KR20110050363A - Glass fiber-reinforced resin film and method of cutting the same, and glass fiber-reinforced resin panel and method of preparing the same - Google Patents

Abstract

PURPOSE: A glass fiber-reinforced resin film and a method of cutting the same, and a glass fiber-reinforced resin panel and a method of manufacturing the panel are provided to prevent dust from flying and to efficiently produce a glass fiber-reinforced resin film with high smoothness in the cross section. CONSTITUTION: A method of cutting a glass fiber-reinforced resin film comprises following steps. A laser processing head and a glass fiber-reinforced resin film make relative movement in one direction. A new hole is repetitive formed to be overlapped with a part of a previously formed hole by a laser light radiated intermittently from the laser processing head. The hole forming step is repeated to cut the glass fiber-reinforced resin film The radiating direction of the laser light when the new hole is formed is opposite to that of the laser light when a reference hole is formed. The overlapped part of the reference hole and the new hole is between 25% and 90%.

Description

Glass fiber reinforced resin film and its cutting method, and glass fiber reinforced resin panel and its manufacturing method TECHNICAL FIELD

The present invention relates to a glass fiber reinforced resin film and a cutting method thereof. Moreover, this invention relates also to a glass fiber reinforced resin panel and its manufacturing method.

Background Art Currently, transparent glass fiber reinforced resin films are employed for display element substrates (particularly active matrix systems), color filter substrates, solar cell substrates, and the like for liquid crystal display elements and organic EL display elements.

By the way, such a glass fiber reinforced resin film is normally manufactured with a film roll first. For this reason, in order to use a glass fiber reinforced resin film as a board | substrate mentioned above, it is necessary to cut | disconnect a glass fiber reinforced resin film to predetermined dimension. And as a method of cutting such a glass fiber reinforced resin film, it cuts by the method (henceforth a "slitter cutting method") cut by the slitter blades, such as a gebel blade and a gang blade, or the wet dicing method. The method (henceforth "wet dicing method"), the method of cutting using a laser beam (henceforth "laser cutting method"), etc. are mentioned (for example, Unexamined-Japanese-Patent No. 2004-269727). Reference).

Japanese Patent Laid-Open No. 2006-219569

However, when a glass fiber reinforced resin film is cut | disconnected using the slit cutting method, a large amount of resin powder and glass powder will generate | occur | produce. For this reason, when a glass fiber reinforced resin film is cut | disconnected by this method, a resin powder and glass powder may adhere to the glass fiber reinforced resin film after cutting in the process after the cutting process of a glass fiber reinforced resin film, and a defective article may bundle. There is. Moreover, although washing | cleaning the glass fiber reinforced resin film after cutting | disconnection and washing off resin powder and glass powder can also be considered, it is hard to say that it is a preferable solution because a washing | cleaning apparatus and a drying apparatus are needed separately.

In addition, when the glass fiber reinforced resin film is cut using the wet dicing method, the resin powder and the glass powder are washed out by the cutting water at the same time as the cutting, so that the same problems as when using the slit cutting method do not occur. It is difficult to say that it is a preferable solution because it is slow and requires a separate drying equipment.

Moreover, when a glass fiber reinforced resin film is cut | disconnected simply by a laser cutting method, the molten solidified material (henceforth a "glass beads") of a glass fiber is produced in a cut cross section in many cases. And there exists a possibility that this glass bead may fall out in a subsequent process, adhere to the glass fiber reinforced resin film after cutting | disconnection, and a defective article will bundle. In addition, although it is also possible to wash the glass fiber reinforced resin film after cutting and wash | cleaning glass beads, it is hard to say that it is a preferable solution since a washing | cleaning installation and a drying installation are needed separately.

An object of the present invention is to cut a glass fiber reinforced resin film that can efficiently produce a glass fiber reinforced resin film having high smoothness of cut cross section while greatly suppressing generation of dust such as resin powder, glass powder, glass beads, and the like. Is to provide.

(1) In the cutting method of the glass fiber reinforced resin film which concerns on one aspect, while a laser processing head and a glass fiber reinforced resin film move relative to one direction, it irradiates to the laser beam irradiated intermittently from a laser processing head. The glass fiber reinforced resin film is cut | disconnected by repeating the process by which a new hole (henceforth "a new hole") is drilled so that it may overlap with a part of the hole drilled by one front (henceforth a "reference hole"). In addition, the glass fiber in the "glass fiber reinforced resin film" here may be a cloth material, or a unidirectional material. Moreover, as a resin component in a glass fiber reinforced resin film, transparent resin of an epoxy resin, an acrylate resin, etc. are mentioned, for example. Moreover, as a "laser" here, a carbon dioxide laser (wavelength: 9.2-9.6 micrometers) is preferable. It is because the transparent resin of an epoxy resin and an acrylate resin is easy to absorb. Moreover, in this cutting method of a glass fiber reinforced resin film, a new hole becomes a next reference hole except the new hole at the time of cutting completion. Moreover, in the cutting method of this glass fiber reinforced resin film, the protective film may be affixed on at least one side of a glass fiber reinforced resin film. Moreover, it is preferable to adjust the pulse interval, peak wavelength, irradiation time, etc. of a laser beam to the extent which glass beads do not generate | occur | produce or become hard to produce in the cut end surface of a glass fiber reinforced resin film.

As a result of earnestly examining by the present inventors, when appropriate laser processing conditions are selected in the cutting method of this glass fiber reinforced resin film, a glass fiber reinforced resin film can be cut | disconnected at the high speed of 8 m / min, It is clear that a glass fiber reinforced resin film with high smoothness of a cut cross section is obtained because glass beads do not grow. For this reason, when the cutting method of this glass fiber reinforced resin film is used, the glass fiber reinforced resin film with high smoothness of a cut cross section is efficiently suppressed, suppressing generation | occurrence | production of dust, such as resin powder, glass powder, and glass beads largely. Can be generated.

(2) Moreover, it is preferable that the laser beam irradiation direction at the time of drilling a new hole is opposite to the laser beam irradiation direction at the time of drilling a reference hole. In this case, two laser processing heads may be prepared or a mirror may be used.

By doing in this way, the heat input distribution of a glass fiber reinforced resin film can be made uniform between a surface side part and a back surface side part, and a glass fiber reinforced resin film can be cut | disconnected favorably.

(3) The overlapping degree between the reference hole and the new hole is preferably 25% or more and 90% or less.

As a result of earnestly examining by the present inventors, it becomes clear that the glass fiber reinforced resin film with high smoothness of a cut cross section can be obtained when the overlapping degree of a reference hole and a new hole is set to this numerical range. For this reason, if it does in this way, the glass fiber reinforced resin film with high smoothness of a cut cross section can be obtained.

(4) Moreover, it is preferable that the overlapping degree of a reference hole and a new hole is 25% or more and less than 50% from a viewpoint of the improvement of the cutting speed of a glass fiber reinforced resin film, and the smoothness of the cut section of a glass fiber reinforced resin film is improved. From the point of view, the overlapping degree between the reference hole and the new hole is preferably 50% or more and 90% or less.

(5) The manufacturing method of the glass fiber reinforced resin panel which concerns on another situation is equipped with a cutting process and a manufacturing process. In a cutting process, a glass fiber reinforced resin film is cut | disconnected by the cutting method of the glass fiber reinforced resin film mentioned above. In a manufacturing process, a glass fiber reinforced resin panel is manufactured from the glass fiber reinforced resin film cut | disconnected in the cutting process.

(6) The laser processing apparatus concerning another aspect is equipped with a laser processing head, a relative movement apparatus, and a control apparatus. The laser processing head intermittently irradiates a laser beam. The relative moving device relatively moves the laser processing head and the laser processing object in one direction. The control device controls at least the relative movement amount of the laser processing head and the laser processing object and the irradiation time of the laser beam, and drills a new hole so as to overlap with a part of the hole drilled one by the laser beam irradiated intermittently from the laser processing head. Repeat.

As a result of earnest examination by the present inventors, when the appropriate laser processing conditions are selected in this laser processing apparatus, a glass fiber reinforced resin film can be cut | disconnected at a high speed of 8 m / min, and glass spheres do not grow in a cut cross section. It is clear that a glass fiber reinforced resin film with high smoothness of a cut end surface can be obtained. For this reason, when this laser processing apparatus is used, the glass fiber reinforced resin film with high smoothness of a cut cross section can be manufactured efficiently, suppressing generation | occurrence | production of dust, such as resin powder, glass powder, and glass beads largely.

(7) The control method of the laser processing apparatus which concerns on another aspect is a laser processing apparatus provided with the laser processing head which irradiates a laser beam intermittently, and the relative movement apparatus which moves a laser processing head and a laser processing object relative to one direction. Control method. In the control method of the laser processing apparatus, the relative movement amount of the laser processing head and the laser processing object and the irradiation time of the laser beam are controlled, and overlapped with a part of the hole drilled in front by the laser beam irradiated intermittently from the laser processing head. The process of repeating a new hole is repeated.

As a result of earnestly examining by the present inventors, when appropriate laser processing conditions are selected in the control method of this laser processing apparatus, a glass fiber reinforced resin film can be cut | disconnected at the high speed of 8 m / min, and a glass sphere in a cut cross section It is clear that a glass fiber reinforced resin film with high smoothness of a cut cross section can be obtained because it does not grow. For this reason, when the control method of this laser processing apparatus is used, the glass fiber reinforced resin film with high smoothness of a cut section can be efficiently manufactured, suppressing generation | occurrence | production of dust, such as resin powder, glass powder, and glass beads largely. .

BRIEF DESCRIPTION OF THE DRAWINGS It is a conceptual diagram which shows the structure of the laser processing apparatus which concerns on one Embodiment of this invention.
2 is a conceptual diagram showing the configuration of a computer for controlling a laser processing apparatus according to an embodiment of the present invention.
3 is a conceptual diagram of laser device specification information stored in a storage unit of a computer for controlling a laser processing apparatus according to an embodiment of the present invention.
It is a conceptual diagram which shows the method of cutting a glass fiber reinforced transparent resin film by the laser processing apparatus which concerns on one Embodiment of this invention.
5 is a cross-sectional view taken along line AA of FIG. 4.
It is a figure which shows the shape of the cutting groove in the case where the overlap ratio of a through hole is made small.
It is a figure which shows the shape of the cutting groove in the case where the overlap ratio of a through hole is enlarged.
8 is a conceptual diagram illustrating a configuration of a laser processing apparatus according to a modification (A).

As shown in FIG. 1, the laser processing apparatus 100 according to the present embodiment mainly uses the pulse laser oscillation apparatus 110, the mask 120 for cutting, the collimator 180, the processing head 200, and the processing head movement. It is comprised of the mechanism 300, the stage 130, the processing head controller 140, and the control computer 150. As shown in FIG. Hereinafter, these structures are explained in full detail.

In addition, in this embodiment, this laser processing apparatus 100 has a function which cuts glass fiber reinforced transparent resin film TP (refer FIG. 1) at high speed. In addition, the glass fiber reinforced transparent resin film (TP) which is a cutting object is mentioned later.

<Configuration of Laser Processing Equipment>

(1) pulse laser oscillation device

The pulse laser oscillation apparatus 110 is an oscillation source of a pulse laser (short pulse high peak carbon dioxide gas laser) LB. When the pulse laser light LB is emitted from the pulse laser oscillation device 110, the pulse laser light LB is refracted by the mirror 210 after passing through the mask 120 and the collimator 180 for cutting, and then the condenser lens. It passes through 220 and is irradiated to the glass fiber reinforced transparent resin film (TP) which is a cutting object.

(2) cutting mask

The cutting mask 120 is formed with a circular opening having a diameter of about 10 mm. And the pulse laser LB which has a substantially uniform intensity distribution can be obtained by passing the pulse laser LB which has a cross-sectional area larger than the area of this opening through this opening.

(3) collimator

The collimator 180 shapes the pulse laser LB which has passed through the mask 120 for cutting.

(4) machining head

As shown in FIG. 1, the processing head 200 mainly consists of the mirror 210, the condenser lens 220, and the assist gas ejection apparatus (not shown), and the processing head movement mechanism 300 makes the X-axis axial. Therefore, it can slide in X1 direction or X2 direction. Hereinafter, these structures are explained in full detail.

(4-1) mirror

The mirror 210 refracts the pulse laser LB oscillated from the pulse laser oscillation device 110 so that the pulse laser LB is irradiated to the cutting object.

(4-2) condensing lens

The condenser lens 220 forms an image of the slit on the object to be cut and simultaneously condenses the pulse laser LB on the object to be cut. In this embodiment, the condenser lens 220 condenses the pulse laser LB having a diameter of about 10 mm with a diameter of about 80 m at the focal point. And in this embodiment, this condensed pulse laser LB is irradiated to glass fiber reinforced transparent resin film TP, and many continuous through-holes are formed in glass fiber reinforced transparent resin film TP.

(4-3) assist gas blowing device

The assist gas ejecting device ejects the assist gas to a cutting point to be cut, and efficiently performs cooling of the cut surface and removal of a sublimation generated during cutting.

(5) processing head moving mechanism

The processing head moving mechanism 300 is a mechanism for sliding the processing head 200 in the X1 direction or the X2 direction along the X axis. In addition, the processing head controller 140 is communicatively connected to the drive unit (not shown) in the processing head moving mechanism 300 via the first communication line 161.

(6) stage

The stage 130 is a flat surface for mounting a cutting object. Moreover, the groove | channel of 1-5 mm is formed in this stage 130 in the cutting part of a cutting object. The object to be cut is sucked through the groove from the lower part of the stage 130, so that the object to be cut is adsorbed to the stage 130 and the suction of the sublimate is efficiently performed.

(7) Machining Head Controller

As described above, the processing head controller 140 is communicatively connected to the drive unit of the processing head moving mechanism 300 via the first communication line 161, and controls the moving direction and the moving amount of the processing head 200.

(8) control computer

As shown in FIG. 2, the control computer 150 mainly consists of an MPU (microprocessor) 151, a storage unit 152, a user interface 153, and a control interface 154. Hereinafter, these structures are explained in full detail.

(8-1) MPU

The MPU 151 controls the entire control computer 150 by executing an operating system (OS) 152a stored in the storage unit 152. In addition, the MPU 151 controls the pulse laser oscillation device 110 and the processing head controller 140 by executing the processing control program 152b.

(8-2) Memory

The storage unit 152 stores the OS 152a, the process control program 152b, and the laser device setting information 152c.

The machining control program 152b is an application program that runs under the OS 152a and is executed by the MPU 151 to control the pulse laser oscillation apparatus 110 and the machining head controller 140.

The laser device setting information 152c includes setting information prepared for each cutting target in advance. As setting items in setting information, as shown in FIG. 3, ON TIME (laser light irradiation time) 171, OFF TIME (laser light irradiation stop time) 172, processing head movement speed 173, and focus ( 174, beam mode 175, condenser lens magnification 176, and imaging scheme 177 are illustrated. In addition, ON TIME (laser light irradiation time) 171, OFF TIME (laser light irradiation stop time) 172, and beam mode 175 are setting items for the pulse laser oscillation apparatus 110, and the processing head movement speed Reference numeral 173, focus 174, condenser lens magnification 176, and imaging method 177 are setting items for the processing head controller 140. And this setting information is referred by the process control program 152b.

In addition, in this embodiment, it is preferable that ON TIME is 10-30 micrometers, It is preferable that OFF TIME is 100-400 micrometers, It is preferable that the processing head moving speed is 6-9 m / min, and a focal point is glass It is preferable to exist in the surface of the fiber reinforced transparent resin film TP, or to exist in the midpoint of a thickness direction. In addition, by such setting, the processing head 200 slides in the X1 direction or the X2 direction by 10 to 50 µm with respect to the pulse laser LB1 short. And as mentioned above, the diameter of the pulse laser LB is about 80 micrometers. For this reason, with this setting, through-holes are successively formed on the glass fiber reinforced transparent resin film TP by the pulse laser LB so as to overlap one after another along the X axis, and as a result, the glass fiber reinforced transparent resin film TP. Will be cut. In addition, this cutting | disconnection state is explained in full detail later using drawing.

(8-3) User Interface

The user interface 153 is composed of, for example, a display, a keyboard, a mouse, and the like, and displays various types of information output from the control computer 150 to the user, or to the user for the control computer 150. Provide information input means;

(8-4) control interface

The control interface 154 is communicatively connected to the processing head controller 140 via the second communication line 162, and is communicatively connected to the pulse laser oscillation device 110 via the third communication line 163, and the control computer 150. Mediate input and output of information between the pulse laser oscillation apparatus 110, the processing head controller 140, and the control computer 150, which is the control target.

<Glass fiber reinforced transparent resin film>

As glass fiber reinforced transparent resin film (TP) used as cutting object in this embodiment, For example, Unexamined-Japanese-Patent No. 2006-219569, Unexamined-Japanese-Patent No. 2007-168150, Unexamined-Japanese-Patent No. 2004-231934, And Japanese Patent Laid-Open No. 2004-238532 and Japanese Laid-Open Patent Publication No. 2004-269727.

As also shown in these publications, the glass fiber material constituting the glass fiber reinforced transparent resin film (TP) may be a woven material or a unidirectional material. Moreover, when a glass fiber material is a textile material, a plain weave, a weaving loom, a runner weave, twill, etc. are mentioned as a textile structure of glass fiber. Moreover, E glass, C glass, A glass, S glass, D glass, T glass, NE glass, quartz glass, low inductive glass, high dielectric constant glass etc. are mentioned as a raw material of this glass fiber material.

As a transparent resin which comprises a glass fiber reinforced transparent resin film (TP), for example, thermoplastic acrylic resins, such as polymethyl methacrylate (PMMA), and (meth) acrylate which has two or more functional groups as a main component Cured acrylate resin, epoxy resin cured compound having two or more epoxy groups, cycloolefin resin polymerized norbornene derivative or cyclohexadiene derivative, olefin-maleimide alternating copolymer, poly-4-methylpentene- Olefin resins, such as 1, thermosetting resins for optical lenses, such as CR-39, etc. are mentioned.

Moreover, as (meth) acrylate which has two or more functional groups, For example, Cycloether, such as alicyclic (meth) acrylate, di (meth) acrylate of the acetal compound of hydroxy pivalaldehyde and trimethylolpropane, etc. Type di (meth) acrylate, hexanediol di (meth) acrylate, neopentyl glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, hydrogenated bisphenol A Di (meth) acrylate of an ethylene oxide adduct, etc. are mentioned.

Moreover, although it changes also with a hardening | curing agent as an epoxy resin, when it is an anhydride type hardening | curing agent, an alicyclic epoxy resin, triglycidyl isocyanurate, etc. are mentioned, for example. Moreover, although these epoxy resins may be used independently as long as the refractive index of a glass fiber material can be matched, another epoxy resin may be used together for the purpose of adjusting a refractive index.

In addition, the transparent resin may contain a small amount of fillers such as antioxidants, ultraviolet absorbers, dyes, and other inorganic fillers in a range that does not impair the properties such as transparency, solvent resistance, and heat resistance as necessary.

Moreover, in manufacture of such glass fiber reinforced transparent resin film (TP), in order to make glass fiber reinforced transparent resin film (TP) transparent, it is necessary to make the refractive index of the said glass fiber material and the refractive index of transparent resin substantially the same.

<Cutting state of glass fiber reinforced transparent resin film by laser processing apparatus>

In this embodiment, the glass fiber reinforced transparent resin film TP which is a cutting object is cut | disconnected as shown to FIG. 4 and FIG. Here, the overlap ratio of the through holes Hn and Hn-1 formed by the pulse laser LB (the degree of overlap of the through holes in the planar view of the glass fiber reinforced transparent resin film TP) The length reference on the X axis) is 50%.

When cutting of the glass fiber reinforced transparent resin film TP is started in this laser processing apparatus 100, as shown in FIG. 4 and FIG. 5, even if the through-holes Hn and Hn-1 are in the X1 direction (X2 direction). It is formed continuously so as to overlap one after another to form a cutting groove (Gr). 4 and 5, the through hole (new hole) indicated by reference numeral Hn is the latest through hole, and the through hole (reference hole) indicated by reference character Hn-1 is one of the latest through holes Hn. It is a through hole formed in the front. In addition, in FIG. 5, the code | symbol t has shown the thickness direction of the glass fiber reinforced transparent resin film TP.

In addition, in the laser processing apparatus 100 which concerns on this embodiment, the overlap ratio of the through-holes Hn and Hn-1 can be changed by changing the input information corresponding to the above-mentioned setting item.

For example, as shown in FIG. 6, when the overlap ratio is reduced, the glass fiber reinforced transparent resin film TP can be cut at a higher speed, but the smoothness of the cut end surface is lowered.

On the other hand, as shown in FIG. 7, when the overlap rate is increased, the cutting speed is slowed but the smoothness of the cut section is increased.

Hereinafter, the present invention will be described in more detail with reference to Examples.

Example 1

(1) Production of glass fiber reinforced transparent resin film

First, 99 parts by weight of a hydrogenated biphenyl type alicyclic epoxy resin (E-BP, manufactured by Daicel Chemical Industry Co., Ltd.) having a structure represented by Formula (1), β- (3,4-epoxycyclohexyl) ethyltrimethoxy An epoxy resin composition was prepared by mixing 1 part by weight of silane (KBM303, manufactured by Shin-Etsu Chemical Co., Ltd.) and 1 part by weight of an aromatic sulfonium thermal cationic catalyst (SI-100L, manufactured by Samshin Chemical).

Next, the T glass-based glass fabric (thickness 95 µm, refractive index 1.520, Nitto spinning agent, WTX116F) was impregnated with the epoxy resin composition, followed by defoaming to prepare a prepreg.

Then, the prepreg sandwiched with a release-treated glass plate was heat treated at 80 ° C. for 2 hours, followed by further heat treatment at 250 ° C. for 2 hours to obtain a glass fiber reinforced transparent resin film having a thickness of 0.1 mm (glass filler content: 63). Weight%).

(2) cutting of the glass fiber reinforced transparent resin film by pulse laser

Laser fiber processing system (mounted laser processing head: COHERENT K-225 (short pulse carbon dioxide laser), output: 225 W, peak power: 200-650 W) manufactured by Iowa Laser Co., Ltd. was controlled as described above to control the glass fiber. The reinforced transparent resin film (protective film is not affixed) was cut out. In addition, the ON TIME at this time is 30 μs, the OFF TIME is 400 μs, the processing head moving speed is 8 m / min, the focus is -0.1 mm (ie, the focus is the bottom of the film), and the beam mode is a single beam. It was a mode. Moreover, the moving pitch of the processing head at this time was 57 micrometers, and the overlap rate was 38%.

Although the cut surface of the glass fiber reinforced transparent resin film was observed with the optical microscope, the glass surface also generate | occur | produced very few and smoothness was also high enough practically.

[Example 2]

The glass fiber reinforced transparent resin film used in Example 1 was cut | disconnected similarly to Example 1 except having set ON TIME to 10 microseconds and OFF TIME to 100 microseconds. Moreover, the moving pitch of the processing head at this time was 15 micrometers, and the overlap rate was 81%.

Although the cut surface of the glass fiber reinforced transparent resin film was observed with the optical microscope, the glass surface also generate | occur | produced very few and smoothness was also high enough practically.

Example 3

The glass fiber reinforced transparent resin film used in Example 1 was cut | disconnected similarly to Example 1 except having set ON TIME to 20 microseconds and OFF TIME to 200 microseconds.

Although the cut surface of the glass fiber reinforced transparent resin film was observed with the optical microscope, the glass surface also generate | occur | produced very few and smoothness was also high enough practically.

Example 4

The glass fiber used in Example 1 in the same manner as in Example 1 except that ON TIME was set to 20 μs, OFF TIME was set to 200 μs, and the focus was set to 0 mm (ie, the focus is on the top of the film). The reinforced transparent resin film was cut out.

Although the cut surface of the glass fiber reinforced transparent resin film was observed with the optical microscope, the glass surface also generate | occur | produced very few and smoothness was also high enough practically.

Example 5

The glass fiber reinforced transparent resin film used in Example 1 was cut | disconnected similarly to Example 1 except having set the focus to 0 mm (namely, the focus is the upper surface of a film).

Although the cut surface of the glass fiber reinforced transparent resin film was observed with the optical microscope, the glass surface also generate | occur | produced very few and smoothness was also high enough practically.

<Variation example>

(A) In the laser processing apparatus 100 which concerns on the previous embodiment, although the pulse laser LB was irradiated with respect to the glass fiber reinforced transparent resin film TP from one processing head 200, the processing head 200 was turned off. It may arrange | position to the both sides of the height direction of a stage, and may irradiate a pulse laser LB from the both processing heads 200 to the glass fiber reinforced transparent resin film TP alternately. As such means, the use of the laser processing apparatus 100a shown in FIG. 8 is considered.

In the laser processing apparatus 100a, the processing head 200 and the processing head movement mechanism 300 of the laser processing apparatus 100 shown in FIG. 1 are also arrange | positioned at the back surface side of the stage 130a, and the pulse laser oscillation apparatus 110 is shown. Pulsed laser light LB irradiated from is supplied to the processing head 200 on the back surface side by mirrors 410 and 420. In addition, the mirror 410 slides in the vertical direction along the Y axis at regular time intervals. For this reason, the pulse laser LB is alternately supplied to the processing head 200 of the surface side of the stage 130a, and the processing head 200 of the back surface side. In addition, the mirror 420 is fixed. In addition, a groove (a passage through the pulse laser LB) is formed in the stage 130a along the X axis direction. Moreover, the drive part of the processing head movement mechanism 300 of the surface side of the stage 130a is connected to the processing head controller 140a via the 1st communication line 161, and the stage (through the 4th communication line 164) is communicated. 130a) The drive part of the processing head movement mechanism 300 of the back surface side is connected by communication. And the processing head controller 140a controls the drive part of the processing head movement mechanism 300 on both sides of the stage 130a according to the command from the control computer 150. FIG.

By doing in this way, the heat input distribution of glass fiber reinforced transparent resin film TP can be made uniform between a surface side part, and a back surface side part, and glass fiber reinforced transparent resin film TP can be cut | disconnected more favorably.

As other means, the mirrors 410 and 420 are removed from the laser processing apparatus 100a shown in FIG. 8, and the pulse laser oscillation apparatus 110, the mask 120 for cutting and the collimator (1) of the laser processing apparatus 100a are removed. 180 is further added to the processing head 200 on the back side of the stage 130a from another pulse laser oscillation apparatus 110 through another cutting mask 120 and collimator 180. In the means for irradiating (LB) or the laser processing apparatus 100 shown in FIG. 1, the pulse laser LB irradiated from the processing head 200 toward the glass fiber reinforced transparent resin film TP at regular time intervals. It is intermittently refracted by a mirror which slides in the X1 and X2 directions along the X axis direction, and the pulse laser LB is guided to the back side of the stage 130 by a fixed mirror (any one or more may be used). And, the method including irradiating the pulsed laser (LB) to another slide glass for sliding movement in the same direction as the processing head 200 to the back of the glass-fiber reinforced transparent resin film (TP) is considered.

(B) Although the processing head 200 was configured to slide along the X axis in the laser processing apparatus 100 according to the above embodiment, the processing head 200 is fixed and the stage 130 is moved to a three-axis moving stage. You may also

(C) Although not specifically mentioned in the above embodiment, the single beam mode may be adopted as the beam mode, or the flat beam mode (irradiation mode of the beam with high intensity in the vicinity of the outer periphery) may be adopted.

(D) Although not specifically mentioned in the above embodiment, a plurality of short-sided both sides of the roll-shaped glass fiber reinforced transparent resin film TP are arranged in series along the longitudinal direction of the glass fiber reinforced transparent resin film TP. The glass fiber reinforced transparent resin film TP may be sequentially carried out on the stage 130 of the laser processing apparatus 100 every time it is inserted into a chuck and cutting process is completed.

(E) In the laser processing apparatus 100 according to the previous embodiment, a circular opening having a diameter of about 10 mm was used as the mask 120 for cutting, but the shape of the opening formed in the mask 120 for cutting was adopted. The size and size are not particularly limited and can be appropriately selected depending on the type of the glass fiber reinforced transparent resin film (TP). For example, the shape of the opening may be square or the like. In such a case, the improvement of the smoothness of the cut end surface of glass fiber reinforced transparent resin film TP can be expected.

(F) Although the collimator 180 is arrange | positioned behind the mask 120 for cutting in the laser processing apparatus 100 which concerns on the previous embodiment, the collimator 180 may be arrange | positioned in front of the mask 120 for cutting. .

The cutting method of the glass fiber reinforced resin film which concerns on this invention can produce | generate a glass fiber reinforced resin film with high smoothness of cut cross section efficiently, suppressing generation | occurrence | production of dust, such as resin powder, glass powder, and glass beads largely. It has a characteristic of being said, and is useful as an alternative method of the cutting method of the conventional glass fiber reinforced resin film. Moreover, the cutting method of the glass fiber reinforced resin film which concerns on this invention is expected to show the same effect, even if it applies to cutting of fiber reinforced base materials, such as a prepreg, for example, of fiber reinforced base materials, such as a prepreg, It is thought to be useful as an alternative to the cutting method.

200 machining heads
LB pulsed laser
Hn new holes
Hn-1 reference hole
TP Glass Fiber Reinforced Transparent Resin Film

Claims (8)

While moving the laser processing head and the glass fiber reinforced resin film in one direction, the new laser beam is overlapped with a part of a hole (hereinafter referred to as a “reference hole”) drilled by one by a laser beam irradiated intermittently from the laser processing head. The cutting method of the glass fiber reinforced resin film which cut | disconnects a glass fiber reinforced resin film by repeating the process which drills a hole (henceforth a "new hole"). The method according to claim 1,
The cutting method of the glass fiber reinforced resin film which is a laser beam irradiation direction at the time of drilling the said new hole is opposite to the laser beam irradiation direction at the time of drilling the said reference hole. The method according to claim 1 or 2,
The overlapping degree of the said reference hole and the said new hole is 25% or more and 90% or less, The cutting method of the glass fiber reinforced resin film. The method according to claim 3,
The overlapping degree of the said reference hole and the said new hole is 25% or more and less than 50%, The cutting method of the glass fiber reinforced resin film. The method according to claim 3,
The overlapping degree of the said reference hole and the said new hole is 50% or more and 90% or less, The cutting method of the glass fiber reinforced resin film. A cutting step of cutting the glass fiber reinforced resin film by the cutting method of the glass fiber reinforced resin film according to any one of claims 1 to 5,
The manufacturing method of the glass fiber reinforced resin panel provided with the manufacturing process which manufactures a glass fiber reinforced resin panel from the said glass fiber reinforced resin film cut | disconnected in the said cutting process. The glass fiber reinforced resin film cut by the cutting method of the glass fiber reinforced resin film of any one of Claims 1-5. The glass fiber reinforced resin panel manufactured by the manufacturing method of the glass fiber reinforced resin panel of Claim 6.

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