KR20100106019A - Lighting apparatus with light emitting device - Google Patents

Lighting apparatus with light emitting device Download PDF

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Publication number
KR20100106019A
KR20100106019A KR1020090024436A KR20090024436A KR20100106019A KR 20100106019 A KR20100106019 A KR 20100106019A KR 1020090024436 A KR1020090024436 A KR 1020090024436A KR 20090024436 A KR20090024436 A KR 20090024436A KR 20100106019 A KR20100106019 A KR 20100106019A
Authority
KR
South Korea
Prior art keywords
light emitting
substrate
heat
cover
cavity
Prior art date
Application number
KR1020090024436A
Other languages
Korean (ko)
Inventor
윤한호
Original Assignee
(주)케이씨엠이노테크
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)케이씨엠이노테크 filed Critical (주)케이씨엠이노테크
Priority to KR1020090024436A priority Critical patent/KR20100106019A/en
Publication of KR20100106019A publication Critical patent/KR20100106019A/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/237—Details of housings or cases, i.e. the parts between the light-generating element and the bases; Arrangement of components within housings or cases
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/54—Cooling arrangements using thermoelectric means, e.g. Peltier elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals

Abstract

PURPOSE: An LED(Light Emitting Diode) device is provided to improve the efficiency of heat dissipation by forming an LED substrate and a cover made of aluminum. CONSTITUTION: An LED device includes a substrate(100), a transparent cover(200), and a cover(300). A plurality of LEDs are mounted on the lower surface of the substrate. The transparent cover covers the lower surface of the substrate. The cover unit supports the outer surface of the substrate. The cover unit covers the upper surface of the substrate to form a cavity. The cover unit is comprised of a first cover and a second cover. The substrate and the cover unit are made of aluminum or aluminum alloy materials.

Description

Light emitting diode lighting device {lighting apparatus with light emitting device}

The present invention relates to a light emitting diode lighting apparatus, and more particularly, the light source is made of a light emitting diode, the light emitting diode lighting device that can effectively reduce the heat emitted from the light emitting diode to prevent the reduction in the amount of light and short life of the light emitting diode It is about.

In general, a lighting apparatus used in real life is provided with an incandescent lamp, a fluorescent lamp and a mercury lamp. Such conventional lighting devices have used a natural cooling method without including a separate structure or configuration for removing (externally emitting) heat emitted from an incandescent lamp, a fluorescent lamp and a mercury lamp.

On the other hand, in recent years, a number of lighting devices equipped with light emitting diodes (LEDs) are being developed, because the light emitting diodes emit light of the same brightness, and thus have advantages of low power consumption and long lifespan.

Such a conventional light emitting diode illumination device is provided with only one or a small number of light emitting diodes as a light source, so that heat generation of the light emitting diodes is not a problem.

However, in recent years, attempts have been made to use light emitting diode lighting devices for lighting devices such as street lamps and industrial lightings, where the amount of light required is very large.

However, since the light quantity of the light emitting diode is exposed to high temperature for a long time and its life is shortened, the conventional light emitting diode lighting apparatus having a large amount of light required is provided with a plurality of light emitting diodes and a large amount of light emitted from such a plurality of light emitting diodes. There is a disadvantage that the amount of light is reduced and the life is shortened by heat.

Accordingly, there is a problem in that more light emitting diodes are provided to secure illuminances above a predetermined required value, or a large cost is required to replace the light emitting diodes at the end of their lifetime.

In order to solve the problems as described above, the present invention is to provide a light emitting diode illumination device capable of rapidly emitting heat emitted from a plurality of light emitting diodes to the outside.

In order to solve the above problems, the light emitting diode lighting apparatus according to the present invention, a plurality of light emitting diodes for emitting light is provided on the lower surface, a substrate having an electric circuit for supplying power to the plurality of light emitting diodes; A transparent cover installed to cover a lower side of the substrate to allow light emitted from the plurality of light emitting diodes to be irradiated downward; And a cover part supporting an outer circumference of the substrate and having a convex shape upward, covering a top side of the substrate to form a cavity between the substrate and the cover part. A first cover covering the upper side of the central portion at the side portion, and a second cover covering the upper side of the central portion at the other side portion of the substrate so as to overlap in a state spaced apart from the first cover by a predetermined distance in the height direction. Heat is released into the spaced gaps of the first and second covers.

The substrate and the cover part may be made of aluminum or an aluminum alloy material.

The cover part may further include a filter member provided in the gap to prevent foreign substances including rainwater from being introduced into the cavity.

The substrate may include one or more heat pipes having a plurality of heat dissipation fins disposed on an outer circumferential surface thereof and installed on an upper surface of the substrate so that heat generated from a plurality of light emitting diodes can be quickly dissipated into the cavity. can do.

The substrate may include: at least one Peltier element disposed on an upper surface of the substrate to move heat from one surface in contact with the upper surface to the other surface direction; And a heat pipe provided with a plurality of heat dissipation fins on an outer circumferential surface and respectively installed on the other surface of the Peltier device so that heat of the other surface of the Peltier device can be quickly dissipated into the cavity.

The substrate may include one or more heat pipes disposed on an upper surface of the substrate to quickly transfer heat generated from a plurality of light emitting diodes; And at least one heat sink connected to the heat pipe such that heat transferred through the heat pipe is quickly dissipated into the cavity.

In the light emitting diode lighting apparatus according to the present invention, a fixing pipe is connected to the cover part so as to support the cover part, and the cover part allows the interior of the cavity to communicate with the inside of the fixing pipe so that heat in the cavity is fixed to the fixed pipe. It may include; one or more communication holes emanating to the side.

According to the light emitting diode lighting apparatus of the present invention, the substrate and the cover portion on which the light emitting diode is installed are provided with high thermal conductivity aluminum, so that heat generated from the light emitting diode can be quickly discharged along the substrate and the cover portion by conduction. have.

In addition, a Peltier element, a heat pipe, a heat sink, and the like are installed on the upper surface of the substrate in the cavity between the substrate and the lid part, so that heat generated from the light emitting diode can be quickly released into the cavity.

Moreover, the said cover part consists of a 1st and 2nd cover which forms the clearance gap between them, and the space | interval can dissipate heat | fever in a cavity rapidly.

In addition, since the filter member is provided in the gap formed in the cover part, it is possible to effectively prevent foreign substances including rainwater from flowing into the cavity, and even if rainwater is introduced into the gap, the filter member is heated by the heat in the cavity. It can be brought into contact with a large surface to evaporate.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.

The light emitting diode lighting device according to the present invention is a lighting device having a large amount of light, such as a street light, a tunnel light, a security light, and an industrial light, and uses a plurality of light emitting diodes as its light source.

Hereinafter, with reference to the accompanying Figures 1 to 3, it will be described in detail the configuration, operation effect and use state of the LED lighting apparatus according to the first embodiment of the present invention. In the LED lighting apparatus according to the first embodiment of the present invention, a plurality of light emitting diodes 110 are provided on the bottom surface of the substrate 100, the substrate 100 provided on the lower surface, the transparent cover 200, the substrate ( The cover unit 300 is installed to cover the upper side of the 100.

The substrate 100 provides a place where a plurality of light emitting diodes 110 can be installed, and an electric circuit (not shown) for supplying power to the light emitting diodes 110 is formed. Therefore, the plurality of light emitting diodes 110 emit light by receiving power from an external power source through the electric circuit.

The substrate 100 is made of aluminum or an aluminum alloy having a high thermal conductivity and having a predetermined rigidity so that heat emitted from the plurality of light emitting diodes 110 can be quickly dissipated in a conductive manner. However, it is noted that the material of the substrate 100 is not limited thereto.

In the first embodiment of the present invention, the substrate 100 is provided in the form of a flat plate, but is not limited thereto. For example, it may be provided in a plate shape bent downward.

The transparent cover 200 is installed to cover the lower side of the substrate 100 to protect the light emitting diodes 110 and the substrate 100 from external impact or foreign matter. In addition, the transparent cover 200 is made of a transparent resin or the like so that the light emitted from the light emitting diodes 110 passes and is irradiated downward.

In addition, the transparent cover 200 may be provided to have a cross-sectional shape that serves as a kind of convex or concave lens to refract or concentrate or diverge the light emitted from the light emitting diodes 110.

The cover part 300 supports the outer circumference of the substrate 100 and is provided to cover the upper side of the substrate 100. At this time, the cover part 300 has a convex shape to the upper side to form a cavity 300-1 between the substrate 100.

In addition, the cover part 300 is preferably made of aluminum or an aluminum alloy like the above-described substrate 100 so that heat inside the cavity 300-1 can be quickly dissipated to the outside.

In more detail with respect to the cover portion 300, the cover portion 300, the first cover 310 to cover the upper side of the central portion at one side of the substrate 100, and the other side of the substrate 100 A second cover 320 is provided to cover the upper side of the central part, and the end of the central part overlaps with the end of the first cover 310 spaced apart by a predetermined distance in the height direction.

Accordingly, the first cover 310 and the second cover 320 are spaced apart in the height direction from the center of the substrate 100 to form a gap G. The gap G serves as a gas flow path through which heat inside the cavity 300-1 can be quickly dissipated to the outside in a convection manner.

On the other hand, the gap (G) is provided with a filter member 330 having a plurality of fine holes, the filter member 330 through the gap (G) foreign matter, such as rain water flows into the cavity 300-1 While blocking the gas, the gas passes through and serves to quickly dissipate heat inside the cavity 300-1 to the outside.

In addition, the filter member 330 is made of a metal having high thermal conductivity to quickly dissipate heat not only in a convection manner but also in a conductive manner. Such a filter member 330 may be preferably made of a wire mesh.

The gap G is preferably provided above the central portion of the substrate 100 in view of the convex shape toward the upper side of the cover part 300 and the higher temperature of the air and the higher position of the gap G.

In the first embodiment of the present invention, the structure installed in the gap (G) has been described as a filter member, but is not limited thereto. For example, a partition wall structure having a plurality of holes may be provided.

On the other hand, as shown in Figure 1, the upper surface of the substrate 100 is provided with a plurality of Peltier elements 120. The plurality of Peltier elements 120 are provided in a plate shape, and when electric power is applied, heat is transferred from one surface to the other surface so that the one surface from which the heat is lost is cooled, and the other surface obtained with the heat is heated.

The plurality of Peltier elements 120 are installed such that one surface of which heat is lost is in contact with the upper surface of the substrate 100 to cool the substrate 100 obtained with the heat emitted from the light emitting diodes 110. Accordingly, the upper surfaces of the plurality of Peltier elements 120 are in a high temperature state by the moved heat.

Heat pipes 130 having a plurality of heat dissipation fins 131 are formed on an upper surface of the Peltier element 120. Therefore, the heat moved to the upper surface of the Peltier device 120 is quickly moved along the heat pipe 130 and the heat dissipation fin 131, and dissipates the heat into the cavity 300-1.

In this case, the heat pipe 130 is extended to be connected to the first and second covers 310 and 320. Therefore, the heat transferred in a conductive manner along the heat pipe 130 is transferred to the first and second covers 310 and 320, and more quickly to the outside through the first and second covers 310 and 320. Can be released.

Then, the heat dissipated in the cavity 300-1 described above is discharged to the outside through the gap G between the first and second covers 310 and 320 described above, as shown in FIG. 1. . In addition, since the first and second covers 310 and 320 are made of a material having high thermal conductivity, some of the first and second covers 310 and 320 are also discharged to the outside through the first and second covers 310 and 320.

In the first embodiment of the present invention, the Peltier element 120 is provided on the upper surface of the substrate 100. However, the Peltier element 120 may be omitted depending on the number of the light emitting diodes 110 and the amount of heat generated. That is, the heat pipe 130 may be directly installed on the upper surface of the substrate 100.

On the other hand, the light emitting diode illumination device is fixed to the fixed pipe (SP) is connected to the outside one side, the communication pipe (SP-1) is in communication with the cavity 300-1 to the portion connected to the fixed pipe (SP). Is formed. Therefore, the heat inside the cavity 300-1 may be discharged to the fixed pipe SP side through the communication hole SP-1.

The fixed pipe SP is made of stainless steel having a high thermal conductivity, and is connected to a pole arm (not shown) made of a similar material, and thus serves as an excellent heat sink.

When the light emitting diode 110 as described above is exposed to high temperature for a long time, its light quantity and lifespan are reduced. The material of the substrate 100, the Peltier element 120, the heat pipe 130, the heat dissipation fin 131, The configuration of the first and second covers 310 and 320 and the communication hole SP-1 rapidly releases a large amount of heat emitted from the plurality of light emitting diodes 110 to the outside, so that the amount of light is reduced or its life is reduced. It effectively blocks the shrinkage.

Hereinafter, with reference to Figure 4 will be described in detail the configuration, operation effect and use state of the LED lighting apparatus according to the second embodiment of the present invention. The LED lighting apparatus according to the second embodiment of the present invention is not provided with the Peltier element 120, the heat pipe 130 'is different in configuration, except that the heat sink 140 is further provided. The light emitting diode lighting apparatus according to the first embodiment of the present invention is similar in construction.

Therefore, hereinafter, the heat pipe 130 ′ and the heat sink 140 will be described mainly, and other configurations will be omitted by referring to the description of the first embodiment.

The heat pipes 130 'are shortly provided on the substrates 100 above the light emitting diodes 110, respectively. The heat pipe 130 ′ transmits heat transferred from the light emitting diode 110 to the substrate 100 to the heat sink 140.

As described in the first embodiment, some of the heat pipes 130 ′ may be provided to extend upward and be connected to the first and second covers 310 and 320.

The heat sink 140 is installed on a plurality of heat pipes 130 ′ provided on the substrate 100 to effectively dissipate heat transferred through the heat pipes 130 ′ into the cavity 300-1. It plays a role.

In the second embodiment of the present invention, the heat sink 140 is formed of a single layer on the plurality of heat pipes 130 ′, but is not limited thereto.

In addition, in the second embodiment of the present invention, the Peltier element 120 is not provided, but the present invention is not limited thereto, and the substrate 100 and the heat pipe 130 'may be replaced with the heat pipe 130'. It may be installed.

As described above, the LED lighting apparatus according to the present invention includes the substrate 100, the Peltier element 120, the heat pipes 130 and 130 ′, and the heat of the light emitted from the plurality of LEDs 110. The conduction method through the second cover (310, 320), and the gap (G), the communication hole (SP-1) of the heat dissipation fin 131, the heat sink 140, the first and second cover (310, 320) By quickly emitting to the outside in a convection manner, by preventing the light emitting diode 110 is exposed to a high temperature environment of a predetermined level or more, it is possible to effectively prevent the light quantity and life of the light emitting diode 110 is reduced.

Although the present invention has been described in detail only with respect to the described embodiments, it will be apparent to those skilled in the art that various modifications and variations are possible within the technical spirit of the present invention, and such modifications and variations belong to the appended claims. will be.

1 is a side cross-sectional view of a light emitting diode illumination device according to a first embodiment of the present invention;

2 is a plan view of a light emitting diode lighting apparatus according to a first embodiment of the present invention;

3 is a rear view of the LED lighting apparatus according to the first embodiment of the present invention;

4 is a side cross-sectional view of a light emitting diode lighting apparatus according to a second embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

100: substrate 110: light emitting diode (LED)

120: Peltier element 130, 130 ': heat pipe

131: heat sink fin 140: heat sink

200: transparent cover 300: cover

300-1: cavity 310: first cover

320: second cover 330: filter member

G: clearance SP: fixed pipe

SP-1: Communication Hole

Claims (7)

A substrate having a plurality of light emitting diodes emitting light and having an electric circuit configured to supply power to the plurality of light emitting diodes; A transparent cover installed to cover a lower side of the substrate to allow light emitted from the plurality of light emitting diodes to be irradiated downward; And And a cover part supporting an outer circumference of the substrate and having a convex shape upward, covering a top side of the substrate to form a cavity between the substrate and the cavity. The cover part, A first cover covering an upper side of the central portion at one side of the substrate, and And a second cover covering the upper side of the center portion from the other side of the substrate so as to overlap the first cover in a state spaced apart by a predetermined distance in a height direction, wherein heat in the cavity is spaced apart from the first and second covers. Light emitting diode illumination device, characterized in that emitted in the gap. The method of claim 1, The substrate and the cover portion, The light emitting diode illumination device, characterized in that made of aluminum or aluminum alloy material. The method of claim 1, The cover part, A filter member provided in the gap to prevent foreign matter, including rainwater, from entering the cavity; The light emitting diode illumination device further comprises. The method according to any one of claims 1 to 3, Wherein: At least one heat pipe provided with a plurality of heat dissipation fins on an outer circumferential surface of the plurality of light emitting diodes so as to quickly dissipate heat generated from the plurality of light emitting diodes; The light emitting diode lighting apparatus comprising a. The method according to any one of claims 1 to 3, Wherein: At least one Peltier element disposed on an upper surface of the substrate to move heat from one surface in contact with the upper surface to the other surface direction; And A heat pipe provided with a plurality of heat dissipation fins on an outer circumferential surface of the Peltier element so as to quickly dissipate heat from the other side of the Peltier element; The light emitting diode lighting apparatus comprising a. The method according to any one of claims 1 to 3, Wherein: One or more heat pipes disposed on an upper surface of the substrate to rapidly transfer heat generated from a plurality of light emitting diodes; And One or more heat sinks connected to the heat pipes such that heat transferred through the heat pipes is quickly dissipated into the cavity; The light emitting diode lighting apparatus comprising a. The method according to any one of claims 1 to 3, A fixing pipe is connected to the cover part to support the cover part, The cover part, At least one communication hole for dissipating heat in the cavity to the fixed pipe side by allowing the cavity to communicate with the inside of the fixed pipe; The light emitting diode illuminating device comprising a.
KR1020090024436A 2009-03-23 2009-03-23 Lighting apparatus with light emitting device KR20100106019A (en)

Priority Applications (1)

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KR1020090024436A KR20100106019A (en) 2009-03-23 2009-03-23 Lighting apparatus with light emitting device

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Application Number Priority Date Filing Date Title
KR1020090024436A KR20100106019A (en) 2009-03-23 2009-03-23 Lighting apparatus with light emitting device

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KR20100106019A true KR20100106019A (en) 2010-10-01

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KR1020090024436A KR20100106019A (en) 2009-03-23 2009-03-23 Lighting apparatus with light emitting device

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102896254A (en) * 2012-09-11 2013-01-30 厦门海莱照明有限公司 Process for manufacturing light-emitting diode (LED) radiator through aluminum alloy plastic materials
KR20160004440U (en) * 2015-06-16 2016-12-26 대한라이팅 주식회사 Outdoor Lighting

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102896254A (en) * 2012-09-11 2013-01-30 厦门海莱照明有限公司 Process for manufacturing light-emitting diode (LED) radiator through aluminum alloy plastic materials
CN102896254B (en) * 2012-09-11 2014-09-17 厦门海莱照明有限公司 Process for manufacturing light-emitting diode (LED) radiator through aluminum alloy plastic materials
KR20160004440U (en) * 2015-06-16 2016-12-26 대한라이팅 주식회사 Outdoor Lighting

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