KR20110007659A - Lighting apparatus with led - Google Patents

Lighting apparatus with led Download PDF

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Publication number
KR20110007659A
KR20110007659A KR1020090065205A KR20090065205A KR20110007659A KR 20110007659 A KR20110007659 A KR 20110007659A KR 1020090065205 A KR1020090065205 A KR 1020090065205A KR 20090065205 A KR20090065205 A KR 20090065205A KR 20110007659 A KR20110007659 A KR 20110007659A
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KR
South Korea
Prior art keywords
led
circuit board
printed circuit
heat dissipation
case
Prior art date
Application number
KR1020090065205A
Other languages
Korean (ko)
Inventor
홍삼권
Original Assignee
홍삼권
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Publication date
Application filed by 홍삼권 filed Critical 홍삼권
Priority to KR1020090065205A priority Critical patent/KR20110007659A/en
Publication of KR20110007659A publication Critical patent/KR20110007659A/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/10—Arrangement of heat-generating components to reduce thermal damage, e.g. by distancing heat-generating components from other components to be protected
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/049—Patterns or structured surfaces for diffusing light, e.g. frosted surfaces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Abstract

The present invention relates to an LED lighting device having a cooling device, and an object of the present invention is to provide an LED lighting device, the heat dissipating material is filled in the space between the LED and the floodlight cover. To this end, the present invention, a printed circuit board mounted with at least one LED and a driving circuit; A case fixed to be in close contact with the printed circuit board to support the printed circuit board and having a surface through which light emitted from the LED passes; A light transmission cover fixed to the case open to the open surface of the case to transmit light; And a heat dissipation member filled between the printed circuit board and the floodlight cover to dissipate heat generated by the LED.

LED, Cooling, Heat Dissipation, LED, Lighting

Description

LED lighting device {LIGHTING APPARATUS WITH LED}

The present invention relates to a lighting apparatus using LED, and more particularly, to an LED lighting apparatus equipped with a cooling device.

Recently, light emitting diodes (LEDs) are being actively applied to lighting devices as low power, high efficiency, and environmentally friendly materials.

However, in the structure of the conventional lighting device, since the heat generated from the LED is not cooled efficiently, the life and stability of the LED vulnerable to high temperature is limited. Thus, conventional luminaires had to be designed with low power that was less than the maximum efficiency at which LEDs could be utilized.

The effective heat dissipation in the conventional lighting device is not possible because heat generated from the LED is transferred to the PCB Assy through the SMD Soldering Point, and the PCB Assy heat is radiated out through the heat sink or the outer case. to be.

That is, in the above structure, since the heat generated from the LED must escape through the SMD soldering point of a small area, the cooling efficiency is inevitably deteriorated. In other words, all surfaces other than LDE's SMD Soldering Point are in contact with air, and since air is an effective thermal insulator with a thermal conductivity of only 0.025k, all the heat generated from the LED is drawn out through the SMD Soldering Point. Therefore, the cooling efficiency of the LED lighting apparatus is reduced overall.

The present invention for solving the above problems is to provide a LED lighting device, the heat dissipating material is filled in the space between the LED and the floodlight cover.

In order to achieve the above object, the present invention, a printed circuit board mounted with at least one LED and a driving circuit; A case fixed to be in close contact with the printed circuit board to support the printed circuit board and having a surface through which light emitted from the LED passes; A light transmission cover fixed to the case open to the open surface of the case to transmit light; And a heat dissipation member filled between the printed circuit board and the floodlight cover to dissipate heat generated by the LED.

The present invention is filled with a heat dissipating material in the space between the LDE and the floodlight cover, it is possible to sufficiently lower the temperature of the LED, thereby has the effect that the driving efficiency of the LED lighting device can be increased. That is, the present invention fills the space between the LED that is in contact with the air in the luminaire and the light emitting glass of the lighting device with a heat dissipation material (thermally conductive silicon, silicon oil, etc.), so that the heat generated from the surface of the LED is transmitted to the lighting device. It has the effect of maximizing heat dissipation by efficiently transferring to the cover and PCB assembly.

In addition, the present invention by applying a heat dissipation material having a refractive index similar to the floodlight cover of the lighting device to suppress the phenomena caused by the refraction, scattering, diffuse reflection, etc. of the light beam to emit a more uniform and smooth light, so that the difference in refractive index is transmitted The inside of the cover has an effect that can facilitate the design of the shape of the lens and the like to achieve other purposes. That is, the present invention applies a heat dissipation material (silicon oil, etc.) having a similar refractive index to the floodlight cover of the lighting device, the refractive, scattering, generated when the light from the LED passes through the air and incident on the floodlight of the lighting device It has the effect of reducing diffuse reflection.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

1 is a cross-sectional view schematically showing the structure of an LED lighting apparatus according to the present invention, and schematically shows a structure in which the interior space of the LED lighting apparatus is filled by applying a heat dissipation material. Figure 2 is a cross-sectional view showing in more detail the structure of the LED lighting apparatus according to the present invention, in particular, shows the structure of the LED lighting apparatus used for the street light.

LED lighting apparatus according to the present invention is a cooling method for efficient cooling of the LED is applied as shown in Figure 1 and 2, the printed circuit board 200 mounted with at least one LED 210 and a driving circuit, The case 100 is fixed in close contact with the printed circuit board to support the printed circuit board, and the surface through which the light emitted from the LED passes is open, and is fixed in close contact with the case on the open surface of the case to transmit light. The transparent cover 300 and a heat dissipation member 400 is disposed between the printed circuit board and the transparent cover to dissipate heat generated from the LED.

The printed circuit board 200 is for supplying power to the LED to emit the LED, a PCB substrate which is generally used in the present may be applied, and in the present invention, at least one or more LEDs 210 may be provided with the floodlight cover 300. It is placed on the printed circuit board facing each other. The LED 210 is electrically connected to the substrate through a contacting point 220. On the other hand, the present invention as an additional method for dissipating heat generated from the LED, it is also possible to form an aluminum or copper metal plate having excellent thermal conductivity on the lower surface of the printed circuit board 200. That is, the printed circuit board 200 is to perform the basic function of the lighting device for generating light, and can be manufactured in various ways using the methods currently used, in particular, the heat radiation efficiency on the lower surface of the printed circuit board A metal plate may be formed to increase the. In addition, between the metal plate and the housing, in order to increase the heat dissipation effect, various types of heat dissipation plates and heat dissipation fans 500 as shown in FIG. 2 may be disposed.

The case 100 is for supporting the printed circuit board and various kinds of heat dissipating components mentioned above, and is configured to be in close contact with the printed circuit board. That is, as shown in Figure 1, it can be divided into the upper end (A) and the lower end (B) of the case on the basis of the printed circuit board. Here, the upper end of the case is filled with a heat dissipation member 400 to be described below, the lower end of the case may be embedded with various heat dissipation components described above. In addition, since the case and the printed circuit board are closely attached and fixed as described above, the heat dissipation member 400 filled in the upper end of the case cannot flow out to the lower end of the case through the case and the printed circuit board. In order to reinforce this function, a heat-resistant packing (not shown) may be mounted at the contact point of the printed circuit board and the case. On the other hand, the upper end portion (A) of the case is open to allow the light emitted from the LED mounted on the printed circuit board to pass through, and the light-emitting cover 300 is mounted on the open surface.

The floodlight cover 300 is for transmitting the light emitted from the LED, and may be applied to a light-transmitting glass for lighting devices that are generally used today, and various kinds of transparent synthetic resins may be applied.

The heat dissipation member 400 is filled in the space between the surface of the printed circuit board on which the LED is mounted and the floodlight cover, that is, the upper end portion A of the case, and silicon oil or thermal conductive silicon may be used. Here, among the upper end of the case, a thermally conductive silicon (opaque) having a relatively high thermal conductivity may be applied to a space having a height that does not cover the light emitting part of the LED (particularly, a space indicated by A in FIG. 1), and among the upper ends of the case, light emission Transparent silicone oil may be applied to the remaining space up to the floodlight cover exceeding the height of the wealth. Alternatively, a transparent heat dissipating material, that is, silicon oil, may be filled in the entire space of the upper end of the case. In addition, if the lower end portion (B) of the case can be maintained in a closed space, the case lower portion of the present invention is also filled with the heat dissipation material as described above, it is also possible to more efficiently discharge the heat released to the printed circuit board to the outside have.

As described above, the heat dissipation material applied to the present invention has higher insulation and thermal conductivity, and additionally, transparency and refractive index are closer to the floodlight cover, and thus, heat conductive silicon or silicon oil is preferably applied. In the case of thermally conductive silicon, products having a thermal conductivity of about 0.8k to 1.6k are commercially available. In addition, silicone oil has a very high transparency and a refractive index of 1.35 to 1.45, which is close to the floodlight cover, and has a thermal conductivity of about 0.6k to 0.8k, which is very low compared to metals (Al: 237k and Fe: 79k). However, since it is a very high numerical value compared with air (0.025k), it is suitable as a heat radiating material of this invention. That is, unlike the conventional LED lighting device is surrounded by the air layer around the LED light emitting element, the heat dissipation is extremely low, the LED lighting device according to the present invention by filling the heat dissipating material around the LED, dozens of times compared to the air The heat transfer effect can be obtained to maximize the heat dissipation effect. On the other hand, as the heat dissipating material, it is preferable to apply heat conductive silicon or silicon oil as described above, but in addition, various kinds of materials capable of implementing the above-described features may be applied.

Table 1 below shows the LED lighting device (MR-16 type) when the heat dissipating material is not applied in the state where the external temperature is 30 ° C., and the LED light when the heat dissipating material (silicon oil) is applied as in the present invention. Experimental results of measuring the temperature at the floodlight cover and the LED surface in the device is shown.

Figure 112009502752240-PAT00001

Through the experimental results as shown in Table 1, the numerical value is changed little by little depending on the shape of the lighting device under different conditions, the material, the type of heat dissipating material, etc., but the basic tendency is the same. As can be seen that the LED lighting device using the heat dissipation can achieve an additional heat dissipation effect of approximately 10 ° C. to 20 ° C. as compared to the LED lighting device without the heat dissipating material.

That is, as a result of lighting experiment by applying silicon oil to the same LED lighting device (MR-16) as a heat dissipation material, as shown in [Table 1], when the heat dissipation material is not applied, the surface temperature of the LED is 85.4 ℃ On the other hand, when the heat dissipation material is applied as in the present invention, the surface temperature of the LED is only 71.6 ° C, and it can be seen that an additional cooling effect of 13.8 ° C can be obtained. That is, the present invention is different depending on the shape of the LED lighting device, the material, and the type of the applied heat insulating material, but an additional cooling effect of about 10 to 20% can be obtained.

Figure 3 is an exemplary view showing a comparison of the phenomenon of the light emitted from the illumination device, showing the reduction of the stain phenomenon obtained by applying a heat radiation material having a refractive index similar to the floodlight cover. Here, (a) shows the phenomenon of the light emitted from the conventional LED lighting apparatus, (b) shows the phenomenon of the light emitted from the LED lighting apparatus according to the present invention.

The light emitted from the LED 210 passes through the air in the upper part of the case 100 to reach the floodlight cover 300, and undergoes refraction, scattering, and diffuse reflection according to the difference in refractive index and the surface state of the floodlight cover. This is further increased by the difference in refractive index between the air (refractive index 1.0002) and the light-transmitting cover (before and after the refractive index 1.5), and this phenomenon is reduced by replacing the air with a heat sink such as silicon oil (refractive index 1.4 to 1.5) as in the present invention. This reduces staining and allows softer light to be emitted. In addition, due to the reduction in the amount of refraction, it is possible to more easily design a shape having a different purpose (condensing lens, diffusion lens, etc.) of the transparent cover surface.

Figure 4 is another cross-sectional view schematically showing the structure of the LED lighting apparatus according to the present invention, by forming the outer surface of the floodlight cover in a corrugated shape, showing a structure for increasing the surface area of the floodlight cover to increase the heat dissipation effect.

That is, FIG. 4 shows that the cooling effect can be enhanced by increasing the surface area of the outer surface of the floodlight cover. Such a floodlight cover can be effectively applied to a conventional lighting device, but in the conventional lighting device, since the air layer having an extremely low thermal conductivity exists between the LED and the floodlight cover, its efficiency is extremely low. However, since the LED lighting device according to the present invention is filled with a heat dissipation member 400 having a thermal conductivity of several tens of times the air between the LED and the floodlight cover, the method is additionally provided through a method as shown in FIG. 4 to increase the surface area of the floodlight cover. The heat dissipation effect can be obtained.

In the following, a method of radiating heat emitted from an LED by the LED lighting apparatus according to the present invention is described.

First, the LED lighting apparatus according to the present invention may be used for applications such as indoor lights and stands, and in particular, may be used for street lamps.

The basic driving method of the LED lighting device according to the present invention is the same as the general LFED lighting device.

Here, when the power is applied to the LED 210 to emit light, the light emitted from the light emitting portion of the LED is transmitted through the light transmission cover 300 through the heat dissipation member 400 to be emitted to the outside.

At this time, the heat generated from the light emitting portion of the LED is conducted to the heat dissipation member 400 having a high thermal conductivity and then emitted to the outside through the floodlight cover 300.

In addition, heat is also generated under the light emitting part of the LED, particularly, the contact 220 with the printed circuit board, and the generated heat is conducted along the printed circuit board. At this time, since the surface of the printed circuit board is in contact with the heat dissipating material, the heat conducted to the printed circuit board is again conducted to the heat dissipating material and is discharged to the outside through the floodlight cover 300.

On the other hand, when the metal plate as described above is provided on the lower surface of the printed circuit board, or the heat dissipation fan 500 or the heat dissipation plate as shown in Figure 2 is provided, the heat dissipation effect can be further increased.

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the technical spirit of the present invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification, but should be defined by the claims.

1 is a cross-sectional view schematically showing the structure of an LED lighting apparatus according to the present invention.

Figure 2 is a cross-sectional view showing in more detail the structure of the LED lighting apparatus according to the present invention.

Figure 3 is an exemplary view showing a comparison of the phenomena of light emitted from the lighting device.

Figure 4 is another cross-sectional view schematically showing the structure of the LED lighting apparatus according to the present invention.

Description of the Related Art

1000: case 200: printed circuit board

210: LED 300: Floodlight cover

400: heat dissipation

Claims (3)

A printed circuit board on which at least one LED and a driving circuit are mounted; A case fixed to be in close contact with the printed circuit board to support the printed circuit board and having a surface through which light emitted from the LED passes; A light transmission cover fixed to the case open to the open surface of the case to transmit light; And LED lighting device including a heat dissipating material is filled between the printed circuit board and the floodlight cover to dissipate heat generated by the LED. The method of claim 1, The heat dissipation material, An opaque heat dissipation material or a transparent heat dissipation material having thermal conductivity applied to a space having a height not covering the light emitting portion of the LED; And LED lighting apparatus comprising a transparent heat dissipation material is applied to the remaining space up to the floodlight cover to exceed the height of the LED light emitting portion. The method of claim 1, LED illuminating device, characterized in that the surface of the floodlight cover is configured in a corrugated shape.
KR1020090065205A 2009-07-17 2009-07-17 Lighting apparatus with led KR20110007659A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103415741A (en) * 2012-02-10 2013-11-27 人们与分享株式会社 Light-emitting diode lighting device
KR101412749B1 (en) * 2013-02-22 2014-07-01 주식회사 지앤씨 Led lighting fixture with blocking alien substance
KR101425455B1 (en) * 2012-05-23 2014-08-07 한장민 Light-emitting diode(led) lighting with hear sinking liquid

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103415741A (en) * 2012-02-10 2013-11-27 人们与分享株式会社 Light-emitting diode lighting device
KR101427121B1 (en) * 2012-02-10 2014-08-07 주식회사 지앤씨 Lighting fixture using lighting emitting diode
KR101425455B1 (en) * 2012-05-23 2014-08-07 한장민 Light-emitting diode(led) lighting with hear sinking liquid
KR101412749B1 (en) * 2013-02-22 2014-07-01 주식회사 지앤씨 Led lighting fixture with blocking alien substance

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