not constant. In this case, the wirings 134 and 144 of the flexible printed circuit boards 130 and 140 may be formed to have different pitches corresponding to the irregular electrode pads 12 of the image display panels 10. . That is, the flexible printed circuit boards 130 and 140 previously receive design information of the electrode pads 12 of the image display panels 10, and use the received design information to display wiring lines in each section. 134 and 144 may be manufactured to have different pitches or irregularly varying pitches.

As described above, even when the test objects have electrode pads 12 arranged irregularly, the flexible printed circuit boards 130 and 140 may be commonly used for various test objects by using design information of the test objects. Manufacturing is possible. Therefore, the manufacturing process of the flexible printed circuit boards 130 and 140 may be simplified and the manufacturing cost may be reduced. In addition, the flexible printed circuit boards 130 and 140 may be quickly responded to various inspection objects.

Referring to FIG. 7, the illustrated flexible printed circuit board 150 may include a plurality of wires 154 formed on the insulating substrate 152, and the plurality of sections 150A, 150B, 150C, and 150D. May have The wires 154 may be formed of a plurality of groups, and the wires 154 constituting each of the groups may be electrically connected to each other. For example, the wires 154 constituting the groups may be connected to each other by the connection wires 156.

The method of forming the connection lines 156 will be described in detail later. On the other hand, as shown, although the wires 154 have a pitch that varies linearly, wires of the type shown in FIGS. 4 to 6 may be used in place of the wires 154. .

Referring to FIG. 8, the illustrated flexible printed circuit board 160 may include a plurality of wires 164 formed on the insulating substrate 162, and a plurality of wires 164 corresponding to the pitch change of the wires 164. May have intervals 160A, 160B, 160C, and 160D.

Contact tips 166 for contacting the electrode pads 12 of the image display panel 10 may be formed on the wires 164 positioned in the respective sections 160A, 160B, 160C, and 160D, respectively. have. The contact tips 166 may be provided to facilitate electrical connection between the wires 164 and the electrode pads 12. That is, the contact tips 166 may be disposed on wiring portions corresponding to the electrode pads 12 of the image display panel 10 to be inspected.

The contact tips 166 may be formed using a solder material. For example, the contact tips 166 may be formed through a squeeze method using a mask and solder paste exposing the wiring portions. However, the scope of the present invention will not be limited by the method of forming the contact tips 166.

On the other hand, as shown, although the wires 164 have a pitch that varies linearly, wires of the type shown in FIGS. 4 to 6 may be used in place of the wires 164. . Although not shown, the wires 164 may be formed of a plurality of groups, and the wires 164 forming the groups may be connected to each other through connection wires as shown in FIG. 7.

Referring back to FIGS. 1 and 2, the block assembly 170 includes the flexible printed circuit corresponding to the pitch P1 of the electrode pads 12 of the inspection object to be inspected, that is, the image display panel 10. The flexible printed circuit board 110 may be attached to allow the wires 114 of a section selected from the sections 110A, 110B, 110C, and 110D of the substrate 110 to directly contact the electrode pads 12. have.

The block assembly 170 is mounted on a base block 172, a fixed block 174 fixed to the base block 172, and the fixed block 174, and selected sections of the flexible printed circuit board 110 are attached thereto. Inspection block 176 having a bottom surface 176A that may be included.

The fixing block 174 may be fixed to a front end of the base block 172 by a plurality of bolts (not shown), and the inspection block 176 may be mounted and disposed in a vertical direction 174A. And a protrusion 174B formed in a horizontal direction from the top of the side surface 174A.

The inspection block 176 may be mounted to be movable in a vertical direction on the side surface 174A of the fixing block 174. For example, as illustrated, the inspection block 176 may be mounted to be movable in a vertical direction to the side 174A of the fixed block 174 by the linear motion guide 178. In addition, an elastic member 180 may be disposed between the inspection block 176 and the protrusion 174B of the fixing block 174. The elastic member 180 has wiring lines 114 of the flexible printed circuit board 110 attached to the lower surface 176A of the inspection block 176 to the electrode pads 12 of the image display panel 10. It can be used to provide elastic restoring force in the vertical direction so as to be in close contact with it.

The fixing block 174 and the inspection block 176 may extend in the direction in which the electrode pads 12 of the image display panel 10 are arranged.

A coil spring may be used as the elastic member 180. However, unlike the above, a block made of an elastic material, for example, rubber or a polymer material may be used in place of the elastic member 180.

9 and 10 are schematic side views for describing probe units according to other embodiments of the present invention.

As shown in FIG. 1, although the selected section of the flexible printed circuit board 110 is attached to the lower surface 176A of the test block 176, as shown in FIG. An elastic block 202 may be disposed on the lower surface, and a selected section of the flexible printed circuit board 110 may be attached on the lower surface 202A of the elastic block 202.

The elastic block 202 may be made of rubber or a polymer material, and may extend in the direction in which the electrode pads 12 of the image display panel 10 are arranged. The elastic block 202 is a section of the flexible printed circuit board 110 such that the wirings 114 of the flexible printed circuit board 110 closely contact the electrode pads 12 of the image display panel 10. It can be used to pressurize.

In addition, as shown in FIG. 10, the block assembly 210 may be disposed on the inspection block 214 fixed to the base block 212 and the front end of the base block 212 and the lower surface of the inspection block 214. It may include an attached elastic block 216. That is, the fixed block 174 and the test block 200 shown in FIG. 9 may be integrated into one test block 214 as shown in FIG. 10.

Referring again to FIGS. 1 and 2, the selected section of the flexible printed circuit board 110 is adjacent to the inspection block 176 such that the selected section of the inspection block 176 is adjacent to the front edge 176B of the inspection block 176 (see FIG. 12). 176A may be attached to the bottom surface 176A. In particular, as shown in FIG. 3, an alignment mark 116 for alignment with the front edge 176B of the bottom surface 176A of the inspection block 176 on the insulating substrate 112 of the flexible printed circuit board 110. ) May be formed.

11 is a schematic side view for explaining a method of attaching a flexible printed circuit board to an inspection block, and FIG. 12 is a schematic bottom view for explaining a method for attaching a flexible printed circuit board to an inspection block. FIG. 13 is a schematic bottom view illustrating another example of a method of attaching a flexible printed circuit board to an inspection block. FIG.

Referring to FIGS. 11 and 12, the second section (not shown) in the flexible printed circuit board 110 having the first, second, third, and fourth sections 110A, 110B, 110C, and 110D as shown in FIG. When 110B is selected, the remaining part of the flexible printed circuit board 110 disposed behind the selected second section 110B, that is, the remaining section including the third section 110C and the fourth section 110D, The wires 114 of the second section 110B may be folded in the opposite direction, that is, upward, with respect to the direction in which the electrode pads 12 are in contact with each other, and may be attached to the front side 176C of the inspection block 176. have.

In this case, the first and second sections 110A and 110B may have the alignment marks 116 corresponding to the second sections 110B to coincide with the front edge 176B of the lower surface 176A of the inspection block 176. It may be attached to the bottom surface 176A of the inspection block 176.

Meanwhile, even when the flexible printed circuit board 110 is attached to the elastic blocks 202 and 216 illustrated in FIGS. 9 and 10, the front edges of the lower surfaces of the elastic blocks 202 and 216 are similar to the above. Can be attached.

Referring to FIG. 13, unlike the above, an alignment mark 176D corresponding to the alignment mark 116 of the flexible printed circuit board 110 may be formed on the lower surface 176A of the inspection block 176. have. In this case, the flexible printed circuit board 110 is aligned with the inspection block 176 using the alignment mark 176D of the inspection block 176 and the alignment mark 116 of the flexible printed circuit board 110. And may be attached.

Meanwhile, alignment marks (not shown) may also be formed on the elastic blocks 202 and 216 illustrated in FIGS. 9 and 10, and the flexible printed circuit board 110 may include the elastic members 202 and 216. ) May be attached to the lower surfaces of the elastic members 202 and 216.

Referring back to FIG. 1, the flexible printed circuit board 110 may be electrically connected to a tester that provides an image signal. In addition, a driving circuit device (such as a TAP IC or an integrated IC) may be provided on the flexible printed circuit board 110 to receive the image signal and provide a test signal or a driving signal to the electrode pads 12. May be arranged.

The rear end of the flexible printed circuit board 110 may be attached to a mount member 182 positioned on the base block 172. Although not shown in detail, the rear end of the flexible printed circuit board 110 may be electrically connected to the tester.

14 to 16 are schematic cross-sectional views for describing a method of manufacturing the flexible printed circuit board illustrated in FIG. 1.

According to an embodiment of the present invention, the method of manufacturing the flexible printed circuit board 110 may include providing an insulated flexible substrate 112 and forming the wirings 114 on the insulated substrate 112. It may comprise the step of forming.

In particular, a polyimide substrate may be used as the flexible insulating substrate 112, and the wires 114 may be formed using processes such as vacuum deposition, electroplating, and etching.

For example, a seed layer (not shown) may be formed on the insulating substrate 112 using a vacuum deposition method, and then conductive on the seed layer using an electroplating method, as shown in FIG. 14. A conductive layer 118A made of a material may be formed. A photosensitive film (not shown) may be formed on the conductive layer 118A, and the photosensitive pattern 118B may be formed on the conductive layer 118A by performing exposure and development processes as illustrated in FIG. 15. As shown in FIG. 16, the wirings 114 may be formed on the insulating substrate 112 by performing an etching process using the photosensitive pattern 118B as an etching mask. After forming the interconnections 114, the photosensitive pattern 118B may be removed by an ashing and / or strip process.

17 to 20 are schematic plan views and cross-sectional views illustrating a method of manufacturing the flexible printed circuit board illustrated in FIG. 7.

17 and 18, a polyimide substrate may be provided as the flexible insulating substrate 152. Through holes 152C may be formed in the insulating substrate 152. The through holes 152C may be formed using a computer numerical control (CNC) drill or an ultraviolet laser drill.

The through holes 152C may be formed to oppose the wirings 154 formed on the first surface 152A of the insulating substrate 152 and the first surface 152A of the insulating substrate 152. It can be used to connect the connection wires 156 formed on the two surface 152B to each other.

19 and 20, a seed layer (not shown) may be formed on the insulating substrate 152 using a vacuum deposition method, and subsequently formed of a conductive material by an electroplating method using the seed layer. A conductive layer (not shown) may be formed.

Although not shown, a photosensitive film (not shown) may be formed on the conductive layer, and then photosensitive patterns (not shown) may be formed on the conductive layer by performing exposure and development processes. Subsequently, by performing an etching process using the photosensitive patterns as an etching mask, the wirings 154 and the connection wirings (1) on the first surface 152A and the second surface 152B of the insulating substrate 152 ( 156 can be formed simultaneously. After forming the interconnections 154 and the interconnections 156, the photosensitive patterns may be removed by an ashing and / or strip process.

As illustrated, the wires 154 and the connection wires 156 may be connected to each other by a conductive layer 155 formed on inner surfaces of the through holes 152C. That is, the conductive layer 155 formed on the inner surfaces of the through holes 152C may function as a via contact connecting the wires 154 and the connection wires 156 to each other.

In particular, the wires 154 may be divided into a plurality of groups by the connection wires 156, and the wires 154 constituting each of the groups may be divided by each of the connection wires 156. Can be connected to each other. Signals for driving the image display panel, for example, R1, G1, B1, R2, G2, and B2 signals, may be applied to each of the groups. To this end, the wires 154 may be connected to a driving circuit element or a tester that provides the test signals.

FIG. 21 is a schematic plan view illustrating another example of the flexible printed circuit board of FIG. 3.

Referring to FIG. 21, second wirings 158 may be formed on the first surface 152A of the flexible printed circuit board 152. The second wires 158 may be respectively connected to the connection wires 156 through the insulating substrate 152, and test signals applied to the image display panel 10 may be connected to the second wires 158. ) May be applied. That is, the test signals may be applied to the image display panel 10 through the second wires 158, the connection wires 156, and the first wires 154, and the second wires 158. ) May be connected to a driving circuit element or a tester providing the test signals.

In addition, terminals 159 connected to the second wires 158 may be formed on the first surface 152A. The terminals 159 may be used for connection with the tester.

The first wires 154, the connection wires 156, and the second wires 158 may be formed in a similar manner as described above with reference to FIGS. 19 and 20. That is, the first wires 154, the connection wires 156, and the second wires 158 may be simultaneously formed by vacuum deposition, electroplating, photosensitive film formation, exposure, development, and etching processes.

FIG. 22 is a schematic side view for explaining a probe unit according to another embodiment of the present invention, and FIG. 23 is a schematic side view for explaining a state in which the flexible printed circuit board shown in FIG. 22 is attached to an inspection block. .

Referring to FIG. 22, the probe unit 300 according to another embodiment of the present invention may include a flexible printed circuit board 310 and a block assembly 320 to which the flexible printed circuit board 310 is attached. .

The flexible printed circuit board 310 is formed on a flexible insulating substrate 312 and the insulating substrate 312 and the pitch is changed in the longitudinal direction to correspond to the pitch of the electrode pads formed on the various inspection objects, respectively And wirings 314 having the plurality of wiring lines, and may have a plurality of sections respectively corresponding to the pitches of the wirings 314. Since the flexible printed circuit board 310 is the same as described above with reference to FIGS. 1 to 21, further detailed description thereof will be omitted.

The block assembly 320 includes a base block 322, a fixed block 324 fixed to the base block 322, and an inspection block 326 mounted to be movable in a direction perpendicular to the fixed block 324. The selected section of the flexible printed circuit board 310 may be attached to the lower surface 326A of the inspection block 326.

The flexible printed circuit board 310 may be partially attached to the test block 326 and may extend rearward from the test block 326. At this time, the base block 322 may be formed with a slit through which the flexible printed circuit board passes.

In particular, a selected section of the flexible printed circuit board 310 may be attached to the lower surface 326A of the inspection block 326. The selected section may be aligned with respect to the front edge of the bottom surface 326A of the inspection block 326. At this time, an alignment mark as shown in FIGS. 3 to 8 may be used. Unlike the above, a separate alignment mark may be provided on the lower surface 326A of the inspection block 326 to align the selected section of the flexible printed circuit board 310.

Referring to FIG. 23, the third section 310C is selected in the flexible printed circuit board 310 having the first, second, third, and fourth sections 310A, 310B, 310C, and 310D as shown. In this case, the front end portions of the flexible printed circuit board 310 disposed in front of the selected third section 310C, that is, the first section 310A and the second section 310B may be formed of the third section 310C. The front side 326B of the inspection block 326 is folded in the opposite direction, ie, upward, with respect to the direction in which the wirings 314 are in contact with the inspection object, for example, the electrode pads 12 of the image display panel 10. ) May be attached.

In this case, the third and fourth sections 310C and 310D may have an alignment mark (not shown) of the third section 310C at the front edge of the lower surface 326A of the inspection block 326 or the inspection block 326. It may be aligned and attached to the bottom surface 326A of the inspection block 326 based on the alignment mark formed on the bottom surface 326A of the.

FIG. 24 is a schematic side view for explaining another example of attaching the flexible printed circuit board illustrated in FIG. 22 to an inspection block.

Referring to FIG. 24, when the third section 310C is selected in the flexible printed circuit board 310 having the first, second, third, and fourth sections 310A, 310B, 310C, and 310D, the third section 310C is selected. A front end portion of the flexible printed circuit board 310 disposed in front of the selected third section 310C, that is, the first section 310A and the second section 310B, may be cut and removed. That is, since the first and second sections 310A and 310B may be portions that are not necessary, the flexible portions may be generated when the flexible printed circuit board 310 is folded as shown in FIG. 22 by removing them. Damage to the printed circuit board 310 may be prevented.

As shown, the flexible printed circuit board 310 is attached to the lower surface 326A of the inspection block 326, but the elastic block as shown in FIG. 9 is disposed on the lower surface of the inspection block 326. May be attached. In addition, as illustrated in FIG. 10, an integrated test block may be mounted to the fixed block 322.

A method of inspecting an object using the flexible printed circuit board 310 as described above will be described in detail with reference to the accompanying drawings.

According to an embodiment of the present invention, the inspection method may check the wirings 114 of the sections selected from the sections 110A, 110B, 110C, and 110D of the flexible printed circuit board 110 to be inspected, for example, Contacting the electrode pads 12 of the image display panel 10 to be inspected among the image display panels, and testing the wires 114 to electrically inspect the image display panel 10. The method may include applying a signal to the image display panel 10.

The remaining portion of the flexible printed circuit board 10 disposed behind the selected section of the flexible printed circuit board 10 is opposite to the direction in which the wires 114 contact the electrode pads 12. It may be folded upward as shown in FIG. 11, and the remaining portion may be attached to the front side 176C of the inspection block 176.

According to another embodiment of the present invention, the front end portion of the flexible printed circuit board 310 disposed in front of the selected section of the flexible printed circuit board 310 has wiring lines 314 connected to the electrode pads 12. 22 may be folded upward as shown in FIG. 22, the shear site may be attached to the front side 326B of the inspection block 326.

According to another embodiment of the present invention, the front end portion of the flexible printed circuit board 310 disposed in front of the selected section of the flexible printed circuit board 310 may be removed by cutting as shown in FIG. have.

The wirings 114 in the selected section of the flexible printed circuit board 110 may directly contact the electrode pads 12 of the image display panel 10. In particular, the wires 114 of the selected section may be pressed downward by the elastic member 180 and / or the elastic blocks 202 and 216 as shown in FIGS. 1, 9, and 10. Accordingly, a stable connection may be made between the wirings 114 of the selected section and the electrode pads 14 of the image display panel 10.

According to the embodiments of the present invention as described above, the flexible printed circuit board has pitches that are changed in the longitudinal direction so as to correspond to the pitches of the test objects, for example, electrode pads formed on various image display panels. The wires may include wires and have a plurality of sections respectively corresponding to the pitches of the wires.

Among the sections of the flexible printed circuit board, a section having a pitch equal to that of the electrode pads of the image display panel to be inspected may be selected, and the selected section may be a lower portion of the inspection block for contact with the electrode pads. It can be attached to the face. That is, the wires of the selected section may function as probes for inspecting the image display panel.

While the foregoing has been described with reference to preferred embodiments of the present invention, those skilled in the art will be able to variously modify and change the present invention without departing from the spirit and scope of the invention as set forth in the claims below. It will be appreciated.

1 is a schematic side view for explaining a probe unit according to an embodiment of the present invention.

FIG. 2 is a schematic front view for describing the probe unit of FIG. 1.

11 is a schematic side view for explaining a method of attaching a flexible printed circuit board to an inspection block.

12 is a schematic bottom view illustrating a method of attaching a flexible printed circuit board to an inspection block.

FIG. 13 is a schematic bottom view illustrating another example of a method of attaching a flexible printed circuit board to an inspection block. FIG.

22 is a schematic side view for explaining a probe unit according to another embodiment of the present invention.

FIG. 23 is a schematic side view for explaining a state in which the flexible printed circuit board illustrated in FIG. 22 is attached to an inspection block.

10: image display panel 12: electrode pad

100: probe unit 110: flexible printed circuit board

112: insulated substrate 114: wiring

116: alignment mark 118: elastic member

120, 130, 140, 150, 160: flexible printed circuit board

170: block assembly 172: base block

174: fixed block 176: inspection block

178: linear motion guide 180: elastic member

202, 216: elastic block

Claims

An insulating substrate having a ductility; And

Wirings formed on the insulating substrate and having pitches that are changed in a length direction so as to correspond to pitches of electrode pads formed on inspection objects, respectively,

Electrically inspecting the inspection object by contacting the electrode pads of the inspection object to be inspected among the inspection objects with a plurality of sections each corresponding to the pitches of the interconnections. Flexible printed circuit boards used in

The flexible printed circuit board of claim 1, wherein the pitches of the wirings are linearly changed.

The flexible printed circuit board of claim 1, wherein the pitches of the wirings are changed non-linearly.

The flexible printed circuit board of claim 1, wherein the pitches of the wirings in the respective sections include a plurality of sub pitches different from each other.

The flexible printed circuit board of claim 1, wherein the wiring lines comprise a plurality of groups, and the groups are electrically connected to each other.

6. The apparatus of claim 5, further comprising connecting wires formed on a second surface opposite the first surface of the insulating substrate on which the wirings are formed and for connecting the wirings forming each of the groups to each other through the insulating substrate. Flexible printed circuit board, characterized in that.

The flexible printed circuit board of claim 6, further comprising second wirings formed on a first surface of the insulating substrate and connected to the connection wirings through the insulating substrate, respectively.

The flexible printed circuit board of claim 1, wherein contact tips for contacting the electrode pads are formed on the wires in the respective sections.

In the method of manufacturing a flexible printed circuit board which is in contact with the electrode pads of the inspection object to be electrically inspected among the inspection objects each having electrode pads,

Providing a flexible insulating substrate; And

Forming interconnections having pitches that are changed in the longitudinal direction on the insulating substrate so as to correspond to the pitches of the electrode pads formed on the inspection objects, respectively.

The method of claim 9, wherein the wirings are formed of a plurality of groups, and the groups are electrically connected to each other.

12. The connection of claim 10, wherein the wirings are formed on a first surface of the insulating substrate and connect the wirings forming each of the groups with each other through the insulating substrate on a second surface opposite to the first surface. And forming wirings simultaneously with the wirings.

The flexible printed circuit board of claim 11, wherein second wirings, which are respectively connected to the connection wirings through the insulation substrate, are simultaneously formed on the first surface of the insulation substrate. Way.

A wiring board having a flexible insulating substrate and wirings formed on the insulating substrate and having pitches that are changed in a length direction so as to correspond to pitches of the electrode pads formed on the inspection objects, respectively, and corresponding to the pitches of the wirings, respectively. In the method for electrically inspecting one of the inspection object using a flexible printed circuit board having a plurality of sections,

Contacting wires of a section selected from the sections with electrode pads of a test target to be tested among the test targets; And

And applying a test signal to the inspection object through the wires to electrically inspect the inspection object.

The method of claim 13, wherein the remaining portion of the flexible printed circuit board disposed behind the selected section is folded in a direction opposite to the direction in which the wires contact the electrode pads.

The method of claim 13, wherein the front end portion of the flexible printed circuit board disposed in front of the selected section is folded in a direction opposite to the direction in which the wires contact the electrode pads.

The method of claim 13, wherein the front end portion of the flexible printed circuit board disposed in front of the selected section is removed.

The method of claim 13, wherein the printed circuit board is pressed using an elastic member to bring the wires into contact with the electrode pads of the test object.

And wirings having a flexible insulating substrate and pitches formed on the insulating substrate and having pitches that are changed in the longitudinal direction to correspond to the pitches of the electrode pads formed on the various inspection objects, respectively. A flexible printed circuit board having a plurality of sections; And

And a block assembly to which the flexible printed circuit board is attached such that wirings in a section selected from among the sections corresponding to the pitch of the electrode pads of the inspected object to be inspected among the inspected objects are in contact with the electrode pads. Probe unit characterized in that.

19. The probe unit of claim 18, wherein the wires are formed of a plurality of groups, and the groups are electrically connected to each other.

The flexible printed circuit board of claim 19, wherein the flexible printed circuit board is formed on a second surface facing the first surface of the insulating substrate on which the wirings are formed, and for connecting the wirings forming each of the groups to each other through the insulating substrate. Probe unit further comprises a connection wiring.

21. The probe unit of claim 20, wherein the flexible printed circuit board further comprises second wirings formed on a first surface of the insulating substrate and connected to the connection wirings through the insulating substrate, respectively.

The method of claim 18, wherein the block assembly,

Base block;

A fixed block fixed to the base block; And

And a test block mounted to the fixed block and having a lower surface to which a selected section of the flexible printed circuit board is attached.

The method of claim 22, wherein the fixing block has a side on which the inspection block is mounted and a protrusion formed on the upper side,

The block assembly,

A linear motion guide for mounting the inspection block on a side of the fixed block to be movable in a vertical direction; And

And an elastic member disposed between the inspection block and the protrusion of the fixed block and providing an elastic restoring force in a direction perpendicular to the inspection block.

The method of claim 18, wherein the block assembly,

Base block;

A fixed block fixed to the base block;

An inspection block mounted to the fixed block; And

And an elastic block attached to a lower surface of the inspection block and having a lower surface to which a selected section of the flexible printed circuit board is attached and for contacting the wirings of the selected section with the electrode pads of the inspection object. Probe unit.

The method of claim 18, wherein the block assembly,

Base block;

An inspection block fixed to the base block; And

26. The flexible printed circuit board of claim 22, 24 or 25, wherein the flexible printed circuit board is formed of the test block or the elastic block such that the selected section is adjacent to the front edge of the lower surface of the test block or the elastic block. Probe unit, characterized in that attached to the lower surface.

27. The method of claim 26, wherein the remaining portion of the flexible printed circuit board disposed behind the selected section is attached to the front side of the test block while folding the wires in a direction opposite to the direction in which the wires contact the electrode pads. Probe unit characterized in that.

27. The method of claim 26, wherein the front end portion of the flexible printed circuit board disposed in front of the selected section is attached to the front side of the inspection block folded in the opposite direction to the direction in which the wires contact the electrode pads. Probe unit characterized in that.

27. The probe unit of claim 26, wherein a front end portion of the flexible printed circuit board disposed ahead of the selected section is removed.

30. The probe unit of claim 29, wherein a slit through which the flexible printed circuit board passes is formed in the base block.

26. An alignment mark according to any one of claims 22, 24, and 25, wherein sections of the flexible printed circuit board are formed with alignment marks for alignment with the front edge of the lower surface of the inspection block or the elastic block, respectively. Probe unit, characterized in that.

26. An alignment mark according to any one of claims 22, 24, and 25, wherein an alignment mark for aligning the flexible printed circuit board is formed on a lower surface of the inspection block or the elastic block.

And a plurality of alignment marks corresponding to the alignment marks of the test block or the elastic block in sections of the flexible printed circuit board.