KR20100111075A - Intenna of cellular phone and manufacturing method thereof - Google Patents

Abstract

PURPOSE: An antenna of a cellular phone and manufacturing method thereof are provided to improve the contact between an insulating base and a contact terminal by injecting molding an antenna base. CONSTITUTION: An insulating base is installed inside a cellular phone while forming an antenna body. A connection unit(110) is formed with the base as one body and is protruded from one side of a base. The connection unit is elastically contacted with the connection element of a PCB panel inside the cellular phone. A pole(120) is formed with the base as one body and is protruded from the other side of the base. The pole has a head unit on end and is inserted into the hole of the PCB to be fixed.

Description

Cell phone intenna and its manufacturing method {INTENNA OF CELLULAR PHONE AND MANUFACTURING METHOD THEREOF}

The present invention relates to an intenna installed inside a mobile phone, and more particularly, to improve the connection of an intenna connected to a PCB panel and to add a fastening part to facilitate assembly, to improve the binding force, and to reduce the number of parts. And it relates to a mobile phone antenna and a method for manufacturing the same that can reduce the manufacturing cost and stabilize the transmission and reception of the mobile phone.

Miniaturization is being progressed due to the rapid technological expansion of electronic communication devices such as mobile phones and GPS. Not only are the multi-band antennas being developed with the development of surface mount technology, but they are also manufactured in various ways according to the purpose of use and operation principle.

The intena installed in a mobile phone is generally composed of a body formed of an insulator such as polycarbonate, and a conductive metal film coupled to the surface of the body by a circuit pattern capable of wireless transmission and reception in a specific frequency band.

Currently, the method of manufacturing the intenna is a SUS welding method of forming a desired pattern into a metal piece and then thermally fusion to the body, an etching method of plating the entire molding and leaving only the pattern and cutting the rest, a double injection method of plating on the molded body, and a laser. There is an LDS method for engraving the conductor circuit on the three-dimensional surface of the part, and a printing plating (PDS) method for directly printing plating on the molded body.

Among the above methods, the etching method, the double injection method, the LDS method, and the printing plating method must include an intena contact device manufactured in the middle to connect the molded antenna to the PCB panel, which will be described in more detail as follows.

FIG. 1 is a side view schematically showing a state where an antenna contact device is interposed between an antenna and a PCB panel. As can be seen in the figure, an antenna contact device 30 is interposed between the PCB panel 10 and the antenna body 20. The antenna contact device 30 is formed in a C shape to have an elastic force. The flat lower part is fixed to the PCB panel 10 with solder 40 and the bent part of the upper part is formed to elastically contact the inner body 20.

When connecting using an antenna or contact device as described above, it is necessary to secure a space for the antenna or contact device to be inserted and affects the installation of other components, and it is difficult to design the interior and interior of the mobile phone, and also to manufacture the antenna or contact device. The process and the process of assembling the contact or fixing the contact device by soldering is added, there is a problem that causes a decrease in productivity and a price increase.

Accordingly, an object of the present invention for solving the above problems is to provide a connection structure to the base itself and to form an intenna pattern by the printing plating (PDS) method to directly connect the interconnect and the PCB panel by coupling ease and connectivity It is to provide an intenna to improve.

In addition, another object of the present invention is to provide an intenna that directly connects the intenna and the PCB panel without intervening the intenna contact device, thereby reducing design convenience and manufacturing process.

In addition, another object of the present invention is to provide an intenna which can improve the contactability by increasing the transmittance by making the contact portion of the intena elastically connected to the PCB panel.

In addition, another object of the present invention is to provide an intenna which can improve the contact stability and durability of the intenna by filling the elastic material in the contact portion with the PCB panel.

Another object of the present invention is to provide a method for manufacturing a cellular phone intenna, which can shorten the design convenience and manufacturing process as described above and improve contactability and stability.

According to an aspect of the present invention,

An insulator base constituting the body of the intenna and installed inside the mobile phone;

A connection part formed integrally with the base and protruding from one side of the base to elastically contact the connection terminal of the PCB panel inside the mobile phone;

A pole pole formed integrally with the base and protruding at right angles to the other side of the base and having a head portion at an end thereof and inserted into a hole of a PCB panel; And

A printed circuit pattern printed on the surface of the base and connected to the connection to transmit and receive electromagnetic waves; Provides a mobile phone intenna containing.

The insulator base may be formed of a thermoplastic synthetic resin or thermosetting synthetic resin such as polycarbonate and polyester.

The connecting part is formed of a vertical part and a horizontal part, and a space part is formed therein, and the horizontal part preferably forms a curved part for stability of the connection.

In the space part, a rubber having a high dielectric constant may be inserted to improve elasticity and contact force. In this case, it is preferable to form projections for fixing the rubber in the space portion.

In addition, the space portion may be inserted into the leaf spring of the C-shaped cross-section along the longitudinal direction in order to improve the elastic force and conductivity. In this case, it is preferable to form projections for preventing the separation of the leaf spring above and below the space inlet.

In addition, the coil spring may be installed vertically in order to improve elasticity and conductivity. In this case, it is preferable to form projections for fixing the spring above and below the space.

On the other hand, the hole of the PCB panel when the pole is inserted can be further installed to be fixed to each other and fixed to the head portion.

And, in order to achieve the above another object, the present invention,

A base molding step of injecting a molding forming a base of the mobile phone intenna, wherein one side end of the base inner surface protrudes inwardly an L-shaped connection portion, and a pole pole protrudes vertically on the other side;

A printing step of printing the intena pattern formed by etching the printing plate by a laser method on the surface and the connection portion of the base which has undergone the above steps;

A drying step of drying the base subjected to the above step at a temperature of 60 to 200 ° C. for 30 to 120 minutes;

Ultrasonic degreasing for 2 to 3 minutes at 50-60 ℃ using ESCREE 40-80g / L and washing with water, then using 400-600g / L chromic anhydride and 150-200g / L sulfuric acid at 30-90 Degreasing step of etching for a second;

Neutralization step of washing the base with water and neutralizing for 30 to 90 seconds at 30 ~ 50 ℃ using hydrochloric acid 2 ~ 8%;

After washing the base with water, activate it for 2 ~ 3 minutes at room temperature using 1.5 ~ 2.5mg / L of palladium chloride, and then accelerate it for 30 ~ 120 minutes at room temperature using 80 ~ 120g / L of caustic soda. Activating step;

A plating step of plating the base surface;

Washing, dehydrating, and drying the base by washing and dehydrating the base; And

Filling step of inserting any one of rubber, C-shaped cross-section, coil spring into the space inside the connection portion; It provides a method for manufacturing a cell phone intenna comprising.

In the forming step, a head portion may be formed at the end of the pole, and a plurality of protrusions may be simultaneously formed to prevent the insertion of the insert inside the L-shaped connecting portion.

In the printing step, it is preferable to print the intena pattern formed by etching the printing plate by a laser method on the base surface and the connecting portion.

In the printing process of the connection unit, a jig may be used to prevent deformation or damage of the connection unit.

The plating step, after washing the base after the activation step with water to the electroless copper plating for 60 to 120 minutes using copper sulfate 2 ~ 5g / L, Hormarin 2 ~ 6g / L and sodium hydroxide 7 ~ 10g / L Electroless copper plating process;

Electrolytic copper plating process to wash the base after the process with water and electrolytic copper plating at room temperature for 2-8 minutes using copper sulfate 150 ~ 220g / L and lactic acid copper 30 ~ 60g / L; And

Electrolytic nickel plating to wash the base through the above process with water and electrolytic nickel plating at 45 ~ 55 ℃ using nickel sulfate 150 ~ 200g / L, nickel hydrochloride 40 ~ 60g / L, boric acid 40 ~ 60g / L at 45 ~ 55 ℃ process; It may include.

According to the cell phone antenna of the present invention and a method for manufacturing the same, the base of the intenna having a connection structure on the base itself is formed by injection molding, and the intenna pattern is formed by printing plating (PDS) method so that the intenna and the PCB panel are directly connected. By doing so, there is an effect of improving coupling ease and connectivity.

In addition, by directly connecting the antenna and the PCB panel without intervening the contactor device, the design convenience and manufacturing process can be shortened, thereby improving productivity and reducing the production cost, and also making the contact part of the antenna to be elastically connected to the PCB panel. It is effective to improve transmission and reception rate.

In addition, inserting an elastic material into the connection portion of the intenna in contact with the PCB panel has the effect of increasing the contact stability and durability of the intenna.

Hereinafter, a cell phone antenna according to an embodiment of the present invention will be described based on the accompanying drawings.

2 is a view showing a mobile phone antenna according to an embodiment of the present invention, Figure 2a is a front view showing the outer surface and Figure 2b is a front view showing the inner surface.

Referring to the drawings, the mobile phone antenna 1000 according to an embodiment of the present invention has a connection part 110 on one side and a pole 120 formed on the other side based on the insulator base 100 formed of a synthetic resin. It is. The insulator base 100 includes an antenna pattern 130 on which a transmission / reception circuit is printed. This will be described in more detail as follows.

First, the insulator base 100 is installed inside the mobile phone and forms a body of the intena 1000. The insulator base 100 is injection molded into a thermoplastic synthetic resin or a thermosetting synthetic resin such as polycarbonate and polyester. Therefore, it is not necessary to extrude and shape stainless steel as in the SUS method, so it is easy to manufacture and suitable for mass production.

On one side of the base 100 is formed a connection portion 110 is connected to the PCB panel 10 of the mobile phone, Figure 3 is a partial cross-sectional view for showing the structure of the connection portion of the antenna according to an embodiment of the present invention, Figure As can be seen from, the connecting portion 110 is formed to be integrally formed with the base 100.

The connection part 110 is formed to protrude from the edge of the inner surface of the base 100 so as to match the position of the connection terminal 11 of the PCB panel 10, and is formed to have a substantially inwardly L-shape installed inside the mobile phone. Elastic contact with the connection terminal 11 of the PCB panel 10. Therefore, the antenna 1000 directly contacts the PCB panel 10 without interposing the antenna contact device, thereby reducing design and processes of the antenna contact device.

The connection part 110 has an L-shape in which the vertical part 111 and the horizontal part 112 are connected to each other, and has elasticity when contacting the connection terminal 11 of the PCB panel 10. 114 is formed, and the horizontal portion 112 has its center portion bent outward to form a curved portion 113.

The curved portion 113 is a portion formed to stabilize the connection between the connection portion 110 and the elastic force when the contact portion 110 is in contact with the connection terminal 11 of the PCB panel 10.

4 is a view illustrating a state in which rubber is inserted into a connection part according to an embodiment of the present invention, and FIG. 5 is a view illustrating a state in which a leaf spring having a C-shaped cross section is inserted into the connection part according to an embodiment of the present invention. 6 shows a state in which a coil spring is installed in the connecting portion according to the embodiment of the present invention.

As shown in FIG. 4, the rubber portion 115 having a high dielectric constant may be inserted into the space portion 114 formed inside the connection portion 110 to improve the elastic force and the contact force. It is preferable to form the projection 115a for fixing the rubber 115.

In addition, as shown in Figure 5, the space portion 100 can be inserted into the leaf spring 116 of the C-shaped cross section along the longitudinal direction to improve the elastic force and conductivity of the connecting portion 110, in this case the space portion (100) It is preferable to form the projections (116a) for preventing the separation of the leaf spring 116 above and below the inlet.

In addition, as shown in FIG. 6, the spring 117 may be vertically installed in the space 100 to improve elasticity and conductivity. In this case, the spring 117 may be disposed above and below the space 100. It is preferable to form the projections 117a for fixing them.

7 illustrates a state in which an intenna is connected to a PCB panel according to an embodiment of the present invention, and FIG. 8 illustrates a coupling state of a pole pole and a fixture according to an embodiment of the present invention. The partially enlarged view in FIG. 7 shows the side shape.

Referring to the drawings, the pole pole 120 is formed on the inner surface of the base 100 to strengthen the connection between the antenna 1000 and the PCB panel 10. The pole 120 is formed to protrude vertically from the inner surface of the base 100, and is injection molded integrally with the base 100, like the connection portion 110.

The head portion 121 is provided at the end of the pole 120 so that the base 110 is inserted into the hole 11 having the same position among the holes basically provided in the PCB panel 10. Fix it to

Meanwhile, as shown in FIG. 8, the fastener 122 may be installed in the hole 11, and the fastener 122 is a member that is mutually engaged with the head portion 121 of the pole 120. ) And the PCB panel 10 can be strengthened.

Then, an inner pattern 130 for transmitting and receiving radio waves is printed on the outer surface of the base 100. The antenna pattern 130 is printed not only on the outer surface of the base 100 but also on the connection portion 110 to electrically connect radio waves to be received from the antenna 1000 or transmitted from the PCB panel 10.

As described above, in the present invention, the intenna pattern 130 is simply printed and plated on the insulator base 100 to form the intena 1000 and connected to the connection terminal 110 of the PCB panel 10 without a separate connection means. The manufacturing process is much simpler and easier than the conventional methods, such as the dual injection method and the LDS method.

Next, FIG. 9 is a flowchart illustrating a method of manufacturing a mobile phone intenna according to an embodiment of the present invention. A method of manufacturing a mobile phone intenna according to an embodiment of the present invention will be described with reference to FIG. 9. .

First, the base molding step (S100) is a step of injecting a molding forming the base 100 of the mobile phone antenna, one side end of the inner surface of the base 100 so that the L-shaped connecting portion 110 protrudes inward, and the base ( 100) the other side of the inner surface so that the pole 120 is projected vertically (S100).

At this time, it is preferable to form the head portion 121 at the end of the pole 120 so that there is no play when inserted into the hole 12 of the PCB panel 10, the space formed in the L-shaped connecting portion 110 When the rubber 115, the plate spring 116 of the C-shaped cross section, the coil spring 117, etc., are inserted into the portion 114 to increase the elastic force and the supporting force, the protrusions 115a, It is preferable to form 116a, 117a.

In addition, in this case, in the hole 112 of the PCB panel 10 into which the pole pole 120 of the base 100 is inserted, a fastener 122 for binding with the head portion 121 of the pole pole 120 to strengthen the fixing force is provided. It is better to install separately.

Next, the printing step (S200) is a step of printing plating a circuit pattern for transmitting and receiving radio waves to the base 100, and prints the surface and the connecting portion 110 of the molded base 100 using the ink. At this time, the base surface and the connecting portion are printed after etching the printed plate by a laser method to form a pattern.

In addition, the jig 118 is used to prevent the connection part 110 from being damaged or deformed in the printing process.

FIG. 10 is a cross-sectional view illustrating a state in which a jig is installed below the curved portion 113 of the connecting portion 110. As shown in the drawing, the jig 118 is inserted through a hole formed in the base 100, and thus the curved portion is inserted. (113) Deformation or breakage of the connecting portion 110 can be prevented by supporting the lower portion and supporting the plated portion with printing.

Next, in the drying step (S300), the base 100 after the printing step is dried for 30 to 120 minutes at a temperature of 60 ~ 200 ℃.

In the degreasing step (S400), the ultrasonic degreasing at 50 to 60 ° C. for 2 to 3 minutes using 20% to 50g / L of ESCREEN and washing with water, followed by 400 to 600g / L of chromic anhydride and 150 to 200g / L of sulfuric acid. Etch degreasing for 30 to 90 seconds at 70 ℃.

The base 100, which has undergone such a process, proceeds to a neutralization step (S500). In the neutralization step (S500), the base 100 is washed with water, and then hydrochloric acid is used at 30 to 50 ° C. at 30 to 50 ° C. Neutralize for 90 seconds.

In the next activation step (S600), after washing the base 100 through the above process with water and activated with palladium chloride 1.5 ~ 2.5mg / L for 2 to 3 minutes at room temperature, washed again with water and caustic soda Using 80 ~ 120g / L at 30 ° C for 30 minutes to accelerate the activation.

The base 100, which has undergone such a process, is completed by going through the other plating step (S700), followed by washing, dehydration and drying (S800).

11 is a flowchart showing a plating process according to an embodiment of the present invention.

The plating step S700 will be described in more detail with reference to FIG. 11. The plating step S700 includes an electroless copper plating process T100, an electrolytic copper plating process T200, and an electrolytic nickel plating process T300.

Electroless copper plating process (T100) is washed with water after the base step 100 through the activation step (S600) process using copper sulfate 2 ~ 5g / L, Hormarin 2 ~ 6g / L, sodium hydroxide 7 ~ 10g / L 60-120 minutes electroless copper plating process, the electrolytic copper plating process (T200) is the base 100 after the above process to wash with water and using copper sulfate 150 ~ 220g / L and lactic acid copper 30 ~ 60g / L 2 ~ Electrolytic copper plating process at room temperature for 8 minutes, electrolytic nickel plating process (T300) is washed with water to the base 100 through the above process, nickel sulfate 150 ~ 200g / L, nickel hydrochloride 40 ~ 60g / L and dispersion 40 ~ Electrolytic nickel plating is carried out for 4 to 8 minutes at 45 ~ 55 ℃ using 60g / L.

PCB panel (filling step (S900) through the filling step (S900) for inserting a metal, such as rubber, metal spring to increase the dielectric constant in the space portion 114 inside the connecting portion 110 to the base 100 through the drying step (S800) ( When it is connected to 10) and to help the elastic force and the buffer action is to complete the production of the finished product of the antenna (1000).

FIG. 1 is a side view schematically showing a state where an antenna contact device is interposed between a conventional antenna and a PCB panel inside a mobile phone.

FIG. 2 is a front view illustrating a cellular phone antenna according to an embodiment of the present invention, in which FIG. 2A shows an outer surface and FIG. 2B shows an inner surface.

Figure 3 is a partial cross-sectional view for showing the structure of the connection portion of the antenna according to an embodiment of the present invention.

Figure 4 is a partial cross-sectional view showing a state in which the rubber is inserted into the connection portion according to an embodiment of the present invention.

5 is a partial cross-sectional view showing a state in which the leaf spring of the C-type cross section is inserted into the connecting portion according to an embodiment of the present invention.

6 is a partial cross-sectional view showing a state in which the coil spring is installed in the connecting portion according to an embodiment of the present invention.

7 is a side view illustrating a state in which an intenna is connected to a PCB panel according to an embodiment of the present invention.

Figure 8 is a partial cross-sectional view showing a coupling state of the pole and the fixture according to an embodiment of the present invention.

9 is a flowchart illustrating a method for manufacturing a cellular phone intenna according to an embodiment of the present invention.

10 is a partial cross-sectional view illustrating a process of inserting and printing a jig into a connection part according to an embodiment of the present invention.

11 is a flowchart illustrating a plating process according to an embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

10: PCB panel 11: Connection terminal

12: Hole 20: Intenna body

30: antenna contact device 40: solder

100: base 110: connection

111: vertical part 112: horizontal part

113: curved portion 114: space portion

115: Rubber 116: plate spring of the C type cross section

117: coil spring 118: jig

115a, 116a, 117a: protrusion 120: pole

121: A head part 122: Fixing mouth

130: Intenna pattern 1000: Intenna

Claims (12)

An insulator base constituting the body of the intenna and installed inside the mobile phone; A connection part formed integrally with the base and protruding from one side of the base to elastically contact the connection terminal of the PCB panel inside the mobile phone; A pole pole formed integrally with the base and protruding at a right angle to the other side of the base and having a head portion at an end thereof, the pole pole being inserted into a hole of the PCB panel; And A printed circuit pattern printed on the surface of the base and connected to the connection to transmit and receive electromagnetic waves; Cell phone intenna containing. The method of claim 1, The insulator base is a mobile phone intenna, characterized in that formed from thermoplastic synthetic resin or thermosetting synthetic resin. The method of claim 1, The connecting portion comprises a vertical portion and a horizontal portion is formed inside the space portion, the horizontal portion is a mobile phone intenna, characterized in that to form a curved portion for the stability of the connection. The method of claim 3, Rubber is inserted into the space portion, the cell phone interior, characterized in that a projection for fixing the position of the rubber is formed in the space portion. The method of claim 3, The space portion is inserted into the leaf spring of the C-shaped cross section along the longitudinal direction, the mobile phone intenna, characterized in that the upper and lower projections formed to prevent the separation of the leaf spring. The method of claim 3, A coil spring is vertically installed in the space part, and a mobile phone intenna is formed in the upper and lower portions of the space part to fix a projection to fix the position of the spring. The method of claim 1, Mobile phone intenna, characterized in that the fasteners are installed in the hole of the PCB panel is fixed to each other is bound to the head when the pole is inserted. A base molding step of injecting a molding forming a base of the mobile phone intenna, wherein one side end of the base inner surface is formed to protrude inwardly with an L-shaped connection portion, and a pole is protruded vertically on the other side; A printing step of printing the intena pattern formed by etching the printing plate by a laser method on the surface and the connection portion of the base which has undergone the above steps; A drying step of drying the base subjected to the above step at a temperature of 60 to 200 ° C. for 30 to 120 minutes; Ultrasonic degreasing for 2 ~ 3 minutes at 50 ~ 60 ℃ using ESCREE 20 ~ 50g / L and washing with water, then using 400 ~ 600g / L chromic anhydride and 150 ~ 200g / L sulfuric acid at 30 ℃ ~ 90 ℃ Degreasing step of etching for a second; Neutralization step of washing the base with water and neutralizing for 30 to 90 seconds at 30 ~ 50 ℃ using hydrochloric acid 2 ~ 8%; After washing the base with water, activate it for 2 ~ 3 minutes at room temperature using 1.5 ~ 2.5g / L of palladium chloride, and then accelerate it for 30 ~ 120 minutes at room temperature using 80 ~ 120g / L of caustic soda after washing with water again. Activating step; A plating step of plating the surface of the base; Washing, dehydrating, and drying the base by washing and dehydrating the base; And Filling step of inserting any one of rubber, C-shaped cross-section, coil spring into the space inside the connection portion; Method of manufacturing a mobile phone intenna comprising. The method of claim 8, In the forming step, the head portion is formed at the end of the pole, and a plurality of projections for producing a cell phone, characterized in that at the same time to form a plurality of projections to prevent the departure of the insert inside the L-shaped connecting portion. The method of claim 8, wherein in the printing step, the base surface and the connecting portion are etched on the printing plate by a laser method to form a pattern and then print. The method of claim 8 or 10, The method of manufacturing a mobile phone intenna, characterized in that in the printing process of the connecting portion using a jig to prevent deformation or damage of the connecting portion. The method of claim 8, The plating step, After washing the base after the activation step with water electroless copper plating process for electroless copper plating 60 ~ 120 minutes using copper sulfate 2 ~ 5g / L, Hormarin 2 ~ 6g / L and sodium hydroxide 7 ~ 10g / L ; Electrolytic copper plating process to wash the base after the process with water and electrolytic copper plating at room temperature for 2-8 minutes using copper sulfate 150 ~ 220g / L and lactic acid copper 30 ~ 60g / L; And Electrolytic nickel plating to wash the base through the above process with water and electrolytic nickel plating at 45 ~ 55 ℃ using nickel sulfate 150 ~ 200g / L, nickel hydrochloride 40 ~ 60g / L and boric acid 40 ~ 60g / L at 45 ~ 55 ℃ process; Method for producing a cell phone intenna comprising a.

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