KR20100114302A - Photonic device package module and process of the same - Google Patents

Abstract

PURPOSE: A photonic device package module and process of the same are provided to increase the lifespan of an optical device by discharging the heat from the optical through a radiation plate. CONSTITUTION: A photonic device package module and process of the same includes a metallic board(10), an optical device(20), and a molding layer(30). The metallic board has a reflector and includes one or plural mounting space passing between top and bottom thereof. The optical device in installed in the mounting space of the metallic board. The space of the metallic board is filled to form the molding layer and protect the mounted optical device.

Description

Optical device package module and manufacturing method {Photonic Device Package Module and Process of The Same}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical device packaging module and a method of manufacturing the same, and more particularly, to an optical device packaging module and a method of manufacturing the same, which are capable of dissipating heat generated in an optical device very effectively and manufacturing them in various shapes.

Recently, optical devices, including LEDs, are being widely used as next generation lighting sources. However, due to the heat generated by optical devices such as LEDs, efficiency is reduced, lifespan is shortened, and other wavelength changes between red (R), green (G), and blue (B) are increasing due to temperature increase. . Furthermore, as optical devices such as LEDs become increasingly high power, problems due to generated heat become more serious.

This heat problem is inevitable because the size of the current per unit area is very large in Joule heat due to the current flowing through the chip of the optical device because the size of the optical device such as LED is small.

In particular, due to the characteristics of the semiconductor weak to high temperature, it is possible to maintain the original performance must be a smooth heat dissipation design, there is a problem that the emission wavelength is changed or the emission efficiency of light is reduced when the semiconductor is operated at a high temperature.

And heat directly affects the life of the LED product has a problem that shorten the life of the LED module product when operating at high temperatures.

Therefore, a heat dissipation structure that emits heat generated from an optical device such as an LED is a key part of the packaging process.

In general, thermal resistance and junction temperature are used as an indicator of excellent heat dissipation design in an optical device such as an LED, and the thermal resistance is a value determined by the size or physical properties of the material of the package. The contact temperature is a value that represents the actual heat generated by the optical device during operation after the final heat dissipation design.

The lower the thermal resistance is better, the lower the contact temperature when operating at the same power (power) can be said to be a well-designed packaging structure. In order to lower the thermal resistance, some materials having high thermal conductivity are used, but ultimately, it is most effective to simplify the packaging to eliminate the thermal resistance, and lowering the contact temperature is the most important measure of the luminous efficiency and lifetime of the optical device. .

In addition, packaging is a finishing process of packaging an optical device chip according to an optical design and a heat dissipation design, which is a very important process to upgrade the performance of the optical device chip.

Recently, the direction of the packaging technology is going to be ultra-thin, miniaturized, high output (lighting) according to the application, and the importance of the high output package is intensifying. An important consideration in high-power packages is the thermal design, which requires proper selection and placement of packaging materials to prevent heat accumulation on the chip. As the demand for high power LEDs for lighting increases, the development of package technology that optimizes heat dissipation design becomes more important.

Therefore, a technology for effectively dissipating heat generated from optical devices such as LEDs is an essential part of the LED package, and so far, no one package method has been recognized as being excellent.

The present invention has been made in view of the above points, by removing the substrate itself on which the optical element is mounted to zero the thermal resistance generated from the substrate, and attaching the optical element chip directly to the heat sink to generate the optical element It is an object of the present invention to provide an optical device package module and a method of manufacturing the same, which can configure heat to be directly discharged through a heat sink.

In another aspect, the present invention provides an optical device package module and a method for manufacturing the same, which is capable of implementing a heat dissipation structure that can maximize the light emission efficiency of the optical device by lowering the junction temperature of the optical device by releasing the heat generated by the optical device most effectively. It is to.

An optical device package module according to the present invention includes a metal substrate having a reflector and formed with one or a plurality of mounting spaces penetrating up and down, an optical device mounted in a mounting space of the metal substrate, and a mounting space of the metal substrate. It includes a molding layer that fills the interior and protects and supports the mounted optical element.

In addition, the optical device package module according to the present invention further comprises a connection wire formed between the insulating layer on the upper surface of the metal substrate, and a bonding wire for connecting the electrode of the optical device mounted in the connection wiring and the mounting space. It is possible.

In addition, the optical device package module according to the present invention may further include a heat sink installed in contact with the bottom surface of the metal substrate and the optical device.

In the above, the metal oxide layer may be disposed between the bottom surface of the metal substrate and the optical device and the heat sink.

It is also possible to further form a solder layer between the metal substrate and the bottom surface of the optical device or between the metal oxide layer and the heat sink.

An optical device package module manufacturing method according to the present invention comprises the steps of preparing a plate-shaped metal substrate, oxidizing the metal substrate to a depth of 10 to 100㎛ on one side to form a metal oxide layer, and Removing a part from the opposite side of the metal oxide layer to the metal oxide layer to form a mounting space having a reflector, forming an insulating layer on the upper surface of the metal substrate and forming a connection wiring, and mounting space of the metal substrate Mounting an optical device on the optical device, connecting the electrode and the connection wiring to the optical device, and forming a molding layer covering the mounting space and covering the optical device and the connection wiring.

The optical device package module manufacturing method according to the present invention may further include removing the metal oxide layer after forming the molding layer.

In addition, the method of manufacturing an optical device package module according to the present invention may further include forming a solder layer after forming the molding layer or removing the metal oxide layer.

Furthermore, the method of manufacturing an optical device package module according to the present invention may further include mounting a metal substrate on which the optical device is mounted on a heat sink.

According to the optical device package module and the manufacturing method thereof according to the present invention, since the bottom surface of the optical device can be configured to be in direct contact with the heat sink, the heat generated by the optical device can be most effectively discharged through the heat sink.

In addition, according to the optical device package module and the manufacturing method of the present invention, since the metal substrate does not remain on the bottom side of the optical device, the junction temperature (junction temperature) of the optical device is increased by the thermal resistance due to the metal substrate inherently It is possible to eliminate, it is possible to minimize the thermal resistance, the contact temperature of the optical element is lowered, the light emission efficiency of the light is increased and the life of the optical element is improved.

According to the optical device package module and the manufacturing method thereof according to the present invention, it is possible to maximize the light luminous efficiency of the optical device.

Next, a preferred embodiment of an optical device package module and a method of manufacturing the same according to the present invention will be described in detail with reference to the drawings. In the drawings, the same components are denoted by the same reference numerals, and detailed description thereof will be omitted.

However, embodiments of the present invention may be modified in many different forms, the scope of the invention is not to be construed as limited to the embodiments described below. Embodiments of the present invention are provided to explain those skilled in the art to understand the present invention, the shape of the elements shown in the drawings and the like are shown by way of example in order to emphasize more clear description.

As shown in FIG. 1, a first embodiment of an optical device package module according to the present invention includes a metal substrate 10, an optical device 20, and a molding layer 30.

The metal substrate 10 is formed using a material having a very high thermal conductivity compared to synthetic resins or ceramics.

Aluminum, titanium, or the like may be used as a material for forming the metal substrate 10.

One or a plurality of mounting spaces 14 penetrate up and down are formed in the metal substrate 10.

In the case where the optical elements 20 are mounted one by one on the metal substrate 10, mounting spaces 14 are formed one by one, and a plurality of optical elements 20 are mounted on one metal substrate 10. In this case, a plurality of mounting spaces 14 are formed by arranging in a set pattern.

The wall surface forming the mounting space 14 may be formed as an inclined surface having a smaller cross-sectional area toward the bottom so as to effectively reflect the light emitted from the optical device 20 to be mounted to the front to greatly increase the luminous efficiency of the light. desirable.

The mounting space 14 may be formed using various methods such as etching or drilling.

In addition, the wall surface forming the mounting space 14 may be formed as a mirror surface having excellent light reflection efficiency to configure a reflecting mirror.

The optical device 20 is mounted in the mounting space 14 of the metal substrate 10.

The optical device 20 is preferably mounted at the center of the mounting space 14 of the metal substrate 10 because the light emitting efficiency of light can be maintained uniformly.

As the optical device 20, a light receiving device, a light emitting device, or the like may be used, and an LED (LED) or the like may be used as the light emitting device.

The molding layer 30 fills the inside of the mounting space 14 of the metal substrate 10.

The molding layer 30 functions to protect and support the optical device 20 mounted in the mounting space 14 of the metal substrate 10.

As the molding material forming the molding layer 30, a transparent polymer material may be used, and if necessary, a fluorescent material or a wavelength conversion material may be mixed with the polymer material and used to emit light of the optical device 20. In addition, it is possible to implement new effects.

Although not shown in the figure, it is also possible to achieve the lens effect by adjusting the thickness of the molding layer 30. For example, when the molding layer 30 is formed such that the central portion in which the optical device 20 of the mounting space 14 is located is thicker and thinner toward the edge, the effect of the convex lens can be obtained. When the molding layer 30 is formed to be thin and become thicker toward the edge, the effect of the concave lens can be obtained.

The connection wiring 44 is formed on the upper surface of the metal substrate 10 at a position close to the edge of the mounting space 14.

The connection wiring 44 may be formed using a method such as vapor deposition, plating, or silk screen printing.

In the case of forming the connection line 44 by the deposition method, it is also possible to form a pattern at the same time as the deposition using a shadow mask (shadow mask).

An insulating layer 42 is formed of an insulating material between the connection wiring 44 and the metal substrate 10 to insulate.

The insulating layer 42 may be formed to a thin thickness of 1 μm or less, and may be formed using a method such as vapor deposition or spray coating.

Silicon nitride, silicon oxide, or the like may be used as an insulating material for forming the insulating layer 42.

The connection wiring 44 is connected to the electrode 22 of the optical device 20 mounted in the mounting space 14 through the bonding wire 46.

In the case where the electrode 22 is formed only on the upper surface of the optical device 20, as shown in FIG. 1, both electrodes 22 are formed on the upper surface of the metal substrate 10 through the bonding wires 46. It is connected to the connection wiring (44).

The optical device 20 is provided with an electrode 22 made of a conductive metal such as copper (Cu) or gold (Au).

The electrode 22 of the optical device 20 may be formed only on the upper surface, and one electrode 22 may be formed on the lower surface of the other electrode 23 on the upper surface. If necessary, the electrodes 22 may be formed only on the lower surface thereof.

In the second embodiment of the optical device package module according to the present invention, as shown in FIG. 2, the electrodes 22 are formed on the upper and lower surfaces of the optical device 20, and the electrodes 22 on the upper surface are One of the connection wires 44 formed on the upper surface of the metal substrate 10 through the bonding wires 46, and the electrode 23 on the lower surface extends to the bottom surface of the optical device 20. Connect to the connection wiring (45).

Since the other connection wiring 45 is formed of a conductive metal, the reflection efficiency is excellent. Therefore, it is also possible to form the entire wall surface of the mounting space 14 to effectively implement the function of the reflector reflecting the light emitted from the optical element (20).

It is preferable to form the insulating layer 42 wide enough to insulate between the other connecting wiring 45 and one connecting wiring 44 and the metal substrate 10. In the above, the insulating layer 42 formed on the bottom surface of the optical device 20 may be removed to improve heat dissipation efficiency.

In the third embodiment of the optical device package module according to the present invention, as shown in FIG. 3, the heat sink 90 is installed such that the bottom surface of the metal substrate 10 and the optical device 20 are in contact with each other.

When the heat sink 90 is installed as described above, since heat generated in the optical device 20 is directly discharged through the heat sink 90, it is possible to maximize heat dissipation efficiency.

In addition, since there is only one contact between the optical device 30 and the heat sink 90, it is possible to minimize the contact temperature.

In the fourth embodiment of the optical device package module according to the present invention, as shown in FIG. 4, the metal oxide layer 50 is formed on the bottom surface of the metal substrate 10 and the optical device 20.

The metal oxide layer 50 may be formed by oxidizing the metal substrate 10 by anodization or the like.

For example, when aluminum is used as the metal substrate 10, the metal oxide layer 50 is formed by changing a part of the metal substrate 10 into an aluminum oxide layer through anodization.

The metal oxide layer 50 can be formed to a thickness of 10 to 100㎛ as needed.

As shown in FIG. 4 to implement the wall surface of the mounting space 14 of the metal substrate 10 as a reflector, the mounting space 14 may be selected from metals such as gold, silver, copper, platinum, palladium, and alloys thereof. It is also possible to form the reflective layer 48 by plating, vapor deposition, coating, or the like on the inner surface of the substrate.

In the case of the reflective layer 48, it is preferable that the reflective layer 48 is configured to be electrically shorted with the connection wiring 44 formed on the upper surface of the metal substrate 10.

When the reflective layer 48 is formed, an insulating layer 42 is formed between the reflective layer 48 and the metal substrate 10 to insulate the metal substrate 10.

In the above, it is advantageous to remove the insulating layer 42 located on the bottom side of the optical device 20 in terms of insulation resistance and contact temperature.

In the fifth embodiment of the optical device package module according to the present invention, as shown in FIG. 5, the solder layer 60 is formed on the bottom surface of the metal substrate 10 and the optical device 20.

The solder layer 60 is thinly formed by deposition or plating.

When the solder layer 60 is formed as described above, solder bonding is possible directly on the heat sink 90.

Since the solder layer 60 is also formed of a metal, the thermal resistance is low.

In the sixth embodiment of the optical device package module according to the present invention, the solder layer 60 is formed on the bottom surface of the metal oxide layer 50 in the fourth embodiment.

As described above, the techniques of the first to sixth embodiments may be selected and merged or replaced with each other.

Next, a manufacturing method for manufacturing the optical device package module according to the present invention configured as described above will be described.

First, an embodiment of a method of manufacturing an optical device package module according to the present invention may include preparing a metal substrate 10 (S10) and forming a metal oxide layer 50, as shown in FIGS. 8 and 9. (S20), forming the mounting space 14 (S30), forming the insulating layer 42 and the connection wiring 44 (S40), and mounting the optical device 20 (S50) ), And forming the molding layer 30 (S60).

In the preparing of the metal substrate 10 (S10), a plate-shaped metal substrate 10 made of a material having a very high thermal conductivity compared to that of a synthetic resin or a ceramic is prepared.

As the material for forming the metal substrate 10, aluminum, titanium, or the like may be used.

The metal substrate 10 may be formed in a plate shape with a thickness of 0.1 to 5 mm. Preferably, the metal substrate 10 may be formed in a thin plate shape with a thickness of 0.15 to 1.0 mm.

In the forming of the metal oxide layer 50 (S20), the metal oxide layer 50 is formed by oxidizing to a depth of 10 to 100 μm on one side of the metal substrate 10 as necessary.

The metal oxide layer 50 may be formed by oxidizing the metal substrate 10 by anodization or the like.

For example, when aluminum is used as the metal substrate 10, the metal oxide layer 50 is formed by changing a part of the metal substrate 10 into an aluminum oxide layer through anodization.

In the forming of the mounting space 14 (S30), a part of the metal substrate 10 is removed from the opposite side of the metal oxide layer 50 to the metal oxide layer 50 to remove the mounting space 14 having a reflector. Form.

The mounting space 14 is formed to penetrate the metal substrate 10 up and down.

The mounting space 14 is formed by arranging one or a plurality of pieces on one metal substrate 10.

For example, when the optical devices 20 are mounted one by one on the metal substrate 10, the mounting spaces 14 are formed one by one, and the plurality of optical devices 20 are mounted on one metal substrate 10. In order to mount the plurality of mounting spaces 14 are formed by arranging in a set pattern.

The wall surface forming the mounting space 14 is formed as an inclined surface having a smaller cross-sectional area toward the bottom to effectively reflect the light emitted from the optical device 20 to be mounted to the front to greatly increase the luminous efficiency of the light.

The mounting space 14 is formed by removing a part of the metal substrate 10 using various methods such as etching or drilling.

Drilling in the above can be performed using a mechanical or laser drill.

In addition, the wall surface forming the mounting space 14 may be formed as a mirror surface (mirror surface) having excellent light reflection efficiency to configure a reflector.

In the above, the mirror surface may be embodied to be naturally formed by precisely etching or drilling.

In the forming of the insulating layer 42 and the connection wiring 44 (S40), the insulating layer 42 is formed on the upper surface of the metal substrate 10, and then the connection wiring 44 is formed on the insulating layer 42. To form.

The connection wiring 44 is formed at a position close to the edge of the mounting space 14 on the upper surface of the metal substrate 10.

The connection wiring 44 may be formed using a method such as vapor deposition, plating, or silk screen printing. In the case of forming the connection line 44 by the deposition method, it is also possible to form a pattern at the same time as the deposition using a shadow mask (shadow mask).

The insulating layer 42 is formed using an insulating material.

The insulating layer 42 may be formed to a thin thickness of 1 μm or less, and may be formed using a method such as vapor deposition or spray coating.

Silicon nitride, silicon oxide, or the like may be used as an insulating material for forming the insulating layer 42.

When forming the connection wiring 44, as shown in FIG. 4 to implement the wall surface of the mounting space 14 of the metal substrate 10 as a reflector, metals such as gold, silver, copper, platinum, palladium and the like It is also possible to form the reflective layer 48 by plating, depositing, coating, or the like on the inner surface of the mounting space 14 by selecting from the alloys of.

In the case of the reflective layer 48 is formed to be electrically shorted with the connection wiring 44 formed on the upper surface of the metal substrate 10. For example, the reflective layer 48 is formed such that the edge is positioned at a predetermined distance from the edge of the connection wiring 44.

In the mounting of the optical device 20 (S50), the optical device 20 is mounted in the mounting space 14 of the metal substrate 10 and then connected to the electrode 22 of the optical device 20. The wiring 44 is electrically connected.

The connection wire 44 and the electrode 22 of the optical device 20 mounted in the mounting space 14 are connected using a bonding wire 46.

In the case where the electrode 22 is formed only on the upper surface of the optical device 20, as shown in FIGS. 1 and 4, both electrodes 22 are connected to the upper surface of the metal substrate 10 through the bonding wires 46. It is connected to the connection wiring 44 formed on.

2 and 5, in the case where the electrode 22 is formed by separating the upper and lower surfaces of the optical device 20, the upper electrode 22 is connected to the metal substrate through the bonding wire 46. It is connected to one of the connection wirings 44 formed on the upper surface of the (10), the electrode 23 of the lower surface is connected to the other connection wiring 45 formed to extend to the bottom of the optical element (20).

In the forming of the molding layer 30 (S60), the molding layer 30 is filled to cover the mounting space 14 and to protect the optical device 20, the connection wiring 44, and the bonding wire 46. Form.

The molding layer 30 functions to protect and support the optical device 20 mounted in the mounting space 14 of the metal substrate 10.

As the molding material for forming the molding layer 30, a transparent polymer material may be used, and if necessary, a fluorescent material or a wavelength conversion material may be mixed with the polymer material to emit light of the optical device 20. In addition, it is possible to implement new effects.

And another embodiment of the optical device package module manufacturing method according to the present invention, as shown in Figure 9 and 10, the step of removing the metal oxide layer 50 in the above-described embodiment (S70) and the solder layer Forming (60) (S80), and mounting on the heat sink (90) (S90) is further included.

In the step of removing the metal oxide layer 50 (S70), the metal oxide layer 50 formed on the bottom surface of the metal substrate 10 is removed so as not to damage the optical device 20.

Removal of the metal oxide layer 50 may be performed using a method such as chemical etching or mechanical polishing.

When the metal oxide layer 50 is removed, the insulating layer 42 located on the bottom surface of the optical device 20 may also be removed.

The metal oxide layer 50 may be used without being removed.

In addition, the metal oxide layer 50 may be formed in the form of a very thin film (removed while controlling the finely removed thickness).

In the forming of the solder layer 60 (S80), the metal oxide layer 50 is removed and then the solder layer 60 is formed.

The solder layer 60 is formed thin by depositing or plating a solder.

Since the solder layer 60 is also formed of a metal, the thermal resistance is low.

After the forming of the molding layer 30 proceeds (S60), the step of removing the metal oxide layer 50 (S70) is omitted, and immediately forming the solder layer 60 (S80) It is also possible to proceed.

When proceeding as described above, as shown in Figure 5, the solder layer 60 is formed on the bottom surface of the metal oxide layer 50.

In the step S90 of mounting on the heat sink 90, the solder layer 60 is mounted on the heat sink 90.

When the solder layer 60 is formed in the above, direct solder bonding to the heat sink 90 is possible.

In addition, it is possible to proceed to step S90 of forming the molding layer 30 or mounting of the heat sink 90 in step S70 of removing the metal oxide layer 50.

For example, after the forming of the molding layer 30 is performed (S60), the removing of the metal oxide layer 50 (S70) and the forming of the solder layer 60 (S80). Omitting, it is also possible to proceed directly to the step (S90) to be mounted on the heat sink (90).

In addition, after forming the molding layer 30 (S60) and removing the metal oxide layer 50 (S70), the step of forming the solder layer 60 is omitted (S80). In addition, it is also possible to proceed to step (S90) to be mounted on the heat sink 90 immediately.

In the case where the step (S80) of forming the solder layer 60 is omitted, the mounting is performed using a method such as solder bonding, bonding, or bolt for mounting on the heat sink 90.

When the heat sink 90 is installed as described above, since heat generated in the optical device 20 is directly discharged through the heat sink 90, it is possible to maximize heat dissipation efficiency.

In addition, since there is only one contact between the optical device 30 and the heat sink 90, it is possible to minimize the contact temperature.

In the above, a preferred embodiment of an optical device package module and a method of manufacturing the same according to the present invention have been described. However, the present invention is not limited thereto and is variously modified within the scope of the claims and the detailed description of the invention and the accompanying drawings. It is possible to do this and this also belongs to the scope of the present invention.

1 is a partially enlarged cross-sectional view showing a first embodiment of an optical device package module according to the present invention.

2 is a partially enlarged cross-sectional view showing a second embodiment of an optical device package module according to the present invention.

3 is a partially enlarged cross-sectional view showing a third embodiment of an optical device package module according to the present invention.

4 is a partially enlarged cross-sectional view illustrating a fourth embodiment of an optical device package module according to the present invention.

5 is a partially enlarged cross-sectional view illustrating a fifth embodiment of an optical device package module according to the present invention.

6 is a partially enlarged cross-sectional view illustrating a sixth embodiment of an optical device package module according to the present invention.

7 is a block diagram illustrating a first embodiment of a method of manufacturing an optical device package module according to the present invention.

8 is a process chart showing the first embodiment of the method of manufacturing an optical device package module according to the present invention.

9 is a block diagram illustrating a second embodiment of a method of manufacturing an optical device package module according to the present invention.

10 is a process diagram showing a second embodiment of a method for manufacturing an optical device package module according to the present invention.

Claims (18)

A metal substrate having a reflector and having one or more mounting spaces penetrating up and down; An optical element mounted in the mounting space of the metal substrate; And a molding layer filling the inside of the mounting space of the metal substrate and protecting the mounted optical device. The method according to claim 1, And a bonding wire formed on an upper surface of the metal substrate with an insulating layer interposed therebetween, and a bonding wire connecting the connection wire and an electrode of an optical device mounted in a mounting space. The method according to claim 2, And an electrode formed only on an upper surface of the optical device, and connecting both electrodes to a connection wiring formed on the upper surface of the metal substrate through bonding wires. The method according to claim 3, And a reflective layer is formed on the wall of the mounting space of the metal substrate using a metal, and an insulating layer is formed between the reflective layer and the metal substrate. The method according to claim 2, An electrode is formed on the upper and lower surfaces of the optical device, and the electrode on the upper surface is connected to one of the connection wires formed on the upper surface of the metal substrate through a bonding wire, and the electrode on the lower surface extends to the bottom of the optical device. Optical device package module connected to one connection wiring. The method according to claim 1, And a metal oxide layer disposed on the bottom surface of the metal substrate and the optical device. The method according to claim 6, And the metal oxide layer is formed to a thickness of 10 ~ 100㎛. The method according to claim 6, An optical device package module further comprises a solder layer located on the bottom surface of the metal oxide layer. The method according to claim 1, And a solder layer disposed on the bottom surface of the metal substrate and the optical device. The method according to any one of claims 1 to 9, And a heat dissipation plate disposed on a metal substrate opposite to the molding layer and a bottom surface of the optical device. Preparing a plate-shaped metal substrate; Oxidizing the metal substrate to a depth of 10 to 100 μm on one side to form a metal oxide layer; Removing a portion of the metal substrate from the opposite side of the metal oxide layer to the metal oxide layer to form a mounting space having a reflector; Forming an insulating layer on the upper surface of the metal substrate and forming a connection wiring; Mounting an optical device in a mounting space of the metal substrate and connecting an electrode and a connection wiring of the optical device; And forming a molding layer filling the mounting space and covering the optical device and the connection wiring. The method of claim 11, If the electrode is formed only on the upper surface of the optical device optical fiber package module manufacturing method for connecting both electrodes with the connection wiring formed on the upper surface of the metal substrate through the bonding wire. The method according to claim 12, And forming a reflective layer on a wall of the mounting space of the metal substrate when the connection wiring is formed. The method of claim 11, When the electrode is formed separately from the upper and lower surfaces of the optical device, the upper electrode is connected to one of the connection wires formed on the upper surface of the metal substrate through a bonding wire, and the lower electrode is extended to the bottom of the optical device. Optical device package module manufacturing method for connecting to the connection wiring. The method of claim 11, And forming the molding layer and then removing the metal oxide layer. The method according to claim 15, Removing the metal oxide layer and forming a solder layer on the bottom surface of the metal substrate and the optical device. The method of claim 11, And forming a solder layer on a bottom surface of the metal oxide layer after forming the molding layer. The method according to any one of claims 11 to 17, And mounting the metal substrate on which the optical device is mounted on a heat sink.

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