KR101668855B1 - Thermosetting resin composition for semiconductor pakage and Prepreg and Metal Clad laminate using the same - Google Patents

Abstract

The present invention relates to a thermosetting resin composition for a semiconductor package, and a prepreg and a metal foil laminates using the same. More specifically, the present invention relates to a semiconductor package which can be used for a printed circuit board for a micropattern of a micropattern by securing the flowability of the prepreg by controlling the reaction rate by using a benzoxazine resin instead of phenol novolak resin as a curing agent. And a prepreg and a metal foil laminates using the thermosetting resin composition.

Description

TECHNICAL FIELD [0001] The present invention relates to a thermosetting resin composition for a semiconductor package, a prepreg using the same, and a metal-clad laminate using the same.

The present invention relates to a thermosetting resin composition capable of ensuring flowability of a buildup prepreg of a printed circuit board (PCB) for a semiconductor package, and a prepreg and a metal foil laminate using the same.

A copper clad laminate used in a conventional printed circuit board is made by impregnating a base of a glass fabric into a varnish of the thermosetting resin and then semi-curing the prepreg, which is then heated and pressed together with the copper foil . A prepreg is again used for constructing a circuit pattern on the copper-clad laminate and for building-up on the circuit pattern.

In recent years, printed circuit boards for semiconductor packages have become thinner and circuit patterns have become finer, and it has become necessary to ensure the flowability of the prepreg for build-up in order to fill fine patterns with thin prepregs.

However, the thermosetting resin composition for a prepreg currently used has a poor compatibility with a filler and a resin, making it difficult to ensure the flowability of the prepreg.

The present invention provides a thermosetting resin composition for a semiconductor package capable of securing the flowability of a buildup prepreg of a printed circuit board for a semiconductor package which is becoming finely patterned by changing a kind of filler and a curing agent.

Another object of the present invention is to provide a prepreg using the above-mentioned thermosetting resin composition and a metallic window board including the prepreg.

The present invention relates to a binder comprising an epoxy resin, a bismaleimide resin and a cyanate resin; Benzoxazine resin; And a surface-treated filler. The present invention also provides a thermosetting resin composition for a semiconductor package.

The thermosetting resin composition is prepared by mixing 100 parts by weight of a binder containing 20 to 30% by weight of an epoxy resin, 20 to 30% by weight of a bismaleimide resin and 40 to 50% by weight of a cyanate resin, 40 parts by weight; And 100 to 300 parts by weight of the surface-treated filler.

The benzoxazine resin may be at least one selected from the group consisting of a bisphenol A type benzoxazine resin, a bisphenol F type benzoxazine resin, a phenolphthalein benzoxazine resin, and a mixture of benzoxazine resin and a part of a curing accelerator have.

The surface-treated filler is preferably one prepared by dry or wet surface treatment of an inorganic filler using a surface treatment agent.

The surface treating agent is an epoxy silane and the inorganic filler is selected from the group consisting of silica, aluminum trihydroxide, magnesium hydroxide, molybdenum oxide, zinc molybdate, zinc borate, zinc stannate, alumina, clay, kaolin, Talc, calcined kaolin, calcined talc, mica, glass staple fiber, glass fine powder and hollow glass.

The epoxy resin may be at least one selected from the group consisting of bisphenol A type epoxy resin, phenol novolak epoxy resin, tetraphenyl ethane epoxy resin, naphthalene type epoxy resin, biphenyl type epoxy resin, dicyclopentadiene epoxy resin and dicyclopentadiene type epoxy resin and naphthalene Based epoxy resin, or a mixture of two or more epoxy resins.

The bismaleimide resin may be at least one selected from the group consisting of compounds represented by the following general formula (2).

(2)

(Wherein n is 0 or an integer of 1 to 50)

The cyanate resin may be at least one selected from the group consisting of compounds represented by the following general formula (3).

(3)

(Wherein n is 0 or an integer of 1 to 50)

The thermosetting resin composition may further include at least one additive selected from the group consisting of a solvent, a curing accelerator, a flame retardant, a lubricant, a dispersant, a plasticizer and a silane coupling agent.

The present invention also provides a prepreg produced by impregnating a fiber substrate with the thermosetting resin composition.

The prepreg may have a kinematic viscosity of 10 to 1000 Pa.s at a temperature of 100 to 150 < 0 > C.

The present invention also relates to a prepreg, And a metal foil which is integrated with the prepreg by heating and pressurizing the metal foil.

The thermosetting resin composition of the present invention can be obtained by changing the phenol novolak resin used as a conventional curing agent to a benzoxazine resin and improving the uniformity and securing the excellent flowability of the prepreg including the surface-treated specific filler, It is possible to provide a prepreg as a build-up material applicable to a patterned printed circuit board. In addition, the thermosetting resin composition of the present invention exhibits physical properties equal to or higher than those of the conventional resin composition, and the flowability is excellent, thereby improving the reliability.

Fig. 1 shows kinematic viscosity results on a rheometer according to Examples and Comparative Examples.

Hereinafter, the thermosetting resin composition according to a specific embodiment of the present invention will be described in detail.

According to one embodiment of the present invention, a binder comprising an epoxy resin and a bismaleimide-based resin; Benzoxazine resin; And a surface-treated filler. The present invention also provides a thermosetting resin composition for a semiconductor package.

The present invention provides a thermosetting resin composition capable of providing a prepreg and a metal laminate having excellent flow properties by changing the kinds of filler and curing agent to materials different from conventional ones.

The compatibility of the filler constituting the thermosetting resin composition with the resin differs depending on the surface treatment, and the better the compatibility with the resin, the more the flowability is secured. Further, when the kind of the curing agent is specifically changed so that the reaction between the resins occurs slowly, the flowability is secured.

Accordingly, the present invention can control the reaction rate by changing the phenol novolak used as a conventional curing agent to a benzoxazine resin. That is, the phenol novolac curing agent, which has been mainly used in the past, generally has a hydroxyl group in its structure and reacts with epoxy resin and the like at room temperature, and thus the initial reaction rate is fast. On the other hand, the benzoxazine resin used in the present invention exhibits a function as a curing agent and has a property of generating a hydroxyl group at a temperature of 150 ° C or higher. As a result, the reaction occurs slowly at room temperature or at an early stage, Can be adjusted.

Also, in the case of the filler, the surface treatment agent such as the epoxy silane used in the conventional surface treatment may remain in the resin composition as well as on the surface of the filler, and this amount may affect the reaction rate. Therefore, it is possible to control the reaction rate of the resin by making the degree of surface treatment uniform while minimizing the amount of the residual epoxy silane by changing the surface treatment of the filler. Preferably, in the present invention, the use of a filler surface-treated by a wet method can improve the uniformity of surface treatment compared to the conventional method.

Accordingly, the thermosetting resin composition of the present invention does not cause much reaction in the drying step of making the prepreg, so that it is possible to make a metal laminate or ensure flowability during a build-up process, thereby easily filling a fine pattern. The metal laminate including the prepreg may be usefully used for the build-up of printed circuit boards for semiconductor packages. The thermosetting resin composition of the present invention and the prepreg and metal plate laminate using the same can be applied not only to a double-sided printed circuit board but also to a multilayer printed circuit board.

Hereinafter, the components of the thermosetting resin composition of the present invention will be described in more detail.

The thermosetting resin composition of the present invention comprises a binder, a curing agent and a filler including an epoxy resin and a special resin.

At this time, the epoxy resin used in the thermosetting resin composition for prepreg can be used, and the kind of the epoxy resin is not limited.

For example, the epoxy resin may be at least one selected from the group consisting of bisphenol A epoxy resin, phenol novolac epoxy resin, tetraphenyl ethane epoxy resin, naphthalene epoxy resin, biphenyl epoxy resin, dicyclopentadiene epoxy resin of formula A mixture of a chloropentadiene-based epoxy resin and a naphthalene-based epoxy resin may be used.

[Chemical Formula 1]

(Wherein n is 0 or an integer of 1 to 50)

It is preferable to use a bismaleimide resin and a cyanate resin as the special resin.

The bismaleimide resin may be at least one selected from the group consisting of compounds represented by the following general formula (2).

(2)

(Wherein n is 0 or an integer of 1 to 50)

In a preferred example, the bismaleimide resin is a copolymer of bismaleimide resin composed of diphenylmethane bismaleimide resin, phenylene bismaleimide resin, bisphenol A type diphenyl ether bismaleimide resin, and oligomers of phenylmethane maleimide resin Resins, and the like.

The cyanate resin may be at least one selected from the group consisting of compounds represented by the following general formula (3). For example, the cyanate resin may be at least one selected from the group consisting of a novolak type cyanate resin, a bisphenol A type cyanate resin, a bisphenol E type cyanate resin, a bisphenol type cyanate resin of a tetramethyl bisphenol F type cyanate resin, And an advanced prepolymer. These may be used alone or in combination of two or more.

(3)

(Wherein n is 0 or an integer of 1 to 50)

The binder component is a mixture of the above-mentioned epoxy resin, bismaleimide resin and cyanate resin, in consideration of the physical properties required for the thermosetting resin composition, so that the content of the entire resin mixture can be adjusted to 100 wt% . For example, 20 to 30% by weight of an epoxy resin, 20 to 30% by weight of a bismaleimide resin and 40 to 50% by weight of a cyanate resin based on the total weight of the total resin composition.

Meanwhile, the benzoxazine resin used in the present invention can control the reaction rate, thereby ensuring the flowability of the prepreg. In addition, benzoxazine enables curing of the above-mentioned epoxy resin and bismaleimide resin.

That is, the benzoxazine resin can be used as a curing agent for the epoxy resin and the bismaleimide resin. Since the benzoxazine resin is used as a curing agent for the bismaleimide resin, the curing reaction of the resins which can be carried out at a low temperature, such as the drying process, is small, unlike the conventional phenol novolak resin, and the degree of curing of the prepreg is lowered Flowability can be ensured. This also provides an effect of minimizing appearance defects occurring in the press process used in the build-up process as well as in manufacturing the metal laminate plate.

The benzoxazine resin may be contained in an amount of 1 to 40 parts by weight, 5 to 30 parts by weight, or 5 to 20 parts by weight based on 100 parts by weight of the binder. That is, it is preferable that the benzoxazine resin is included in an amount of 1 part by weight or more based on 100 parts by weight of the binder so that sufficient curing of the bismaleimide resin contained in the binder can be induced. However, when the benzoxazine resin is contained in an excess amount, the curing reaction rate during the preparation of the prepreg may be retarded more than necessary, and the process efficiency may be lowered. Therefore, it is preferable that the benzoxazine resin is contained in an amount of 40 parts by weight or less based on 100 parts by weight of the binder.

The benzoxazine resin may be at least one selected from the group consisting of a bisphenol A type benzoxazine resin, a bisphenol F type benzoxazine resin, a phenolphthalein benzoxazine resin, and a mixture of benzoxazine resin and a part of a curing accelerator have.

In addition, in the present invention, the uniformity of the resin composition can be improved by using a filler that has been subjected to a surface treatment with high uniformity without using a conventional filler.

As a method of surface-treating the filler, there is a method of treating the filler with a dry or wet method using a surface treatment agent such as epoxy silane. Therefore, in the present invention, any of the fillers that have been subjected to a dry or wet surface treatment may be used, and a wet filler may be preferably used.

That is, the surface treatment is the most important to treat the thinnest and uniformly with a small amount of the surface treatment agent, and in this regard, the wet treatment is more advantageous than the dry treatment. The reason for this is that, in the case of wetting, the degree of surface treatment can be made uniform with a small amount, and the amount of epoxy silane remaining after the surface treatment becomes small. More specifically, the unreacted epoxy silane not used in the surface treatment participates in the reaction in the resin composition, and can be a parameter for accelerating the reaction rate. However, in the case of dry type, the amount used for surface treatment is large and the amount of residual epoxy silane may be relatively large.

Therefore, it is more preferable to use the surface-treated filler prepared by wet-surface-treating the inorganic filler using a surface treatment agent. However, even if a filler surface-treated in the present invention is used, a benzoxazine resin, which is not a conventional phenolic curing agent, is used.

Further, according to a preferred embodiment of the present invention, the surface treatment agent may be an epoxy silane. The inorganic filler may be selected from the group consisting of silica, aluminum trihydroxide, magnesium hydroxide, molybdenum oxide, zinc molybdate, zinc borate, zinc stannate, alumina, clay, kaolin, talc, fired kaolin, And may be at least one selected from the group consisting of mica, glass short fibers, glass fine powder and hollow glass.

More preferably, according to the present invention, 0.01 to 1 part by weight of epoxy silane based on 100 parts by weight of an inorganic filler is surface-treated with a filler by a wet method. At this time, the filler may be a slurry type or a powder type.

The filler may be used in an amount of 100 to 300 parts by weight or 150 to 250 parts by weight based on 100 parts by weight of the binder. When the content of the filler is less than about 100 parts by weight, the thermal expansion coefficient increases. However, there is a problem of bending due to heat after the semiconductor chip is mounted after the production of the substrate. If the content exceeds 250 parts by weight, the flowability of the prepreg is deteriorated.

Meanwhile, the thermosetting resin composition according to an embodiment of the present invention may further include at least one additive selected from the group consisting of a solvent, a curing accelerator, a flame retardant, a lubricant, a dispersant, a plasticizer and a silane coupling agent.

Specifically, the present invention can be used as a solution by adding a solvent to the resin composition, if necessary. The solvent is not particularly limited as long as it exhibits good solubility with respect to the resin component, and alcohol, ether, ketone, amide, aromatic hydrocarbon, ester, nitrile and the like can be used. Or a mixed solvent of two or more of them may be used. The content of the solvent is not particularly limited as long as it can impregnate the glass fiber into the resin composition during preparation of the prepreg.

The curing accelerator may be used for the purpose of accelerating the curing of the binder described above. The type and blending amount of the curing accelerator are not particularly limited, and for example, an imidazole-based compound, an organophosphorous compound, a tertiary amine, a quaternary ammonium salt and the like are used, and two or more kinds of them may be used in combination. Preferably, the present invention uses an imidazole-based compound as a curing accelerator. When the imidazole-based curing accelerator is used, the curing accelerator is used in an amount of about 0.1 to 1 part by weight based on 100 parts by weight of the binder, and less than 5 to 15% by weight of the imidazole-based curing accelerator can be used . Examples of the imidazole-based curing accelerator include 1-methyl imidazole, 2-methyl imidazole, 2-ethyl 4-methyl imidazole, 2-phenyl imidazole, 2-cyclohexyl 4-methyl imidazole, 4-butyl 5-ethyl imidazole, ), 2-methyl 5-ethyl imidazole, 2-octyl 4-hexyl imidazole, 2,5-dichloro-4-ethyl imidazole Imidazoles such as 2,5-dichloro-4-ethyl imidazole and 2-butoxy 4-allyl imidazole, and imidazole derivatives. Particularly excellent reaction stability and low cost 2-methylimidazole or 2-phenylimidazole is preferred.

The thermosetting resin composition of the present invention may further contain at least one additive selected from the group consisting of a flame retardant, a lubricant, a dispersant, a plasticizer and a silane coupling agent, which are usually added as needed. The resin composition of the present invention may further contain various high polymer compounds such as other thermosetting resins, thermoplastic resins and oligomers and elastomers thereof, and other salt resistance compounds or additives, so long as the properties inherent to the resin composition are not impaired. These are not particularly limited as long as they are selected from commonly used ones.

According to another embodiment of the present invention, there is provided a prepreg produced by impregnating a fiber substrate with the thermosetting resin composition.

The prepreg means that the thermosetting resin composition is impregnated into the fiber substrate in a semi-cured state.

The kind of the fiber base material is not particularly limited, but it may be a fiber base material, a polyamide resin fiber such as a polyamide resin fiber or an aromatic polyamide resin fiber, a polyester resin fiber, an aromatic polyester resin fiber, a wholly aromatic polyester A synthetic fiber base material composed of a woven or nonwoven fabric mainly composed of polyester resin fibers such as polyolefin fibers, polyester fiber fibers such as polyolefin fibers and resin fibers, polyimide resin fibers and fluororesin fibers as main components, and synthetic fibers such as kraft paper, cotton linter paper, Or the like can be used, and a glass fiber substrate is preferably used. The glass fiber base can improve the strength of the prepreg, reduce the water absorption rate, and reduce the thermal expansion coefficient. The glass substrate used in the present invention can be selected from glass substrates used for various printed circuit board materials. Examples thereof include, but are not limited to, glass fibers such as E glass, D glass, S glass, T glass and NE glass. The glass base material can be selected according to the intended use or performance as required. Glass substrate forms are typically woven, nonwoven, roving, chopped strand mat or surfacing mat. The thickness of the glass base material is not particularly limited, but about 0.01 to 0.3 mm or the like can be used. Of these materials, the glass fiber material is more preferable in terms of strength and water absorption property.

In addition, the method for preparing the prepreg in the present invention is not particularly limited and may be manufactured by a method well known in the art. For example, the impregnation method, the coating method using various coaters, the spraying method, and the like can be used as the method for producing the prepreg.

In the case of the impregnation method, a prepreg can be prepared by preparing a varnish and impregnating the fiber substrate with a varnish.

That is, the preparation conditions of the prepreg are not particularly limited, but it is preferable to use them in a varnish state in which a solvent is added to the thermosetting resin composition. The solvent for resin varnish is not particularly limited as long as it is miscible with the resin component and has good solubility. Specific examples thereof include ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone and cyclohexanone, aromatic hydrocarbons such as benzene, toluene and xylene, amides such as dimethylformamide and dimethylacetamide, And aliphatic alcohols such as sorb and butyl cellosolve.

In the preparation of the prepreg, it is preferable that the solvent used is volatile at 80 wt% or more. Therefore, there is no limitation on the production method and drying conditions, and the drying temperature is about 80 to 180 占 폚, and the time is not particularly limited as long as it is in balance with the gelation time of the varnish. It is preferable that the impregnation amount of the varnish is such that the resin solid content of the varnish is about 30 to 80% by weight based on the total amount of the resin solid content and the substrate of the varnish.

The prepreg can have a kinematic viscosity of 1 to 10,000 Pa.s or 10 to 1000 Pa.s at a temperature of 100 to 150 DEG C on a rheometer (Marker: HAAKE, Model: Rheostressl). The kinematic viscosity of the prepreg varies with the reaction rate, and the lower the reaction rate, the lower the viscosity at higher temperatures. A prepreg having a low viscosity at a high temperature has an excellent workability in a post-process, and is a characteristic required in a build-up prepreg that fills a gradually fine pattern.

According to another aspect of the present invention, there is provided a prepreg, And a metal foil which is integrated with the prepreg by heating and pressurizing the metal foil.

Wherein the metal foil comprises: a copper foil; Aluminum foil; A three-layered composite foil having an intermediate layer of nickel, nickel-phosphorus, nickel-tin alloy, nickel-iron alloy, lead or lead-tin alloy and having copper layers of different thicknesses on both sides; Or a composite foil of a two-layer structure in which aluminum and a copper foil are combined.

According to a preferred embodiment, the metal foil to be used in the present invention is a copper foil or an aluminum foil, and may have a thickness of about 2 to 200 mu m, but preferably has a thickness of about 2 to 35 mu m. Preferably, a copper foil is used as the metal foil. According to the present invention, it is also possible to provide a copper foil having a copper layer of 0.5 to 15 占 퐉 and a copper foil of 10 to 20 占 퐉 on both surfaces of the intermediate layer, such as nickel, nickel-phosphorus, nickel- tin alloy, A composite foil of a three-layer structure in which a copper layer of 300 占 퐉 is provided, or a two-layer composite foil in which aluminum and a copper foil are combined.

The metal laminate including the prepreg thus produced can be laminated on one or more sheets and then used in the manufacture of double-sided or multi-layer printed circuit boards. In the present invention, the metal-clad laminate may be subjected to a circuit processing to produce a double-sided or multi-layer printed circuit board, and the circuit processing may be performed in a general double-sided or multi-layer printed circuit board manufacturing process.

Further, in order to evaluate the flowability of the prepreg, the degree of flow after lamination can be grasped by using a 12 탆 copper foil with a high roughness of the copper foil and a 2 탆 copper foil with a small roughness. The flowability evaluation method can be evaluated by visually observing the surface of the cured prepreg by visually observing the amount of the copper foil layer removed by etching and then flowing out to the outside.

As described above, according to the present invention, by using the above-mentioned thermosetting resin composition, it can be applied to various printed circuit boards in various fields, and can be preferably used for manufacturing a printed circuit board for a semiconductor package.

Best Mode for Carrying Out the Invention Hereinafter, the function and effect of the present invention will be described in more detail through specific examples of the present invention. It is to be understood, however, that these embodiments are merely illustrative of the invention and are not intended to limit the scope of the invention.

Example  1 to 2, Comparative Example  One, Reference Example 1

Each component was mixed with the composition and content shown in Table 1 below to prepare thermosetting resin compositions of Examples and Comparative Examples, respectively. Also, even when a phenol curing agent was used in the same manner, a resin composition of Reference Example 1 was prepared for evaluating the flowability after dry and wet surface treatment of an inorganic filler.

Then, each of the thermosetting resin compositions was mixed with an inorganic filler dispersed in dimethylformamide and mixed in a high-speed stirrer until the solid content reached 70 wt% to prepare a resin varnish.

Subsequently, the resin varnish was impregnated with 16 mu m-thick glass fibers (1017, manufactured by Nittobo Co., Ltd., T-glass) and hot air dried at a temperature of 120 DEG C to prepare a buildup prepreg.

Then, a copper clad laminate was prepared using the prepreg and the copper foil prepared above.

(1) Specimen 1: A prepreg produced as described above was laminated, a copper foil (12 탆 thick, manufactured by Mitsui) was placed on both sides of the laminate, and the laminate was pressed at a temperature of 230 캜 at a rate of 30 kg / (Thickness: 0.064 mm) for 90 minutes.

(2) Specimen 2: A prepreg produced as described above was laminated, and a copper foil (2 탆 in thickness, manufactured by Mitsui) was placed on both sides thereof and laminated. The laminate was pressed at a temperature of 230 캜 at a rate of 30 kg / (Thickness: 0.044 mm) was prepared by heating and pressurizing the mixture at 90 DEG C for 90 minutes.

Reference Example 1 Example 1 Example 2 Comparative Example 1 Epoxy resin 30 30 30 30 Bismaleimide
Suzy 30 30 30 30 Cyanate
Suzy 40 40 40 40 Benzoxazine resin - 20 20 - Inorganic filler A - 150 - 150 Inorganic filler B 150 - 150 - Phenol hardener 5 - - 5 week)
1) Epoxy resin: dicyclopentadiene epoxy resin, XD-1000 (manufactured by Nippon Kayaku)
2) Bismaleimide resin: phenylmethane maleimide resin, BMI-2000 (DAIWAKASEI)
3) Cyanate resin: Bisphenol A cyanate resin, BA-3000S (Lonza)
4) benzoxazine resin: MT-35600 (Huntsman)
5) Inorganic filler A: SFP-30MHE (Denka, dry surface treatment)
6) Inorganic filler B: SC-2050 (Admatechs, wet surface treatment)
7) Phenol Hardener: GPX-41

Experimental Example  : Property evaluation

1. Viscosity Evaluation

In order to evaluate the flowability of the prepreg, the flowability was evaluated by measuring the kinematic viscosity of the prepreg while raising the temperature at a constant rate with a rheometer. The results are shown in Fig.

The kinematic viscosity of the prepreg was measured in a CS mode using HAAKE Rheostressl while raising the temperature from 80 ° C to 180 ° C at a rate of 3 ° C / min. The temperature (℃) and kinematic viscosity of the lowest viscosity region were recorded and compared.

2. Evaluation of physical properties of copper-clad laminates

As described above, the prepreg and the copper foil prepared in the above Examples, Comparative Examples and Reference Examples were used to make a copper-clad laminate, and the flowability and physical properties were evaluated. The results are shown in Table 2.

(a) Flowability

The copper foil layer was etched and removed from the specimen 1 (prepared by using one prepreg and a 12 탆 copper foil) and the specimen 2 (one prepreg and 2 탆 copper foil) prepared in the above examples and comparative examples, The sex was evaluated.

The flowability was evaluated by visually observing the resin content exiting to the outside of the copper clad laminate, and visually observing the cured prepreg surface.

(b) glass transition temperature and modulus

The copper foil layer on the copper foil window was removed by etching, and the glass transition temperature and modulus were measured at a heating rate of 5 ° C / min using DMA (Dymamic Mechanical Analysis).

(b) Coefficient of thermal expansion (CTE)

The copper foil layer of the copper clad laminate was etched and removed, and the thermal expansion coefficient was measured at a heating rate of 10 캜 / min using TMA (Thermo Mechanical Analysis).

Reference Example 1 Example 1 Example 2 Comparative Example 1 Kinematic viscosity
(° C / Pa.s) 128/880 137/270 137/130 125/1255 Glass transition temperature
(DMA) ° C 310 310 310 310 X / Y CTE (TMA) 8 8 8 8

From the results shown in FIG. 1 and Table 2, Examples 1 and 2 of the present invention can ensure flowability, but Comparative Example 1 shows a lack of flowability.

Also, it was confirmed that the flowability was increased when the inorganic filler was changed from a dry type to a wet type surface treatment in Reference Example 1, as compared with Comparative Example 1, even when the phenol hardening agent was used in the same manner. From these results, it can be confirmed that the result of Example 2 using the wet-surface-treated inorganic filler is more excellent than that of Example 1.

In addition, since the present invention can use all the inorganic fillers that have been subjected to the dry or wet surface treatment, the benzoxazine resin and the cyanate resin are included therein, and the phenol curing agent is not included. And shows excellent flow properties.

Therefore, in the case of the present invention, it is possible to easily fill a fine pattern with a thin prepreg, thereby providing a thermosetting resin composition which can be usefully used for manufacturing a printed circuit board for a semiconductor package.

While the present invention has been particularly shown and described with reference to specific embodiments thereof, those skilled in the art will appreciate that such specific embodiments are merely preferred embodiments and that the scope of the present invention is not limited thereby. something to do. It is therefore intended that the scope of the invention be defined by the claims appended hereto and their equivalents.

Claims (12)

To 100 parts by weight of a binder comprising 20 to 30% by weight of an epoxy resin, 20 to 30% by weight of a bismaleimide resin and 40 to 50% by weight of a cyanate resin; Benzoxazine resin 1 to 40 parts by weight; And 100 to 150 parts by weight of the surface-treated filler,
Wherein the surface-treated filler is prepared by wet-surface-treating 0.01 to 1 part by weight of epoxy silane based on 100 parts by weight of an inorganic filler.
delete The method according to claim 1, wherein the benzoxazine resin is selected from the group consisting of a bisphenol A benzoxazine resin, a bisphenol F benzoxazine resin, a phenolphthalein benzoxazine resin, and a mixture of benzoxazine resin and a curing accelerator Wherein the thermosetting resin composition is a thermosetting resin composition for a semiconductor package.
delete The method according to claim 1,
The inorganic filler is selected from the group consisting of silica, aluminum trihydroxide, magnesium hydroxide, molybdenum oxide, zinc molybdate, zinc borate, zinc stannate, alumina, clay, kaolin, talc, calcined kaolin, Wherein the thermosetting resin composition is at least one selected from the group consisting of a glass short fiber, a glass fine powder, and a hollow glass.
The epoxy resin composition according to claim 1, wherein the epoxy resin
Based epoxy resin, a bisphenol A epoxy resin, a phenol novolak epoxy resin, a tetraphenyl ethane epoxy resin, a naphthalene epoxy resin, a biphenyl epoxy resin, a dicyclopentadiene epoxy resin, and a dicyclopentadiene epoxy resin and a naphthalene epoxy resin And mixtures thereof. The thermosetting resin composition according to claim 1, wherein the thermosetting resin composition is a thermosetting resin composition.
The thermosetting resin composition according to claim 1, wherein the bismaleimide resin is at least one selected from the group consisting of compounds represented by the following formula (2).
(2)

(Wherein n is 0 or an integer of 1 to 50)
The thermosetting resin composition according to claim 1, wherein the cyanate resin is at least one selected from the group consisting of compounds represented by the following general formula (3).
(3)

(Wherein n is 0 or an integer of 1 to 50)
The method according to claim 1,
Wherein the thermosetting resin composition further comprises at least one additive selected from the group consisting of a solvent, a curing accelerator, a flame retardant, a lubricant, a dispersant, a plasticizer and a silane coupling agent.
A prepreg produced by impregnating a fiber substrate with the thermosetting resin composition according to any one of claims 1, 3 and 5 to 9.
11. The prepreg of claim 10 having a kinematic viscosity of from 10 to 1000 Pa.s at a temperature of from 100 to 150 < 0 > C.
A prepreg according to claim 11; And a metal foil integrated with the prepreg by heating and pressing.

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