KR20110003413A - Electric connector and method for electric connection of circuit board using the same - Google Patents

Electric connector and method for electric connection of circuit board using the same Download PDF

Info

Publication number
KR20110003413A
KR20110003413A KR1020090060238A KR20090060238A KR20110003413A KR 20110003413 A KR20110003413 A KR 20110003413A KR 1020090060238 A KR1020090060238 A KR 1020090060238A KR 20090060238 A KR20090060238 A KR 20090060238A KR 20110003413 A KR20110003413 A KR 20110003413A
Authority
KR
South Korea
Prior art keywords
substrate
pin
guide pin
base substrate
via holes
Prior art date
Application number
KR1020090060238A
Other languages
Korean (ko)
Inventor
이수봉
Original Assignee
삼성테크윈 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성테크윈 주식회사 filed Critical 삼성테크윈 주식회사
Priority to KR1020090060238A priority Critical patent/KR20110003413A/en
Publication of KR20110003413A publication Critical patent/KR20110003413A/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/732—Printed circuits being in the same plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

The present invention provides an electrical connector for electrically connecting a first substrate on which first via holes are formed and a second substrate on which second via holes are formed, comprising: a base substrate; A plurality of connection pins disposed on one side of the base substrate and detachably inserted into the first via holes and the second via holes to electrically connect the first substrate and the second substrate; A first guide pin disposed on one side of the base substrate and detachably inserted into the first substrate to fix the base substrate on the first substrate; And a second guide pin disposed on one side of the base substrate, the second guide pin detachably inserted into the second substrate to fix the base substrate on the second substrate. To provide.

Description

Electric connector and method for electric connection of circuit board using the same

The present invention relates to an electrical connector and a method of connecting circuit boards using the same, and more particularly, to an electrical connector having a connection pin and a method of connecting circuit boards using the same.

In general, an electrical connection device is used to connect two separate conductors located in a part of an electrical system to transmit power or to transmit electrical signals or information and is commonly known as a connector. These connectors are structured to connect the separated conductors, and are composed of female and male connectors, and each connector is provided with female or male terminals, and when the connectors are coupled, the male and female terminals are formed to make electrical connections. have. Electrical connection methods using connectors are used to connect between circuit boards or elements between various electrical appliances.

In addition, as electronic products become smaller and lighter in recent years, there is a need for an electrical connector capable of realizing a thinner structure than a combination.

It is an object of the present invention to provide an electrical connector and a method of connecting circuit boards using the same, which can implement a structure that reduces the use of space in coupling.

According to an aspect of the present invention, an electrical connector for electrically connecting a first substrate on which first via holes are formed and a second substrate on which second via holes are formed, comprises: a base substrate; A plurality of connection pins disposed on one side of the base substrate and detachably inserted into the first via holes and the second via holes to electrically connect the first substrate and the second substrate; A first guide pin disposed on one side of the base substrate and detachably inserted into the first substrate to fix the base substrate on the first substrate; And a second guide pin disposed on one side of the base substrate and detachably inserted into the second substrate to fix the base substrate to the second substrate.

Here, at least one of the connection pin, the first guide pin or the second guide pin may have a spacer portion coupled to contact the base substrate with a first cross-sectional area and a first height; And a pin portion coupled to contact the spacer portion with a second cross-sectional area and a second height, the pin portion being configured to fit into a via hole of at least one of the first substrate and the second substrate, wherein the first cross-sectional area is defined as the first cross-sectional area. It can be configured to be larger than or equal to 2 cross-sectional area.

Here, the electrical connector may be formed by directly contacting or indirectly contacting the first conductive layer formed in the first via hole and the second conductive layer formed in the second via hole or through the connection pins. The substrate can be electrically connected.

Here, each of at least one of the connection pin, the first guide pin, or the second guide pin may include a pin core disposed in contact with the base substrate; And a fin outer portion disposed on the base substrate to cover the pin core and configured to fit into at least one of the via holes of the first substrate or the second substrate. In this case, the pin core may be configured such that the radius of the distal end portion from the base substrate is larger than the cross-sectional area of the proximal end portion. The outer surface of the pin core may have an uneven portion formed to increase the roughness. Alternatively, an adhesive material may be interposed between the pin core and the pin outer portion. The pin core may be made of a material comprising copper.

Here, the fin outer portion may be made of a material including a conductive elastic body. The pin outer portion may be elastically supported to fit at least one of the first via holes or the second via holes by an elastic force of the conductive elastic body. Alternatively, the fin outer portion may be made of a material including a metal.

The base substrate may include: an insulating layer on one surface of which the connection pin, the first guide pin, and the second guide pin are coupled and bent; And it may include a reinforcing layer bonded to the other surface of the insulating layer. In this case, the reinforcement layer may be provided with a notch having a width greater than or equal to the thickness of the reinforcement layer corresponding to the bent portion of the insulation layer.

According to another aspect of the invention the base substrate; A connection pin disposed on one side of the base substrate; A first guide pin disposed on one side of the base substrate; A method of electrically connecting circuit boards using an electrical connector including a second guide pin disposed on one side of the base substrate, the first substrate and the second conductive layer having first via holes provided with a first conductive layer formed thereon. Disposing a second substrate having second via holes, the second conductive layer facing the first conductive layer; Removably inserting the first guide pin into the first substrate to fix the base substrate on the first substrate; Electrically connecting the first substrate and the second substrate by removably inserting the connection pin into the first via holes and the second via holes; And fixing the base substrate to the second substrate by detachably inserting the second guide pin into the second substrate.

According to the electrical connector and the method of connecting the circuit boards using the same according to the embodiment of the present invention, not only the use of space at the time of coupling can be reduced, but also a simple structure has an advantageous effect on mass production.

Hereinafter, with reference to the illustrated embodiments of the accompanying drawings, the present invention will be described in detail.

1 is a schematic perspective view showing a coupling relationship between an electrical connector and circuit boards according to an embodiment of the present invention. 2 is a schematic plan view from above of the embodiment of FIG. 1; 3 is a cross-sectional view taken along line II of FIG. 1.

1 to 3, the electrical connector 1 includes an insulating substrate 100, a connection pin 110, a first guide pin 120, and a second guide pin 130 and a first circuit board ( 10) and the second circuit board 20 may be provided. In this case, the first circuit board 10 includes a first conductive layer 140 having first via holes 140 ′, and the second circuit board 20 faces the first conductive layer 140. A second conductive layer 141 having second via holes 141 ′ is provided.

In this case, the connection pin 110, the first guide pin 120, and the second guide pin 130 are disposed on one side of the insulating substrate 100. Here, the connecting pin 110 is detachably inserted into the first via holes 140 ′ and the second via holes 141 ′ of the overlapped first circuit board 10 and the second circuit board 20. The first circuit board 10 and the second circuit board 20 are connected to each other. The first guide pin 120 is detachably inserted into the first circuit board 10 and fixes the insulating substrate 100 to which the first guide pin 120 is attached to the first circuit board 10. The second guide pin 130 is detachably inserted into the second circuit board 20 and fixes the insulating substrate 100 to which the second guide pin 130 is attached to the second circuit board 20.

Hereinafter, the insulation substrate 100, the connecting pin 110, the first guide pin 120, and the second guide pin 130 constituting the electrical connector 1 will be described with reference to FIGS. 4 and 5. 100, the connecting pin 110, the first guide pin 120, and the second guide pin 130 will be described with reference to FIGS. 6 to 10.

The insulating substrate 100 will be described with reference to FIGS. 4 and 5. 4 is a schematic cross-sectional view showing a portion of the embodiment of FIG. 1 folded about the notch 105. FIG. 5 is a schematic perspective view showing a portion of the embodiment of FIG. 1 folded about the notch 105.

 4 and 5, the insulating substrate 100 may include a reinforcing layer 101 and an insulating layer 102. In this case, the reinforcement layer 101 may have a discontinuous surface on the insulating layer 102 to form the notch 105. In this case, the insulating layer 102 may be made of an insulating member and may be made of a bendable material. In addition, the reinforcing layer 101 may be configured as a reinforcing member so that the insulating layer 102 has sufficient rigidity, and may be omitted if the insulating layer 102 has sufficient rigidity. The reinforcement layer 101 may be provided with metal or may be provided with plastic. However, the member that the reinforcing layer 101 may include is not limited thereto, and it will be understood by those skilled in the art that various structural members are possible.

Referring to FIG. 4, the reinforcement layer 101 has a discontinuous surface on the insulating layer 102 to form the notch 105, wherein the width w of the notch 105 is smaller than the thickness d of the reinforcement layer 101. Can be formed. In this way, when the width w of the notch 105 is sufficiently large, the insulating layer 102 made of a material capable of bending the insulating substrate 100 around the notch 105 may be bent (S). The thickness d of the 101 may be configured so as not to interfere with the bending (S). Here, the degree of bending S of the insulating substrate 100 may be adjusted by using a correlation between the thickness d of the reinforcing layer 101 and the width w of the notch 105. For example, the thickness of the notch case 105, the width (w) is large enough, the insulating substrate 100 is bent (S) is 90. The only not bend over if the width (w) the reinforcing layer 101 of (d If it is narrower than the angle of bending (S) will be limited.

The insulating substrate 100 may be fabricated using a metal etching method such as photolithography using a material such as a flexible copper clad laminate (FCCL), and thus, an inexpensive mask may be utilized. This method has the advantage that it can be mass-produced at low cost because expensive tools such as injection molding molds are unnecessary.

The connecting pin 110, the first guide pin 120, and the second guide pin 130 will be described with reference to FIGS. 6 to 10. 6 is a cross-sectional view schematically illustrating a coupling relationship between the embodiment of FIG. 3 and a first circuit board and a second circuit board. 7 is a cross-sectional view showing the embodiment of FIG. 5 is combined. FIG. 8 is an enlarged cross-sectional view of region A of FIG. 7. FIG. 9 is an enlarged cross-sectional view of region B of FIG. 7. 10A, 10B, and 10C are cross-sectional views illustrating the coupling between the pin core 150 and the fin outer portion 160.

6 or 7, the first guide pin 120 is coupled to the first circuit board 10 and the second guide pin 130 is coupled to the second circuit board 20. In addition, the connection pin 110 is inserted into the overlapped first and second circuit boards 10 and 20. In this case, the method of electrically connecting the first circuit board 10 and the second circuit board 20 may include a second conductivity of the first conductive layer 140 and the second circuit board 20 of the first circuit board 10. The layer 141 may be in contact with each other to allow electricity to flow therethrough, or the connecting pin 110, the first guide pin 120, and the second guide pin 130 may be formed of a conductive material. The current may flow by connecting the two conductive layers 141. Alternatively, the connecting pin 110, the first guide pin 120, and the second guide pin 130 may be formed of a conductive material, and the first conductive layer 140 and the second circuit board 20 of the first circuit board 10 may be provided. The second conductive layer 141 may also be brought into contact to allow electricity to flow.

The first circuit board 10 and the second circuit board 20 are generally manufactured in a multi-layered structure and thus have a plurality of via holes for connecting individual layers. In general, an electronic circuit board is formed by forming a via hole through a plurality of circuit layers for electrical connection between the plurality of circuit layers, and then including a conductive layer including a conductive member such as a metal layer on the inner wall of the hole to electrically connect the plurality of circuit layers. This is possible. At this time, since the circuit boards have a process of forming the via hole and having a conductive layer regardless of whether the connector is used in the present invention, the process of forming a via hole for connecting the connector in the step and providing a conductive layer. Is possible without additional processing. In this case, the conductive layer of the circuit board may be formed by plating the raw material metal layer after arranging the raw material metal layer on the edge portion of the via hole formed in the circuit board. Here, the thickness of the plating layer may be 0.1um to 40um.

On the contrary, since a sputtering layer is formed on the raw material metal layer through the sputtering method after the raw material metal layer is disposed on the edge of the via hole, a conductive layer can be formed on the circuit board. The thickness of the sputtering layer may be 0.01um to 1.0um.

Alternatively, after the raw material metal layer is disposed on the edge of the via hole, a conductive layer may be formed on the circuit board by forming a deposition layer on the raw material metal layer through an evaporation method. The thickness of the deposition layer may be 0.01um to 1.0um.

As such, using the conductive layer formed on the via hole teburi on the circuit board, it is possible to electrically connect the circuit boards to one electrical connector 1 having a simple structure without the need for complicated connectors, so that there is no additional cost, and It has a favorable effect on production.

 7 is a cross-sectional view illustrating a state in which the electrical connector 1, the first circuit board 10, and the second circuit board 20 are coupled to each other. Referring to FIG. 8, in which the portion A of FIG. 7 is enlarged, the first guide pin 120 contacts the via holes of the first circuit board 10 to fix the insulating substrate 100. Although only the first guide pin 120 is illustrated in FIG. 8, the second guide pin 130 also has a similar structure and role to that of the first guide pin 120.

Referring to FIG. 9, in which the portion B of FIG. 7 is enlarged, the connecting pin 110 may include the first conductive line member 140 of the first circuit board 10 and the second conductive layer of the second circuit board 20. Since 141 is in contact with each other, the first circuit board 10 and the second circuit board 20 are electrically connected to each other. Alternatively, the connecting pin 110 may be formed of a conductive member to allow electricity to flow.

As shown in FIG. 8 or 9, at least one of the connecting pin 110, the first guide pin 120, or the second guide pin 130 may connect the pin core 150 and the pin outer portion 160. It can be provided. Referring to FIG. 8 or 9, the pin core 150 is disposed on the insulating substrate 100 in contact with the insulating substrate 100, and the fin outer portion 160 is disposed on the insulating substrate 100 to be disposed on the pin core. And 150 at least one of the first circuit board 10 and the second circuit board 20.

The connecting pin 110, the first guide pin 120, or the second guide pin 130 may have a dual structure of a pin core having a high bonding force between the pin outer portion 160 and the insulating substrate 100. The structure can be maintained without being destroyed even if the bonding and separating processes of the substrate 10 and the second circuit board 20 are repeated several times.

For example, in FIG. 8, the first pin core 150 and the first pin outer portion 160 may be combined to form the first guide pin 120, and the second guide pin 130 may be configured in the same manner. can do. In addition, in FIG. 9, the second pin core 150 ′ and the second pin outer portion 160 may be coupled to form a connection pin 110.

The fin core may be formed using a photo lithography process and an etching process, and the fin core may include copper. In addition, the connecting pin 110, the first guide pin 120, or the second guide pin 130, which is a combination of the pin cores 150 and 150 ′ and the pin outer portions 160 and 160 ′, may be photo lithography. It is possible to realize pitch of 0.15mm to 0.4mm by using printing process using the process and can be implemented from 20pin to 1600pin according to the design of mask.

Referring to Figures 10a to 10c will be described a structure for increasing the coupling force of the pin core and the pin outer portion. 10A is a cross-sectional view illustrating the shape of the third fin core 151 coupled to the third fin outer portion 161 by varying widths of both ends. FIG. 10B is a cross-sectional view illustrating the shape of the fourth fin core 152 coupled to the fin outer portion by roughening the surface. 10C is a cross-sectional view illustrating the shape of the fifth fin core 153 coupled to the fin outer portion with an adhesive material.

Referring to FIG. 10A, the third fin core 151 may include a third fin core (the width P 1 of the end of the third fin core 151 contacting the insulating substrate 100 does not contact the insulating substrate 100). It may be formed wider than the width (P 2 ) of the end of the 151. With such a shape, the third pin core 151 may perform an anchor function to prevent the third pin outer part 161 from being separated in the vertical direction during the coupling separation process with the circuit boards. have. However, the shape of the third fin core 151 is not limited thereto, and those skilled in the art will appreciate that the coupling force of the third fin core 151 and the third fin outer portion 161 may be increased in various shapes.

Referring to FIG. 10B, when the outer surface of the fourth fin core 152 is roughened by a metal etching method, the coupling force between the fourth fin core 152 and the fourth fin outer portion 162 may be increased. have.

Referring to FIG. 10C, the adhesive material 170 may be disposed between the fifth fin core 153 and the fifth fin outer portion 163 to increase the coupling force between the fifth fin core 153 and the fifth fin outer portion 163. ) Can be applied. In this case, the adhesive material 170 may be a silicone adhesive, an acrylic adhesive, or a composite adhesive of silicone and acrylic. Specifically, Toray's Polyester adhesive or Dow Corning's polydimethylsiloxane (PDMS) -based silicone adhesive may be used. In addition, the adhesive material 170 may be coated by screen printing, roll coating, ink-jet, or the like. However, the adhesive material 170 and the coating method are not limited thereto, and a person skilled in the art will appreciate that various adhesive materials 170 and the coating method are possible.

The fin outer portions 160, 160 ′, 161, 162, and 163 may include conductive elastomers. In this case, the conductive elastomer may be made of a material such as silicone rubber and may have a hardness of about 3 to 60 degrees. In this case, if the hardness value is too low, it is difficult to maintain structural rigidity after bonding with the circuit boards, and if the hardness value is too high, elastic deformation is not easy, which may make insertion difficult and may damage the circuit boards. Therefore, the hardness of the pin outer portion (160, 160 ', 161, 162, 163) may be configured to a hardness of 10 to 20 degrees. However, those skilled in the art are not limited thereto in configuring the fin outer portions 160, 160 ′, 161, 162, and 163, and may be made of an electrically conductive material, for example, metal.

Referring to FIG. 8, the first guide pin 120 is configured to have a step. That is, the first guide pin 120 is in contact with the spacer portion having a first cross-sectional area a 1 and a first height h 1 at a portion in contact with the insulating substrate 100, and a second cross-sectional area a 2 in contact with the spacer portion. And a pin portion configured to be fitted into the via holes 140 ′ of the first circuit board 10 with a second height h 2 . Here, the first cross-sectional area a 1 may be configured not to be smaller than the second cross-sectional area a 2 .

As described above, since the first guide pin 120 has two steps and the first cross-sectional area a 1 is wider than the second cross-sectional area a 2 , the entire first guide pin 120 is completely formed on the circuit board. It is not inserted. Thus, the first guide pin 120, the entire circuit is not fully inserted into the substrate completely against the circuit board can avoid a case where separation is difficult, and the insulating substrate 100, it has a first height (h 1) and When the electrical connector 1 is separated from the circuit boards by forming a predetermined separation width between the circuit boards, a space for separation may be secured.

In this case, since the fin outer portions 160, 160 ′, 161, 162, and 163 may be formed of a conductive elastomer, the fin outer portions 160, 160 ′, 161, 162, and 163 when inserted into the first circuit board 10. Is elastically deformed and can be easily inserted into the first circuit board 10. In addition, since the elastic restoring force of the inserted pin outer portions 160, 160 ′, 161, 162, and 163 is in close contact with the first conductive layer 140 of the via holes of the first circuit board 10, it is not easily separated.

In this case, the first guide pin 120 is not applied only to the first circuit board 10, but is inserted into a portion where the first circuit board 10 and the second circuit board 20 are stacked as shown in FIG. 11. Can be.

As another effect, the first guide pin 120 having a step on the overlapped circuit boards serves to fix the first circuit board 10 to the second circuit board like a pushpin. Referring to FIG. 11, the spacer portion of the first guide pin 120 is applied by applying pressure to the first circuit board 10 as if the first circuit board 10 is tacked on the second circuit board 20. The structure which fixes the 1st circuit board 10 to the 2nd circuit board 20 is formed. Therefore, the first conductive layer 140 of the first circuit board 10 and the second conductive layer 141 of the second circuit board 20 are electrically connected to each other by the pressure of the first guide pin 120. do. The structure and role of the second guide pin 130 inserted into the second circuit board 20 are similar to those of the first guide pin 130.

6 to 9, the first guide pin 120 and the second guide pin 130 are configured to have a step, and the connecting pin 110 is formed in a straight shape without a step, but the present invention is not limited thereto. . For example, as shown in FIG. 12, all of the connecting pin 110, the first guide pin 120, and the second guide pin 130 may be configured to have a step, but are not shown. Both the first guide pin 120 and the second guide pin 130 may be formed in a straight shape without a step. Those skilled in the art will appreciate that various modifications are possible without being limited thereto. For example, the first guide pin 120 and the second guide pin 130 may have a straight shape, and the connecting pin 110 may have a step or only some of the connection pins 110 may have a step.

In this way, the first circuit board 10 and the second circuit board 20 are stacked so that the two circuit boards are provided with the electrical connector 1 which is in close contact with each other so that the occupied space can be used repeatedly and the electrical connector 1 There is no need for a separate space to reduce the overall size of the component. Thereby, the total height of the 1st board | substrate 10 and the 2nd board | substrate 20 into which the electrical connector 1 and the electrical connector 1 were inserted can be comprised so that it may not exceed 0.3 mm.

A method of using the electrical connector 1 will be described with reference to FIGS. 1 to 12. First, the first substrate 10 including the first via holes 140 ′ having the first conductive layer 140 is prepared, and the second via holes 141 ′ having the second conductive layer 141 are prepared. ) May be disposed such that the second conductive layer 141 faces the first conductive layer 140.

In addition, the first guide pin 120 of the electrical connector 1 may be detachably inserted into the first substrate 10 to fix the insulating substrate 100 on the first substrate 10.

In addition, the connecting pin 110 of the electrical connector 1 is removably inserted into the first via holes 140 ′ and the second via holes 141 ′ so that the first substrate 10 and the second substrate 20 are removed. Can be electrically connected.

In addition, the second guide pin 130 of the electrical connector 1 may be detachably inserted into the second substrate 20 to fix the insulating substrate 100 on the second substrate 20. Here, the steps are not listed in order of time, and the order of steps to be applied may be variously modified.

While the present invention has been described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

The invention is applicable to all industries of using and manufacturing electrical connectors.

1 is a schematic perspective view showing a coupling relationship between an electrical connector and circuit boards according to an embodiment of the present invention.

2 is a schematic plan view from above of the embodiment of FIG. 1;

3 is a cross-sectional view taken along line II of FIG. 1.

4 is a schematic cross-sectional view showing a portion of the embodiment of FIG. 1 folded about the notch.

5 is a schematic perspective view showing a portion of the embodiment of FIG. 1 folded about the notch.

6 is a cross-sectional view schematically illustrating a coupling relationship between the embodiment of FIG. 3 and a first circuit board and a second circuit board.

7 is a cross-sectional view showing the embodiment of FIG. 5 is combined.

FIG. 8 is an enlarged cross-sectional view of region A of FIG. 7.

FIG. 9 is an enlarged cross-sectional view of region B of FIG. 7.

FIG. 10A is a cross-sectional view illustrating a shape of a pin core coupled to a fin outer part by varying widths of both ends. FIG.

Figure 10b is a cross-sectional view showing the shape of the pin core coupled to the fin outer portion to rough the surface.

Figure 10c is a cross-sectional view showing the shape of the pin core coupled to the fin outer portion with an adhesive material.

11 is a schematic cross-sectional view showing a coupling relationship between an electrical connector and circuit boards according to another embodiment of the present invention.

12 is a schematic cross-sectional view showing a coupling relationship between an electrical connector and circuit boards according to another embodiment of the present invention.

Brief description of symbols for the main parts of the drawings

10: first circuit board 20: second circuit board

100: insulating substrate 101: reinforcing layer

102: insulating layer 105: notch

110: connection pin 120: first guide pin

130: second guide pin 140, 141: conductive layer

150: pin core 160: pin outer portion

170: adhesive material

Claims (14)

An electrical connector for electrically connecting a first substrate on which first via holes are formed and a second substrate on which second via holes are formed. A base substrate; A plurality of connection pins disposed on one side of the base substrate and detachably inserted into the first via holes and the second via holes to electrically connect the first substrate and the second substrate; A first guide pin disposed on one side of the base substrate and detachably inserted into the first substrate to fix the base substrate on the first substrate; And An electrical connector disposed on one side of the base substrate, the second guide pin detachably inserted into the second substrate to fix the base substrate to the second substrate. According to claim 1, At least one of the connection pin, the first guide pin or the second guide pin A spacer portion having a first cross-sectional area and a first height, the spacer portion coupled to contact the base substrate; And A pin portion coupled to abut the spacer portion having a second cross-sectional area and a second height, the pin portion being configured to fit into a via hole of at least one of the first substrate and the second substrate, the first cross-sectional area being the second portion; Electrical connectors greater than or equal to cross sectional area. According to claim 1, The electrical connector may connect the first substrate and the second substrate by direct contact between the first conductive layer formed in the first via hole and the second conductive layer formed in the second via hole or indirect contact through the connection pins. Electrical connector to connect electrically. The method according to claim 1 or 2, Each of at least one of the connection pin, the first guide pin, or the second guide pin is a pin core disposed in contact with the base substrate; And And a pin structure disposed on the base substrate to cover the pin core and having a pin outer portion configured to fit into a via hole of at least one of the first substrate and the second substrate. 5. The method of claim 4, And the pin core has a radius of the distal end from the base substrate greater than the cross-sectional area of the proximal end. 5. The method of claim 4, An electrical connector is formed on the outer surface of the pin core in order to increase the roughness. 5. The method of claim 4, And an adhesive material interposed between the pin core and the pin outer portion. 5. The method of claim 4, And the pin core is made of a material comprising copper. 5. The method of claim 4, The pin outer portion is made of a material comprising a conductive elastomer. The method of claim 9, And the pin outer portion is elastically supported to fit at least one of the first via holes or the second via holes by an elastic force of the conductive elastic body. 5. The method of claim 4, And the pin outer portion is made of a material comprising a metal. According to claim 1, The base substrate, An insulating layer on one surface of which the connecting pin, the first guide pin, and the second guide pin are coupled and bent; And a reinforcing layer bonded to the other side of the insulating layer. The method of claim 12, And the reinforcing layer has a notch having a width greater than or equal to the thickness of the reinforcing layer in a portion corresponding to the bent portion of the insulating layer. A base substrate; A connection pin disposed on one side of the base substrate; A first guide pin disposed on one side of the base substrate; A method of electrically connecting circuit boards using an electrical connector including a second guide pin disposed on one side of the base substrate, Disposing a first substrate having first via holes with a first conductive layer and a second substrate having second via holes with a second conductive layer such that the second conductive layer faces the first conductive layer. step; Removably inserting the first guide pin into the first substrate to fix the base substrate to the first substrate; Electrically connecting the first substrate and the second substrate by removably inserting the connection pin into the first via holes and the second via holes; And And removably inserting the second guide pin into the second substrate to fix the base substrate on the second substrate.
KR1020090060238A 2009-07-02 2009-07-02 Electric connector and method for electric connection of circuit board using the same KR20110003413A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020090060238A KR20110003413A (en) 2009-07-02 2009-07-02 Electric connector and method for electric connection of circuit board using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090060238A KR20110003413A (en) 2009-07-02 2009-07-02 Electric connector and method for electric connection of circuit board using the same

Publications (1)

Publication Number Publication Date
KR20110003413A true KR20110003413A (en) 2011-01-12

Family

ID=43611289

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090060238A KR20110003413A (en) 2009-07-02 2009-07-02 Electric connector and method for electric connection of circuit board using the same

Country Status (1)

Country Link
KR (1) KR20110003413A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102118001A (en) * 2011-01-14 2011-07-06 番禺得意精密电子工业有限公司 Method for manufacturing shielded connector
KR20170025949A (en) 2015-08-31 2017-03-08 문성군 The radio network controller of the welding current and crater current for welding equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102118001A (en) * 2011-01-14 2011-07-06 番禺得意精密电子工业有限公司 Method for manufacturing shielded connector
KR20170025949A (en) 2015-08-31 2017-03-08 문성군 The radio network controller of the welding current and crater current for welding equipment

Similar Documents

Publication Publication Date Title
CN102027643B (en) Connector structure
JP4551776B2 (en) Double-sided FPC
US7625231B2 (en) Adaptor for cable connector
CN102577647B (en) Circuit board
JP4775976B2 (en) Sheet-like connection terminal and FPC board connection method using the same
TW200428722A (en) Connecting structure of printed wiring board
US20090173529A1 (en) Circuit structure and fabrication method thereof
US9320141B2 (en) Wiring structure, cable, and method of manufacturing wiring structure
TWI603659B (en) Printed circuit board and connector to connect the circuit board
JP5406908B2 (en) Printed wiring board
WO2011077228A1 (en) Male connector block, female connector block, and connector
CN102184759A (en) Cable, cable connector and cable assembly
US20100134995A1 (en) Electrical Interconnection System
KR20110003413A (en) Electric connector and method for electric connection of circuit board using the same
JP5325699B2 (en) Flexible aggregation wiring connector
JP5342341B2 (en) Printed wiring board
JP5469958B2 (en) Flexible aggregation wiring connector
TWI584543B (en) Connector and the method of manufacturing the same
JP6564277B2 (en) Flexible wiring board with seal
JP5677475B2 (en) Printed wiring board
JP2009200292A (en) Flexible printed wiring board, and forming method for projection structure of wiring board
JP3169040U (en) Flat cable
JPS6039989Y2 (en) connector
JP5406907B2 (en) Printed wiring board
JP5852923B2 (en) Wiring body connection structure

Legal Events

Date Code Title Description
N231 Notification of change of applicant
WITN Withdrawal due to no request for examination