KR20110043809A

KR20110043809A - Substrate for probe card and method for manufacturing the same

Info

Publication number: KR20110043809A
Application number: KR1020090100494A
Authority: KR
Inventors: 김형익
Original assignee: (주) 미코티엔
Priority date: 2009-10-22
Filing date: 2009-10-22
Publication date: 2011-04-28

Abstract

A method of manufacturing a substrate for a probe card includes preparing a ceramic disk, forming a conductive hole penetrating the upper and lower surfaces of the ceramic disk, filling a conductive paste with an adhesive paste, and filling a conductive hole with an adhesive paste. Inserting a conductive pin to the top, and curing the adhesive paste to fix the conductive pin in the state in which the conductive pin is inserted. Therefore, the adhesive paste is completely filled in the conductive holes to stably fix the conductive pins, thereby achieving uniform signal transmission.

Description

Substrate for probe card and method for manufacturing the same}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate for a probe card and a method of manufacturing the same, and more particularly, to a substrate for a probe card having a conductive pin for signal transmission, such as a space transformer, an interposer, and the like.

In general, a semiconductor device includes a Fab process for forming an electrical circuit including electrical devices on a silicon wafer used as a semiconductor substrate, and an EDS (electrical) for inspecting electrical characteristics of the semiconductor devices formed in the fab process. die sorting) and a package assembly process for encapsulating and individualizing the semiconductor devices with an epoxy resin.

The EDS process is performed to determine a defective semiconductor device among the semiconductor devices. The EDS process is performed using an inspection apparatus called a probe card. The probe card applies an electrical signal while the probe is in contact with a pad of the semiconductor elements, and determines a failure by a signal checked from the applied electrical signal.

Among the components constituting the probe card includes a probe card substrate for transmitting a test signal between the upper and lower surfaces, and the probe card substrate may be used in a single layer or multiple layers. For example, the substrate for the probe card is based on a ceramic disk, and may be used for a space transformer, an interposer, or the like.

The substrate for the probe card has a conductive pin (conductive terminal) penetrating through the ceramic disk to transmit a signal between the upper and lower surfaces, and if the conductive pin is not fixed securely or is not installed at the correct height, accurate signal transmission. There is this difficult problem.

Accordingly, there is a demand for a probe card substrate and a method of manufacturing the same, which can secure the conductive pin more stably, ensure the reliability of signal transmission, and have excellent workability.

Accordingly, one problem to be solved by the present invention is to provide a method for manufacturing a substrate for a probe card, which can stably fix a conductive pin and improve reliability of signal transmission, and has excellent workability.

In addition, another problem is to provide a substrate for a probe card in which the conductive pin is stably fixed and the reliability of signal transmission is improved.

In order to achieve the above object, a method of manufacturing a substrate for a probe card according to an embodiment of the present invention includes preparing a ceramic disk, forming a conductive hole penetrating the upper and lower surfaces of the ceramic disk, and in the conductive hole Filling an adhesive paste, inserting a conductive pin into an upper end of the conductive hole in which the adhesive paste is filled, and curing the adhesive paste to fix the conductive pin while the conductive pin is inserted. Include.

At this time, in the method of manufacturing a substrate for a probe card according to an embodiment, the conductive pin may have a head portion to be caught on an upper end of the conductive hole.

In the method of manufacturing a substrate for a probe card according to another embodiment, the conductive hole may be formed to have a stepped top, and may be inserted such that the head portion of the conductive pin is caught on the stepped step.

In addition, the conductive pin may be a portion of the head portion protrudes to the upper surface of the ceramic disk when the head portion is inserted to the stepped.

In addition, the adhesive paste may include an epoxy resin or a silicone resin, and the curing of the adhesive paste may be performed in a temperature range of room temperature to 200 ° C. Alternatively, the adhesive paste may include a conductive metal, and curing of the adhesive paste may be performed in a temperature range of 800 ° C. to 900 ° C.

In another embodiment, a method of manufacturing a substrate for a probe card may further include inserting a second conductive pin into a lower end of the conductive hole filled with the adhesive paste.

In a method of manufacturing a substrate for a probe card according to another embodiment, the conductive pin may have a first head portion to be caught by an upper end of the conductive hole, and the second conductive pin may have a second head portion to be caught by a lower end of the conductive hole. have.

In the method of manufacturing a substrate for a probe card according to another embodiment, the conductive holes are formed to have first and second stepped tops and bottoms, respectively, so that the first head portion of the conductive pin is caught by the first stepped end. The second head portion of the second conductive pin may be inserted to be inserted into the second step.

The conductive pin may include a portion of the first head portion protruding from an upper surface of the ceramic disk when the first head portion is inserted into the first step, and the second conductive pin may be formed of the second head portion. A part of the second head portion protrudes from the lower surface of the ceramic disk when inserted to take two steps.

In addition, the adhesive paste may include a conductive epoxy resin or a conductive silicone resin, and curing of the adhesive paste may be performed at a temperature range of room temperature to 200 ° C. Alternatively, the adhesive paste may include a conductive metal, and curing of the adhesive paste may be performed in a temperature range of 800 ° C. to 900 ° C.

In the method of manufacturing a substrate for a probe card according to another embodiment, the sum of the length of the conductive pin and the length of the second conductive pin has a length smaller than the length of the conductive hole.

In order to achieve the above object, a substrate for a probe card according to an embodiment of the present invention includes a ceramic disk, a conductive pin, and an adhesive layer. The ceramic disk has conductive holes penetrating the upper and lower surfaces. The conductive pin is inserted into the upper end of the conductive hole and has a head portion to be caught by the upper end of the conductive hole. The adhesive layer is filled in the conductive hole and fixes the conductive pin, and has a cured state.

At this time, the conductive hole in the probe card substrate according to an embodiment may have a stepped by the head portion is inserted into the upper end.

In addition, the conductive pin is a portion of the head portion protrudes to the upper surface of the ceramic disk when the head portion is inserted so as to catch the step, and the other end portion of the conductive pin located opposite the head portion is the lower surface of the ceramic disk Protrudes.

In another embodiment, the probe card substrate further includes a second conductive pin inserted into the lower end of the conductive hole and having a second head portion to be caught by the lower end of the conductive hole.

In the substrate for a probe card according to another embodiment, the conductive hole may have a first step of the head part inserted and caught at an upper end, and a second step of the second head part inserted into the lower end.

In addition, the conductive pin is a portion of the head portion protrudes to the upper surface of the ceramic disk when the head portion is inserted to the first step, the second conductive pin is the second head is caught by the second step Part of the second head portion protrudes from the lower surface of the ceramic disk when inserted.

In the substrate for a probe card according to another embodiment, the sum of the length of the conductive pin and the length of the second conductive pin has a length smaller than the length of the conductive hole.

As described above, according to the method for manufacturing a substrate for a probe card according to the present invention, after filling an adhesive paste into a conductive hole of a ceramic disk, a conductive pin is inserted, and after the conductive pin is inserted, the adhesive paste is cured to fix the conductive pin. Therefore, since the conductive pin is inserted into the conductive hole filled with the adhesive paste, the adhesive paste is completely filled without a space between the conductive hole and the conductive pin, thereby stably fixing the conductive pin.

In addition, since the head portion of the conductive pin is fixed to the upper end of the conductive hole, workability is improved, and the insertion degree of the conductive pin can be uniformly processed without a separate planarization process for uniformly inserting the conductive pin. . Therefore, the manufacturing process can be simplified, the productivity can be improved, and the manufacturing cost can be reduced. In addition, it is possible to easily improve the contact reliability of the head portion by forming the head portion to protrude fine.

Hereinafter, a probe card substrate and a method of manufacturing the same according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. Like reference numerals are used for like elements in describing each drawing. In the accompanying drawings, the dimensions of the structures are shown in an enlarged scale than actual for clarity of the invention. The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described on the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, parts, or combinations thereof. Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

1 is a cross-sectional view schematically showing a substrate for a probe card according to a first embodiment of the present invention.

Referring to FIG. 1, the probe card substrate 100 may include a ceramic disk 110, a conductive pin 120, and an adhesive layer 130. Here, the probe card substrate 100 is a member used for signal transmission in the probe card, and may be, for example, a substrate used in a space transformer, an interposer, or the like. In addition, the probe card substrate 100 may be applied to a substrate having terminals (or contacts) on two planes and transferring signals between the two planes.

The ceramic disk 110 has a flat plate shape and has a size proportional to the size of an inspection object (eg, a silicon wafer). The thickness of the ceramic disk 110 may be formed to have a range of about 5 mm to 10 mm. However, the thickness of the ceramic disk 110 is not limited to the above range, and may have a thickness of 5 mm or less or 10 mm or more in some cases. The ceramic disc 110 is made of a ceramic material, and examples of the ceramic material may include aluminum nitride (AlN) and aluminum oxide (Al ₂ O ₃ ). The material of the ceramic disk 110 is mainly used aluminum nitride (AlN).

The ceramic disk 110 has a conductive hole 112 penetrating the upper and lower surfaces. The ceramic disk 110 has one or more conductive holes 112 and generally has a plurality of conductive holes 112. In the present embodiment, the conductive hole 112 may have a stepped 113 at an upper end thereof. The stepped 113 may be obtained by forming a portion of the upper end of the conductive hole 112 to have a relatively large diameter.

The conductive pin 120 is inserted into the conductive hole 112 of the ceramic disk 110. The conductive pin 120 is formed to penetrate the ceramic disk 110, and serves as a conductive member that substantially transmits a signal between the upper and lower surfaces of the ceramic disk 110. Therefore, the conductive pin 120 may be made of a conductive material. For example, the conductive pin 120 may be brass, beryl copper, copper, nickel, kovar, invar, or the like. In addition, the conductive pin 120 may be plated to prevent oxidation, and examples of the plating material may include gold. In the present embodiment, the conductive pin 120 may have a head 122 at one end thereof to be caught by the step 113 of the conductive hole 112. Accordingly, the conductive pin 120 is inserted into the predetermined depth without being inserted anymore because the head portion 122 is caught by the step 113. In the state where the conductive pin 120 is inserted such that the head 122 is caught by the step 113, it is preferable that a part of the head 122 protrudes finely to the surface (eg, the upper surface) of the ceramic disc 110. Do. Therefore, it is preferable that the thickness of the head 122 has a value slightly larger than the depth of the step 113. As such, the head 122 may be minutely protruded from the surface of the ceramic disk 110, so that the conductive pin 122 may stably contact the members providing the signal, thereby improving signal transmission efficiency. The head 122 and the step 113 have shapes corresponding to each other. The stepped 113 is preferably formed in a horizontal plane shape as shown in the drawing because the head 122 can be stably hung. The conductive pin 120 is formed such that the other end portion located at the opposite side of the one end where the head portion 122 is formed is minutely protruded to the lower surface of the ceramic disk 110. Part of the other end of the conductive pin 120 is formed to protrude is preferable for the same reason that the head portion 122 is formed to be minutely projected.

The adhesive layer 130 is filled in the conductive hole 112. Accurately, the adhesive layer 130 is filled between the conductive pin 120 and the conductive hole 112. The adhesive layer 130 serves to fix the conductive pin 120. The adhesive layer 130 is formed by curing the adhesive paste. Therefore, the adhesive layer 130 has a cured state. The adhesive layer 130 may have conductive or non-conductive properties. For example, the adhesive layer 130 may include an epoxy resin or a silicone resin, or may include a conductive metal. In this case, the epoxy resin may be a conductive epoxy resin or a non-conductive epoxy resin, and the silicone resin may be a conductive silicone resin or a non-conductive silicone resin. Examples of the conductive metal may include silver (Ag), silver-palladium (Ag-Pd) alloy, and the like, but are not limited thereto. When the adhesive layer 130 is made of a conductive material, the adhesive layer 130 serves to fix the conductive pin 120 and to assist the conductive pin 120 to transmit an electrical signal.

As such, the stepped 113 is formed at the upper end of the conductive hole 112, and the conductive pin 120 has the head portion 122 to be caught by the stepped 113, thereby electrically conducting the conductive pin 120. It is possible to insert and install in the hole 112. Therefore, since it is possible to omit a separate planarization process for adjusting the height of the conductive pin 120, workability is improved.

Hereinafter, a method of manufacturing the probe card substrate 100 will be described with reference to the drawings.

2 is a schematic process flowchart illustrating a method of manufacturing a substrate for a probe card shown in FIG. 1, and FIGS. 3A to 3E are schematic process diagrams for describing a method of manufacturing the substrate for a probe card of FIG. 2.

2 and 3A, in the method of manufacturing a substrate for a probe card, first, a ceramic disk 110 is prepared. (S110) The ceramic disk 110 may have a size corresponding to a silicon wafer as an inspection target. And the thickness ranges from about 5 mm to 10 mm. For example, the ceramic disk 110 may be prepared as a disk in a semi-sintered state to facilitate the formation of the conductive holes 112 to be performed in the next step. Since the ceramic has good workability in the semi-sintered state, it is preferable to prepare the ceramic disk 110 in the semi-sintered state.

2 and 3B, conductive holes 112 penetrating the upper and lower surfaces are formed in the prepared ceramic disk 110. (S120) In general, a plurality of conductive holes 112 are formed in the ceramic disk 110. The number of the conductive holes 112 to be formed is not limited and may be variously changed in some cases. In the present embodiment, the conductive hole 112 may be formed to have a stepped 113 at an upper end thereof. The step 113 is formed at a predetermined depth from the upper surface of the ceramic disk 110. For example, the conductive hole 112 may be formed by drilling. Since the ceramic disk 110 is in a semi-sintered state with good workability, the drill hole may form a conductive hole 112 having a small size or a fine pitch. Contrary to the above, the formation of the conductive hole 112 is not limited to drilling, and other methods may be used.

When the conductive holes 112 are formed in the ceramic disk 110, the ceramic disk 110 is sintered in a semi-sintered state. The sintering process may vary depending on the type of ceramic used for the ceramic disc 110. For example, aluminum oxide (Al ₂ O ₃ ) may be sintered in a Wet hydrogen (H ₂ ) atmosphere at a temperature of about 1600 ° C. to 1650 ° C. In the case of aluminum nitride (AlN), sintering may be performed in a nitrogen (N ₂ ) gas atmosphere at a temperature of about 1750 ° C. to 1850 ° C.

2 and 3C, after the conductive hole 112 is formed in the ceramic disk 110, the adhesive paste 132 is filled in the conductive hole 112. (S130) Here, the adhesive paste 132 is formed. It is preferable to fill in only the region except the step 113 region. When the adhesive paste 132 is filled up to the stepped 113 area, the adhesive paste 132 is interposed between the head 122 and the stepped 113 of the conductive pin 120, so that the conductive pin 120 is accurately positioned. It is not desirable to insert it. That is, the adhesive paste 132 is filled in the conductive hole 112 region from the lower end of the step 113 to the lower surface of the ceramic disk 110.

The adhesive paste 132 may have conductive or non-conductive properties. For example, the adhesive paste 132 may include an epoxy resin or a silicone resin. Wherein the epoxy resin and the silicone resin can be conductive or non-conductive. Alternatively, the adhesive paste 132 may include a conductive metal, and examples of the conductive metal may include silver (Ag), silver-palladium (Ag-Pd) alloy, and the like. The conductive metal is not limited to the examples mentioned.

2, 3D and 3E, the conductive pin 120 is inserted into the upper end of the conductive hole 112 in which the adhesive paste 132 is filled (S140). Since the head portion 122 is caught by the (), the conductive pin 120 is no longer inserted when the head portion 122 is caught on the step 113. Therefore, since the conductive pin 120 is inserted to the correct position through the simple process of inserting the conductive pin 120 until the head 122 is caught on the step 113, the conductive pin 120 for inserting at a uniform height Will be easier to insert. In addition, since the conductive pin 120 is inserted into the conductive hole 112 in the state where the adhesive paste 132 is filled, the conductive pin 120 is inserted while applying pressure to the adhesive paste 132. Therefore, the adhesive paste 132 is completely filled between the conductive pins 120 and the conductive holes 112 with no empty space.

Since the thickness of the head 122 in the conductive pin 120 has a thickness slightly larger than the depth of the step 113, when the head part 122 is inserted to be caught by the step 113, the head part 122 is disposed. A portion of the head portion 122 protrudes finely to the upper surface of the ceramic disk 110. In addition, the conductive pin 120 is formed to have a length such that a part of the other end positioned on the opposite side of the one end where the head portion 122 is formed may be minutely protruded to the lower surface of the ceramic disk 110. The head 122 and the other end of the conductive pin 120 are minutely projected to the upper and lower surfaces of the ceramic disk 110, respectively, so that the conductive pin 120 can be stably contacted.

When the insertion of the conductive pin 120 is completed, the adhesive paste 132 filled between the conductive hole 112 and the conductive pin 120 is cured in order to fix the conductive pin 120. (S150) Adhesive paste The curing method for 132 may vary depending on the type of material of the adhesive paste 132. For example, when the adhesive paste 132 includes an epoxy resin or a silicone resin, the curing process is performed at a temperature ranging from room temperature to about 200 ° C. In other words, the adhesive paste 132 of an epoxy resin or a silicone resin is naturally cured at room temperature, or cured by applying a relatively low temperature of about 200 ° C. or less. As another example, when the adhesive paste 132 includes a conductive metal, the curing process is performed at a temperature range of about 800 ° C to 900 ° C. The curing process for the conductive paste 132 of the conductive metal is preferably performed at a temperature of about 850 ℃.

The adhesive layer 130 is formed by performing a curing step on the adhesive paste 132 as described above. The adhesive layer 130 serves to fix the conductive pin 120. In addition, the adhesive layer 130 formed based on the conductive adhesive paste 132 has conductivity, and serves as a conductive member that transmits an electrical signal by assisting the conductive pin 120. At this time, since the adhesive layer 130 has a structure completely filled in the conductive hole 112 without empty space, the adhesive layer 130 has a constant impedance and uniformity in signal transmission efficiency.

On the other hand, in the description of the probe card substrate 100 and the manufacturing method thereof, the conductive hole 112 has a stepped 113 at the top, the conductive pin (112) to the top of the conductive hole 112 formed with the stepped 113 120) is described as being inserted. However, the step 113 may be formed at the lower end of the conductive hole 112, and the conductive pin 120 may be inserted into the lower end of the conductive hole 112.

4 is a cross-sectional view schematically showing a substrate for a probe card according to a second embodiment of the present invention.

Referring to FIG. 4, the probe card substrate 200 may include a ceramic disk 210, a conductive pin 220, and an adhesive layer 230.

Except that the conductive hole 212 of the ceramic disk 210 does not have a step, the description of the ceramic disk 210, the conductive pin 220, and the adhesive layer 230 is described in FIG. 1. The disk 110, the conductive pin 120 and the adhesive layer 130 is substantially the same as the description.

Therefore, in the probe card substrate 200 according to the present embodiment, the conductive pin 220 has a head portion 222, and the conductive pin 220 is electrically conductive so that the head portion 222 is caught by the upper end of the conductive hole 212. It is inserted into the hole 212. That is, the conductive pin 220 is inserted into the conductive hole 212 so that the head portion 222 is caught by the upper surface of the ceramic disk 210 around the upper end of the conductive hole 212. As such, the conductive pin 220 is inserted into the conductive hole 212 by a predetermined depth by the head part 222.

In the method of manufacturing the probe card substrate 200 illustrated in FIG. 4, except that the conductive hole 212 has no step, the probe card substrate 100 described above with reference to FIGS. 2 and 3A to 3E is described. Is substantially the same as the method of preparation.

5 is a schematic cross-sectional view of a substrate for a probe card according to a third embodiment of the present invention.

Referring to FIG. 5, the probe card substrate 300 may include a ceramic disk 310, a first conductive pin 320, a second conductive pin 330, and an adhesive layer 340.

The ceramic disk 310 has a flat shape and has a size proportional to the size of an inspection object (eg, a silicon wafer). The thickness of the ceramic disk 310 may be formed to have a range of about 5 mm to 10 mm. However, the thickness of the ceramic disk 110 is not limited to the above range, and may have a thickness of 5 mm or less or 10 mm or more in some cases. The ceramic disc 310 is made of a ceramic material, and examples of the ceramic material may include aluminum nitride (AlN) and aluminum oxide (Al ₂ O ₃ ). The material of the ceramic disk 310 is mainly used aluminum nitride (AlN).

The ceramic disk 310 has a conductive hole 312 penetrating the upper and lower surfaces. The ceramic disk 310 has one or more conductive holes 312 and generally has a plurality of conductive holes 312. In the present exemplary embodiment, the conductive hole 312 may have a first step 313 at the top and a second step 314 at the bottom. The first and second stepped portions 313 and 314 may be obtained by forming upper and lower portions of the first and second step portions, respectively, having a relatively large diameter.

The first conductive pin 320 is inserted into the conductive hole 312 of the ceramic disk 310. In detail, the first conductive pin 320 is inserted into the upper end of the conductive hole 312. In the present embodiment, the first conductive pin 320 may have a first head portion 322 at one end thereof to be caught by the first step 313 of the conductive hole 312. Accordingly, since the first head 322 is caught by the first step 313, the first conductive pin 320 is inserted to a predetermined degree without being inserted anymore. Here, the first conductive pin 320 is inserted in such a way that the first head portion 322 is caught to the first step 313, a part of the first head portion 322 to the upper surface of the ceramic disk 310. It is preferable to protrude finely. To this end, the thickness of the first head portion 322 has a thickness slightly larger than the depth of the first step 313. Since the first head part 322 protrudes finely, contact reliability is improved. The first head portion 322 has a shape corresponding to the first step 313 and is formed to be stably hung.

The second conductive pin 330 is inserted into the conductive hole 312 of the ceramic disk 310. In detail, the second conductive pin 330 is inserted into the lower end of the conductive hole 312. In the present exemplary embodiment, the second conductive pin 330 may have a second head portion 332 at one end thereof to be caught by the second step 314 of the conductive hole 312. Therefore, since the second head 332 is caught by the second step 114, the second conductive pin 330 is inserted to a predetermined degree without being inserted anymore. Here, the second conductive pin 330 is inserted so that the second head portion 332 is caught by the second step 314, a part of the second head portion 332 is to the lower surface of the ceramic disk 310. It is preferable to protrude finely. To this end, the thickness of the second head portion 332 has a thickness slightly larger than the depth of the second step 314. Since the second head part 332 protrudes finely, contact reliability is improved. The second head part 332 has a shape corresponding to the second step 314 and is formed to be stably hung.

The first and second conductive pins 320 and 330 serve as conductive members for transmitting signals. Therefore, the first and second conductive pins 320 and 330 may be made of a conductive material, respectively. For example, the first and second conductive pins 320 and 333 may be brass, beryl copper, copper, nickel, kovar, invar, or the like. In addition, the first and second conductive pins 320 and 330 may be plated to prevent oxidation, and examples of the plating material may include gold.

Meanwhile, the ends of the first and second conductive pins 320 and 330 inserted into the conductive holes 312 may be spaced apart from each other by a predetermined interval. If the lengths of the first and second conductive pins 320 and 330 are too long, the first and second conductive pins 320 and 330 may not be inserted to be caught by the first and second steps 313 and 314. In addition, although the ends of the first and second conductive pins 320 and 330 may be formed in contact with each other, in this case, the first and second conductive pins 320 and 330 apply pressure to each other by a flow, thereby forming a conductive hole. There is a risk of separation from 312. Therefore, for this purpose, the sum of the lengths of the first and second conductive pins 320 and 330 is formed to have a length smaller than the length of the conductive hole 312, thereby forming the first and second conductive pins 320 and 330. It is preferred that the ends are spaced apart. In addition, since the first and second conductive pins 320 and 330 are spaced apart from each other, the transmission of an electrical signal is made by the adhesive layer 340 interposed between the first and second conductive pins 320 and 330. In other words, an electrical signal applied to the first conductive pin 320 is transferred to the second conductive pin 330 through the adhesive layer 340, and conversely, from the second conductive pin 330 to the first conductive pin 320. Even when the signal is transmitted, the signal is transmitted through the adhesive layer 340.

The adhesive layer 340 is filled in the conductive hole 312. That is, the adhesive layer 340 is filled between the first and second conductive pins 320 and 330 and the conductive hole 312. The adhesive layer 340 fixes the first and second conductive pins 320 and 330, and also serves as a medium for transmitting an electrical signal between the first and second conductive pins 320 and 330. Thus, the adhesive layer 340 includes a conductive material. For example, the adhesive layer 340 may include a conductive epoxy resin or a conductive silicone resin, or may include a conductive metal. Examples of the conductive metal may include silver (Ag), silver-palladium (Ag-Pd) alloy, and the like, but are not limited thereto. The adhesive layer 340 is formed by curing the adhesive paste. Thus, the adhesive layer 340 has a cured state.

As such, by using the first and second conductive pins 320 and 330 having the first and second head portions 322 and 332, the first and second conductive pins 320 and 330 are installed at a constant height. It is possible. Therefore, workability is improved by omitting a separate planarization process.

Hereinafter, a method of manufacturing the probe card substrate 300 will be described with reference to the drawings.

6 is a schematic process flowchart illustrating a method of manufacturing a substrate for a probe card shown in FIG. 5, and FIGS. 7A to 7E are schematic process diagrams for describing a method of manufacturing the substrate for a probe card of FIG. 6.

Here, the manufacturing method of the probe card substrate 300 shown in FIGS. 6 and 7A to 7E is similar to the manufacturing method of the probe card substrate 100 described above with reference to FIGS. 2 and 3A to 3E. Therefore, a brief description will be given of the differences.

6 and 7A, first, a ceramic disk 310 is prepared. (S210) For example, the ceramic disk 310 is semi-sintered to facilitate a process of forming a conductive hole 312 in a next step. Can be prepared as a disk in the state.

6 and 7B, conductive holes 312 penetrating the upper and lower surfaces are formed in the prepared ceramic disk 310. (S220) One or more conductive holes 312 are formed, and in general, the ceramic disk 310 is formed. A plurality of conductive holes 312 are formed therein. The number of the conductive holes 312 is not limited. In the present embodiment, the conductive hole 312 may be formed to have a first step 313 at the top and a second step 314 at the bottom. The first step 313 is formed at a predetermined depth from the upper surface of the ceramic disk 310, and the second step 314 is formed at a predetermined depth from the lower surface of the ceramic disk 310. The conductive hole 312 may be formed through, for example, drilling.

When the formation of the conductive holes 312 in the ceramic disk 310 is completed, the sintering process is performed on the ceramic disk 310 in a semi-sintered state to form a ceramic sintered body. The sintering process may vary depending on the type of ceramic used in the ceramic disk 310.

6 and 7C, the adhesive paste 342 is filled in the conductive hole 312 formed in the ceramic disc 310. (S230) Here, the first and second head parts 322 and 332 are accurately placed. It is preferable that the adhesive paste 342 is filled only in an area except for the first and second steps 313 and 314 so as to be caught by the first and second steps 313 and 314. Therefore, the adhesive paste 342 is preferably filled in a region between the first step 313 and the second step 314. The adhesive paste 342 includes a conductive material.

6, 7D and 7E, the first conductive pin 320 is inserted into the upper end of the conductive hole 312 in which the adhesive paste 342 is filled. (S240) In addition, the adhesive paste 342 Insert the second conductive pin 330 into the lower end of the conductive hole 312 is filled (S250) The order of inserting the first and second conductive pins (320, 330) into the conductive hole (312). The first conductive pin 320 and the second conductive pin 330 may be in the reverse order or the reverse order thereof, and the first and second conductive pins 320 and 330 may be simultaneously inserted.

The first conductive pin 320 is no longer inserted when the first head portion 322 is caught by the first step 313. Therefore, when the first conductive pin 320 is inserted until the first head 322 is caught by the first step 313, the first conductive pin 320 is inserted to the correct position. Will be easier to insert. The second conductive pin 330 is also substantially the same as the first conductive pin 320.

In addition, since the first and second conductive pins 320 and 330 are inserted into the conductive holes 312 in which the adhesive paste 342 is filled, the first and second conductive pins 320 and 330 are attached to the adhesive paste 342. It is inserted under pressure. Therefore, the adhesive paste 342 is completely filled between the first and second conductive pins 320 and 330 without empty space. In addition, the first and second conductive pins 320 and 330 are formed on the surface of the ceramic disk 310 while the first and second head portions 322 and 332 are caught by the first and second steps 313 and 314, respectively. As finely protrudes. Therefore, the first and second conductive pins 320 and 330 are in stable contact.

When the insertion of the first and second conductive pins 320 and 330 is completed, the first and second conductive pins 320 and 330 and the conductive holes may be fixed to fix the first and second conductive pins 320 and 330. The adhesive paste 342 filled between 312 is cured (S260). That is, the adhesive paste 142 is cured to form the adhesive paste 142 as a cured adhesive layer 130. The first and second conductive pins 320 and 330 are fixed. In addition, the adhesive layer 140 serves to transfer an electrical signal between the first and second conductive pins 320 and 330. The curing method of the adhesive paste 142 may vary depending on the type of material of the adhesive paste 342.

8 is a view schematically showing a substrate for a probe card according to a fourth embodiment of the present invention.

Referring to FIG. 8, the probe card substrate 400 may include a ceramic disk 410, a first conductive pin 420, a second conductive pin 430, and an adhesive layer 440.

Except that the conductive hole 412 of the ceramic disk 410 does not have a stepped portion, the ceramic disk 410, the first conductive pin 420, the second conductive pin 430, and the adhesive layer 440 may be formed on the ceramic disk 410. The description is substantially the same as the description of the ceramic disk 310, the first conductive pin 320, the second conductive pin 330 and the adhesive layer 340 shown in FIG.

Therefore, in the probe card substrate 400 of the present embodiment, the ceramic disk 410 has a conductive hole 412, and the first and second conductive pins 420 and 430 have the first and second head portions 422, respectively. , 432). The first conductive pin 420 is inserted such that the first head portion 422 is caught by the upper end of the conductive hole 412, and the second conductive pin 430 has the second head portion 432 formed by the conductive hole 412. Is inserted to take the bottom of the. In other words, the first conductive pin 420 is inserted into the conductive hole 412 such that the first head 422 is caught by the upper surface of the ceramic disk 410 around the upper end of the conductive hole 412, and the second conductive pin 420. 430 is inserted into the conductive hole 412 such that the second head portion 432 is caught by the lower surface of the ceramic disk 410 around the lower end of the conductive hole 412. As such, the first and second conductive pins 420 and 430 are inserted into the conductive holes 412 by a predetermined depth by the first and second head portions 422 and 432.

In the method of manufacturing the probe card substrate 400 illustrated in FIG. 8, except that the conductive hole 412 has no step, the probe card substrate 300 described above with reference to FIGS. 6 and 7A to 7E is described. Is substantially the same as the method of preparation.

As described above, according to the substrate for a probe card and a method of manufacturing the same, the adhesive paste is filled into the conductive hole and then the conductive pin is inserted into the conductive hole, so that the adhesive paste is completely filled without a blank space between the conductive pin and the conductive hole. Done. Therefore, the conductive pin can be stably fixed, and if the adhesive paste has conductivity, a uniform impedance is formed by full filling to secure uniformity of signal transmission.

In addition, since the head portion is formed in the conductive pin so that the degree of insertion is constant, the insertion degree of the conductive pin can be made uniform. In addition, a separate flat process for uniformizing the height of the conductive pin may be omitted. In addition, since the head portion is formed to protrude finely to the surface of the ceramic disk, it is possible to improve the contact reliability of the conductive pin.

Therefore, it is excellent in workability, a high contact reliability is required, a uniform impedance is formed, and can be preferably used for manufacturing a substrate for a probe card requiring reliability of transmission of an electrical signal.

While the foregoing has been described with reference to preferred embodiments of the present invention, those skilled in the art will be able to variously modify and change the present invention without departing from the spirit and scope of the invention as set forth in the claims below. I can understand that you can.

FIG. 2 is a schematic process flowchart illustrating a method of manufacturing a substrate for a probe card shown in FIG. 1.

3A to 3E are schematic process diagrams for describing a method of manufacturing a substrate for a probe card of FIG. 2.

FIG. 6 is a schematic process flowchart illustrating a method of manufacturing the substrate for a probe card shown in FIG. 5.

7A to 7E are schematic process diagrams for describing a method of manufacturing the substrate for a probe card of FIG. 6.

Explanation of symbols on the main parts of the drawings

100, 200, 300, 400: substrate for probe card

110, 210, 310, 410: ceramic disc

112, 212, 312, 412: conductive holes

113: step 313: first step

314: second step 120 and 220: conductive pin

122, 222: head 320, 420: first conductive pin

322, 422: first head portion 330, 430: second conductive pin

332 and 432: second head portions 130, 230, 340 and 440: adhesive layer

132, 342: adhesive paste

Claims

Preparing a ceramic disk;

Forming a conductive hole penetrating the upper and lower surfaces of the ceramic disk;

Filling an adhesive paste into the conductive hole;

Inserting a conductive pin into an upper end of the conductive hole filled with the adhesive paste; And

And curing the adhesive paste to fix the conductive pin in a state in which the conductive pin is inserted.

The method of claim 1, wherein the conductive pin has a head portion to be caught by an upper end of the conductive hole.

The method of claim 2, wherein the conductive hole is formed to have a stepped upper end, and the head is inserted into the stepped end so that the head portion of the conductive pin is caught.

4. The method of claim 3, wherein the conductive pin protrudes a part of the head portion from an upper surface of the ceramic disk when the head portion is inserted to the stepped portion. 5.

The method of claim 2, wherein the adhesive paste comprises an epoxy resin or a silicone resin, and the curing of the adhesive paste is performed at a temperature ranging from room temperature to 200 ° C. 4.

The method of claim 2, wherein the adhesive paste comprises a conductive metal, and curing of the adhesive paste is performed at a temperature in a range of 800 ° C. to 900 ° C. 4.

The method of claim 1, further comprising inserting a second conductive pin into a lower end of the conductive hole filled with the adhesive paste.

The method of claim 7, wherein the conductive pin has a first head portion to be caught on the upper end of the conductive hole,

The second conductive pin has a second head portion so as to be caught on the lower end of the conductive hole.

The method of claim 8, wherein the conductive hole is formed to have a first step and a second step at the top and bottom, respectively,

The first head portion of the conductive pin is inserted to the first step,

And a second head portion of the second conductive pin is inserted into the second step.

10. The method of claim 9, wherein the conductive pin protrudes a portion of the first head portion to the upper surface of the ceramic disk when the first head portion is inserted to the first step,

And a portion of the second head portion protrudes from the lower surface of the ceramic disk when the second conductive pin is inserted such that the second head portion is caught by the second step.

The method of claim 7, wherein the adhesive paste includes a conductive epoxy resin or a conductive silicone resin, and curing of the adhesive paste is performed at a temperature ranging from room temperature to 200 ° C. 9.

The method of claim 7, wherein the adhesive paste comprises a conductive metal, and curing of the adhesive paste is performed at a temperature in a range of 800 ° C. to 900 ° C. 9.

The method of claim 7, wherein the sum of the length of the conductive pin and the length of the second conductive pin has a length smaller than the length of the conductive hole.

A ceramic disk having conductive holes penetrating the upper and lower surfaces;

A conductive pin inserted into an upper end of the conductive hole and having a head part to be caught by an upper end of the conductive hole; And

A substrate for a probe card comprising a hardened adhesive layer filling the conductive hole and fixing the conductive pin.

15. The probe card substrate of claim 14, wherein the conductive hole has a stepped portion in which the head portion is inserted.

The method of claim 15, wherein the conductive pin is a portion of the head portion protrudes to the upper surface of the ceramic disk when the head portion is inserted to the stepped portion, the other end portion of the conductive pin which is located opposite to the head portion is A substrate for a probe card, characterized by protruding from a lower surface of a ceramic disk.

The probe card substrate of claim 14, further comprising a second conductive pin inserted into a lower end of the conductive hole and having a second head portion to be caught by the lower end of the conductive hole.

18. The probe card substrate of claim 17, wherein the conductive hole has a first step on which the head is inserted and is caught, and a second step on which the second head is inserted.

19. The method of claim 18, wherein the conductive pin is a portion of the head portion protrudes to the upper surface of the ceramic disk when the head portion is inserted so as to catch the first step,

The second conductive pin is a substrate for a probe card, characterized in that a part of the second head portion protrudes to the lower surface of the ceramic disk when the second head portion is inserted to catch the second step.

The probe card substrate of claim 17, wherein a sum of the length of the conductive pin and the length of the second conductive pin has a length smaller than the length of the conductive hole.