KR20110026722A - Single side copper clad laminate, manufacture of the same and printed circuit board prepared therefrom - Google Patents

Abstract

PURPOSE: A printed circuit board using a metal foil laminated plate is provided to avoid the warpage after the separation from a release film by arranging a pair of prepregs and metal foil at both sides of the release film and controlling the component included in the prepregs. CONSTITUTION: In a metal foil laminated plate, a pair of prepregs and metal foil are arranged at both sides of a release film(4). Based on the release film, the metal foil laminated plate has a symmetrical structure. The prepreg includes a glass base material, impregnated resin, and inorganic filler material. The difference of coefficients of thermal expansion of a first prepreg(2) near the release film and the second prepreg(3) near the metal foil is 0.5~10.

Description

Metal foil laminate, single-sided printed circuit board using same and manufacturing method thereof {SINGLE SIDE COPPER CLAD LAMINATE, MANUFACTURE OF THE SAME AND PRINTED CIRCUIT BOARD PREPARED THEREFROM}

The present invention relates to a metal foil laminate, a printed circuit board using the same, and a method for manufacturing the same. More specifically, a pair of prepregs and metal foils are disposed on both sides of a release film to form a symmetrical structure around the release film, and a pair. It is to provide a single-sided printed circuit board and a method of manufacturing the same by controlling the components included in the prepreg of the separation film after separation from the release film.

Single sided printed circuit board (PCB) uses a metal clad laminate that is placed on both sides of a metal foil fabricated by laminating metal foils on both sides of an insulating layer of prepreg and heating and press forming. In this process, a circuit is formed on one side and one side of the metal foil is removed by etching to manufacture a single-sided printed circuit board.

Another method of manufacturing single-sided printed circuit boards can be fabricated using single-sided metal foil laminates without metal foil on one side from the beginning. At this time, single-sided metal laminate boards are prepreg and metal foil on both sides with a release film. It can be laminated to make a symmetrical structure, such a metal foil laminate is described in Japanese Patent Laid-Open No. 1998-138395. Such a metal foil laminate having a symmetrical structure can be manufactured in a general printed circuit board manufacturing process, and after completion of all processes, two separated printed circuit boards can be obtained. However, when the single-sided printed circuit board of such a structure is separated from the release film, there is a problem that the warpage of the substrate is severely generated due to structural asymmetry.

In general, at the end of the manufacturing process of a single-sided printed circuit board, after applying a solder resist (SR) ink that protects the circuit, warping occurs toward the circuit. If the SR ink is applied to the other side without the circuit, the occurrence of warpage can be suppressed, but in terms of cost, there is a problem in using the SR ink on the surface without the circuit.

In order to solve the problems of the prior art as described above, the present invention forms a symmetrical structure around the release film by arranging a pair of prepregs and metal foil on both sides of the release film, respectively, a glass substrate included in the pair of prepregs Metal foil laminates that do not cause warpage after separation from the release film even if SR ink is not applied on the side without a circuit by controlling the content of resin, the type of resin, and the content of inorganic filler in relation to the content, and a single-sided printed circuit board including the same And to provide a method for producing the same.

Hereinafter, the configuration and effects of the present invention will be described in more detail with reference to specific embodiments and examples of the present invention. However, the following embodiments and examples are only intended to more clearly understand the invention, the scope of the invention is not limited to the following embodiments and examples.

The present invention is a metal foil laminate having a structure in which a pair of prepreg and a metal foil are disposed on both sides of the release film and are symmetric about the release film, wherein the prepreg includes a glass substrate, an impregnated resin, and an inorganic filler. And a coefficient of thermal expansion difference between the first prepreg adjacent to the release film of the pair of prepregs and the second prepreg adjacent to the metal foil of the pair of prepregs has a range of 0.5 to 10. And a metal foil laminate. When the coefficient of thermal expansion is less than 0.5, there is almost no difference between the first prepreg and the second prepreg, and thus there is no effect of improving warpage. When the coefficient of thermal expansion exceeds 10, the direction of bending is reversed in the opposite direction to the circuit. There is a problem.

In one embodiment of the present invention, by placing a pair of prepreg and metal foil on both sides of the release film to form a structure symmetrical around the release film, the prepreg comprises a glass substrate, impregnated resin and inorganic filler, The first prepreg adjacent to the release film of the pair of prepregs contains a resin of more than 100 parts by weight to 200 parts by weight of the inorganic filler and the impregnated resin based on 100 parts by weight of the glass substrate, and the metal foil in the pair of prepregs The second prepreg adjacent to provide a metal foil laminate, the solid content of the inorganic filler and the impregnated resin on the basis of 100 parts by weight of the glass base material comprises a resin of 80 parts by weight to less than 100 parts by weight.

The prepreg is prepared by using a solvent such as methyl ethyl ketone (MEK), Methyl Cellosolve (methyl cellosolve, MCS), dimethylformamide (DMF), or the like, as necessary for sheet-like substrates such as glass cloth and glass nonwoven fabric. The prepreg for laminated sheets can be obtained by impregnating a resin composition.

In another embodiment of the present invention, the type and content of the glass substrate included in the first prepreg and the second prepreg may be different. It may be achieved by adjusting the solids content of the impregnating resin of the prepreg, or by selecting a different type of glass base material so that the thermal expansion coefficient of the first prepreg and the second prepreg is different. For example, if the second prepreg adjacent to the metal foil uses T glass or NE glass, and the first prepreg adjacent to the release film uses E glass, the difference in thermal expansion coefficient between the prepregs causes a difference in the final single-sided printed circuit board. The occurrence of warpage can be suppressed.

The glass substrate used in the present invention may be selected from glass substrates used for various printed circuit board materials. Examples thereof include, but are not limited to, glass fibers such as E glass, D glass, S glass, and NE glass. If necessary, the glass-based material may be selected according to the intended use or performance. Glass-based forms are typically woven, nonwoven, roving, chopped strand mats or surfacing mats. Although the thickness of the glass substrate is not particularly limited, about 0.01 to 0.3 mm or the like can be used. Of these materials, glass fiber materials are more preferred in terms of strength and water absorption properties.

Examples of the impregnating resin that can be used for the prepreg according to one embodiment of the present invention include phenol resin, epoxy resin, modified epoxy resin, imide resin, unsaturated polyester resin, cyanate ester resin, bismaleimide triazine resin (Bismaleimide Triazine Resin) , BT resin) and the like, but is not limited thereto. According to one embodiment of the present invention, the impregnating resin may be a compound having a dihydro benzooxadine ring, an epoxy resin, and a phenol resin. In addition, these resin can also use 2 or more types together and can also add a solvent as needed to make various solvent solutions. As said solvent, an alcohol type, an ether type, a ketone type, an amide type, an aromatic hydrocarbon type, ester type, a nitrile type, etc. may be used, and the mixed solvent which used several types together can also be used.

It is preferable that the impregnation resin used by this invention contains 1 or more types of resin whose weight average molecular weights are 10,000-1,500,000. When the weight-average molecular weight of the impregnated resin is less than 10,000, the bending property tends to be lowered. When the impregnated resin having 1,500,000 or more is used, the impregnation property of the glass substrate is lowered, and the heat resistance and the bending property may be deteriorated.

The solid content in the resin composition including the inorganic filler and the impregnated resin impregnated in the substrate may be 80 parts by weight to 200 parts by weight based on 100 parts by weight of the glass substrate, and more specifically, the first prepreg adjacent to the release film. The solid content in the resin composition including the impregnated inorganic filler and the impregnated resin may be more than 100 parts by weight to 200 parts by weight based on 100 parts by weight of the glass substrate, and preferably 105 parts by weight to 140 parts by weight. The resin composition including the inorganic filler and the impregnated resin relative to the weight of the glass substrate 100 as described above has an effect of increasing the coefficient of thermal expansion.

In addition, the resin composition including the inorganic filler and the impregnated resin of the second prepreg adjacent to the metal foil may be from 80 parts by weight to less than 100 parts by weight based on 100 parts by weight of the glass base, preferably 85 parts by weight to 95 parts by weight. It is wealth. The resin composition has the effect of reducing the coefficient of thermal expansion by the solid content of the composition including the inorganic filler and the impregnated resin as compared to the glass substrate as described above.

The prepreg composition of the present invention may include an inorganic filler. The thermal expansion coefficients of the first prepreg and the second prepreg may be differently adjusted by differently adjusting the contents of the inorganic filler contained in the first prepreg and the second prepreg. Specifically, the first prepreg is an inorganic filler of 50 to 120 phr (part per hundred resin, the weight of the relative inorganic filler in terms of 100 weight pure resin) of the inorganic filler in the resin composition impregnated into the glass fiber Wherein the second prepreg comprises 120 to 200 phr of Inorganic fillers may be included. If the content of the inorganic filler is too much, moldability is reduced in some cases.

Specific examples of the inorganic fillers include silicas such as natural silica, fused silica, amorphous silica, and hollow silica, aluminum trihydroxide (ATH), magnesium hydroxide molybdate, and the like. Molybdenum compounds such as molybdenum oxide and zinc molibdate, zinc borate, zinc stannate, alumina, clay, kaolin, talc (talc), calcined kaolin, calcined talc, mica, short glass fiber (glass fine powder such as E glass or D glass) and hollow glass Include. The average particle diameter (D50) of the inorganic filler is not particularly limited. For example, the average particle diameter (D50) of the inorganic filler is preferably 0.2 to 5 micrometers in view of dispersibility.

The composition for preparing the prepreg may further include at least one additive selected from the group consisting of a flame retardant, a lubricant, a dispersant, a plasticizer, and a silane coupling agent that are commonly added. The prepreg resin composition of the present invention may include various high polymer compounds, other flame resistant compounds or additives such as other thermosetting resins, thermoplastic resins and oligomers and elastomers thereof, so long as the properties inherent in the resin composition are not impaired. These are not particularly limited as long as they are selected from those commonly used.

As a hardening | curing agent contained in the said prepreg composition, various thing conventionally known can be used, For example, when using an epoxy resin as a thermosetting resin, dicyandiamide, diaminodiphenylmethane, diaminodiphenyl sulfone, phthalic anhydride And polyfunctional phenols such as pyromellitic anhydride, phenol novolac and cresol novolac. A curing accelerator can also be used for the purpose of promoting the reaction of the thermosetting resin and the curing agent. The kind and compounding quantity of a hardening accelerator are not specifically limited, For example, an imidazole compound, an organophosphorus compound, a tertiary amine, a quaternary ammonium salt, etc. are used, and 2 or more types can also be used together.

Although the manufacturing conditions, etc. of a prepreg for printed circuit boards are not specifically limited, It is preferable to use a resin composition in the varnish state which added the solvent. In addition, in the production of prepregs for printed circuit boards, it is preferable that the solvent used is volatilized at least 80% by weight. For this reason, there is no restriction | limiting also in a manufacturing method, drying conditions, etc., The temperature at the time of drying is 80 degreeC-180 degreeC, and time does not have a restriction | limiting in particular by the balance with the gelation time of a varnish. The varnish impregnation amount is preferably such that the resin solid content of the varnish is 30 to 80% by weight relative to the total amount of the resin solid content of the varnish and the base material.

The organic solvent for the resin varnish is not particularly limited as long as it is compatible with the mixture of the dihydro benzooxadine ring (A) and the halogen-free epoxy resin (B). Specific examples thereof include ketones such as acetone, methyl ethyl ketone, methylisobutyl ketone and cyclohexanone, aromatic hydrocarbons such as benzene, toluene and xylene, and amides such as dimethylformamide and dimethylacetamide.

In another embodiment of the present invention, a metal foil laminate may be formed by heating a laminate of a plurality of prepregs or a copper foil laminate in which copper foils are laminated on one or both sides of the laminate. have. (Iii) impregnating the substrate with a resin varnish composed of an epoxy resin composition for a printed circuit board and drying to form a prepreg; (Ii) disposing a pair of prepregs and metal foils on both sides of the release film, respectively; And (iii) heating and pressing the overlapped composite to provide a method for manufacturing a laminate for a printed circuit board.

For example, in the manufacture of a metal foil laminate, the first prepreg and the second prepreg are respectively superimposed on both sides of a release film, and the metal foil is superimposed on one side of the pair of prepregs, respectively, usually from 80 ° C. to 230 ° C., preferably The metal foil laminate can be produced by heating and press molding at a pressure in the range of from 0.5 to 8.0 MPa, preferably in the range of from 1.5 to 5.0 MPa, at a temperature in the range of 130 ° C to 200 ° C.

Copper foil and aluminum foil are used for the metal foil used for this invention, Although what has a thickness of 5-200 micrometers can be used, 3-35 micrometers is preferable. Moreover, as metal foil, copper foil is preferable. Nickel, nickel-phosphorus, nickel-tin alloys, nickel-iron alloys, lead, lead-tin alloys, etc. are used as intermediate layers, and 0.5 to 15 µm copper layers and 10 to 300 µm copper layers are provided on both surfaces. One-layer composite foil or a two-layer composite foil obtained by combining aluminum and copper foil can be used.

In one embodiment of the present invention, the release film that can be used for the metal foil laminate is polypropylene, polyethylene terephthalate (PET), pentaerythritol (PEN), polyvinyl alcohol (PVA), polyimide (PI) film may be It is not limited thereto. The release film has a thickness of 20 to 50 micrometers and is excellent in chemical resistance, so that a PI film is preferable.

In another aspect, the present invention is a circuit processing of a metal foil laminate to produce a printed circuit board, the circuit processing can be applied to a method performed in a general circuit board manufacturing process.

In the method of manufacturing a printed circuit board with an inner layer plate protruding from a flexible substrate, after forming a circuit on a metal foil laminate to be a printed circuit board, the outer peripheral processing is performed to some extent by punching or the like around the circuit in advance. It is preferable to also use the prepreg for circuit boards cut | disconnected to the required size previously. In addition, it is preferable that the protruded printed circuit board (inner layer board) protects the circuit portion with a cover rail, a solder resist, or the like which is generally used as necessary. On the other hand, in the case of using a printed circuit board prepreg having a resin exudation amount of 3 mm or less from the printed circuit board prepreg at 250 ° C. or less and 10 MPa or less heating and pressure molding conditions, 250 ° C. or less and 10 MPa or less Under heating and pressing conditions. The prepreg for a printed circuit board, the metal foil laminated board, and the printed circuit board of the present invention are suitable for the manufacturing method of the printed circuit board.

In addition, the present invention is a process for producing a printed circuit board prepreg by impregnating and drying the thermosetting resin composition on the substrate; Manufacturing a metal foil laminate by arranging the pair of prepregs and the metal foils sequentially on both sides of the release film, and then heating and pressure molding them; Manufacturing a printed circuit board by circuit processing the metal foil laminate; Performing SR coating on the substrate; And a method of manufacturing two single-sided printed circuit boards by removing the release film.

In the metal foil laminate according to an embodiment of the present invention, two copper foils are laminated, and a portion of the copper foil is removed to form a circuit pattern by etching, and SR ink coating is performed on only one side of the circuit where the SR ink coating is performed about 20 to 30 μm. Two identical single-sided printed circuit boards can be manufactured by removing the release film, and the manufacturing cost can be reduced because there is no need to etch copper foil on one side and both sides of the SR coating are performed. Can be obtained.

According to the present invention, a metal foil laminate, a printed circuit board using the same, has a merit in that a single-sided printed circuit board does not generate warpage after separation from the release film even if the SR ink is not applied to the circuitless side.

Hereinafter, the present invention will be described in more detail with reference to Examples, but the scope of the present invention is not limited to the following Examples.

Example  One

(1) Preparation of a compound having a dihydro benzooxadine ring in the molecule

After mixing 1.7 kg of phenol novolak resin (trade name KPH-F-2001, manufactured by Kolon Chemical Co., Ltd.) with 1.5 kg of aniline and mixing at 60 ° C for 1 hour, 1.6 kg of formaldehyde in a 5 L flask equipped with a reflux device. After adding to maintain the temperature at 100 ° C., a mixed solution of novolak resin and aniline was slowly added for 30 minutes. Thereafter, the reaction mixture was maintained for 1 hour, and the obtained compound was dried under reduced pressure at 120 ° C. to obtain a compound (A) having a dihydro benzooxadine ring in the molecule.

 (2) Preparation of non-halogen non-phosphorus resin composition

First, 68 parts by weight of the compound (A) prepared in 1 above was added to a 1000 ml beaker, and 85 parts by weight of methyl cellosolve was added to completely dissolve it. Then, (B) 17 parts by weight of bisphenol A novolac epoxy resin ( C) 9 parts by weight of a cresol novolak resin (number average molecular weight = 2,500), (D) 6 parts by weight of a 2,2-bis (4-cyanatephenyl) propane prepolymer (BA230S, manufactured by Lonza) as a cyanate ester resin , 0.1 parts by weight of 2-phenyl imidazole, 0.1 parts by weight of boric acid, 0.7 parts by weight of (G) azo-naphthol dye, and 0.7 parts by weight of azo-based metal complex salt acid dye were added and dissolved completely to obtain a mixed solution.

Thereafter, (E) magnesium hydroxide (trade name Magnifin, manufactured by ALBEMARLE) 21 PHR, (F) silica (trade name SFP 30M, manufactured by DENKA, Japan) 64 PHR, and a slurry (Slurry) dispersed in methyl cellosolve was Into the mixed solution, methylcellosolve was added so that the solid content was 50%, and stirred until the slurry was completely mixed to prepare a flame retardant resin composition.

(3) Preparation of Prepreg

After impregnating the flame-retardant resin composition prepared above in 90㎛ thick glass fibers (2116, E-glass, manufactured by Nittobo Co., Ltd.), followed by hot air drying, the first prepreg and flame retardance having 118 parts by weight of the flame-retardant resin composition compared to 100 parts by weight of glass fibers. A second prepreg having a resin composition of 85 parts by weight was prepared.

In addition, as shown in FIG. 2, the prepregs are laminated to have a symmetrical structure around the PI release film. The first prepreg is placed on the release film and the second prepreg is placed on the copper foil (Mitsui 18 μm VLP), and then laminated together. The copper foil laminate was manufactured by heating and pressing for 90 minutes at a temperature of 220 ° C. and a pressure of 40 kg / cm 2 using a press.

Example  2

Prepared in the same manner as in Example 1, varying the impregnated amount of the flame retardant resin composition as described in Tables 1 and 2 to the impregnated amount of the flame-retardant resin composition to 90 ㎛ thick glass fiber (2116 manufactured by Nittobo, E-glass) After impregnating differently, hot air was dried to prepare a first prepreg having 113 parts by weight of the flame retardant resin composition and a second prepreg having 92 parts by weight of the flame retardant resin composition to 100 parts by weight of the glass fiber. The copper foil laminated sheet manufacturing method is the same as that of Example 1.

Example  3

Prepared in the same manner as in Example 1, but varying the impregnation amount of the flame retardant resin composition as described in Tables 1 and 2 after impregnating the flame-retardant resin composition in 90 ㎛ glass fiber (Nittobo Co., Ltd. 2116, E-glass) After hot air drying, a first prepreg having a flame retardant resin composition of 108 parts by weight relative to 100 parts by weight of glass fiber and a second prepreg having a flame retardant resin composition of 96 parts by weight were prepared. Copper foil laminate manufacturing method is the same as in Example 1.

Example  4

In this embodiment, prepreg and isotropic laminates were prepared using glass fibers having the same type and content of resin and inorganic filler included in the prepreg but having different coefficients of thermal expansion.

Specifically, prepared in the same manner as in Example 1, varying the impregnation amount of the flame retardant resin composition as described in Tables 1 and 2 to the flame-retardant resin composition to 90㎛ glass fiber (Nittobo company 2116, E-glass) After impregnation, hot air was dried to prepare a first prepreg having 105 parts by weight of the flame retardant resin composition compared to 100 parts by weight of glass fiber, and the same resin content was impregnated into 90 µm glass fiber (2116, manufactured by Nittobo, T-glass). A second prepreg was prepared. The copper foil laminated sheet manufacturing method is the same as that of Example 1.

Example  5

In the present embodiment, the resin content contained in the prepreg and the kind of glass fiber used were the same, but prepreg and isotropic laminated plate were prepared by varying the amount of the inorganic filler.

Manufactured in the same manner as in Example 1, but after varying the impregnation amount of the flame retardant resin composition as shown in Table 1, after impregnating the flame-retardant resin composition in 90㎛ thick glass fiber (2116 manufactured by Nittobo, E-glass), hot air The first prepreg was prepared by drying 105 parts by weight of the flame retardant resin composition to 100 parts by weight of glass fiber, and the same as in Example 1, but the magnesium hydroxide (E) 21 PHR and silica (F) 64 PHR of Example 1 Instead, a resin composition containing 150 PHR of silica (trade name SFP 30M, manufactured by DENKA Co., Ltd.) alone as an inorganic filler was prepared to impregnate the same glass fiber with the same resin content to prepare a second prepreg. The copper foil laminated sheet manufacturing method is the same as that of Example 1.

Comparative example  One

Prepared in the same manner as in Example 1, but varying the impregnation amount of the flame retardant resin composition as described in Tables 1 and 2 after impregnating the flame-retardant resin composition in 90 ㎛ glass fiber (Nittobo Co., Ltd. 2116, E-glass) After drying by hot air, a prepreg having a flame retardant resin composition of 105 parts by weight compared to 100 parts by weight of glass fiber was prepared, and a copper clad laminate was prepared using only one type of prepreg. Copper foil laminated sheet manufacturing method is substantially the same as Example 1.

Test Example  One

After etching and removing the copper foil layer of the copper-clad laminate prepared in Examples 1 to 5 and Comparative Example 1, the coefficient of thermal expansion was measured using a TMA (Thermal Mechanical Analysis) Tensile mode in a completely cured C-stage state.

In addition, in order to measure the bending characteristics of the PCB, the height of the edge was bent up from the bottom after placing the PCB on a flat surface plate in a strip state.

Prepreg according to Examples 1 to 5 and Comparative Example 1, the weight of the resin composition containing the resin and the inorganic filler, the inorganic filler (phr) content ratio, compared to 100 parts by weight of glass fiber Inorganic fillers and resin contents are shown in Tables 1 and 2, respectively.

 TABLE 1

Glass fiber parts Resin composition containing resin and inorganic filler (parts by weight) Inorganic filler
(PHR) Inorganic fillers compared to glass fiber 100 Glass Fiber 100 Contrast Resin Example 1 2nd prepreg 100 85 85 39 46 1st prepreg 100 118 85 54 64 Example 2 2nd prepreg 100 92 85 42 50 1st prepreg 100 113 85 52 61 Example 3 2nd prepreg 100 96 85 44 52 1st prepreg 100 108 85 50 58 Example 4 2nd prepreg 100 105 85 48 57 1st prepreg 100 105 85 48 57 Example 5 2nd prepreg 100 105 150 48 57 1st prepreg 100 105 85 48 57 Comparative Example 1 2nd prepreg 100 105 85 48 57 1st prepreg 100 105 85 48 57

(In the above table, the resin content is based on 100 parts by weight of glass fiber, and the inorganic filler is expressed in PHR which is part by weight based on 100 parts by weight of resin).

TABLE 2

Fiberglass type Coefficient of thermal expansion PCB bending characteristics Example 1 2nd prepreg E-glass 14 3 mm 1st prepreg E-glass 20 Example 2 2nd prepreg E-glass 15 4mm 1st prepreg E-glass 19 Example 3 2nd prepreg E-glass 16 5 mm 1st prepreg E-glass 18 Example 4 2nd prepreg T-glass 13 4.5mm 1st prepreg E-glass 17 Example 5 2nd prepreg E-glass 12 4mm 1st prepreg E-glass 17 Comparative Example 1 2nd prepreg E-glass 17 6 mm 1st prepreg E-glass 17

As shown in the above table, Examples 1 to 5 of the present invention have a difference in the coefficient of linear thermal expansion between the first prepreg and the second prepreg in the range of 4 to 6 and are different from those of the prepreg having the same linear thermal expansion coefficient of Comparative Example 1. It can be seen that there are different differences. The present invention forms a symmetrical structure around the release film by arranging a pair of prepregs and metal foils on both sides of the release film, and controlling the content of the resin relative to the glass substrate content contained in the pair of prepregs, and selecting the type of the resin. By adjusting the content of the inorganic filler, the thermal expansion coefficient difference between the first prepreg and the second prepreg is achieved within a specific numerical range, so that warpage does not occur after separation from the release film even if the SR ink is not applied to the non-circuit side. To provide a metal foil laminate, a single-sided printed circuit board comprising the same and a method of manufacturing the same. If the bending value of the PCB is large, the memory chip may not be mounted on the PCB in the semiconductor packaging process, or even if mounted, it may cause a fatal defect in which the chip falls off in the reliability test.

1 is a schematic view of a manufacturing method of a metal foil laminate and a printed circuit board according to an embodiment of the present invention.

2 is a schematic view of a metal foil laminate according to Example 1 of the present invention.

3 is a schematic view of a metal foil laminate according to Comparative Example 1 of the present invention.

Claims (10)

A metal foil laminate having a structure in which a pair of prepregs and metal foils are disposed on both surfaces of a release film and are symmetric about the release film. The prepreg includes a glass substrate, an impregnated resin, and an inorganic filler, and includes a coefficient of thermal expansion of a first prepreg adjacent to a release film of the pair of prepregs, and a second prepreg adjacent to a metal foil of the pair of prepregs. coefficient of thermal expansion) metal foil laminate, the difference is 0.5 to 10. According to claim 1, wherein the first prepreg adjacent to the release film on the basis of 100 parts by weight of the glass substrate comprises a solid content of more than 100 parts by weight to 200 parts by weight of the inorganic filler and the impregnated resin, the first adjacent to the metal foil 2 Prepreg is a metal foil laminate comprising a solid content of the inorganic filler and the impregnated resin is 80 parts by weight to 100 parts by weight. The metal foil laminate according to claim 1, wherein the kind of glass base material contained in said first prepreg and said second prepreg is different. The metal foil laminate according to claim 3, wherein the glass substrate is selected from the group consisting of T glass, E glass, D glass, S glass, and NE glass. The method of claim 1, wherein the first prepreg comprises 50 parts by weight to 120 parts by weight (PHR) of inorganic filler based on 100 parts by weight of the impregnated resin, and the second prepreg 120 based on 100 parts by weight of the impregnated resin Metal foil laminated plate containing an inorganic filler of 200 parts by weight to 200 parts by weight (PHR). The method of claim 1, wherein the inorganic filler is a silica, such as natural silica, fused silica, amorphous silica and hollow silica, aluminum trihydroxide (ATH), magnesium hydroxide (Magnesium hydroxide) ) Molybdenum compounds such as molybdenum oxide and zinc molybdate, zinc borate, zinc stannate, alumina, clay, kaolin ), Talc, calcined kaolin, calcined talc, mica, short glass fiber, glass fine powder, and hollow glass 1 A metal foil laminated sheet which is a species or more. The metal foil laminate according to claim 1, wherein the prepreg is prepared from a composition further comprising at least one additive selected from the group consisting of a flame retardant, a lubricant, a dispersant, a plasticizer and a silane coupling agent. According to claim 1, wherein the release film is at least one selected from polypropylene, polyethylene terephthalate (PET), pentaerythritol (PEN), polyvinyl alcohol (PVA), and polyimide (PI) film Metal foil laminate. The metal foil laminate according to claim 1, wherein the release film has a thickness of 20 to 50 micrometers. A method for manufacturing a single-sided printed circuit board, comprising the steps of forming a circuit pattern on the metal foil of the metal foil laminate according to any one of claims 1 to 9, performing a solid resist coating, and removing a release film.

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