KR20110041865A - Metal-mask for various type - Google Patents

Abstract

The present invention relates to a metal mask for a release component that can further print the cream solder required for mounting a release component (connector, tuner, etc.) to be added on the PCB after the surface mounting operation is completed.

Conventional cream solder printing metal masks can be printed only on the flat surface where the component is not mounted, whereas the present invention can print the cream solder on the uneven surface to which the component is already attached, so that only the conventional solder or wave soldering method can be used. The soldering process of the release part that was used can be converted to reflow soldering.

Description

Metal Mask for Deformed Parts {Metal-mask for various type}

In the manufacturing process of an electronic circuit board, the use of surface-mounted components has various advantages such as increasing the mounting density per unit area to reduce the size of the finished product and improving the high frequency characteristics by the lead-free wiring process.

However, the adhesive strength of the components depends only on the copper foil surface joining surface of the substrate, which is unsuitable for the soldering process of large-weight parts, connectors, switches, etc., which are heavily weighted.

In general, the finished product of the electronic circuit board includes not only SMD components (surface mounting components) but also components to which external force is applied during operation of the finished product such as connectors, USB ports, and switches. The product is completed through the wave soldering process, which is inserted and soldered into molten lead.

Wave soldering is a method in which soldered SMD components pass through hot-melt solder ports so that the components deteriorate during the process, deform plastic parts, short the leads between narrow pitch parts, and expose only additional soldered parts. There are many problems such as the cost of the manufactured shielding jig and the increase of the man-hour.

In addition, the wave soldering process uses flux in the soldering pretreatment process, which requires a separate purification facility as an environmental regulatory substance.

Typical screen mask metal masks have a stencil formed on a thin sheet of stainless steel that can only be printed on a flat PCB surface.

The problem to be solved by the present invention is that it is possible to print a cream solder for further soldering a release component on a substrate already equipped with a SMD component (surface mounting component), thereby reflowing the wave soldering method of mounting the release component In order to solve the above problems by making possible to replace the soldering process.

Replacing the soldering process of the release component with the reflow method solves the problems of the wave soldering process listed, eliminating the need for purification equipment for the processing of volatile organic solvents, thereby reducing production costs, improving productivity, and improving product reliability. have.

The present invention relates to a metal mask for a release part configured to be able to print a cream solder on the pad surface on which the release part is to be mounted by escaping from the component protrusion of the PCB where the surface mounting work is completed, and the surface of the metal plate 10 having a predetermined thickness. The release part printing opening part 23 corresponding to the lead shape of the release part is formed, and the opening part 23 for release part printing adheres closely to the pad surface by escaping from the part already mounted in the surface mounting process on the back surface of the metal plate 10. It is characterized in that the engraved surface 28 is formed to be engraved.

The opening 23 for printing a release part has an opening formed to correspond to the lead shape of various parts such as the SD memory slot 24, the header pin 25, the HMI connector, and the D-SUB connector 27. The cream solder is supplied to the pad surface through the opening.

The metal mask for the release parts composed of the above characteristics can be printed on the PCB surface where the SMD parts are already attached, and the cream solder for mounting the release parts can be additionally printed, thus reflow soldering the soldering process of the release parts that were processed by the wave soldering method. To be replaced by

Hereinafter, with reference to the accompanying drawings will be described the configuration and function of the present invention.

1 is a perspective view showing an upper surface of a metal mask for a release part according to the present invention.

An opening 23 for printing a release part is formed in the metal plate 10 having a predetermined thickness (6 to 10 mm) and is coupled to the outer frame 11 so that the cream solder does not flow out of the plate 10 during the printing operation.

2 and 3 are detailed views of the back surface of the metal mask for release parts according to the present invention, and the structure of the escape surface 28 engraved on the back surface of the metal plate 10 and the opening 23 for printing the release part can be seen. .

The support surface 22 serves as a support for dedicating empty areas of the target PCB so that an appropriate distance suitable for printing is maintained between the mask and the PCB.

4 and 5 can compare the metal mask opening cut surface 40 for SMD and the opening cut surface 30 of the metal mask for a release part to which the present invention is applied.

Figure 6 is a detailed view of the PCB adhesion state 30 in the cream solder printing according to the present invention, the release part printing opening 23 escapes the SMD component 33 of the PCB 32, the surface mounting work is completed pad of the PCB The structure close to the surface 31 is shown.

1 is a perspective view showing an upper surface of a metal mask for a release part according to the present invention;

Figure 2 is a rear view of the metal mask for a release part according to the invention a

Figure 3 is a rear view of the metal mask for a release part according to the invention b

Figure 4 is an opening cutaway surface of a conventional metal mask for surface-mount components

5 is an opening cutaway side view of the metal mask for release parts according to the present invention. FIG. 6 is a close-up view of a printed circuit board mounted during cream solder printing using the metal mask for release parts according to the present invention.

Claims (1)

The printing openings corresponding to the lead shapes of the release parts are formed on the surface of the metal plate of a predetermined thickness so that the surface of the surface of the PCB may be creamed on the pad surface of the release part by escaping from the projected parts of the PCB. A metal mask for release parts, which is engraved on the back surface to form an engraved surface so that the printing opening is in close contact with the pad surface by escaping from the parts already mounted in the surface mounting process.

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