KR20110036192A - Integrated system and method for testing electronic component - Google Patents

Abstract

PURPOSE: An integrated electronic component testing device and method thereof are provided to easily compare reliability of components based on a test result. CONSTITUTION: At least two electronic components are mounted on a test jig(200). A test main body(100) includes a plurality of test measuring devices. A signal routing unit(300) changes a relay state to selectively transmit a signal between the test main body and the test jig. A test computer(500) selects a test measuring device according to the type of a test, changes the contact of the signal routing unit and evaluates the performance of a corresponding electronic component according to a test result to supply power or signals of the selected test measuring device to an electronic component.

Description

Integrated system and method for testing electronic component

The present invention relates to an integrated electronic component test apparatus and method thereof, and more particularly, to test the function and durability of various electrical / electronic components such as resistors, and to easily compare and analyze the reliability of each component based on the test results. An integrated electronic component test apparatus and a method thereof are provided.

In general, various instruments and signal generators are used to perform performance tests to verify the manufacturer's specifications of electrical / electronic components such as resistors and capacitors.

For example, in the case of measuring output ripple of a DC / DC converter, the oscilloscope is connected to a DC power supply that supplies the input power of the DC / DC converter and an electronic load that applies a load to the output. To measure the waveform of the output terminal.

In this case, the user must know and test the correct usage and test method for each instrument to obtain accurate results.

However, when testing the load regulation characteristics of the same component, the output voltage is measured using a high-precision multimeter instead of the oscilloscope. In addition, a separate thermo-hygrostat should be used for environmental test.

In other words, if the items to be measured differ, even for the same parts, the test environment and equipment must be separately configured.

In order to perform various characteristic tests of electrical / electronic components, it is necessary not only to understand the characteristics of the components, but also to master the usage of instruments and signal generators to be connected, and to test various characteristics of one component. It is cumbersome and time consuming, because different instruments must be connected in different ways for different characteristics of the part.

If the equipment in the laboratory where the test is conducted is replaced, a problem arises in that the investigator needs to further learn to use the new equipment. This means that technical personnel skilled in test equipment and test methods will have to work long hours.

If the type and quantity of parts to be tested and verified becomes large, this can be a costly and labor intensive task.

As a result, a typical manufacturer generally accepts a manufacturer's specification from a trusted component manufacturer and does not undergo separate testing or verification procedures.

However, in areas such as nuclear power plants and defense industries, abnormal behavior and quality deviations of components can lead to significant loss of property and personnel, requiring very high reliability.

This requires a separate quality process for the manufacturer's production process and, by itself or by an accredited certification body, verifies that the product meets the required quality. In this process, extensive tests on the function and reliability of the aforementioned electrical / electronic components are conducted. In some cases, various characteristic tests are performed on dozens of components and dozens of samples. Will be taken.

The problem to be solved by the present invention in view of the above problems is to prepare a test jig that can test a variety of electronic components at the same time, and to test the various electronic components at the same time by installing test equipment that can be selected and proceeded by selecting a variety of tests The present invention provides an integrated electronic component test apparatus and method thereof.

The integrated electronic component test apparatus according to the present invention for solving the above problems includes a test jig capable of mounting at least two electronic parts and an electrical characteristic by applying power or a signal to an electronic part mounted on the test jig. A test body including a plurality of test instruments to be tested, a signal routing unit capable of changing a relay state to selectively transmit signals between the test body and the test jig, and electronic components mounted to the test jig. Select the test instrument corresponding to the test type, change the contact point of the signal routing unit so that the power or signal of the selected test instrument is supplied to the electronic component, and input the test result of the test instrument measuring the test result. Test computers that evaluate the performance of their electronic components Including the emitter.

In addition, the integrated electronic component test method of the present invention comprises the steps of: a) mounting the electronic component to be tested on a test jig, selecting an electronic component mounted on the test jig from a database of a test computer, and b) in the step a). Selecting a test type for the selected electronic component and conducting a test; c) an appropriate test instrument is selected according to the test type, and a test signal of the test instrument is supplied to the electronic component mounted on the test jig Controlling the relay so as to control the relay; and d) receiving a test result of the electronic component supplied with the test signal from a test computer through the selected test instrument and evaluating characteristics of the electronic component.

The integrated electronic component test apparatus and method of the present invention mount various electronic components on a test jig, test each electronic component with a measuring unit including various measuring instruments, and analyze the performance of each of the electronic components based on the results. By configuring the temperature and humidity to increase the reliability of the test, the following effects can be obtained.

First, batch tests can be performed on the characteristics of electronic components, and the test can be performed even if there is a lack of expertise in test methods and instruments, reducing test time and eliminating the need for specialized personnel.

Second, all data acquired using the integrated electronic component test apparatus can be used as a basic data that can be used to increase the reliability and stability of electronic components used for the maintenance of nuclear power plants in the future.

Third, it is possible to select replacement parts of old or discontinued parts by comparing the characteristics of similar parts, and provide basic data to replace with more reliable parts.

Fourth, it is possible to improve the reliability of electronic components in nuclear power plants by analyzing component characteristic deviations through multi-sample tests for specific components, enabling intensive management and testing of components with large characteristic deviations.

Fifth, it is possible to establish a material supply and demand method that can continuously purchase and supply more reliable parts by preparing comparison data for each manufacturer by using integrated electronic component test apparatus.

Sixth, the user can check whether the parts used for device maintenance are damaged or aging based on the data acquired through the device, and can be used as an important reference in selecting a replacement cycle of the parts.

 Seventh, by developing test procedures and management procedures for the electronic components used in each field equipment, it can contribute to increase the reliability of electronic components in the field.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. First, in adding reference numerals to the components of each drawing, it should be noted that the same reference numerals have the same reference numerals as much as possible even if displayed on different drawings. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear. In addition, the following will describe a preferred embodiment of the present invention, but the technical idea of the present invention is not limited thereto and may be variously modified and modified by those skilled in the art.

1 is a conceptual diagram of an integrated electronic component test apparatus according to a preferred embodiment of the present invention.

Referring to FIG. 1, an integrated electronic component test apparatus according to a preferred embodiment of the present invention includes a tester main body 100, a test jig 200, a signal routing unit (SRU) 300, and a constant temperature / humidifier 400. ) And a test computer 500.

The tester main body 100 is provided with at least one component test instrument 110, the test instrument 110 generates a signal for testing the electrical elements mounted on the test jig 200.

The at least one test instrument 110 is connected to the test computer 500, operates under the control of the test computer 500, and tests the appropriate test instrument 110 according to the switch selection of the SRU 300. A signal is applied to the test jig 200 to test the electronic component.

Examples of the test instrument 110 may include an oscilloscope, a temperature measuring meter, a multimeter, an LCR meter, a signal generator, an AC / DC power supply, a DC electronic load, a withstand voltage tester, and the like.

Each of the test instruments 110 includes a signal applying unit for supplying power or generating a signal to a test target component and a measuring unit for measuring characteristics of the test component, and in the present invention, performance for more accurate and reliable testing. This is constructed using commercially available instruments that are proven and easy to calibrate.

Enumerating examples of commercially available instruments with the above proven performance, the DPO7104 can be used as an oscilloscope. The DPO7104 is a very useful instrument for analyzing high-speed signals such as clock jitter with high-performance oscilloscopes with Tektronix's Digital Phosphor technology. In addition, it has a GPIB communication function, which can be easily connected to the test computer 500 and controlled by user interface software.

In addition, the input / output signal delay time of the logic IC, the operation time of the fuse and the relay, the output ripple of the DC / DC converter, and the op amp Used to measure bandwidth of Amp and signal quality of Oscillator.

In an embodiment of the present invention, Agilent's 34420A may be used as the temperature measuring meter. The 34420A is a multifunction instrument that can measure voltage, resistance, current, temperature, and more. It can be directly connected to a temperature sensor, specifically measuring the temperature of a component in real time. It also features GPIB communication, which can be easily controlled from user interface software.

Features include 2-channel, 7.5 digit resolution, and temperature measurement capability. The surface temperature of components must be measured for reliability and tests that require voltage measurements such as resistance voltage application tests, capacitor charging tests, and transistor (FET) function tests. It is used for testing.

In addition, in the embodiment of the present invention, Agilent's Precise Multimeter 3458A may be used as the multimeter. The 3458A can measure high-speed, high-precision voltages, currents, and resistances, and can measure fine currents up to 1pA. It also features GPIB communication, which can be easily controlled from the user interface software.

It can also be used in the case of testing capacitors, transistors, etc. when fine current measurement is required and when high voltage measurements up to 1000V are required.

In addition, Agilent's LCR Meter 4263B can be used as a circuit measuring device. The 4263B is a high performance instrument that can measure inductance, capacitance, resistance and various characteristic values of LCR electronic components. In particular, the cable length between the measuring instrument and the measuring part can be set, allowing error correction due to the cable length, thereby enabling more accurate measurement.

It also has a universal interface bus communication function can be easily controlled by the test computer (500). In addition, it has a characteristic of 100KHz test frequency, 0.1% accuracy, etc., and is used for the test for measuring various characteristic values of resistors, capacitors, and transistors.

In the embodiment of the present invention, Agilent's Function Generator 33250A may be used as the signal generator. The 33250A generates precise waveforms for more reliable measurement results. Also connected to the test computer 500 can be easily controlled.

Capable of 80MHz sine wave or signal output, features 10Vpp, and is used for signal input when testing the amplifier's bandwidth.

In an embodiment of the present invention, Agilent's 6813B may be used as the AC / DC power supply. The 6813B can output AC voltage of high voltage and high output up to 1KHz, and can output DC voltage of high voltage and high output with positive voltage and negative voltage, so it can be used for various tests, and can be controlled by the test computer 500.

It features 300VAC / 13A (rms), ± 425VDC / 10A, 45 ~ 1KHz frequency, and is used for passive devices such as resistors and capacitors, and active devices such as MOS transistors, bipolar transistors, and photo couplers. It is used for the maximum voltage test and for supplying power to the primary during transformer testing.

In an embodiment of the present invention, Agilent's 5761A may be used as the DC power supply. The 5761A is a high-accuracy DC power source capable of high current output and features commercial interface bus (GPIB) communications that can be easily controlled from the user interface software. It features 6VDC / 180A, 3mV / 180mA programming accuracy, 6mV / 540mA measurement accuracy, and is used for supplying a base current during the maximum current test of SCR, bipolar transistor test or diode with high current capacity.

On the other hand, the Agilent 5767A can be used as the DC power supply. The 5767A is a high-precision, medium-voltage DC power source with GPIB communication that can be easily controlled from the user interface software. It features 60VDC / 25A, 30mV / 25mA programming accuracy, 60mV / 75mA measurement accuracy, and is used for gate voltage for MOS transistor test, drive voltage for logic integrated circuit test, and input voltage of linear regulator.

In an embodiment of the present invention, Agilent's N3300A may be used as the DC electronic load. The N3300A is a mainframe that allows you to configure different types of electronic loads to meet your requirements, allowing you to use up to six 300W electronic loads or up to three 600W electronic loads to use the full 1800W electronic load capacity. Make sure The built-in GPIB port provides a single GPIB address for easy control of each electronic load from user interface software. In addition, N3302A, N3306A, etc. is also possible, N3302A features 0 ~ 30A, 0 ~ 60V, maximum 150W, and can be used when a small load is required, N3302A 0 ~ 120A, 0 ~ 60V, 600W maximum It is characteristic and is used when a large load is required. In some cases, the N3306A can be connected in parallel up to 1200W.

In an embodiment of the present invention, Kikusui's TOS9201 may be used as a withstand voltage tester. The TOS9201 is a withstand voltage and insulation resistance tester capable of outputting high power capacities and features GPIB communication that can be easily controlled from the user interface software. 5KV / 100mA (30 minutes) withstand voltage, 0.01MO ~ 9.99GO insulation resistance, etc., between reverse side of diode, SCR, relay, photocoupler, transformer, DC / DC converter, etc. It is used to measure the breakdown voltage and insulation resistance.

As described above, the tester main body 100 may include various test measuring instruments 110 that can be controlled by the test computer 500.

The test jig 200 has a structure for accommodating various component packages, and performs a function of connecting the component test instrument 110 provided in the tester main body 100 with the test target component. The test jig 200 is configured to freely attach or detach the jig printed circuit board for each test target component, and may be installed inside the thermo-hygrostat 400.

2 is a configuration diagram of a test jig 200 that can be applied to the present invention.

Referring to FIG. 2, the test jig 200 applied to the present invention is configured to facilitate the function and reliability test of the part by mounting the test part, and the first part mounting part 220 is disposed on one side of the upper surface of the main body 210. Is provided. The first component mounting unit 220 has a two-pin component socket structure to facilitate mounting of two-pin components such as resistors, capacitors, and diodes.

In order to accommodate various types of electronic components, a second component mounting unit 230 including a connector is provided outside the first component mounting unit 220. The second component mounting unit 230 is largely composed of two types. One of them is a connector 231 formed in a structure that can be coupled to a jig. The connector 231 is preferably provided with at least two for easy connection.

The other part is provided with a connection portion connected to the connector 231 on the bottom surface, the component mounting board on which the component mounting module 233 including a component mounting socket, a clip, a soldering pad, etc. can be attached. (232).

On the other hand, the component mounting rail 240 for fixing the second component mounting portion 230 to the main body 210 to facilitate the test of the electronic component is provided on the outside of the two connectors 231. The component mounting rail 240 is provided with grooves for fixing both ends of the component mounting board 232 connected to the main body 210 via the connector 231 in the longitudinal direction.

After connecting the component mounting board 232 to the main body 210, the main body 210 has a handle 250 for mounting a component mounting board on one side for electrical connection.

A temperature measuring arm 260 including a temperature sensor 261 is provided at one end near the first component mounting part 220 and the second component mounting part 230. The temperature measuring arm 260 has a structure consisting of a three-axis joint so that the temperature sensor 261 can be easily attached to the temperature measuring surface of the part, regardless of the shape of the part, in order to measure the temperature change of the part during the test. It is preferable to have.

In addition, a test signal connection connector 271, a high voltage signal connection connector 272, a high current signal connection connector 273, and a high bandwidth signal connection connector 274 are provided on the main body 210 side.

The test signal connection connector 271 is used to connect a voltage of 1 KV or less and a current signal of 10 A or less with the tester main body 100. The high voltage signal connection connector 272 is used to connect a high voltage signal up to 5KV with the tester body 100. The high current signal connection connector 273 is used to connect a high current signal of up to 180 A with the tester body 100. The high bandwidth signal connection connector 274 is for connecting a measuring instrument for testing a signal requiring a high bandwidth, such as an oscilloscope or a circuit device measuring instrument, among the test measuring instruments 110 of the tester main body 100.

The thermo-hygrostat 400 performs a function of providing a temperature / humidity environment suitable for the environmental characteristics of the test target component. The thermo-hygrostat 400 is preferably automatically controlled in conjunction with the test computer 500.

In an embodiment of the present invention, the DC / DC converter is mounted to the test jig 200 and connected to the SRU 300 by clamping a main terminal clip. The SRU 300 drives an internal relay and connects a connection with equipment such as a DC power source, a DC load, an oscilloscope, etc. of the test instrument 110 required for the test progress. The SRU 300 may include a digital signal processor and may include a serial communication port for optical communication. The SRU 300 controls the signal connection between the test instrument 110 and the test jig 200 embedded in the tester main body 100.

3 is a block diagram of an embodiment of an SRU 300 applied to the present invention.

Referring to FIG. 3, the SRU 300 applied to the present invention includes a 250 MHz 32-bit digital signal processor 310, an RS-232C port 311 for a console and a serial port 312 for an optical communication. Doing. A maximum of 16 Mbytes of memory (SDRAM) 313 and a maximum of 512 Kbytes of nonvolatile memory (EPROM) 314 are provided.

In addition, the SRU 300 includes a flash memory 315 of 2 Mbytes, and is provided with an output unit 316 that provides 16 channels of digital output. And it is provided with a connector 318 including a connector for connecting various instruments and a connector to which the test jig 200 is connected.

As such, the SRU 300 may properly connect signals necessary for the test between the various test instruments 110 necessary for the test and the test jig 200 equipped with the test parts, and generate a digital signal for the test. A rectifier 322 function for connecting various resistive loads and AC signals to a direct current electronic load is provided.

Reference numeral 219 denotes a display unit for displaying a state, 320 denotes a controller, and 321 denotes a signal router. The relay in the signal router is driven by the control of the controller to connect the test instruments 110 and the test jig 200 to each other. Can be controlled.

In addition, the test computer 500 may be embedded in the tester main body 100 in the form of an OMU (Operating and Management Unit), controls the operation of the test measuring instrument 110 provided in the tester main body 100, and is ready for testing. Upon completion, the test instruments 110 are driven to test the electronic components installed in the test jig 200.

When the test computer 500 is implemented as an OMU, the test computer 500 may be implemented as a notebook PC. The test computer 500 is connected to a test instrument 110 that lists the types in detail above by a general-purpose interface bus (GPIB), and controls the SRU 300 and the thermo-hygrostat 400 by serial communication. The test computer 500 may further include a printer for outputting a test result.

In addition, the test computer 500 may perform functions such as database management of component specifications, test type selection and test progress, test progress and result display, test result report generation and result history management, and tester self-diagnosis in an embodiment of the present invention. Can be done.

4A and 4B illustrate an embodiment of displaying component specifications of the test computer 500 on a screen.

As illustrated in FIG. 4A, the test computer 500 outputs a component specification database management history. The parts specification database management history is largely composed of a category selection unit, a parts database list display unit, and a part characteristic display unit. The category selector selects categories of various electric / electronic components. The currently selected part is highlighted in orange. The parts database list display lists the list stored in the database for the selected category. Displayed items are manufacturer and part number, and the condition search for manufacturer / part number can be performed through the drop down box at the top. The part property display can be configured to display detailed specifications of the item selected in the database list.

4B is a window for input / modification of component specifications. If you press the 'New' or 'Edit' button, it will be executed in a popup form. Here you can enter values such as part management type, part characteristics and test settings. If the specification is not specified from the manufacturer, enter 'N / A'.

After inputting the database for the electronic component in this way, if the electronic component mounted on the test jig 200 is selected from the database of the test computer 500 and the desired test is selected, the information is stored in the tester main body. The test instrument 110 and the SRU 300 are transmitted to the test instrument 110, and the test result of the test jig 200 may be input through the SRU 300 from the test instrument 110.

5A and 5B illustrate one embodiment of a test progress screen of the test computer 500.

When the target component is selected and the test progress is selected as in FIG. 5A, the screen proceeds to the test progress screen as shown in FIG. 5B. The test progress screen includes a part information display part, a test item display part, and a test result display part.

The part information display unit displays information on the currently selected target part. The category, manufacturer, part number, and part specification are displayed. In addition, you can enter the serial number and control number of the part you are currently testing.

The test item display displays a list of tests that can be performed on the selected part and allows the user to select multiple tests through check boxes. Tests that require N / A-managed variables in the database are deactivated. Once the selection is made and the test is in progress, the simple results of each test (measured values, suitable / nonconforming) are displayed together.

The test result display unit displays the title of the currently running or ongoing test, the progress status, and the result value among the selected test items. In the middle of the test, if the user needs to change the cable connection, a notification message is also displayed. When the test is complete, the test results are displayed. If the test result is a measured value, the effective range and the measured value are displayed. If the result is presented in the form of a graph as in the case of a characteristic curve, the result is displayed in the form of a graph.

Such test results are stored in separate files and maintained in a database.

6A and 6B illustrate one embodiment of a history management screen of the test computer 500. In the test result history management screen (FIG. 6A), a list of test results performed is listed, and a user may include a test date, a part type, and the like. The search result can be specified and searched, and the test result can be output in a report form as shown in FIG. 6B. The report can be searched and output at any time later through the result history management screen as well as immediately after the test.

The test method of each test item is listed as follows.

 1.Regulator

1-1. Rated Continuous Working Voltage

, 또는 저항의 양단자에 인가될 수 있는 최대 전압 시험으로 최대 전압에서 저항이 고장나지 않는지를 시험하고 시험후 저항값을 측정하여 저항값의 변화량을 측정한다.

The maximum voltage test that can be applied to both terminals of the resistor is used to test whether the resistance fails at the maximum voltage, and then measure the resistance value and measure the amount of change in the resistance value.

1-2. Maximum Overload Voltage

After applying the maximum voltage that can be applied to both terminals of the resistor for a short time of 5 seconds, the resistance value is measured to measure the amount of change in the resistance value.

1-3. Temperature Coefficient of Resistance

The change rate of the resistance value is measured at each step while changing the ambient temperature according to a predetermined pattern.

1-4. Parasitic Inductance (Wound)

In the case of wire-wound resistors, the parasitic inductance that occurs incidentally to the device is measured.

1-5. High Temperature Moisture Resistance Life

The change rate of the resistance value is measured while repeating the application of the maximum voltage for a long time at a temperature of 40 and a relative humidity of 90 to 95%.

1-6. High Temperature Durability Load Life

The rate of change of the resistance value is measured while repeating the application of the maximum voltage for a long period of time at a high temperature of 70.

2. Capacitor

2-1. Capacity Tolerance

Measure whether the capacitance satisfies the allowed error.

2-2. Equivalent Series Resistance

Verify the performance by measuring the equivalent series resistance value (ESR).

2-3. Disipation Factor

The ratio of resistive power loss to capacitive power is used to determine the quality of capacitors.

2-4. DC Leakage Current

Measure the leakage current by applying the maximum DC voltage.

2-5. Rated Voltage at Maximum Ambient Temperature

Set the ambient temperature to the maximum permissible temperature and test for failure even when the maximum voltage is applied.

2-6. Temperature Stability

While changing the ambient temperature according to a predetermined pattern, the capacitance is measured at each step to measure the amount of change from the initial value.

2-7. Surge Test

At 85, the capacitor is charged and discharged with a surge voltage exceeding the maximum operating voltage, and the discharge operation is repeated a predetermined number of times, and the capacitance is measured at room temperature to determine whether it is in the normal range.

2-8. Withstand voltage test (film type)

In the case of the film type, the maximum allowable withstand voltage is applied to confirm that there is no abnormality in the operation of the capacitor.

2-9. Long Run Test

The capacitor is operated for a long time at the maximum voltage at the maximum operating temperature where the capacitor is not derating and then operated for a long time at the derated voltage at the maximum allowable temperature, and the capacitance is measured at room temperature to determine whether it is in the normal range.

3. fuse

3-1. Nominal Resistance Cold Ohms

It is a figure that nominally shows the energy to open the fuse and the operation time of the fuse is determined by calculating the time to open after forcibly applying about 10 times the rating current.

3-2. Ampere Rating

When 100% of the rated current is applied, it is tested whether the minimum time to open the fuse is satisfied.

3-3. Voltage Rating

After forcefully opening the fuse, apply a rating voltage to test whether the fuse normally cuts off the current.

3-4. Opening time measurement by overcurrent (Nominal Melting I2t)

It is a figure that nominally shows the energy to open the fuse and the operation time of the fuse is determined by calculating the time to open after forcibly applying about 10 times the rating current.

3-5. Long Run Test

It is tested whether it operates without opening for a long time at 80% rating at temperature 40 and relative humidity 90 ~ 95%.

4. transformer

4-1. Transfer Ratio

Apply AC voltage to the primary side and measure the voltage on the secondary side to test whether it meets the criteria.

4-2. Maximum Power Rating

Test for maximum rated current at the secondary side to ensure normal operation.

4-3. DC Resistance

Measure the secondary DC resistance and test whether it meets the standard.

4-4. Inductance

Measure the inductance of primary and secondary side and compare with Turn Ratio value.

4-5. I / O Isolation Voltage

Insulation withstand voltage between primary and secondary is measured and tested to meet the criteria.

4-6. I / O insulation resistance

The insulation resistance between the primary and secondary sides is measured and tested to see if it satisfies the criteria.

4-7. Long Run Test

The maximum rated current flows to the secondary side at a temperature of 40 and a relative humidity of 90 to 95%, and the test is made for a long period of time with the temperature of the parts controlled not to exceed the maximum allowable range.

5. relay

5-1. Contact Resistance

Measure the resistance value when the relay contacts are closed.

5-2. Absolute Maximum Coil Power

Test that the coil operates normally without failure even if the voltage is set to consume maximum power.

5-3. Rated DC Contact Rating

It is tested whether it operates normally without failure even if the maximum allowable voltage and current are applied to the contact side.

5-4. Minimum Coil Voltage to Operate

Measure the minimum coil voltage for the relay contacts to operate.

5-5. Maximum Coil Voltage to Release

Measure the maximum coil voltage for the relay contacts to return to their normal state.

5-6. Operation Time

After applying the rated voltage to the coil, measure the time until the contact operates.

5-7. Release Time

After the voltage is removed from the coil, measure the time for the contact to return to its normal state.

5-8. Insulation Resistance

Test that the insulation resistance between the contacts and the coil satisfies the specification.

5-9. Insulation voltage

Test that the insulation withstand voltage between the contacts and the coil satisfies the specification.

5-10. Long Run Test

Test at a temperature of 40 and a relative humidity of 90-95% for the number of times satisfying the requirements of Expected Electrical Life under the conditions of the maximum coil voltage and the maximum coil current.

6. Diode

6-1. Absolute Maximum DC Reverse Voltage

The diode is tested for failure even when the maximum permissible reverse voltage is applied.

6-2. Reverse Current

For maximum reverse voltages or Zener diodes, test whether the reverse current does not exceed the maximum value at the specified reverse voltage.

6-3. Forward Voltage

Under test current conditions, test that the forward voltage VF does not exceed the maximum value.

6-4. Reverse Voltage

For Zener diodes, test whether the reverse voltage carrying the reference current is within the reference range.

6-5. Reverse Recovery Time

When the reverse bias is applied and the forward bias is applied, it is measured how fast the signal is sent in the forward direction.

6-6. Absolute Maximum Forward Current

Test the diode for failure and normal operation with the maximum current allowed.

6-7. Current-Voltage Characteristic Curve

In the case of VF-IF or Zener diodes, the correlation of VZ-IZ (Zener) is shown as a graph according to the ambient temperature to facilitate the characterization of the diode.

6-8. Absolute Maximum Junction Temperature

Adjust the current to raise the maximum allowable temperature and test for normal operation at 25.

6-9. Long Run Test

At temperatures of 40 and 90-95% relative humidity, the TJ is tested for long periods of normal operation, adjusting the maximum current so that it does not exceed the maximum allowable range.

7. SCR

7-1. Peak Repetitive Off-State Voltage

Test for failure at the maximum voltage that can be applied in the OFF state.

7-2. Gate Trigger Voltage

If SCR is on, measure that gate voltage does not exceed maximum value.

7-3. Gate Trigger Current

If SCR is on, measure if gate current does not exceed maximum value.

7-4. Holding Current

After SCR is on, measure that the minimum current to keep on does not exceed the maximum.

7-5. Maximum On-State Current RMS

Test for normal operation at the maximum RMS current under the specified component temperature conditions.

7-6. Maximum Operating Junction Temperature

Control the current to make sure that the maximum junction temperature does not fail.

7-7. Current-Voltage Characteristic Curve

The correlation curve between IT and VT is shown to facilitate the characterization of SCR.

7-8. Long Run Test

Functional tests are conducted for extended periods of time at a temperature of 40 and a relative humidity of 90% to 95%, with the current adjusted so that the TJ does not exceed the maximum allowable range.

8. MOSFET

8-1. Absolute Maximum Drain-to-Source Voltage

Check the normal operation after applying the maximum voltage between drain and source.

8-2. Absolute Maximum Gate-to-Source Voltage

After applying the maximum voltage between Gate and Source, check the normal operation.

8-3. Gate Threshold Voltage

Adjust the gate voltage to measure the minimum gate-to-source voltage where the drain current is conducted above a certain amount.

8-4. Drain-Source On Resistance

Measure the resistance between the drain and the source when the FET is on.

8-5. Absolute Maximum Continuos Drain Current

While maintaining the temperature of the FET at 25, apply the maximum current allowed to verify normal operation. While maintaining the temperature of the FET at 100, apply the maximum current allowed to confirm normal operation.

8-6. Absolute Maximum Operating Junction Temperature

After the maximum power consumption is applied below FET temperature 25, the FET temperature is measured and the power consumption is reduced by the linear derating factor and tested to see if it operates normally.

8-7. Current Voltage Characteristic Curve

The correlation curve between VDS and ID is shown for VGS to facilitate FET characterization.

8-8. Long Run Test

Test the normal operation by repeating the test for a long time while consuming power to the maximum junction temperature at a certain period at a temperature of 40 and a relative humidity of 90 to 95%.

9. Bipolar Junction Transistor (BJT)

9-1. Collector Cutoff Current

If the transistor is off, measure whether the collector current does not exceed the maximum value.

9-2. Collector Open Emitter Cutoff Current

If the transistor is off, measure whether the collector current does not exceed the maximum value.

9-3. Absolute Maximum Collector-Emitter Voltage

It is tested whether normal operation without failure even if maximum collector-emitter voltage is applied.

9-4. Absolute Maximum Collector-Base Voltage

It is tested whether it operates normally without failure even when the maximum collector-base voltage is applied.

9-5. Absolute Maximum Emitter-Base Voltage

It is tested whether it operates normally without failure even if the maximum emitter-base voltage is applied.

9-6. Collector-Emitter Saturation Voltage

If the transistor is saturated, measure VCE.

9-7. Base Emitter Saturation Voltage

Measure the VBE when the transistor is saturated.

9-8. Absolute Maximum Continuous Collect Current

Test that the IC operates normally without failures in the condition that TJ does not exceed the maximum value.

9-9. Absolute Maximum Operating Junction Temperature

Test the IC for normal operation without failure even if the TJ is adjusted to the maximum value by adjusting the IC.

9-10. Current Amplification Rate (hfe) Collector Current Characteristic Curve

The correlation curve between IC and hFE (DC Current Gain) is shown to facilitate characterization.

9-11. Long Run Test

At 40 ° C and 90% to 95% RH, the functional test is performed for a long time with the output current adjusted so that the TJ does not exceed the maximum allowable range.

10. linear regulator

10-1. Maximum Input Voltage / Maximum Input / Output Voltage (Absolute Input-Output Voltage Differential)

When the voltage is applied so that the maximum input allowable voltage or the difference between the input voltage and the output voltage becomes the maximum value, the normal operation without failure is tested.

10-2. Short-Circuit Current Limiting

If the output is shorted to GND, test that the maximum current allowed is not exceeded.

10-3. Line Regulation

With respect to the output value, measure the difference between the output voltages when the input voltage is minimum and maximum.

10-4. Load Regulation

Measure the difference between the output voltage when outputting 20% of maximum current and 100% of maximum current.

10-5. Operating Junction Temperature or Thermal Shutdown

If the output current is adjusted to the maximum value of TJ but does not fail or if there is a thermal shutdown function, test whether the thermal shutdown operates normally when the TJ is above the maximum value.

10-6. Temperature Coefficent of Output Voltage

Measure the change in output voltage as the TJ rises for a constant output current.

10-7. Long Run Test

Long-term functional tests are conducted with the output adjusted at a temperature of 40 and a relative humidity of 90 to 95%, with the TJ not exceeding the maximum allowable range.

11. photo coupler

11-1. Absolute Maximum Forward Current

It is tested whether normal operation without failure even if maximum allowable current is applied to LED at room temperature.

11-2. Absolute Maximum Collector-Emitter Voltage

It is tested whether normal operation without failure even if maximum allowable voltage is applied between collector and emitter.

11-3. Absolute Maximum Collector Current

Test if the collector current is working without failure even if the collector current is increased to the maximum allowable value.

11-4. Current Transfer Ratio

Test that the Ic / IF values meet the criteria under the given conditions.

11-5. Output Voltage-Current Characteristic Curve

The correlation between VCE and IC for a given IF is graphed to facilitate characterization.

11-6. Input diode forward voltage

The forward voltage at the forward current IF of the input diode is measured.

11-7. Input diode reverse current

The reverse current at the reverse voltage VR of the input diode is measured.

11-8. Collector leakage current

Measure the current between the collector and emitter when the output transistor is not operating.

11-9. I / O Isolation Voltage

Test the insulation voltage between the LED and the detector to see if it meets the criteria.

11-10. I / O insulation resistance

Test the insulation resistance between the LED side and the detector side to see if the standard is met.

11-11 Long Run Test

Long-term operation tests are carried out at 40 ° C and 90% to 95% relative humidity with the maximum allowable IF and VCE applied periodically.

12.OP-AMP

12-1. Absolute Maximum Supply Voltage

Test for normal operation without failure at maximum supply voltage.

12-2. Absolute Maximum Input Voltage

With the maximum supply voltage applied, the maximum input voltage is applied to test that the unit operates normally without failure.

12-3. Gain Bandwidth Product Test

Measure the bandwidth at the unit gain and test whether the reference value is satisfied.

12-4. Long Run Test

Load the OP-Amp output side at a temperature of 40 and a relative humidity of 90-95% and adjust the input signal to maintain the maximum junction temperature conditions for long periods of operation.

13. Logic IC

13-1. Absolute Maximum Supply Voltage

Test the function without failure at the maximum supply voltage.

13-2. Absolute Maximum DC Input Voltage

Test whether the function works without failure even if the maximum allowable voltage is applied to the signal input pin.

13-3. Absolute Maximum DC Output Voltage

Test that the voltage of the output signal does not exceed the specified maximum.

13-4. Absolute Maximum DC Output Source Current

Ensure that the maximum allowable current is output at the signal pin and that the function test is normal under normal conditions.

13-5. Absolute Maximum DC Output Sink Current

Enter the maximum allowable current on the signal pin and test for normal function tests under normal conditions.

13-6. Minimum High Level Input Voltage

While increasing the signal voltage from 0V to the input pin, measure the minimum value recognized as HIGH level.

13-7. Maximum LOW Level Input Voltage

After inputting normal HIGH level to input pin, decrease signal voltage and measure maximum value recognized as LOW level.

13-8. Minimum High Level Output Voltage

Measure whether the voltage of the HIGH signal exceeds the minimum value for the specified load current of the output pin.

13-9. Maximum LOW Level Output Voltage

For the specified load current of the output pin, measure whether the voltage of the LOW signal satisfies below the maximum value.

13-10. Maximum Input Leakage Current

If the voltage of input pin is VCC, measure leakage current.

13-11. Maximum Quiescent Supply Current

Measure the current consumption in the standby state.

13-12. Propagation Delay

Measure the delay time of the output signal to the input signal.

13-13. Operating Temperature

After the ambient temperature has been reached to the maximum allowable temperature, the function is tested for normal operation.

13-14. Long Run Test

Function tests are conducted at extended VCC, VIH, and IO conditions for extended periods of time at a temperature of 40 and relative humidity of 90-95%, adjusting the operation so that the TJ does not exceed the maximum allowable range.

14.DC / DC converter

14-1. Output voltage stability

14-2. Line Regulation

Measure the difference between the output voltage at full load for the minimum and maximum input voltage.

14-3. Load Regulation

Measure the difference in output voltage between no load and peak load.

14-4 Temperature Regulation

Measure the difference in output voltage as the base temperature increases.

14-5 Output Ripple

Full load measurement is made with an oscilloscope under 20MHz filter conditions.

14-6. Power Efficiency

Measure the efficiency between the input power and the output power.

14-7. Under voltage input turn-on

Measure the minimum input voltage at which the dc-dc converter is turned on.

14-8. Under voltage input turn-off

Measure the maximum input voltage below the rated input voltage at which the DC / DC converter is switched off.

14-9. Maximum Voltage of Control Input Pin

Test that the fault does not occur even if the maximum allowable voltage is applied to the control pin.

14-10. Over Current Protection

Check if Shut Down automatically when over current protection condition is reached by increasing the output current above the maximum current.

14-11. Temperature Regulation

Measure the difference in output voltage as the base temperature increases.

14-12. Maximum Operating Base Temperature

Test the output current by adjusting the output current to ensure normal operation without malfunction.

14-13. Over Temperature Protection

Force the DC / DC converter's temperature to be above the maximum allowable base temperature to check if it shuts down automatically.

14-14. Isolation Voltage among Input, Output and Base

Test the maximum allowable withstand voltage between input and output, input and base, and output and base.

14-15. Long Run Test

For long periods of operation, adjust the supply current so that the base temperature maintains the maximum allowable temperature at a temperature of 40 and a relative humidity of 90-95%.

7 is a flowchart of an electronic component test method according to a preferred embodiment of the present invention.

Referring to FIG. 7, a component type is first selected (S800). Thereafter, the part name, the user name, the test date, parameter setting, and the like are performed (S810). Then, the test type is selected (S820). After that, the test starts (S830). Thereafter, the test result is output (S840). Thereafter, data is input to a predetermined table (S850a), and a graph is output based on the input data (S850b). Thereafter, a report on the parts is generated (S860).

FIG. 8 illustrates an example in which the flowchart of FIG. 7 described above is applied to an integrated electronic component test apparatus according to the present invention.

Referring to FIG. 8, the test signal of the test body 100 including the test instrument 110 under the control of the test computer 500 is inserted into a socket of the test jig 200 through the SRU 300, or a clip or Test the electronic components that are fixed by soldering.

The results of the test are passed back to the test instrument 110 through the SRU 300, which is input to the test computer 500, and displayed for the user to recognize, and stores the test results, reports, etc. You can print.

The above description is merely illustrative of the technical idea of the present invention, and various modifications, changes, and substitutions may be made by those skilled in the art without departing from the essential characteristics of the present invention. will be. Accordingly, the embodiments disclosed in the present invention and the accompanying drawings are not intended to limit the technical spirit of the present invention but to describe the present invention, and the scope of the technical idea of the present invention is not limited by the embodiments and the accompanying drawings. . The scope of protection of the present invention should be interpreted by the following claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention.

1 is a conceptual diagram of an integrated electronic component test apparatus according to a preferred embodiment of the present invention.

2 is a block diagram of a test jig that can be applied to the present invention.

3 is a block diagram of an embodiment of an SRU applied to the present invention.

4A and 4B are screen display diagrams showing one embodiment of component specifications of a test computer applied to the present invention on a screen.

5a and 5b is an embodiment of a test progress screen of the test computer applied to the present invention.

6A and 6B illustrate an exemplary embodiment of a history management screen and an output result of a test computer applied to the present invention.

7 is a flowchart of an electronic component test method according to a preferred embodiment of the present invention.

FIG. 8 is a flowchart illustrating an operation of the integrated electronic component test apparatus according to the procedure of FIG. 7.

* Description of the symbols for the main parts of the drawings *

100: test body 110: test instrument

200: test jig 300: signal routing unit

400: constant temperature and humidity 500: test computer

Claims (8)

A test jig for mounting at least two electronic components; A test body including a plurality of test instruments for testing electrical characteristics by applying power or a signal to an electronic component mounted on the test jig; A signal routing unit (SRU) capable of changing a relay state to selectively transmit a signal between the test body and the test jig; And Select the test instrument corresponding to the test type of the electronic component mounted on the test jig, change the contact point of the signal routing unit so that the power or signal of the selected test instrument is supplied to the electronic component, and measure the test result. An integrated electronic component test apparatus including a test computer for receiving a test result of the test instrument and evaluating the performance of the electronic component. The method of claim 1, And a thermo-hygrostat for controlling the temperature and humidity of the test jig side according to the control of the test computer. The method according to claim 1 or 2, The test jig, main body; A first component mounting part positioned on an upper surface of the main body and having a socket for mounting the electronic component alone; A second component mounting unit for mounting a substrate on which electronic components are coupled; Fixing parts fixing both ends of the second component mounting part to the main body; And Integrated electronic component test apparatus comprising a temperature sensor for measuring a temperature change of the electronic component. The method of claim 3, The temperature sensor, The integrated electronic component test apparatus, characterized in that the position can be changed mounted on the temperature measuring arm having a three-axis joint structure. The method of claim 4, wherein The electronic component, An integrated electronic component test device characterized in that it is a resistor, capacitor, fuse, transformer, relay, diode, SCR, MOS transistor, bipolar transistor, linear regulator, photocoupler, op amp, logic IC or DC / DC converter. The method of claim 4, wherein The test instrument, At least one selected from oscilloscope, temperature measuring instrument, current measuring multimeter, LCR meter, signal generator, power supply, electronic load, and withstand voltage tester, each of which can communicate with the test computer and the universal interface bus. Integrated electronic component test device. a) mounting an electronic component to be tested on a test jig and selecting an electronic component mounted on the test jig from a database of a test computer; b) selecting a test type for the electronic component selected in step a) and performing a test; c) selecting a suitable test instrument according to the test type, and controlling a relay such that a test signal of the test instrument is supplied to the electronic component mounted on the test jig; And d) receiving a test result of the electronic component supplied with the test signal from a test computer through the selected test instrument and evaluating characteristics of the electronic component. The method of claim 7, wherein And setting the temperature and humidity conditions in the test computer, and adjusting the ambient temperature and humidity of the test jig according to the temperature and humidity.

Images