KR20110049313A - Led lamp for substituting fluorescent lamp - Google Patents

Abstract

PURPOSE: A light emitting diode-based light illuminating lamp for replacing a fluorescent lamp is provided to separate a heat emitting part into a plurality number of components in order to increase the heat emitting area of the heat emitting part. CONSTITUTION: A heat emitting part(110) is separated into a plurality of components. A plurality of heat emitting components is spaced apart from each other. A printed circuit board(120) is arranged at one side of the heat emitting part. The printed circuit board includes a plurality of light emitting diode elements(130). A base(150) is arranged on either side or both sides of the heat emitting part. The base is in connection with a fluorescent socket.

Description

LED lighting lamp for fluorescent lamp replacement {LED LAMP FOR SUBSTITUTING FLUORESCENT LAMP}

The present invention relates to an LED lamp for replacing a fluorescent lamp, and more preferably to an LED lamp having a plurality of separate radiating parts spaced at predetermined intervals in order to maximize the heat dissipation performance of the heat radiating part corresponding to the glass tube of the conventional fluorescent lamp. .

Types of artificial light sources include incandescent lamps with high melting point, such as metal coils or tungsten wires in vacuum or gas-sealed glass spheres, halogen bulbs that suppress tungsten vaporization by injecting halogen elements into glass spheres, Discharge lamps using gas discharge such as arc discharge or glow discharge, fluorescent lamps coated with fluorescent material inside the discharge tube, and solid state light sources include EL lamps, OLED lamps, and LED lamps.

Fluorescent lamps are a kind of low-pressure mercury lamp that uses a hot cathode to encapsulate mercury in a discharge tube and discharge them at low voltage, and strong ultraviolet rays having a wavelength of 253.7 nm generated by the discharge stimulate the fluorescent paint on the wall of the tube to generate strong fluorescence. The tungsten filament of the hot cathode is made of a double coil and coated with an oxide film such as barium (Ba) to facilitate the release of hot electrons.

Fluorescent lamp ballasts are classified into magnetic, semiconductor, and electronic types. High-grade electronic ballasts with excellent electrical safety, easy system design, and long lamp life have emerged as ballasts suitable for consumer needs.

A light emitting diode (LED) device is a semiconductor device that generates light by flowing a current in a forward direction to a PN junction. A light emitting diode device using a semiconductor converts electrical energy into light energy, and has high efficiency and a long lifespan of 5 to 10 years or more. As such, the LED device is attracting attention in the field of next-generation lighting equipment applications that can replace conventional lighting such as incandescent lamps, fluorescent lamps, etc. because of the advantages of greatly reducing power consumption and maintenance costs.

In particular, since there is no need to use environmentally harmful substances such as mercury and fluorescent materials, interest in LED lighting lamps is increasing as a replacement for fluorescent lamps.

In the LED device, power that is not emitted as light among the input power is released as heat, which heats up the LED device. At this time, if the generated heat is not released to the outside, the damage occurs to the LED element, and the life span is shortened rapidly.

Heat transfer methods include conduction, convection, and radiation. The transfer of heat from the LED element to the radiator is due to conduction, and the transfer of heat from the radiator to the surrounding air is due to convection. Radiation becomes dominant with increasing temperature differences and can be ignored if conduction and convection are sufficient. In general, heat transfer by conduction in which heat is released through a heat dissipation portion in contact with an LED element is sufficient. The problem is therefore the heat transfer by convection, which depends on the area of the heat sink and the amount of air flow.

Korean Laid-Open Patent Publication No. 2008-0047521 discloses an LED lamp formed of a fluorescent lamp type and fitted in place of a fluorescent lamp. As shown in FIG. 1, the LED lamp 10 includes a housing 1, a power supply board (not shown) mounted inside the housing 1, and a circuit board on which a plurality of LEDs 2 are attached. And a substrate cover 3 for covering the power supply board (not shown) and an LED cover 4 for covering the circuit board (not shown). The conventional LED lamp 10 is replaced because it is replaced with a fluorescent lamp, but is easy to replace, there is a problem that the heat dissipation performance is deteriorated because it is not designed to heat dissipation.

In addition, Korean Patent Publication No. 2008-0107627 discloses an LED lamp having a heat sink and a wing. As shown in FIG. 2, the LED lamp 20 includes a PCB 21, an LED (not shown) provided on one surface of the PCB, a heat dissipation plate 22 closely attached to the other surface of the PCB, and a wing 23 provided on the heat dissipation plate. And a protective cover 24 for protecting the LED device. The conventional LED lamp 20 is provided with a wing 23 to improve the heat dissipation performance, but the wing 23 is exposed to the outside there is a problem in stability, the LED light 20 is horizontal to the ceiling When provided, the air flow is not smooth and the heat dissipation performance is reduced.

An object of the present invention is to increase the heat dissipation area by separating a plurality of heat dissipation parts so as to be spaced at a predetermined interval, even if the LED light is arranged horizontally or vertically to the ceiling, the air flow is made smoothly to replace the fluorescent light replacement LED To provide lighting.

 In order to achieve the above object, the LED replacement lamp of the fluorescent lamp of the present invention is provided on a plurality of heat dissipation parts, one side of the heat dissipation part so as to be spaced apart from each other at a predetermined interval, a printed circuit board having a plurality of LED elements, both sides of the heat dissipation part Included in and connected to the fluorescent lamp socket, the base is applied to the power, the heat dissipation portion corresponding to the glass tube of the fluorescent lamp.

At this time, the diffusion plate is provided on the front of the printed circuit board, the diffusion plate is fastened with the heat dissipation unit.

In addition, the printed circuit board may be provided on the lower surface and / or the inclined surface of the heat dissipation unit to be used for indirect lighting and / or direct lighting, and the heat dissipation fin may be further provided on the inclined surface of the heat dissipating unit.

Since the LED lamp of the present invention is separated by a plurality of heat dissipation parts so as to be spaced apart from each other at predetermined intervals, the heat dissipation area is increased, and thus the heat dissipation performance is improved even without a separate heat dissipation fin.

In addition, since a plurality of heat dissipating parts are provided with a passage through which air can flow smoothly, the heat dissipation performance is improved even when the LED lamp is disposed horizontally or vertically with the ceiling.

The LED lamp with improved heat dissipation performance can reduce the temperature inside the LED lamp by 10 to 15 ℃ compared to the conventional lighting. In addition, if the heat radiation fin is additionally provided in the heat radiation portion can further improve the heat radiation performance.

Since the LED lamp has a low temperature inside, it is possible to prevent yellowing of the diffusion plate and shortening the life of components (LED elements, driving circuits, etc.).

In addition, since the heat dissipation part is manufactured by an extrusion method, it can be manufactured in various lengths.

Since the LED lamp of the present invention is replaced in the place where the conventional fluorescent lamp was mounted, it is not only easy to replace, but also can exhibit high brightness with low power.

The present invention relates to a fluorescent lamp replacement LED lamp is improved heat dissipation performance by separating a plurality of heat dissipation parts provided on one surface of the printed circuit board mounted with the LED element spaced at a predetermined interval.

EMBODIMENT OF THE INVENTION Hereinafter, this invention is demonstrated in detail.

The LED lamp of the present invention is provided on one side of the heat dissipation portion, a plurality of heat dissipation parts separated from each other at predetermined intervals, and a printed circuit board having a plurality of LED elements, provided on both sides of the heat dissipation part and connected to a fluorescent lamp socket to supply power. Including an applied base, the heat dissipation portion is a shape corresponding to the glass tube of the fluorescent lamp. In this case, the diffusion plate may be provided on the front surface of the printed circuit board provided in the heat dissipation unit.

The LED lamp of the present invention is formed in the longitudinal direction (long rod shape) as two or more heat dissipation parts, which are shapes corresponding to glass tubes of fluorescent lamps, are separated.

The LED lamp of the present invention is preferably formed in a size similar to the diameter of a conventional fluorescent lamp, and because the diameter of the fluorescent lamp is limited, it is preferable that two heat radiating parts are provided.

Since the heat dissipation portion corresponds to the glass tube of the fluorescent lamp, it is possible to form a cross-sectional shape of the heat dissipation portion in a circular shape so as to have a shape similar to that of a circular glass tube cross section of a conventional fluorescent lamp, which reduces the psychological resistance of consumers. In addition, the heat dissipation unit needs a surface on which a printed circuit board having an LED element may be provided, and when the surface is flat, the printed circuit board may be thermally stably bonded.

The heat dissipation unit is a conventional heat dissipation unit (FIG. 1A) having a semicircular cross section, but is not limited thereto. Various shapes such as a fan, a polygon having a larger or smaller angle than a semicircle may be used.

In addition, a space is formed inside the heat dissipation unit, which not only saves material cost and reduces weight, but may also have a groove in which other components can be mounted.

One embodiment of the LED lamp of the present invention is a straight tube formed in the longitudinal direction as well as the heat radiating portion and the printed circuit board. Here, the straight pipe means a shape formed long in the longitudinal direction regardless of the shape of the cross section.

Figure 3a is an exploded perspective view of the LED lamp according to a preferred embodiment of the present invention, Figure 3b is an exploded perspective view of the LED lamp according to another embodiment of the present invention.

In FIG. 3, a description will be given based on a case in which a cross section of the heat dissipation part is a semicircle in which a circular shape is cut in a horizontal direction.

As shown in FIG. 3, the LED lamp 100 of the present invention includes a heat dissipation unit 110, a printed circuit board 120 having a plurality of LED elements 130, a diffusion plate 140, and a base 150. And a driving circuit 160.

Assuming the semicircles are cut in half, two quadrants are formed. The heat dissipation unit 110 is to have a cross-sectional shape like this. The heat dissipation unit 110 having a cross-sectional shape of two quadrants is arranged to be spaced apart from each other at predetermined intervals, and is formed to have a size slightly smaller than that of a quadrant which is exactly half of a semicircle. For example, since the diameter of a conventional fluorescent lamp is 25.5 ± 1.2 mm, the width of the quadrant is preferably equal to about 12 mm based on this.

One quadrant formed by separating the heat dissipation unit 110, for example, the heat dissipation member 111 has a bottom surface 112 and an air flow surface 113 and a bottom surface 112 connected to one side of the bottom surface 112 and an air flow surface ( 113 and a slanted surface 114 respectively connected to one side. The three surfaces having the same width may have various uses.

The heat dissipation unit 110 has an air flow surface 113 of 70 to 110 ° with respect to the bottom surface 112, but preferably, the air flow surface 113 and the bottom surface 112 are formed at a right angle. The predetermined space formed by separating the 110 and the empty space inside the heat dissipation unit 110 is matched. If the air flow surface 113 is less than 70 ° with respect to the lower surface 112, the space inside the heat dissipation unit 110 is reduced, it is difficult to provide a drive circuit 160 therein, if it exceeds 110 °, the heat dissipation unit 110 ) May interfere with each other when they are separated into a plurality.

The heat dissipation unit 110 may allow the distance between each air flow surface 113 facing each other toward the base inserting portion 116 toward the side (up) in order to maximize the heat dissipation performance. This is because each of the air flow planes 113 facing each other smoothly flows of air than in parallel. At this time, the heat dissipation unit 110 has an air flow plane 113 of 70 to 90 ° with respect to the bottom surface 112 so that the distance between each air flow surface 113 facing each other becomes farther toward the base insertion unit 116. It is formed to, preferably from 80 to 90 ° (a). When the air flow plane 113 is less than 70 ° with respect to the bottom surface 112 of the heat dissipation unit 110, the space inside the heat dissipation unit 110 is reduced, so that the driving circuit 160 is hardly provided therein.

When the heat dissipation unit 110 is inverted for the indirect lighting of the structure described above, the upper portion should be larger in an inverted state. In this case, the air flow plane 113 is formed at 90 to 110 ° with respect to the bottom surface 112, preferably at 90 to 100 °. In this case, when the air flow plane 113 is greater than 110 ° with respect to the bottom surface 112, the heat dissipation unit 110 may interfere with each other when the heat dissipation unit 110 is separated into a plurality.

In addition, the heat dissipation unit 110 may incline the bottom surface 112 provided with the printed circuit board 120 having the plurality of LED elements 130 to adjust the direction of the light emitted from the LED element 130. have. To get more light towards the center, the outside goes further down (e.g., if the bottom 112 is greater than 90 ° with respect to the airflow plane 113), and if it spreads out more, the outside goes up (airflow). The lower surface 112 may be less than 90 degrees with respect to the surface 113).

The inclined surface 114 of the heat dissipation unit 110 may be formed in a circular or planar shape, but as shown in FIG. 3B, the printed circuit board 120 may be formed in a planar shape. Therefore, the heat dissipation unit 110 may be provided with a printed circuit board 120 not only on the lower surface 112 but also on the comb surface 114.

When used in direct illumination, the printed circuit board 120 is provided on the lower surface 112 of the heat dissipation unit as shown in FIG. 3A. When used in indirect lighting, the printed circuit board 120 is provided on the inclined surface 114 of the heat dissipation unit as shown in FIG. 3B. It is preferable to be. However, the present invention is not limited thereto, and the inverted bottom surface 112 provided with the printed circuit board 120 may be used for indirect lighting, or the printed circuit board 120 may be provided on both the lower surface 112 and the inclined surface 114 to be used as direct or indirect lighting. Can be.

In addition, the inclined surface 114 of the heat dissipation unit 110 may be provided with a heat dissipation fin to further improve the heat dissipation performance. At this time, the heat dissipation fins may be formed integrally with the heat dissipation unit or may be separately manufactured and combined, and the same as the material of the heat dissipation unit 110.

The heat dissipation unit 110 has a diffuser plate insertion unit 115 formed at a portion where the lower surface 112 and the inclined surface 114 are connected to each other so that the diffuser plate is inserted, and the inclined surface 114 and the air flow surface 113 are connected to each other. A base inserting portion 116 is formed at the base 150 and is connected to the base 150.

In addition, when the driving circuit is manufactured integrally, the driving circuit insertion unit 117 is formed in the space inside the heat dissipation unit 110 to insert the driving circuit 160. The driving circuit inserting portion 117 is formed with a groove similar to the thickness of the printed circuit board of the driving circuit 160, and may be fixed by being inserted into the driving circuit 160 or fixed by an adhesive or the like. When the driving circuit 160 is shorter in length than the heat dissipation unit 110, the driving circuit 160 does not move in the longitudinal direction by using an adhesive or the like. Therefore, when designing the driving circuit 160, it is preferable not to arrange components and wiring at the outermost side.

The heat dissipation unit 110 formed in the longitudinal direction is preferably manufactured by extrusion to manufacture a variety of lengths, such as 1198 ± 1.5mm, 580 ± 1.5mm, 330 ± 1.5mm.

The material of the heat dissipation unit 110 may be any one selected from iron, aluminum, aluminum alloy, copper, copper alloy, stainless steel, nickel, and tin, and any material may be used as long as the material can emit heat.

Although the cross section of the heat dissipation unit 110 is illustrated as a closed curve, the technical idea of the present invention in which the central portion is separated to maximize the heat dissipation performance of the heat dissipation unit is not limited to the closed curve.

The printed circuit board 120 may include a plurality of LED elements 130 and may be formed in the longitudinal direction in the same manner as the heat radiating unit 110.

In addition, the printed circuit board 120 is preferably attached to the heat dissipation unit 110, it is preferable to use a flexible printed circuit board (Flexible PCB) that can easily adjust the length.

The printed circuit board 120 is preferably attached to the desired surface in the heat dissipation unit 110 with a double-sided adhesive having excellent thermal conductivity. In addition, the bolt may be fixed to reinforce the fixing, but the tab should be formed on the heat dissipation unit 110.

The diffusion plate 140 may diffuse and diffuse light emitted from the LED device 130 at various angles.

The diffusion plate 140 is provided with a fitting portion 141, the fitting portion 141 is coupled to the diffusion plate inserting portion 115 of the heat dissipation portion 110. Since the diffusion plates 140 are fastened to each of the heat sinks 111 of the heat dissipation unit 110 separated from each other at predetermined intervals, the diffusion plates 140 are also disposed to be spaced at predetermined intervals.

Since the diffusion plate 140 is inserted into the diffusion plate insertion unit 115, the diffusion plate 140 is provided on the front surface of the lower surface 112 of the heat dissipation unit 110 and is formed in the longitudinal direction in the same manner as the heat dissipation unit 110. The diffusion plate 140 may be formed to be slightly shorter than the heat radiating unit 110 because the heat radiating unit fitting part 151 of the base 150 is fitted to the diffusion plate inserting unit 115.

When the LED lamp 100 is used in direct or indirect lighting, the diffuser plate 140 is provided on the front surface of the lower surface 112 of the heat dissipation unit 110 (FIG. 3a). Although the diffusion plate 140 may or may not be provided on the front surface of the lower surface 112, the diffusion plate 140 may not be provided (FIG. 3B).

The diffusion plate 140 may be formed of one selected from a prism, a barrier wall, a lens, and a reflection plate in addition to the diffusion plate.

The base 150 is mounted on a socket to which a conventional fluorescent lamp is mounted, and is provided to surround one surface of the heat dissipation unit 110 (FIG. 3B) or the heat dissipation unit 110 and the diffusion plate 140 (FIG. 3A). The power is supplied from the power terminal 154 to supply power to the LED device 130. The base 150 generally uses the G13 standard, and in the case of a straight tube, two bases 150 are used on both sides. If the type of lamp (P type) is changed, the tube size and the type of base change. In this case, the description will be made based on the T8 and G13 fluorescent lamps, but the technical spirit of the present invention is not limited thereto.

The shape of the base 150 has a heat dissipation unit 110 or a heat dissipation unit 110 or the heat dissipation unit 110 and the diffuser plate 140 so as to surround the inside of the heat dissipation unit 110 or the heat dissipation unit 110 and the diffusion plate 140. It is preferable that it is the same as the cross-sectional outline of the combined state. The base 150 is preferably a space in which the pin is located in addition to the case in which the heat radiation unit 110 is provided with a pin that can be applied to the power source for the connection with the wire.

The base 150 has a heat dissipation part 151 and a beam 152 formed to protrude to the inner surface of the base, and the outer surface of the base 150 has the same height as the heat dissipation part 151 and the beam 152. Frame 156 is formed.

The beam 152 provided on the base 150 is formed to protrude on the inner surface of the base, and is provided with an insertion groove 155 that can support a part of the lower surface 112 of each of the heat dissipating parts 110 coupled thereto. A space in which the pin and the wire can move is formed, and the heat dissipation unit 110 is stably fixed.

When the beam 152 couples the base 150 to the heat dissipation unit 110, the space is formed because the inner surface of the base 150 and the heat dissipation unit 110 stop before contacting the heat dissipation unit 110. The base 150 may further include a beam between the beams 152 provided above and below for increasing the strength or waterproofing, dustproofing, and the like. Here, the inner surface of the base 150 refers to a surface provided with the heat dissipation part fitting portion 151. When the heat dissipation unit 110 is provided in the beam 152, the adhesive is applied to the beam 152 to be combined with the heat dissipation unit 110.

In addition, the heat dissipation part fitting part 151 provided on the base 150 is fitted to the base inserting part 116 and the diffusion plate inserting part 115 of the heat dissipating part 110 and coupled with the heat dissipating part 110.

In addition, the diffusion plate support part 153 provided on one side of the base 150 is provided to protrude more than the frame 156 to support the bottom surface of the diffusion plate 140, for example, where light emitted from the LED element 130 passes. The fixing plate 140 is fixed so as not to fall. At this time, the diffusion plate 140 is fitted into the diffusion plate insertion portion 115 of the heat dissipation portion of the radiating plate 140 is fixed primarily, and is fixed secondary by the diffusion plate support portion 153 of the base. It is also possible to use an adhesive to make it more secure here.

LED light 100 of the present invention is a heat dissipation unit 110 and the base 150, the heat dissipation unit 110 and the diffusion plate 140 and the waterproofing unit 110 and the base 150 and the diffusion plate 140 for the waterproof It can be filled with waterproof and dustproof member.

4 is a bottom perspective view of the LED lamp of the present invention.

As shown in Figure 4, the LED lamp 100 of the present invention is a heat dissipation unit (not shown) and the diffusion plate 140 is disposed so as to be spaced apart at a predetermined interval is formed a passage through which air can flow. In general, the flow of air by convection is upward from the ground surface so that the air flows naturally from the bottom of the LED lighting lamp 100 to the bottom, and the heat dissipation area is maximized because the area of the heat dissipation part is maximized.

The LED lamp 100 of the present invention is excellent in heat dissipation performance even if provided in any direction because a passage through which air flows from the bottom is formed even if provided horizontally or vertically with respect to the ceiling.

The specific parts of the present invention have been described in detail above, and for those skilled in the art, these specific descriptions are merely preferred embodiments, and the scope of the present invention is not limited thereto. It is apparent to those skilled in the art that various changes and modifications can be made within the scope and spirit of the art, and such variations and modifications are within the scope of the appended claims.

1 is a perspective view of a conventional LED lamp,

2 is a perspective view of a conventional LED lamp,

Figure 3a is an exploded perspective view of an LED lamp according to a preferred embodiment of the present invention,

Figure 3b is an exploded perspective view of the LED lamp according to another embodiment of the present invention,

4 is a bottom perspective view of the LED lamp of the present invention.

** Description of the major symbols in the drawings **

10: LED light (conventional) 1: Housing (conventional)

2: LED (conventional) 3: Substrate cover (conventional)

4: LED cover (conventional) 20: LED light (conventional)

21: PCB (conventional) 22: Heat sink (conventional)

23: wing part (conventional) 24: protective cover (conventional)

100: LED light 110: heat dissipation unit

111: heat sink 112: lower surface

113: airflow plane 114 inclined plane

115: diffuser plate insertion portion 116: base insertion portion

117: drive circuit inserting portion 120: printed circuit board

130: LED element 140: diffuser plate

141: fitting portion 150: base

151: heat sink fitting portion 152: beam

153: diffuser plate support 154: power supply terminal

155: insertion groove 156: frame

160: drive circuit

Claims (19)

In the LED lamp which can be connected to the fluorescent lamp socket, A plurality of heat dissipation parts separated from each other at predetermined intervals; A printed circuit board provided on one surface of the heat dissipation unit and provided with a plurality of LED elements; Is provided on one side or both sides of the heat dissipation unit, and includes a base connected to the fluorescent lamp socket to receive power, The heat dissipation unit is an LED lamp having a shape corresponding to the glass tube of the fluorescent lamp. The method of claim 1, The heat dissipation unit is provided with two so as to be spaced apart at a predetermined interval, LED lighting lamp having a shape corresponding to a portion of the glass tube of the fluorescent lamp. The method of claim 1, The cross section of the heat dissipating unit is a semi-circular, rectangular, fan-shaped or polygonal shape LED lighting. The method of claim 1, The heat dissipation unit is separated into a form comprising a lower surface, the air flow surface connected to one side of the lower surface and the comb surface formed on one side of the lower surface and the air flow surface. The method of claim 4, wherein LED lighting lamp is formed in the air flow plane with respect to the lower surface 70 to 110 °. The method of claim 4, wherein LED lighting lamp is formed in the air flow plane with respect to the lower surface 70 to 90 °. The method of claim 4, wherein LED lighting lamp is formed in the air flow plane 90 to 110 ° with respect to the lower surface. The method of claim 4, wherein LED lighting lamp is provided on the lower surface of the printed circuit board is provided with a plurality of LED elements. The method of claim 4, wherein LED lighting lamp having a plurality of LED elements is provided on the inclined printed circuit board. The method of claim 4, wherein LED lighting lamp provided with a heat radiation fin on the inclined surface. The method of claim 4, wherein LED lighting lamp is formed in the diffusion plate insert portion is connected to the lower surface and the inclined surface. The method of claim 1, The heat dissipating part is an LED lamp having a driving circuit insert formed therein. The method of claim 1, The base is an LED lamp having a beam formed to protrude. The method according to any one of claims 1 to 13, LED lighting lamp further provided with a driving circuit in the heat dissipation unit. The method of claim 14, LED lighting lamp is further provided on the front of the heat dissipation unit. The method according to any one of claims 1 to 13, LED lighting lamp is further provided on the front of the heat dissipation unit. The method of claim 14, The base is an LED lamp provided on both sides to surround the side of the heat dissipation unit and the diffusion plate. The method of claim 16, The base is an LED lamp having a diffusion plate support on one side. The method of claim 17, LED lamps filled with a waterproof and dustproof member between the heat dissipation unit and the base, the heat dissipation unit and the diffusion plate, and the base and the diffusion plate.

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