KR20110027012A - Es-chuck carrier and vacuum processing apparatus using the same - Google Patents

Abstract

PURPOSE: An electrostatic chuck carrier and a vacuum process device for a substrate using the same are provided to prevent the substrate from falling by rotating a falling prevention guide with a hinge. CONSTITUTION: An absorbing unit(141) adsorbs a substrate with electrostatic force. A falling prevention guide(143) is prepared on one side of the absorbing unit to prevent the substrate absorbed in the absorbing unit from falling. A movement supporting unit(142) is separated from the absorbing unit. The movement support unit is movably installed in a conveyor roller(105). A chucking part(146) is chucked by a chucking unit.

Description

ES-Chuck carrier and vacuum processing apparatus using the same}

The present invention relates to an electrostatic chuck carrier and a vacuum processing apparatus for a substrate using the electrostatic chuck carrier. More specifically, the substrate can be adsorbed and moved in a simple structure, and the substrate is moved in accordance with the process in the vacuum processing chamber. Applicable to the case of moving to 180 degrees or 180 degrees, vacuum processing apparatus of the substrate using the electrostatic chuck carrier and the electrostatic chuck carrier that can be efficiently applied to the substrate movement between the vacuum processing chambers that is not easy to external power supply It is about.

An electrostatic chuck (ESC chuck) is a device for adsorbing and fixing a holding material (hereinafter, referred to as a substrate) such as a glass (glass) by the electrostatic force. At present, it is partly used as the substrate fixing device of the LCD panel bonding machine or the vacuum processing apparatus.

In the case of the electrostatic chuck used in the LCD panel joining machine, the upper substrate is absorbed and supported by the electrostatic force so that the upper substrate faces the lower substrate from the upper surface of the lower substrate when the upper and lower surfaces of the LCD panel are bonded.

In this state, after aligning the upper substrate and the lower substrate, after placing the upper substrate 200 to 400 micrometers above the lower substrate and applying a reverse bias to remove the electrostatic force, the upper substrate free fall toward the lower substrate This causes the upper and lower substrates to adhere. As such, the conventional electrostatic chuck has been mainly used as an apparatus for adsorbing and fixing the opposite side of the process running surface.

On the other hand, the substrate must be moved in order to proceed with the process in the vacuum processing apparatus of the substrate, the contact of the process progress surface is likely to damage the device layer. Therefore, in general, lift pins are installed on stages provided inside the vacuum processing apparatus to support the panel.

Therefore, when the transfer robot supports the opposite side of the process proceeding surface from the lower side and moves to the stage of the vacuum processing apparatus, the lift pin provided on the stage rises to support the opposite side of the process progressing surface of the substrate, and then the lift pin descends to the substrate. It is placed on the stage, and then proceeds to the process, the substrate is carried out in the reverse order.

However, in the vacuum processing apparatus of the substrate according to the prior art, a series of structures for moving the substrate is somewhat complicated, and the substrate is rotated by 90 or 180 degrees depending on the process in the vacuum processing chamber of the vacuum processing apparatus. In the prior art, there is no structure and method to move the substrate by rotating the substrate 90 degrees or 180 degrees, which reduces the process efficiency for substrate movement, and also facilitates the external power supply due to the power supply problem to the electrostatic chuck. There is a problem that is difficult to apply to substrate movement between vacuum processing chambers that are not.

The object of the present invention can be moved by adsorbing the substrate in a simple structure, and can be applied even when the substrate must be rotated by 90 or 180 degrees according to the process in the vacuum processing chamber, and external power supply is easy. The present invention provides an electrostatic chuck carrier and a substrate vacuum processing apparatus using an electrostatic chuck carrier which can be efficiently applied to substrate movement between vacuum processing chambers.

The above object, according to the present invention, the adsorption unit for adsorbing the substrate by the electrostatic force; And a chucking part connected to the suction part and chucked by the chucking unit.

Here, the chucking unit may be a pair of chucking blocks having a chucking groove that is disposed to partially receive the end of the chucking unit.

The apparatus may further include a fine up / down driving unit connected to the pair of chucking blocks to drive the adsorption unit up / down.

The fine up / down driving unit may include: a protruding block protruding from the suction unit side; A support connected to the protruding block and disposed between the pair of chucking blocks; An EL guide provided between the pair of chucking blocks and the protruding block; And an elastic member connected to the pair of chucking blocks and the support, respectively.

Surfaces of the protruding block and the pair of chucking blocks provided with the L guide may be provided to be tapered so that their height is lowered toward the support.

One side of the adsorption part may be further provided with a fall prevention guide to prevent the fall of the substrate adsorbed on the adsorption part to be rotatable.

The apparatus may further include a moving support part disposed at a position spaced apart from the adsorption part and movably supported by the conveyor roller.

The movable support portion may have a plate shape to allow the conveyor roller to contact the upper or lower portion of the movable support portion, and a space portion in which the conveyor roller is disposed may be formed between the movable support portion and the suction portion. The adsorption part and the moving support part may be connected to each other by a connecting part narrower than the width of the moving support part.

On the other hand, the above object, according to the present invention, the adsorption unit for adsorbing the substrate by the electrostatic force; And a moving support part disposed at a position spaced apart from the suction part and supported by the conveyor roller so as to be movable.

Here, the moving support portion may have a plate shape so that the conveyor roller can contact the upper or lower portion of the moving support portion.

The suction part and the moving support part may be connected to each other by a connecting part narrower than the width of the moving support part so that a space part in which the conveyor roller is disposed may be formed between the moving support part and the suction part.

On the other hand, the above object, according to the present invention, at least one vacuum processing chamber; An inlet load lock chamber disposed at one side of the vacuum processing chamber to introduce a substrate into the vacuum processing chamber; An extraction load lock chamber disposed on the other side of the vacuum processing chamber to draw out a substrate on which work is completed; An electrostatic chuck carrier which adsorbs the substrate by electrostatic force and supports the substrate during transfer; And a conveyor roller provided in the vacuum processing chamber such that the electrostatic chuck carrier moves in rolling contact with the electrostatic chuck carrier.

Here, the electrostatic chuck carrier, the adsorption unit for adsorbing the substrate by the electrostatic force; And a moving support part disposed at a position spaced apart from the adsorption part and movably supported by the conveyor roller.

The movable support portion may have a plate shape to allow the conveyor roller to contact the upper or lower portion of the movable support portion, and a space portion in which the conveyor roller is disposed may be formed between the movable support portion and the suction portion. The adsorption part and the moving support part may be connected to each other by a connecting part narrower than the width of the moving support part.

The chucking unit may further include a chucking unit connected to the moving support unit and chucked by the chucking unit.

The chucking unit may be a pair of chucking blocks including a chucking groove disposed to partially receive an end of the chucking unit.

The apparatus may further include a fine up / down driving unit connected to the pair of chucking blocks to drive the adsorption unit up / down.

The fine up / down driving unit may include: a protruding block protruding from the suction unit side; A support connected to the protruding block and disposed between the pair of chucking blocks; An EL guide provided between the pair of chucking blocks and the protruding block; And an elastic member connected to the pair of chucking blocks and the support, respectively.

Surfaces of the protruding block and the pair of chucking blocks provided with the L guide may be provided to be tapered so that their height is lowered toward the support.

One side of the adsorption part may be further provided with a fall prevention guide to prevent the fall of the substrate adsorbed on the adsorption part to be rotatable.

On the other hand, the above object, according to the present invention, at least one vacuum processing chamber; An inlet load lock chamber disposed at one side of the vacuum processing chamber to introduce a substrate into the vacuum processing chamber; An extraction load lock chamber disposed on the other side of the vacuum processing chamber to draw out a substrate on which work is completed; An electrostatic chuck carrier which adsorbs the substrate by electrostatic force and supports the substrate during transfer; And a chucking unit provided in at least one of the drawing load lock chamber, the drawing load lock chamber, and the vacuum processing chamber to chuck the electrostatic chuck carrier to the vacuum processing apparatus of the substrate using the electrostatic chuck carrier. Is also achieved.

Here, the electrostatic chuck carrier, the adsorption unit for adsorbing the substrate by the electrostatic force; And a moving support part disposed at a position spaced apart from the adsorption part and movably supported by the conveyor roller.

The apparatus may further include a carrier moving unit connected to the chucking unit to move the electrostatic chuck carrier.

The carrier moving unit includes a power supply unit; A rack provided along a moving trajectory of the electrostatic chuck carrier; A pinion rotating in engagement with the rack; And a motor configured to receive power from the power supply and generate power for rotating the pinion.

An up / down driving unit connected to the chucking unit to drive up / down of the electrostatic chuck carrier; And a rotating unit connected to the chucking unit to rotate the electrostatic chuck carrier.

The vacuum processing chamber may be a single one chamber or a plurality of independent chambers, and the substrate may be a substrate for organic light emitting diodes (OLED).

According to the present invention, the substrate can be adsorbed and moved in a simple structure, and can be applied even when the substrate needs to be rotated by 90 or 180 degrees according to the process in the vacuum processing chamber, and external power supply is not easy. It can also be applied efficiently to substrate movement between vacuum processing chambers.

In order to fully understand the present invention, the operational advantages of the present invention, and the objects achieved by the practice of the present invention, reference should be made to the accompanying drawings which illustrate preferred embodiments of the present invention and the contents described in the accompanying drawings.

Hereinafter, the present invention will be described in detail by explaining preferred embodiments of the present invention with reference to the accompanying drawings. Like reference numerals in the drawings denote like elements.

1 is a schematic plan view of a vacuum processing apparatus for a substrate using an electrostatic chuck carrier according to a first embodiment of the present invention, FIG. 2 is a schematic side view of FIG. 1, and FIG. 3A is an electrostatic chuck provided in FIG. 1. 3B is an enlarged view of the fine up / down driving unit illustrated in FIG. 3A, and FIGS. 4 to 9 are views illustrating the process of rotating the electrostatic chuck carrier 180 degrees in stages, respectively. .

As shown in these figures, the vacuum processing apparatus for a substrate according to the present embodiment includes a vacuum processing chamber 110 and a drawer disposed on both sides of the vacuum processing chamber 110 with the vacuum processing chamber 110 interposed therebetween. And a drawing load lock chamber (120, 130), an electrostatic chuck carrier (140) for adsorbing the substrate by electrostatic force, and a chucking unit (160) for chucking the electrostatic chuck carrier (140).

The vacuum processing chamber 110 is a chamber for processing various deposition films on a substrate. The substrate of the present embodiment may be a substrate for a liquid crystal display (LCD), a substrate for a plasma display panel (PDP), or a substrate for organic light emitting diodes (OLED), but in the following embodiments, the OLED substrate will be described as a substrate. Shall be.

For reference, when electrons are injected into the cathode of the light emitting diode and holes are injected into the anode, electrons and holes are combined in the light emitting layer through the electron transport layer and the hole transport layer, respectively. At this time, LUMO (lowest unoccupied molecular orbital) and Generates light corresponding to the difference between the highest occupied molecular orbital (HOMO) energy. OLED is used to make a display using light generated at this time.

Compared with LCD substrates, LCD substrates do not emit light by themselves, so there is a backlight that emits white light behind the substrate, and a color filter on the front to make three primary colors, and then adjust the amount of light passing through the polarizer and liquid crystal. While the full color is realized, the substrate for OLED controls the amount of light emitted by the electrons falling to a low energy state in the organic material itself (energy difference between LUMO and HOMO) to create and flow three primary colors. By adjusting the amount of light to control the intensity of light (full) is achieved.

As such, since OLED substrates are self-luminous, they are vivid in brighter places than LCD substrates, and because they emit the same light in all directions, the same color can be obtained regardless of the directions. However, since the OLED substrate adjusts the brightness by the amount of current, current consumption is high when it emits bright light. Therefore, the OLED substrate should be manufactured with a TFT substrate having a higher mobility, not an amorphous silicon TFT.

Therefore, the deposition process for the OLED substrate also proceeds more variously than the substrate for the LCD, the place where the deposition process is carried out is the vacuum processing chamber 110. In this embodiment, the vacuum processing chamber 110 is provided as a single one chamber.

The inlet load lock chamber 120 is disposed on one side of the vacuum processing chamber 110 to serve to introduce the substrate into the vacuum processing chamber 110, and the withdrawal load lock chamber 130 is the other side of the vacuum processing chamber 110. Placed in the to serve to pull out the substrate is completed. The inlet and outlet load lock chambers 120 and 130 are also maintained in a vacuum atmosphere in the same manner as the vacuum processing chamber 110.

In FIGS. 1 and 2, the configuration disposed outside the inlet and outlet load lock chambers 120 and 130 includes a robot for transferring the substrate to the inlet load lock chamber 120 and the substrate from the outlet load lock chamber 130 to the outside. And delivery units 121 and 131.

On the other hand, as shown in Figure 3a, the electrostatic chuck carrier 140 serves to adsorb the substrate by the electrostatic force, the chucking unit 160 serves to chuck the electrostatic chuck carrier 140.

The electrostatic chuck carrier 140 adsorbing one substrate by the electrostatic force is continuously along the in-line inlet load lock chamber 120, the vacuum processing chamber 110, and the outlet load lock chamber 130. Is moved to. That is, the electrostatic chuck carrier 140 passes through the inlet load lock chamber 120, the vacuum processing chamber 110, and the outlet load lock chamber 130, respectively.

However, the chucking unit 160 chucking the electrostatic chuck carrier 140, the carrier moving unit 170 connected with the chucking unit 160, and the electrostatic chuck carrier 140 are driven up / down. The rotation unit 190 for rotating the up / down driving unit 180 and the electrostatic chuck carrier 140 is provided in all of the inlet load lock chamber 120, the vacuum processing chamber 110, and the takeout load lock chamber 130. It doesn't have to be. That is, the chucking unit 160, the carrier movement unit 170, the up / down drive unit 180, and the rotation unit 190 may include an inlet load lock chamber 120, a vacuum processing chamber 110, and an outlet load lock chamber ( 130, it is sufficient if it is provided only in the required position.

First, referring to FIG. 3A, the electrostatic chuck carrier 140 is disposed at a position spaced apart from the adsorption unit 141 and the adsorption unit 14, and a moving support unit 142 movably supported by the conveyor roller 105. ).

For reference, a brief description of the electrostatic chuck. Chuck (Chuck) is a device that holds the substrate during the process, largely divided into E-Chuck (E-Chuck) and M Chuck (M-Chuck). Since the M-Chuck mechanically presses the substrate, it can generate particles in the substrate and also make the edges of the substrate useless. However, this problem may be eliminated due to the development of the electrostatic chuck (ES-Chuck) being applied in the present embodiment.

In the present embodiment, the electrostatic chuck (ES-Chuck) that is being applied eliminates the problem of the existing M-chuck by literally holding the substrate by electrostatic force, that is, electrostatic force.

ES-Chuck includes Uni-polar, Bi-polar and Tri-polar types.

In the uni-polar type, only the positive voltage is applied to the chuck and the chuck is connected to the ground by the plasma generation. To dechuck, the reverse bias is applied. If the reverse bias is not applied, the substrate may be adsorbed for several to several ten minutes even if the power supply is interrupted.

The bi-polar type is a structure in which chucking is released by applying a reverse bias of the applied voltage for chucking by applying +/- DC voltage to the chuck. Chucking or chucking is possible only by the chuck itself, there is an advantage that no plasma is required.

The Tri-polar type is similar to the Bi-polar type, the other being the net charge between the substrate and the chuck by compensating +/- voltage by Vdc by reading the DC Self Bias generated in the plasma. ) Should be zeroed.

The electrostatic chuck carrier 140 of the present embodiment applies a bi-polar type among the above-described types of electrostatic chucks (ES-Chuck), and continues the substrate for several to several ten minutes even when the power supply is stopped while the substrate is chucked. It was developed for application to transfer substrates using adsorptive properties.

Referring to Figure 3a looks at each configuration of the electrostatic chuck carrier 140.

First, the adsorption part 141 is a part which adsorb | sucks a board | substrate by electrostatic force. One side of the adsorption part 141 is provided with a fall prevention guide 143 that prevents the substrate adsorbed by the adsorption part 141 from falling. The fall prevention guide 143 may be provided in plural on both sides of the adsorption part 141 in consideration of the size of the substrate.

The fall prevention guide 143 is provided with the bending part 143a as a means which hangs a board | substrate and prevents a board | substrate from falling. There is an advantage that the substrate does not fall due to the bent portion (143a), but if the fall prevention guide 143 is provided to be fixed at the corresponding position because the bent portion (143a) acts as an obstacle, the substrate is the adsorption portion (141) It may not be easily adsorbed on one side of the). Therefore, in this embodiment, the fall prevention guide 143 is rotated with respect to the adsorption part 141 by further providing the hinge 144 between the adsorption part 141 and the fall prevention guide 143. Only then, the substrate can be easily adsorbed to one side of the adsorption unit 141 without any obstacle, and the fall prevention guide 143 is later rotated by the hinge 144 to prevent the substrate from falling.

The moving support part 142 is a part directly contacting the conveyor roller 105 to move the electrostatic chuck carrier 140. Accordingly, the moving support 142 may advantageously have a flat plate shape, but may have a V groove slot shape or a similar shape. In particular, the electrostatic chuck carrier 140 of the present embodiment, as shown in Figures 4 to 9, because it should be able to move in contact with the conveyor roller 105 in a state of being rotated forward or 180 degrees, the support portion 142 It is advantageous to have a flat plate or V-groove slot shape.

The moving support part 142 and the suction part 141 are connected to each other by a connection part 145 narrower than the width of the moving support part 142. Therefore, a space portion 145a is formed between the moving support portion 142 and the adsorption portion 141, and the conveyor roller 105 may be disposed in the space portion 145a as shown in FIG. 3A.

One side of the moving support part 142 is further provided with a chucking part 146 connected to the moving support part 142 and the chucking unit 160 is chucked. The chucking unit 146 constitutes a place where the chucking unit 160 is chucked. In this embodiment, the chucking unit 146 includes a chucking groove 146a disposed to partially receive an end of the chucking unit 160. And a pair of chucking blocks 146b and 146c.

In the case of FIG. 3A, the chucking grooves 146a are each provided in a pair of chucking blocks 146b and 146c protruding from the moving support part 142, but as shown in FIGS. May be provided in the connecting portion 145. This is because the electrostatic chuck carrier 140 must be disposed in both forward and reverse directions depending on the deposition process situation.

In the present embodiment, two or more, that is, the end of the plurality of chucking unit 160 is formed in a substantially pointed triangular shape chucking groove 146a is also shown in a corresponding shape, but the shape of the chucking groove 146a is It may differ from that shown.

Meanwhile, the pair of chucking blocks 146b and 146c forming the chucking unit 146 are connected to the pair of chucking blocks 146b and 146c to finely up / down the electrostatic chuck carrier 140. A fine up / down driving unit 147 for driving down is further provided. The up / down range of the electrostatic chuck carrier 140 by the fine up / down driving unit 147 is approximately several to several tens of millimeters. The fine up / down driving unit 147 is provided for adjusting a gap between the moving support part 142 of the electrostatic chuck carrier 140 and the conveyor roller 105.

As shown in FIG. 3B, the fine up / down driving part 147 is connected to the protruding block 147a protruding from the moving support part 142, the protruding block 147a, and a pair of chucking blocks 146b, A support 147b disposed between the 146c, an LM guide 147c provided between the pair of chucking blocks 146b and 146c and the protruding block 147a, a pair of chucking blocks 146b and 146c, and It includes an elastic member (147d) connected to the support (147b), respectively.

The elastic member 147d may be provided as a coil spring. In addition, the surfaces of the protruding block 147a provided with the LM guide 147c and the pair of chucking blocks 146b and 146c are provided to be tapered so that their height is lowered toward the support 147b.

Thus, in FIG. 3B, when the chucking unit 160 is operated from a dotted line to a solid line and the end is inserted into the chucking groove 146a and presses the pair of chucking blocks 146b and 146c, the pair of chucking blocks 146b, As the elastic member 147d between the 146c is compressed, the pair of chucking blocks 146b and 146c move in a narrowing form along the LM guide 147c, wherein the protruding block 147a and the pair of chucking blocks are moved. Since the surface between 146b and 146c is tapered, the electrostatic chuck carrier 140 may be slightly up. On the contrary, when the chucking unit 160 is released from the chucking, the pair of chucking blocks 146b and 146c are opened because the elastic member 147d is inflated again, and thus the electrostatic chuck carrier 140 is down again. can be down.

Meanwhile, the chucking unit 160, which may be provided at a required position among the inlet load lock chamber 120, the vacuum processing chamber 110, and the outlet load lock chamber 130, may have a substrate as illustrated in FIGS. 3A to 9. It serves to chuck (grab) the electrostatic chuck carrier 140 that has absorbed it as it is. Since the chucking unit 160 only serves to chuck the electrostatic chuck carrier 140, after the chucking unit 160 chucks the electrostatic chuck carrier 140, the chucking unit 140 moves, up / down. Further configuration of the carrier movement unit 170, the up / down drive unit 180, and the rotation unit 190 is required to move down and rotate. The carrier movement unit 170, the up / down drive unit 180, and the rotation unit 190 are all components connected to the chucking unit 160 and operated together with the chucking unit 160.

Looking at the carrier movement unit 170, the carrier movement unit 170 is connected to the chucking unit 160 serves to move the electrostatic chuck carrier 140. In the present embodiment, the carrier movement unit 170 may be provided in the vacuum processing chamber 110, but may have a circulation structure for circulating the electrostatic chuck carrier 140. Of course, this is only one embodiment and the scope of the present invention need not be limited thereto.

As shown in FIG. 3A, the carrier moving unit 170 rotates in engagement with the power supply unit 171, the rack 172 provided along the moving trajectory of the electrostatic chuck carrier 140, and the rack 172. A pinion 173 and a motor 174 that generates power to rotate the pinion 173 by receiving power from the power supply unit 171. Accordingly, when power is applied from the power supply unit 171 to the motor 174 and the pinion 173 is rotated by the motor 174, the pinion 173 moves along the track 175 of the rack 172, that is, in the present embodiment. As shown in FIG. 1, the electrostatic chuck carrier 140 adsorbs the substrate because the electrostatic chuck carrier 140 is chucked by the chucking unit 160. The deposition process is performed while moving along the circular movement trajectory in the processing chamber 110.

The up / down driving unit 180 is connected to the chucking unit 160 to drive up / down of the electrostatic chuck carrier 140, and the rotating unit 190 is connected to the chucking unit 160. It is connected to serve to rotate the electrostatic chuck carrier 140. The up / down driving unit 180 and the rotating unit 190 are not shown in detail, but the up / down driving unit 180 has a structure such as a cylinder, a linear motor, a servo motor and a gearbox combination, and rotates. The unit 190 can be easily applied to a structure such as a rotating motor.

Referring to the operation of the vacuum processing apparatus of this embodiment having such a configuration is as follows.

First, a transfer unit 121 equipped with a robot or the like grips a substrate of an operation target and transfers the substrate to an incoming load lock chamber 120.

In this case, as shown in FIG. 4, the electrostatic chuck carrier 140 is already disposed on the conveyor roller 105 provided in the inlet load lock chamber 120. The electrostatic chuck carrier 140 may be disposed on the conveyor roller 105 in a reverse state as shown in FIG. 4.

In this state, when the robot of the transfer unit 121 transfers the substrate to the adsorption unit 141 of the electrostatic chuck carrier 140 disposed in the reverse direction as shown in FIG. 5, the substrate is the adsorption unit 141 of the electrostatic chuck carrier 140. Is adsorbed on.

After the substrate is absorbed by the adsorption unit 141, the chucking unit 160 disposed adjacent to the electrostatic chuck carrier 140 is operated to chuck the electrostatic chuck carrier 140. That is, the end of the chucking unit 160 is inserted into the chucking groove 146a of the electrostatic chuck carrier 140 so as to adsorb the substrate by voltage application and the electrostatic chuck carrier 140 is chucked by the chucking unit 160 (FIG. 6). In this case, as described above, the chucking groove 146a corresponds to the case provided in the connecting portion 145.

After the electrostatic chuck carrier 140 is chucked by the chucking unit 160, the up / down driving unit 180 is operated as shown in FIG. 7 to up the chucking unit 160. Then, the electrostatic chuck carrier 140 which adsorbs the substrate is up with the chucking unit 160. Then, the rotary unit 190 is operated as shown in FIG. 8 to rotate the chucking unit 160 by 180 degrees. Then, the electrostatic chuck carrier 140 adsorbing the substrate is rotated 180 degrees with the chucking unit 160, and then the up / down driving unit 180 is operated again as shown in FIG. 9 to down the chucking unit 160. The electrostatic chuck carrier 140 adsorbing the substrate may be down with the chucking unit 160 and disposed on the conveyor roller 105.

Next, the carrier movement unit 170 connected to the chucking unit 160 is operated to transfer the electrostatic chuck carrier 140, which adsorbs the substrate, to the vacuum processing chamber 110. In this case, as shown in FIG. 1, the gate valve G1 passes through the electrostatic chuck carrier 140 even though the power supply is stopped even when the electrostatic chuck carrier 140 moves the gate valve G1. May be adsorbed for from several tens of minutes.

In other words, the gate valve G1 region may have limitations in installing a structure for supplying external power because the space thereof is narrow in view of the drawings, but the electrostatic chuck carrier 140 of the present embodiment may be discharged by the applied electrostatic force once. Since the substrate can be adsorbed for several tens of minutes or more, even if an external power source is not applied, the substrate can be adsorbed for a predetermined time.

When the electrostatic chuck carrier 140 reaches the vacuum processing chamber 110, a deposition process is performed as the carrier movement unit 170 provided in the vacuum processing chamber 110 is operated. That is, when power is supplied from the power supply unit 171 to the motor 174 and the pinion 173 is rotated by the motor 174, the pinion 173 is vacuumed as shown in FIG. 1. The electrostatic chuck carrier 140, which absorbs the substrate, also absorbs the substrate because the electrostatic chuck carrier 140 is chucked by the chucking unit 160. The predetermined deposition process is performed while moving along the circular movement trajectory within.

When the deposition process is completed, the electrostatic chuck carrier 140 that has adsorbed the substrate is transferred to the withdrawal load lock chamber 130 through the gate valve G2, and is transferred to the next process through the transfer unit 131 equipped with a robot or the like. It is taken out. In this case, the drawing load lock chamber 130 may also perform the operation of inverting the electrostatic chuck carrier 140 in the direction of 180 degrees again in FIG. 9 to FIG. 4.

As such, according to the present exemplary embodiment, the substrate may be absorbed and moved by a simple structure, and may be applied even when the substrate needs to be rotated by 90 degrees or 180 degrees according to the process in the vacuum processing chamber 110. In addition, it is possible to efficiently apply to the movement of the substrate between the vacuum processing chamber 110 is not easy to supply external power.

FIG. 10 is a schematic plan view of a vacuum processing apparatus for a substrate using an electrostatic chuck carrier according to a second embodiment of the present invention, and FIG. 11 is a schematic side view of the structure of FIG.

As described above, when the vacuum processing chamber 110 is provided as a single one chamber, the substrate transfer efficiency may be good but may be somewhat disadvantageous in terms of maintenance and installation of components.

Accordingly, as shown in FIGS. 10 and 11, the vacuum processing chambers 210a, 210b and 210c may be provided as a plurality of independent independent chambers 210a, 210b and 210c, but the present invention can be sufficiently applied even in such an environment. Do.

In particular, in the case of the present embodiment, since the gate valves G3 and G4 are further provided between the independent chambers 210a, 210b and 210c, the electrostatic chuck carrier 140 adsorbing the substrate may be the gate valves G3 and G4. However, as described above, even if the power supply is interrupted when passing through the gate valves G3 and G4, the electrostatic chuck carrier 140 can adsorb the substrate for several to several tens of minutes. There is no crowd in carrying out.

12 is a schematic plan view of a vacuum processing apparatus for a substrate using an electrostatic chuck carrier according to a third embodiment of the present invention, and FIG. 13 is a schematic side view of the structure of FIG.

In this embodiment, although the vacuum processing chamber 310 is provided as a single one chamber as in the first embodiment, the above-described carrier moving unit 170 is not provided in the vacuum processing chamber 310, and instead, Corresponds to the case where the conveyor roller 305 is provided, even in such an environment, the present invention is sufficiently applicable.

14 is a layout diagram of the arrangement of the electrostatic chuck carrier and the chucking unit according to the fourth embodiment of the present invention.

Referring to this figure, the carrier moving unit 170a may be a ball screw type 172a to which a motor (not shown) is applied, unlike the carrier moving unit 170 of the above-described embodiment. In this case, the motor may be provided outside the chamber, and as the ball screw 172a is rotated by the operation of the motor, the electrostatic chuck carrier 140 may be moved in the axial direction of the ball screw 172a.

As described above, the present invention is not limited to the described embodiments, and various modifications and changes can be made without departing from the spirit and scope of the present invention, which will be apparent to those skilled in the art. Therefore, such modifications or variations will have to be belong to the claims of the present invention.

1 is a schematic plan view of a vacuum processing apparatus for a substrate using an electrostatic chuck carrier according to a first embodiment of the present invention.

FIG. 2 is a schematic side view of FIG. 1.

3A is a layout view of the electrostatic chuck carrier and the chucking unit provided in FIG. 1.

3B is an enlarged view of the fine up / down driving unit illustrated in FIG. 3A.

4 to 9 are diagrams illustrating the process of rotating the electrostatic chuck carrier 180 degrees, respectively.

10 is a schematic plan structure diagram of a vacuum processing apparatus for a substrate using an electrostatic chuck carrier according to a second embodiment of the present invention.

FIG. 11 is a schematic side view of FIG. 10.

12 is a schematic plan view of a vacuum processing apparatus for a substrate using an electrostatic chuck carrier according to a third embodiment of the present invention.

FIG. 13 is a schematic side view of FIG. 12.

14 is a layout diagram of the arrangement of the electrostatic chuck carrier and the chucking unit according to the fourth embodiment of the present invention.

* Explanation of symbols for the main parts of the drawings

110: vacuum processing chamber 120: incoming load lock chamber

130: withdrawal load lock chamber 140: electrostatic chuck carrier

141: adsorption portion 142: moving support portion

143: fall prevention guide 144: hinge

145: connecting portion 146: chucking portion

160: chucking unit 170: carrier moving unit

180: up / down drive unit 190: rotation unit

Claims (26)

Adsorption unit for adsorbing the substrate by the electrostatic force; And And a chucking part connected to the suction part and chucked by the chucking unit. The method of claim 1, The chucking unit is a pair of chucking block having a chucking groove which is disposed so that the end of the chucking unit is partially received. The method of claim 2, And a fine up / down driving unit connected to the pair of chucking blocks to drive the adsorption unit up / down. The method of claim 3, The fine up / down driving unit, A protruding block protruding from the suction part side; A support connected to the protruding block and disposed between the pair of chucking blocks; An EL guide provided between the pair of chucking blocks and the protruding block; And And an elastic member connected to the pair of chucking blocks and the support, respectively. The method of claim 4, wherein The protruding block and the pair of chucking blocks provided with the LM guide is tapered toward the support so that the height thereof is lowered. The method of claim 1, Electrostatic chuck carrier, characterized in that the fall prevention guide is further provided on one side of the adsorption portion to prevent the fall of the substrate adsorbed on the adsorption portion. The method of claim 1, The electrostatic chuck carrier further comprises a moving support part disposed at a position spaced apart from the suction part and movably supported by a conveyor roller. The method of claim 7, wherein The movable support portion has a plate shape so that the conveyor roller can contact the upper or lower portion of the movable support portion, The electrostatic chuck carrier, characterized in that the suction portion and the movable support portion are interconnected by a connecting portion narrower than the width of the movable support portion so that a space portion in which the conveyor roller is disposed between the movable support portion and the suction portion can be formed. . Adsorption unit for adsorbing the substrate by the electrostatic force; And An electrostatic chuck carrier disposed at a position spaced apart from the adsorption part and including a moving support part movably supported by a conveyor roller. 10. The method of claim 9, The moving support portion has an electrostatic chuck carrier, characterized in that the plate (plate) so that the conveyor roller is in contact with the upper or lower portion of the moving support. 10. The method of claim 9, The electrostatic chuck carrier, characterized in that the suction portion and the movable support portion are interconnected by a connecting portion narrower than the width of the movable support portion so that a space portion in which the conveyor roller is disposed between the movable support portion and the suction portion can be formed. . At least one vacuum processing chamber; An inlet load lock chamber disposed at one side of the vacuum processing chamber to introduce a substrate into the vacuum processing chamber; An extraction load lock chamber disposed on the other side of the vacuum processing chamber to draw out a substrate on which work is completed; An electrostatic chuck carrier which adsorbs the substrate by electrostatic force and supports the substrate during transfer; And And a conveyor roller provided in the vacuum processing chamber to move the electrostatic chuck carrier in rolling contact with the electrostatic chuck carrier. The method of claim 12, The electrostatic chuck carrier, An adsorption unit for adsorbing the substrate by an electrostatic force; And And a moving support part disposed at a position spaced apart from the suction part and movably supported by the conveyor roller. The method of claim 13, The movable support portion has a plate shape so that the conveyor roller can contact the upper or lower portion of the movable support portion, The electrostatic chuck carrier, characterized in that the suction portion and the movable support portion are interconnected by a connecting portion narrower than the width of the movable support portion so that the space between the movable support portion and the suction portion is disposed is formed Substrate vacuum processing apparatus using. The method of claim 13, And a chucking part connected to the movable support part and chucked by the chucking unit. The method of claim 15, The chucking unit is a vacuum processing apparatus for a substrate using an electrostatic chuck carrier, characterized in that the pair of chucking block having a chucking groove that is disposed so that the end of the chucking unit is partially received. The method of claim 16, And a fine up / down driving unit connected to the pair of chucking blocks to drive the adsorption unit up / down. The method of claim 17, The fine up / down driving unit, A protruding block protruding from the suction part side; A support connected to the protruding block and disposed between the pair of chucking blocks; An EL guide provided between the pair of chucking blocks and the protruding block; And And a pair of elastic members connected to the pair of chucking blocks and the support, respectively. The method of claim 17, Surface of the protruding block and the pair of chucking block provided with the LM guide is tapered toward the support so that the height thereof is lowered, the vacuum processing apparatus of the substrate using the electrostatic chuck carrier. The method of claim 13, One side of the adsorption unit vacuum processing apparatus of the substrate using an electrostatic chuck carrier, characterized in that the fall prevention guide is further provided to prevent the fall of the substrate adsorbed on the adsorption unit. At least one vacuum processing chamber; An inlet load lock chamber disposed at one side of the vacuum processing chamber to introduce a substrate into the vacuum processing chamber; An extraction load lock chamber disposed on the other side of the vacuum processing chamber to draw out a substrate on which work is completed; An electrostatic chuck carrier which adsorbs the substrate by electrostatic force and supports the substrate during transfer; And And a chucking unit provided in at least one of the drawing load lock chamber, the drawing load lock chamber, and the vacuum processing chamber to chuck the electrostatic chuck carrier. The method of claim 21, The electrostatic chuck carrier, An adsorption unit for adsorbing the substrate by an electrostatic force; And And a moving support part disposed at a position spaced apart from the suction part and movably supported by the conveyor roller. The method of claim 21, And a carrier moving unit connected to the chucking unit to move the electrostatic chuck carrier. 24. The method of claim 23, The carrier moving unit, A power supply unit; A rack provided along a moving trajectory of the electrostatic chuck carrier; A pinion rotating in engagement with the rack; And And a motor configured to receive power from the power supply to generate power for rotating the pinion. The method of claim 21, An up / down driving unit connected to the chucking unit to drive up / down of the electrostatic chuck carrier; And And a rotating unit connected to the chucking unit to rotate the electrostatic chuck carrier. The method of claim 12 or 21, The vacuum processing chamber is a single one chamber or a plurality of independent chambers, The substrate is a vacuum processing apparatus of the substrate using an electrostatic chuck carrier, characterized in that the substrate for OLED (Organic Light Emitting Diodes).

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