KR20100133139A - Mold and method for manufacturing mold, method for transferring pattern - Google Patents

Abstract

PURPOSE: A method for manufacturing a mold is provided to coat hydrophilic or hydrophobic pattern materials on only region with the same surface property as corresponding pattern materials. CONSTITUTION: A method for manufacturing a mold comprises the steps of: performing hydrophilic treatment of the surface of a mold(100); coating a pattern mask on the surface of the hydrophilic mold; patterning the pattern mask to form exposed regions and pattern mask regions; etching the exposed regions; performing hydrophobic treatment of the etched exposed regions and the pattern mask regions; and removing the pattern mask of a pattern mask layer region.

Description

MOLD AND METHOD FOR MANUFACTURING MOLD, METHOD FOR TRANSFERRING PATTERN}

The present invention relates to a mold, a mold manufacturing method and a pattern transfer method.

Recently, the demand for thinning and high performance of products is increasing in the mining, display, semiconductor, and bio industries. In order to meet such demands, the wiring or functional thin film layers constituting each component must be formed in a smaller and more uniform pattern. Therefore, the fine pattern manufacturing method is particularly applicable to optical gratings, fine wirings, and the like used in optical devices.

In general, conventional methods for producing sub-micrometer patterns include photolithography, fine mask deposition (FMD), printing, and nano imprinting lithography NIL). However, there are respective process limitations in this manufacturing method. Photolithography has a problem in that a manufacturing process is complicated, manufacturing difficulty in manufacturing a shadow mask, expensive manufacturing cost, and precision is lowered due to the distortion of the mask. In addition, it is difficult to align the mask and the object, it is difficult to change the process, that is, change the size and shape of the pattern (pattern).

FMD has a problem caused by using the above-mentioned shadow mask in the exposure method, and has a problem of high manufacturing cost. In addition, there are problems such as material limitation and long manufacturing time.

The ink-jet method of printing cannot use various materials because the material to be patterned should be in the form of a liquid solution, and a nonuniform pattern is generated due to the difficulty of constant liquid crystal spraying. There is this. On the other hand, the roll to roll (roll to roll) method has a disadvantage that only a relatively large pattern can be applied to the pattern size of 30 ~ 40 ㎛.

NIL produces a stamp using E-beam lithography, and there is a problem in that it is difficult to make a stamp in a large area due to a process problem. On the other hand, EUV exposure (photolithography) method is currently used to make a stamp, there is a problem such as a high manufacturing cost. In addition, NIL has a disadvantage in that the manufacturing process is complicated due to a problem that residual PR occurs during PR patterning using a photo-resist (hereinafter, referred to as PR).

Although the micro contact printing process is capable of producing a wide pattern from several tens of um to several tens of nm, the contact between the mold and the substrate is made because a soft mold such as polydimethylsiloxane (PDMS) is used. There is a problem in that the pattern distortion occurs due to deformation of the mold.

1 is a view showing a pattern formed through a laser assisted pattern transfer process according to the prior art.

As shown in FIG. 1, a pattern formed through a conventional laser assisted pattern transfer process indicates that a pattern boundary is uncertain. The conventional laser assisted pattern transfer process has a problem in that it is difficult to make a pattern of 10 μm or less due to diffraction and focus depth limitations. In addition, since the pattern is formed only in the position where the laser passes, it takes a long time to manufacture the pattern in a large area, and there is a disadvantage in that the pattern quality is not good because the boundary of the pattern is uneven compared to other processes. In addition, as the boundary is broken by the laser, particles are scattered on the substrate and the boundary is uneven.

Therefore, in order to solve the above problems, the present invention is formed so that the constant region is hydrophilic and the constant region is hydrophobic, so that the hydrophilic or hydrophobic pattern material is coated only on the region having the same surface properties as the pattern material. It is also an object of the present invention to provide a mold, a mold manufacturing method, and a pattern transfer method which can reuse the mold pattern after transferring the pattern material.

In addition, the present invention provides a mold, a mold manufacturing method, and a pattern transfer method capable of eliminating the nonuniformity of the pattern boundary caused by the material falling off the pattern boundary when the pattern material is coated only on the portion to be patterned. Its purpose is to provide.

It is also an object of the present invention to provide a mold, a mold manufacturing method, and a pattern transfer method having excellent pattern quality by eliminating the nonuniformity of the pattern boundary of micrometer to nanometer size.

The present invention also simplifies the process of forming a pattern to be transferred to a substrate by directly transferring a transfer material coated on a mold surface onto a substrate using a liquid coating material by spin coating. An object of the present invention is to provide a mold, a mold manufacturing method, and a pattern transfer method capable of saving time.

In addition, an object of the present invention is to provide a mold, a mold manufacturing method, and a pattern transfer method capable of large area pattern transfer without using a mask.

In addition, an object of the present invention is to provide a mold, a mold manufacturing method, and a pattern transfer method capable of forming a transfer pattern of a micrometer size or less having a uniform line width.

In addition, an object of the present invention is to provide a mold, a mold manufacturing method, and a pattern transfer method, in which a pattern transfer process made in a conventional vacuum state is possible even in a standby state, and the process is convenient.

The mold of the invention according to claim 1 is alternately formed of a convex portion and a concave portion on which the surface on which the pattern material to be transferred is coated, and if the convex portion is hydrophilic, the concave portion is hydrophobic, and if the convex portion is hydrophobic, the concave portion This is hydrophilic.

Therefore, according to the mold of the invention according to claim 1, the surface of the mold is formed so as to have a certain area hydrophilic and a certain area hydrophobic, so that the hydrophilic or hydrophobic pattern material can be coated only in an area having the same surface property as the pattern material. Can be.

The mold manufacturing method of the invention according to claim 2 includes a hydrophilic treatment step of hydrophilizing a mold surface, a pattern mask coating step of coating a pattern mask on a hydrophilized mold surface, and an exposed area to which a mold surface is exposed by patterning a pattern mask; A pattern mask patterning step of forming a pattern mask film region in which the pattern mask is held between the exposure regions, a fourth step of etching the exposure region, a minority processing step of hydrophobizing the etched exposure region and the pattern mask film region, and a pattern mask film And removing a pattern mask to remove the pattern mask of the region.

Therefore, according to the mold manufacturing method of the invention according to claim 2, the surface of the mold is formed so as to have a certain area hydrophilicity and a certain area hydrophobic, so that the hydrophilic or hydrophobic pattern material can be coated only in a region reacting with the pattern material. Can be.

In the mold manufacturing method according to claim 3, in the mold manufacturing method according to claim 2, in the hydrophilic treatment step, the surface of the mold is treated with plasma or UV (Ultra-Viloet) and hydrogen peroxide (Hydrogen peroxide). .

Therefore, according to the mold manufacturing method of the invention according to claim 3, since the surface of the mold is hydrophilized, the hydrophilic pattern material can remain on the surface of the hydrophilized mold.

In the mold fabrication method according to claim 4, in the mold fabrication method according to claim 4, in the hydrophobic treatment step, the etched exposed region and the pattern mask film are subjected to O ₂ plasma treatment and immersed in a piranah solution. Hydrophobic treatment with silane solution.

Therefore, according to the mold manufacturing method which is invention of Claim 4, since the mold surface is hydrophobized, a hydrophilic pattern material can fall on the hydrophobized mold surface.

The method of manufacturing a mold according to claim 5 includes a hydrophobic treatment step of hydrophobizing a mold surface, a pattern mask coating step of coating a pattern mask on a hydrophobized mold surface, and an exposed area where the mold surface is exposed by patterning the pattern mask; A pattern mask patterning step of forming a pattern mask film region in which the pattern mask is held between the exposure regions, a fourth step of etching the exposure region, a hydrophilic treatment step of hydrophilizing the etched exposure region and the pattern mask film region, and a pattern mask film And removing a pattern mask for removing the pattern mask of the region.

Therefore, according to the mold manufacturing method of the invention according to claim 5, by forming the mold pattern such that the mold surface has hydrophobicity or hydrophilicity selectively, the liquid pattern material is coated only on the region having the same surface property as the pattern material. can do.

The pattern transfer method according to claim 6 is a coating step of coating a hydrophilic pattern material on a hydrophilic surface of a mold produced by the mold manufacturing method according to any one of claims 2 to 5, a hydrophilic pattern material and a substrate And a pressurizing step of pressing against each other, and a transfer step of scanning the laser light in a state where they are brought into contact with each other to transfer the hydrophilic pattern material onto the substrate.

Therefore, according to the pattern transfer method of the invention according to claim 6, since the pattern material is coated only on the portion to be patterned, the nonuniformity of the pattern boundary caused by the material falling off the pattern boundary when transferring with a laser can be eliminated, and the excellent pattern Can have quality. In addition, since the transfer material coated on the mold surface is directly transferred to the substrate by using the spin coating method of the liquid pattern material, the formation process of the pattern transferred to the substrate is simplified, and the manufacturing cost and manufacturing time can be reduced. Can be. Further, according to the pattern transfer method of the invention according to claim 6, a large area transfer can be performed without using a mask, and a transfer pattern of a micrometer size or less having a uniform line width can be formed. In addition, the pattern transfer process, which is performed in the conventional vacuum state, is possible even in the air state, and the process is convenient.

The pattern transfer method of the inventor according to claim 7, the coating step of coating a hydrophobic pattern material on the hydrophobic surface of the mold produced by the mold manufacturing method according to any one of claims 2 to 5, the hydrophobic pattern material and the substrate And a pressurizing step of pressing against each other, and a transfer step of scanning the laser light in a state where they are brought into contact with each other to transfer the hydrophobic pattern material onto the substrate.

Therefore, according to the pattern transfer method of the invention according to claim 7, since only the portion to be patterned is coated with the pattern material, the nonuniformity of the pattern boundary caused by the material falling off the pattern boundary when transferring with the laser can be eliminated, and the excellent pattern Can have quality. In addition, since the transfer material coated on the mold surface is directly transferred to the substrate by using the spin coating method of the liquid pattern material, the formation process of the pattern transferred to the substrate is simplified, and the manufacturing cost and manufacturing time can be reduced. Can be. In addition, a large-area pattern transfer can be performed without using a mask, and a transfer pattern of a micrometer size or less having a uniform line width can be formed. In addition, since the pattern transfer process performed in the conventional vacuum state is possible in the air state, the process is convenient.

As described above, according to the present invention, since the mold surface is formed so as to have a certain area is hydrophilic, and a certain area is hydrophobic, the hydrophilic or hydrophobic pattern material can be coated only in an area having the same surface properties as the pattern material. And the mold pattern can be reused after the pattern material is transferred.

In addition, according to the present invention, since the pattern material is coated only on the portion to be patterned, the nonuniformity of the pattern boundary caused by the material falling off the pattern boundary when being transferred by the laser can be eliminated.

Further, according to the present invention, since the nonuniformity of the pattern boundary of micrometer to nanometer size is eliminated, it can have excellent pattern quality.

In addition, according to the present invention, since the transfer material coated on the mold surface is directly transferred to the substrate by using the spin coating method of the liquid pattern material, the formation process of the pattern transferred to the substrate is simplified, and the manufacturing cost and Manufacturing time can be saved.

Moreover, according to this invention, the pattern transfer of a large area is possible without using a mask.

In addition, according to the present invention, it is possible to form a transfer pattern of micrometer size or less having a uniform line width.

Moreover, according to this invention, since the pattern transfer process performed in the existing vacuum state is possible also in a standby state, a process is convenient.

Specific matters other than the problem to be solved, the problem solving means, and the effects of the present invention as described above are included in the following embodiments and the drawings. Advantages and features of the present invention, and methods for accomplishing the same will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. Like reference numerals refer to like elements throughout.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the accompanying drawings are only described in order to more easily disclose the contents of the present invention, but the scope of the present invention is not limited to the scope of the accompanying drawings that will be readily available to those of ordinary skill in the art. You will know.

2 is a cross-sectional view showing the structure of a mold according to the first embodiment of the present invention.

As shown in FIG. 2, the mold 100 according to the first embodiment of the present invention has a structure in which a surface on which the pattern material to be transferred is coated is alternately formed into a convex portion 100a and a concave portion 100b. .

Here, in the mold 100 according to the embodiment of the present invention, if the convex portion 100a is hydrophilic 110, the concave portion 100b is hydrophobic 140. In addition, although not shown, as a modification according to the first embodiment of the present invention, if the convex portion is hydrophobic, the concave portion is made hydrophilic.

According to the mold according to the first embodiment of the present invention, since the mold surface is formed to have a certain area is hydrophilic, and the predetermined area is hydrophobic, it is possible to apply the hydrophilic or hydrophobic pattern material only to the area reacting with the pattern material. It is also possible to reuse this mold pattern after transferring the pattern material.

Hereinafter, a method of manufacturing a mold according to an embodiment of the present invention configured as described above will be described in detail with reference to FIGS. 3 to 4G.

3 is a view showing a procedure of a mold manufacturing method according to a second embodiment of the present invention.

As shown in Figure 3, the mold manufacturing method according to the second embodiment of the present invention, a hydrophilic treatment step (S100) for hydrophilic treatment of the mold surface, a pattern mask coating step (S200), a pattern mask for coating a pattern mask Pattern mask patterning to form a pattern mask film region in which a pattern mask film is maintained between an exposed region and an exposed region where the mold surface is exposed, a pattern mask patterning step (S300), an etching step of etching the exposed region (S400), and an etched exposed region And a hydrophobic treatment step (S500) of hydrophobizing the pattern mask film region, and a pattern mask removal step (S600) of removing the pattern mask of the pattern mask film region.

The hydrophilic treatment step (S100) is a step of hydrophilizing the mold surface before forming a pattern on the mold surface. Here, the surface of the mold is treated by plasma, UV (Ultra-Violet) treatment, or hydrogen peroxide (Hydrogen peroxide), so that the mold surface has hydrophilic characteristics. However, the present invention is not limited thereto, and it is obvious to those skilled in the art that the method of hydrophilic treatment may vary according to the mold type. Meanwhile, in the embodiment of the present invention, a Si mold, a glass mold, a SiN mold, a SiO 2 mold, a metal coated Si or a glass mold may be used.

The pattern mask coating step (S200) is a step of coating a pattern mask for patterning on a surface of a hydrophilic mold. Here, a pattern mask means the mask used in order to form a pattern in a mold surface. For example, when the mold material is a Si mold, the etching mask film deposited on the mold surface and the photoresist film coated on the etching mask film are collectively referred to. Detailed description thereof will be made in the description of FIG. 3.

The pattern mask patterning step S300 is a step of patterning a pattern mask. A predetermined portion of the pattern mask is patterned using a dry etching process or the like so as to form an exposed area where the mold surface is exposed. A pattern mask film region in which the pattern mask is maintained is formed between the exposed regions.

In the etching step S400, the exposed area formed in the pattern mask patterning step S300 is etched using a dry etching process or a wet etching process. At this time, a predetermined groove is formed in the mold base material by etching.

The hydrophobic treatment step (S500) is a hydrophobic treatment of the etched exposed region and the pattern mask film region which is still held. Here, in the hydrophobic treatment step (S500), the etched exposed area and the pattern mask film area are immersed in a piranah solution by O ₂ plasma treatment, and then hydrophobized with a silane solution, thereby etching the exposed area. And the pattern mask film region have a hydrophobic characteristic. However, the present invention is not limited thereto, and it is obvious to those skilled in the art that the hydrophobic treatment method may vary according to the type of mold.

The pattern mask removing step (S600) is a step of exposing the hydrophilic surface under the pattern mask by removing the pattern mask of the pattern mask film region hydrophobized in the hydrophobic treatment step (S500).

On the other hand, although not shown, as another embodiment of the mold manufacturing method according to the first embodiment of the present invention, the surface of the mold is hydrophobized in S100, and the exposed and patterned mask film regions etched in S500 by hydrophilic treatment In addition, a mold having a surface having a hydrophobic characteristic under the pattern mask and a surface having a hydrophilic characteristic under the pattern mask may be manufactured.

4A to 4G are views illustrating a mold manufacturing process according to a third embodiment of the present invention. Meanwhile, FIGS. 4A to 4G will be described as an example of patterning a Si mold.

4A is a view showing a hydrophilic treatment process of the mold surface 100 according to the third embodiment of the present invention.

As shown in FIG. 4A, the mold surface 100 has hydrophilicity by a predetermined hydrophilic treatment. Here, the hydrophilic treatment process is a process of plasma treatment, UV (Ultra-Violet) treatment or hydrogen peroxide (Hydrogen peroxide) treatment. As a result, a predetermined hydrophilic film 110 is formed on the mold surface 100. 4A is a view corresponding to the hydrophilic treatment step S100 of FIG. 3.

4B is a view illustrating a process of coating the etching mask film 120 and the photoresist film 130 of the mold according to the third embodiment of the present invention. 4B is a view corresponding to the pattern mask coating step S200 of FIG. 3.

As shown in FIG. 4B, an etching mask film 120 is deposited on the hydrophilic film 110 in FIG. 4A. Here, the etching mask film 120 is made of a metal material such as chromium (Cr), nickel (Ni), aluminum (Al) and the like. In addition, the photoresist film 130 is spin coated on the etching mask 120 film. The photoresist film 130 is then exposed.

4C is a view showing a process of etching the photoresist film 130 of the mold according to the third embodiment of the present invention.

As shown in FIG. 4C, the photoresist film 130 is patterned by developing the photoresist film 130 exposed in FIG. 4B. At this time, the exposed photoresist film 130 is removed. Meanwhile, in the embodiment of the present invention, a mask film is manufactured by using a conventional photolithography process as an example. However, in order to pattern an etch mask, conventional techniques such as electron beam lithography, nanoimprinting lithography (NIL), focused ion beam (FIB), and interference lithography, etc. Any process can be used.

4D is a view showing a process of etching the etching mask film 120 of the mold according to the third embodiment of the present invention.

As shown in FIG. 4D, the photoresist film 130 is patterned and removed in FIG. 4C, and then the underlying etching mask film 120 is etched using a dry etching or wet etching process. When the etching mask film 120 is etched away, the mold surface below it, that is, the hydrophilic film 110 is exposed to the outside. In this case, an etching mask film region in which the etching mask film 120 is maintained is formed between the exposed region and the exposed region where the hydrophilic film 110 is exposed.

4C and 4D are diagrams corresponding to the pattern mask patterning step S300 of FIG. 3.

4E is a view showing a process of etching the base material 100 of the mold according to the third embodiment of the present invention. 4E is a diagram corresponding to the etching step S400 of FIG. 3.

As shown in FIG. 4E, the exposed region formed in FIG. 4D is etched using a dry etching process. In this case, a groove having a predetermined height and width is formed in the etched exposed region. Here, the height and width of the groove may be adjusted by variables such as the type of the etching process and the material of the mold.

4F is a view showing a process of hydrophobically treating an etched exposed region and an etching mask film according to a third embodiment of the present invention. 4F is a diagram corresponding to the minority processing step S500 of FIG. 3.

As shown in FIG. 4F, the exposed region 100 is hydrophobized by performing hydrophobic treatment on the exposed region etched in FIG. 4E and the etching mask film held in FIG. 4C. In the hydrophobic treatment that may be used in the embodiment of the present invention, the exposed region 100 and the etching mask film may be dipped in a piranah solution after the O ₂ plasma treatment, and then hydrophobized with a silane solution. Through this method, a general self assembled monolayer (SAM) may be manufactured. The exposed region 100 and the etching mask film 120 may be subjected to hydrophobic treatment with a silane solution after UV irradiation for about 1 hour. Then, the convex portions (etching mask film) 120 with metal still have hydrophilic surface characteristics, and only the concave portions (grooves, 100) etched in FIG. 4D have a few surface characteristics.

4G is a view showing a process of removing the etching mask film 120 of the mold according to the third embodiment of the present invention. 4G is a view corresponding to the step of removing the pattern mask of FIG. 3 (S600).

As shown in FIG. 4G, the concave groove (bottom and wall) portions have a hydrophobic characteristic, and the convex portions have hydrophilic characteristics by removing the hydrophobic etching mask film 120 in FIG. 4F.

On the other hand, although not shown, as another embodiment of the mold manufacturing method according to the third embodiment of the present invention, the surface of the mold is hydrophobized in the process of FIG. 4A, and the exposed region and the etching mask film etched in FIG. 4F are hydrophilic. By processing, a mold having a surface having a hydrophobic characteristic under the etching mask film and a surface having a hydrophilic characteristic of the exposed area may be produced.

The mold manufactured by the mold manufacturing method according to the embodiment of the present invention may repeatedly perform a process of selectively coating a pattern material only on a specific portion of the mold surface and transferring it to a substrate. Through the hydrophilic treatment of the plasma method and the hydrophobic treatment of the SAM method as described above, the characteristics of the mold surface can be maintained for several days to several tens of days. In particular, the SAM method can be maintained for a longer period of time without physically removing the layer. In addition, the existing mold is formed by a method of manufacturing a mold according to an embodiment of the present invention, although the existing process of patterning by depositing or removing material by shooting ions or electron beams (E-beam) should be performed in a vacuum state. The mold can be processed in an atmospheric state rather than in a vacuum state, and can be patterned in a large area.

5A to 5C are diagrams illustrating a pattern transfer method according to a fourth embodiment of the present invention.

5A is a view illustrating a process of coating a pattern material on a mold pattern 110 having selective surface properties according to a fourth embodiment of the present invention.

As shown in FIG. 5A, the liquid pattern material 200 is coated on the mold 100 manufactured by the mold manufacturing method described in FIGS. 3 to 4G. In the embodiment of the present invention, silver ink having hydrophilic properties was used as the liquid pattern material 200 as an example. However, in addition to this, any liquid pattern material capable of spin coating is also possible. In addition, the coating method uses spin coating so that only the convex portions 110 having hydrophilic characteristics are coated with the pattern material 200, and the rest of the portions 140 having hydrophobic characteristics have no pattern material. I can't. This is because the pattern material disappears by the high speed rotation of the mold 100. In addition to spin coating, other solution processes are also possible. Herein, the solution process may include printing methods such as deep coating, ink jet, roll to roll, screen printing, and spray methods. Included. Then, the pattern material is solidified through a baking process, or the pattern material in a liquid state is used as it is. On the other hand, as a transfer material that can be used in the pattern transfer method according to an embodiment of the present invention may be used a biomaterial including a metal material, an organic material, an inorganic material, a ceramic, a protein and a cell.

Therefore, according to the embodiment of the present invention, the surface of the mold 100 is surface-treated so that the pattern material 200 is spin coated only on a specific part (concave or convex), and at the same time, FIGS. 5B and 5C. As such, the pattern material 200 of the specific portion may be directly patterned on the substrate 300.

5B is a view showing a process of transferring the pattern material 200 coated on the mold surface onto the substrate 300 according to the fourth embodiment of the present invention.

As shown in FIG. 5B, after contacting the coated pattern material 200 and the substrate 300 to each other on a specific portion 110 of the mold surface, an appropriate pressure is applied to complete the contact. Then, the laser (L) is scanned while facing each other. At this time, the energy of the strong laser L is absorbed and thermally expanded by the pattern material 200, and the gas pressure is released due to the evaporation of the material and is instantly liquefied. Finally, the pattern material 200 of the convex portion 110 of the mold 100 is transferred to the substrate. In the embodiment of the present invention, the laser scanning direction is illustrated in the direction of the mold 100 from the substrate 300, but is not limited thereto, and may be scanned in the direction of the substrate 300 from the mold 100.

On the other hand, the substrate 300 is preferably formed of a transparent material. However, when the material of the substrate 300 is opaque, it is desirable to scan the laser more strongly in consideration of the light absorption of the material. Here, the material of the substrate 300 is applicable to almost all materials such as Si, glass, polymer, metal, ceramic, other special materials. In the embodiment of the present invention, the laser (L) scanning direction is shown in the direction from the substrate 300 to the mold 100, but is not limited to this, and may be scanned in the direction from the mold 100 to the substrate 300. Do.

On the other hand, the laser (L) is used in the continuous wave (CW) laser method and the pulse (pulse) laser method in consideration of the absorption rate and the required energy with the material. Here, the CW (continuous wave) laser method, the laser emission through the density inversion (population inversion) in the resonator (resonator) inside the laser, the pulse (pulse) laser method is the energy distribution inversion as shown above The energy is collected and released at a time. In the pattern transfer method according to the embodiment of the present invention described above, a method of softening by heat generated through laser light scanned through a continuous wave (CW) method is used as an example, but in order to minimize the influence of heat, a pulse laser ( pulse laser). Here, in the case of using a pulse laser (pulse laser) method, by controlling the laser power and pulse width, etc., the energy of the laser (L) can be absorbed by the pattern material 200 to thermally expand and liquefy instantaneously, In addition, the degree of generation of gas due to evaporation of the pattern material may be controlled by adjusting the laser power and the pulse width. When the pattern material is liquefied, the contact between the pattern material and the substrate is well achieved. However, when the pattern material is oxidized or the pattern material is liquefied and then cured again, problems such as heat shrinkage may occur, thereby causing a problem that the transfer efficiency and quality are deteriorated. In addition, when the pattern material is mainly evaporated, the transfer efficiency is excellent and oxidation is not good, but the state of the pattern surface transferred by the strong laser power deteriorates or particles of the pattern material scatter around the pattern. Problems may occur. Therefore, it is necessary to appropriately adjust the degree to which the pattern material is liquefied and the degree to which gas is generated by evaporation of the pattern material.

5C is a view illustrating a state in which the pattern material 200 coated on the mold surface according to the fourth embodiment of the present invention is transferred onto the substrate 300.

As shown in FIG. 5C, since the pattern material 200 coated on the mold surface in FIG. 5B is transferred to the substrate 300, and the boundary of the transferred pattern is not broken, the uniform pattern having the neat boundary is formed. Obtained.

The pattern manufacturing method according to the fourth embodiment of the present invention can be usefully used for manufacturing a grating of a wire grid polarizer, various wirings, and a linear scale. In addition, the pattern manufacturing method according to the fourth embodiment of the present invention can be used for micro nano patterning of various other materials.

6A to 6D are diagrams illustrating a pattern transfer method according to a fifth embodiment of the present invention.

FIG. 6A illustrates a process of coating the pattern material 400 on a mold pattern 140 having selective surface properties according to a fifth embodiment of the present invention.

As shown in FIG. 6A, a liquid pattern material is coated on a groove of a mold 100 manufactured by the mold manufacturing method described in FIGS. 3 to 4G. In the embodiment of the present invention, silver ink having hydrophilic properties was used as an example of the liquid pattern material. However, in addition to this, any liquid pattern material capable of spin coating is also possible. Then, the pattern material is solidified through a baking process, or the pattern material in a liquid state is used as it is.

Therefore, according to the exemplary embodiment of the present invention, the pattern material 400 is spin-coated only on the grooves 140 which are physically concave because the surface of the mold 100 is surface treated, and simultaneously with FIGS. 6B and 6C. As such, the pattern material 400 of the groove portion may be directly patterned on the substrate 500.

6B is a view illustrating a process of pressing the pattern material 400 and the substrate 500 coated on the mold surface 140 according to the fifth embodiment of the present invention.

As shown in FIG. 6B, after contacting the coated pattern material 400 and the substrate 500 to each other on the groove portion 140 of the mold surface, appropriate pressure is applied to complete the contact.

FIG. 6C illustrates a process of transferring the pattern material 400 coated on the mold surface 140 onto the substrate 500 according to the fifth embodiment of the present invention.

As shown in FIG. 6C, after pressing the pattern material 400 and the substrate 500 coated on the groove portion 140 of the mold surface in FIG. 6B, the laser L is scanned while being in contact with each other. At this time, the energy of the strong laser is absorbed and thermally expanded by the pattern material 400, and the gas pressure is released due to the evaporation of the material and is instantly liquefied. Finally, the material 400 of the recessed portion 140 of the mold is transferred to the substrate 500.

FIG. 6D illustrates a state in which the pattern material 400 coated on the mold surface according to the fifth embodiment of the present invention is transferred onto the substrate 500.

As shown in FIG. 6D, in FIG. 6C, the pattern material 400 coated on the mold surface is transferred to the substrate 500, and since the boundary of the transferred pattern has no breakage of the material, a uniform pattern having a neat boundary is formed. Obtained. In the embodiment of the present invention, the laser scanning direction is shown in the direction of the mold 100 from the substrate 500, but is not limited thereto, and may be scanned in the direction of the substrate 500 from the mold 100.

As described above, according to the present invention, since the mold surface is formed such that the constant region is hydrophilic and the constant region is hydrophobic, the hydrophilic or hydrophobic pattern material can be coated only on the site where it reacts with the pattern material. It is also possible to reuse this mold pattern after transferring the pattern material. In addition, since the pattern material is coated only on the portion to be patterned, the nonuniformity of the pattern boundary caused by the material falling off the pattern boundary when being transferred by the laser can be eliminated. In addition, since the nonuniformity of the pattern boundary of micrometer to nanometer size is eliminated, it can have excellent pattern quality.

In addition, according to the present invention, since the transfer material coated on the mold surface is directly transferred to the substrate by using the spin coating method of the liquid pattern material, the formation process of the pattern transferred to the substrate is simplified, and the manufacturing cost and Manufacturing time can be saved. In addition, since a large-area pattern transfer is possible without using a mask, a transfer pattern of a micrometer size or less having a uniform line width can be formed.

As such, the technical configuration of the present invention described above can be understood by those skilled in the art that the present invention can be implemented in other specific forms without changing the technical spirit or essential features of the present invention.

Therefore, the exemplary embodiments described above are to be understood as illustrative and not restrictive in all respects, and the scope of the present invention is indicated by the following claims rather than the detailed description, and the meaning and scope of the claims and their All changes or modifications derived from equivalent concepts should be construed as being included in the scope of the present invention.

1 is a view showing a pattern formed through a laser assisted pattern transfer (Laser Assisted Pattern Transfer) process according to the prior art.

2 is a cross-sectional view showing the structure of a mold according to the first embodiment of the present invention.

3 is a view showing a procedure of a mold manufacturing method according to a second embodiment of the present invention.

4A to 4G illustrate a mold manufacturing process according to a third embodiment of the present invention.

5A to 5C show a pattern transfer method according to a fourth embodiment of the present invention.

6A to 6D show a pattern transfer method according to a fifth embodiment of the present invention.

Claims (7)

The surface on which the pattern material to be transferred is coated is alternately formed into convex and concave portions, If the convex portion is hydrophilic, the concave portion is hydrophobic, If the convex part is hydrophobic, the concave part is made hydrophilic, Mold. Hydrophilic treatment step of hydrophilizing the mold surface; A pattern mask coating step of coating a pattern mask on the surface of the hydrophilic mold; A pattern mask patterning step of patterning the pattern mask to form a pattern mask layer region in which the pattern mask is maintained between an exposed region where the mold surface is exposed and the exposed region; Etching the exposed area; A hydrophobic treatment step of hydrophobizing the etched exposed region and the pattern mask film region; And A pattern mask removing step of removing a pattern mask of the pattern mask layer region Including, mold manufacturing method. The method of claim 2, In the hydrophilic treatment step, Plasma treatment or UV (Ultra-Violet) treatment or hydrogen peroxide treatment of the mold surface, Mold manufacturing method. The method of claim 2, In the pattern mask removal step, The etched exposed region and the pattern mask layer were immersed in a piranah solution by O ₂ plasma treatment, followed by hydrophobic treatment with a silane solution. Mold manufacturing method. A hydrophobic treatment step of hydrotreating the mold surface; A pattern mask coating step of coating a pattern mask on the surface of the hydrophobic mold; A pattern mask patterning step of patterning the pattern mask to form a pattern mask layer region in which the pattern mask is maintained between an exposed region where the mold surface is exposed and the exposed region; Etching the exposed area; A hydrophilic treatment step of hydrophilizing the etched exposed region and the pattern mask layer region; And A pattern mask removing step of removing a pattern mask of the pattern mask layer region Including, mold manufacturing method. A coating step of coating a hydrophilic pattern material on the hydrophilic surface of the mold prepared by the mold manufacturing method according to any one of claims 2 to 5; A pressing step of pressing the hydrophilic pattern material and the substrate against each other; And A transfer step of scanning the hydrophilic pattern material onto the substrate by scanning laser light in a state where they are opposed to each other; Including, pattern transfer method. A coating step of coating a hydrophobic pattern material on a hydrophobic surface of the mold prepared by the mold manufacturing method according to any one of claims 2 to 5; Pressing the hydrophobic pattern material and the substrate against each other; And A transfer step of scanning the hydrophobic pattern material onto the substrate by scanning laser light in a state where they are opposed to each other; Including, pattern transfer method.

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