KR20100109827A - Plasma display panel and method for fabricating in thereof - Google Patents

Abstract

PURPOSE: A plasma display panel and a method for manufacturing the same are provided to improve the emitting characteristic of secondary-electrons by adding materials with the high emitting coefficient of secondary-electrons into a protective film, a partition wall, and a fluorescent layer. CONSTITUTION: A first dielectric layer(190) is formed on discharging electrodes. A first protective film is formed on the first dielectric layer. The first protective film includes magnesium oxide. A second protective film(195a) is formed on the first protective film. A second protective film(195b) includes either of diamond powder or carbon powder. A first substrate(170) successively includes a plurality of discharging electrodes, the first dielectric layer, the first protective film, and the second protective film. A partition wall is placed between the first substrate and a second substrate(110). The second substrate includes a plurality of address electrodes(120), a second dielectric layer(130), and a fluorescent layer.

Description

Plasma display panel and method for manufacturing the same

The present invention relates to an image display device, and more particularly, to a plasma display device.

With the advent of the multimedia era, display devices that can express more detailed, larger, and more natural colors are required. However, the current CRT (Cathode Ray Tube) has a limit to compose a large screen of 40 inches or more, and the LCD (Liquid Crystal Display), PDP (Plasma Display Panel), and projection TV (Television) are used for high definition video. It is rapidly developing for expansion.

The maximum feature of the display device such as the PDP can be manufactured in a thin thickness compared to the CRT which is self-luminous, and is easy to manufacture a large flat screen (60 to 80 inches), and clearly distinguished from the conventional CRT in terms of style and design. Becomes

The PDP has a lower plate having an address electrode, a top plate having a sustain electrode pair, and a discharge cell defined by a partition wall, and phosphors are coated on the discharge cell to display a screen.

Specifically, when discharge occurs in the discharge space between the upper plate and the lower plate, ultraviolet rays generated at this time are incident on the phosphor to generate visible light, and the screen is displayed by the visible light.

An object of the present invention is to provide a plasma display panel having a high brightness and high efficiency and a method of manufacturing the same, by increasing secondary electron emission characteristics to lower emission voltages.

A plasma display panel according to the present invention for achieving the above object, a plurality of discharge electrodes, a first dielectric layer formed on the discharge electrodes, and formed on the first dielectric layer and magnesium oxide (hereinafter referred to as "MgO" A first substrate including a first passivation layer having a) and a second passivation layer formed on the first passivation layer, the second passivation layer including any one of diamond powder and carbon powder; And a second substrate bonded to the first substrate with a partition therebetween, the second substrate including a plurality of address electrodes, a second dielectric layer, and a phosphor layer sequentially.

In addition, the method of manufacturing a plasma display panel according to the present invention includes the steps of sequentially forming a plurality of discharge electrodes and a first dielectric layer on a first substrate; Forming a first passivation film comprising magnesium oxide (hereinafter referred to as "MgO") on the first dielectric layer; Forming a second passivation layer including any one of diamond powder and carbon powder on the first passivation layer; Forming a plurality of address electrodes, a second dielectric layer and a phosphor layer on the second substrate; Forming a partition on the second dielectric layer; Bonding the first substrate and the second substrate to each other with the barrier rib therebetween; It is made, including.

The plasma display panel according to the present invention and a method for manufacturing the same are prepared by adding diamond powder or carbon powder, which is a material having a large secondary electron emission coefficient, to a protective film, a partition, and a phosphor layer, and a single crystal MgO powder to improve discharge delay characteristics. Secondary electron emission characteristics in the protective film, the phosphor layer and the partition wall exposed to the discharge space during the driving of the PDP are improved, thereby lowering the discharge voltage and improving the efficiency.

Other objects, features and advantages of the present invention will become apparent from the following detailed description of embodiments with reference to the accompanying drawings.

Hereinafter, preferred embodiments of the present invention, in which the above object can be specifically realized, are described with reference to the accompanying drawings.

In the accompanying drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity, and the thickness ratios of the layers in the drawings do not represent actual thickness ratios.

The plasma display panel according to the present invention is characterized in that the protective film has a two-layer structure. Hereinafter, a passivation layer formed on the first dielectric layer 190 of the front substrate 170 may be referred to as a first passivation layer 195a, and a passivation layer formed on the first passivation layer 195a and in contact with the discharge space may be a second passivation layer. This is called a protective film 195b.

1 is a view showing a discharge cell structure of a plasma display panel having a protective film containing a diamond powder according to the present invention.

As shown in FIG. 1, the plasma display panel of the present invention is formed of a scan electrode and sustain electrodes 180a and 180b made of indium tin oxide (ITO) in one direction on a front substrate 170 and a conventional metal material. Bus electrodes 180a 'and 180b' are formed.

The first dielectric layer 190 and the passivation layer are sequentially formed on the front substrate 170 while covering the scan electrode, the sustain electrode, and the bus electrode.

The front substrate 170 is formed through a process such as milling and cleaning the glass for the display substrate.

Here, the scan electrode 180a and the sustain electrode 180b may be formed by a photoetching method by sputtering ITO (Indium-Tin-Oxide) or SnO ₂ or a lift-off method by CVD. It is formed by such.

The bus electrodes 180a 'and 180b' include silver (Ag) and the like. In addition, a black matrix may be formed on the scan electrode and the sustain electrode, and may include a low melting glass and a black pigment.

The first dielectric layer 190 is formed on the front substrate 170 on which the scan electrode, the sustain electrode, and the bus electrode are formed. Here, the first dielectric layer 190 is made of transparent low melting glass, the specific composition will be described later.

In addition, a protective film made of magnesium oxide or the like is formed on the first dielectric layer 190 to protect the dielectric from the impact of (+) ions during discharge and to increase secondary electron emission. Hereinafter, the protective film will be described in detail.

The protective film according to the present embodiment includes a first protective film 195a including a magnesium oxide (MgO) thin film, and a second protective film 195b formed on the first protective film 195a and containing diamond powder. It is done by

In addition, when the dopant is added to the first passivation layer 195a, the jitter value of the address period is reduced, but when the content of the dopant is greater than a predetermined value, the jitter value may be increased.

Therefore, the dopant is preferably doped in a range where the jitter value is minimized, and it is preferable that the dopant is included in the ratio of 20 to 500 ppm in the first passivation layer 195a at an optimum content. And other materials may be used as dopants instead of silicon to reduce jitter.

In addition, the first passivation layer 195a is preferably formed to a thickness of 300 to 700 nanometers (nm). If the thickness of the first passivation layer 195a is 300 nanometers or less, there is a possibility of misdischarge, and if it is 700 nanometers or more, problems in manufacturing process and cost may occur.

In addition, a second passivation layer 195b is formed on the first passivation layer 195a, and the second passivation layer 195a is characterized by including diamond powder in a single crystal form. Here, 'size' means the diameter if the crystal shape is spherical, and the length of one side if the cube.

Currently, in the plasma display panel, secondary electrons emitted as the ionized discharge gas collides with the first passivation layer 195a greatly affect the sustain voltage and efficiency of the plasma display panel.

In this case, γ, which is the secondary electron emission coefficient value of the first passivation layer 195a, is mainly explained by Auger Neutralization, and secondary electrons are emitted only when the condition of Equation 1 below is satisfied.

γ = I _ion -2 (E _g + χ)

In this case, γ> 0, I _ion is the energy of the ionized discharge gas, E _g is the bandgap (bandgap), χ is the electron affinity.

According to Equation 1, γ represents a large value because E _g and χ values of the first passivation layer 195a are small. However, magnesium oxide (MgO) of the first passivation film 195a has a large value of E _g and χ.

Therefore, the magnesium oxide (MgO) of the first passivation film 195a does not show a large value of γ and acts as a limiting factor in increasing the efficiency of the plasma display panel.

Therefore, in the present invention, the second protective film 195b including the single crystal diamond powder having a? Value greater than the MgO is formed on the first protective film 195a.

The diamond powder has a smaller E _g and χ as compared to MgO of the first passivation layer 195a, and in some cases, χ has a negative value.

In this case, the diamond powder in the second passivation layer 195b has a size of 0.1 to 10 μm, and is formed to be 0.5 to 25% of the area of the first passivation layer 195a.

At this time, by hydrotreating the surface of the diamond powder to have a negative χ value to further increase γ, it is possible to increase the secondary electron emission coefficient to lower the discharge voltage and increase the efficiency.

That is, as shown in FIG. 2, the PDP having the second protective film 195b containing the diamond powder according to the present invention has a discharge voltage higher than that of the PDP having the second protective film 195b containing the diamond powder. It can be seen that the efficiency is increased by being low.

As described above, the second passivation layer 195b including the diamond powder may be formed only on a part of the surface of the first passivation layer 195a, not the entire surface. That is, the second passivation layer 195b may be formed in an irregular shape as shown, and may be formed with an area of 0.5 to 25% of the surface of the first passivation layer 195a.

That is, the second passivation layer 195b is consequently formed irregularly on the first passivation layer 195a to increase the surface area of the entire passivation layer, thereby increasing secondary electron emission.

Therefore, diamond powder is formed in a cluster form on a part of the first passivation film 195a so that the entire surface of the passivation film is not flat and has an uneven shape.

Therefore, the surface area where ultraviolet ions collide with the protective film during gas discharge of the plasma display panel increases, so that the emission amount of secondary electrons increases and the discharge start voltage can be lowered. As a result, the discharge efficiency is increased and the jitter is reduced. Let's do it.

On the other hand, an address electrode 120 is formed on one surface of the rear substrate 110 along a direction crossing the sustain electrode pair, and covers a white second on the front surface of the rear substrate 110 while covering the address electrode 120. Dielectric layer 130 is formed.

The second dielectric layer 130 is applied by a printing method or a film laminating method, and then completed through a firing process.

The barrier rib 140 is formed on the second dielectric layer 130 to be disposed between the address electrodes 120. In this case, the partition wall 140 may be stripe-type, well-type, or delta-type, and the partition wall 140 has a single crystal type diamond powder according to the present invention. May be contained.

In addition, phosphor layers 150a, 150b, and 150c of red (R), green (G), and blue (B) are formed between each partition wall 140. At this time, the phosphor layer 150a, 150b, 150c may contain a single crystal diamond powder according to the present invention.

On the other hand, the point where the address electrode 120 on the back substrate 110 and the pair of sustain electrodes on the front substrate 110 cross each other constitutes a discharge cell.

Here, the surface exposed to the current discharge space includes a protective film of the front substrate 170, the barrier rib 140, and the phosphor layers 150a, 150b, and 150c.

Therefore, the partition wall 140 and the phosphor layers 150a, 150b, and 150c may also contain the above-described single crystal diamond powder, as in the second passivation layer 195b of the front substrate 170.

In addition, the front substrate 170 and the rear substrate 110 are bonded to each other with the partition wall 140 interposed therebetween, and are bonded through a sealing material provided at an outer side of the substrate.

In addition, the front substrate 170 and the rear substrate 110 are connected to the driving device.

3 is a view showing a driving device and a connecting portion of the plasma display panel according to the present invention.

As shown in FIG. 3, the entire plasma display apparatus 210 according to the present invention includes a panel 220, a driving substrate 230 supplying a driving voltage to the panel 220, and the panel 220. A tape carrier package 240, which is a type of flexible substrate that connects the electrodes for each cell and the driving substrate 230, is formed.

As described above, the panel 220 includes the front substrate 170, the rear substrate 110, and the partition wall 140.

In addition, an electrical and physical connection between the panel 220 and the TCP 240 and an electrical and physical connection between the TCP 240 and the driving substrate 230 may include an anisotropic conductive film (hereinafter referred to as an ACF). use.

ACF is a conductive resin film made of nickel (Ni) balls coated with gold (Au).

4 is a view showing a substrate wiring structure of the tape carrier package according to the present invention.

As shown in FIG. 4, the TCP 240 is in charge of the connection between the panel 220 and the driving substrate 230, and the driving driver chip is mounted thereon.

The TCP 240 is connected to the wiring 243 on the flexible substrate 242 and the wiring 243 and receives power from the driving substrate 230 to provide a specific electrode of the panel 220. The driver chip 241 is formed.

Here, since the driving driver chip 241 has a structure in which a plurality of signals of high power are alternately outputted by receiving low voltage and driving control signals, the number of wirings connected to the driving substrate 230 is small and the panel ( The number of wires connected to the 220 side is large.

Therefore, the wiring of the driving driver chip 241 may be connected through the space on the driving substrate 230 side. The wiring 243 may not be divided by a boundary of the center of the driving driver chip 341.

5 is a view schematically showing another embodiment of a plasma display device according to the present invention.

In the present embodiment, the panel 220 is connected to the driving device through a flexible printed circuit (FPC) 250.

Here, the FPC 250 is a film having a pattern formed therein using polymide. In addition, in the present embodiment, the FPC 250 and the panel 220 are connected through the ACF. In addition, in this embodiment, the driving substrate 230 is a natural PCB circuit.

Here, the driving device includes a data driver, a scan driver, a sustain driver, and the like.

The data driver is connected to an address electrode to apply a data pulse. The scan driver is connected to the scan electrode to supply a rising ramp waveform, a ramping ramp waveform, a scan pulse, and a sustain pulse. The sustain driver also applies a sustain pulse and a DC voltage to the common sustain electrode.

The plasma display panel is driven by being divided into a reset period, an address period, and a sustain period.

In the reset period, a rising ramp waveform Ramp-up is simultaneously applied to the scan electrodes. In the address period, the negative scan pulse scan is sequentially applied to the scan electrodes, and at the same time, the positive data pulse is applied to the address electrodes in synchronization with the scan pulse. In the sustain period, a sustain pulse sus is alternately applied to the scan electrodes and the sustain electrodes.

Hereinafter, a manufacturing process of a plasma display panel according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings.

<First Embodiment>

6A to 6C are cross-sectional views of a first embodiment showing a process of manufacturing a front substrate of a plasma display panel according to the present invention.

According to the first embodiment of the present invention, the single crystal diamond powder in the second passivation film 195b is formed to increase the secondary electron emission coefficient, thereby lowering the discharge voltage and increasing the efficiency.

Hereinafter, a process of manufacturing the front substrate 170 of the plasma display panel according to the first embodiment of the present invention will be described in detail with reference to FIGS. 6A to 6C.

First, as illustrated in FIG. 6A, the scan electrode 180a, the sustain electrode 180b, and the bus electrodes 180a 'and 180b', which are discharge electrodes, are formed on the front substrate 170.

Here, the front substrate 170 is manufactured by milling and cleaning the glass or soda lime glass for the display substrate.

In addition, the scan electrode 180a and the sustain electrode 180b may be formed using photoetching by sputtering indium tin oxide (ITO).

In addition, the scan electrode 180a and the sustain electrode 180b may be formed of indium tin oxide (ITO) using an ion plating method, a vacuum deposition method, or the like.

In addition, the scan electrode 180a and the sustain electrode 180b may form SnO ₂ by a lift-off method by CVD.

When the indium tin oxide (ITO) is formed using the photoetching method, the ITO is deposited on the front substrate 170 when the scan electrode 180a and the sustain electrode 180b are formed, and the photo is deposited on the deposited ITO. The resist is applied and dried. Thereafter, the patterned photomask is placed on the photoresist and exposed to light. After the exposure process, the uncured portion is developed and then etched to form the scan electrode 180a and the sustain electrode 180b.

In addition, in the case of forming the scan electrode 180a and the sustain electrode 180b by using the lift-off method, the photoresist is coated on the front substrate 170, and then, the SnO ₂ is formed on the coated photoresist. The photomask on which the pattern is formed is placed and exposed by irradiation with light. After the exposure process, the uncured portion is developed. Thereafter, after the development process, SnO ₂ is deposited, and then the photoresist is removed to form the scan electrode 180a and the sustain electrode 180b.

In addition, a black matrix may be formed on the scan electrode 180a and the sustain electrode 180b, and may include a low melting glass and a black pigment.

The bus electrodes 180a 'and 180b' may be formed of silver (Ag) using a screen printing method or a photosensitive paste method.

In addition, the bus electrodes 180a 'and 180b' may be formed using a photoetching method by sputtering Cr / Cu / Cr or Cr / Al / Cr.

When the bus electrodes 180a 'and 180b' are formed by using the screen printing method, a conductive material paste such as silver (Ag) is printed on the front substrate 170 through a screen mask, and then dried and baked. Form.

In addition, when the bus electrodes 180a 'and 180b' are formed using the photosensitive paste method, photosensitive silver (Ag) is printed and coated on the front substrate 170 and dried. Subsequently, a photo mask having a predetermined pattern is placed on the coated silver and exposed to light. After the exposure process, the uncured portion is developed and then dried and baked again to form the bus electrodes 180a 'and 180b'.

In addition, when the bus electrodes 180a 'and 180b' are formed using the photoetching method, the Cr / Cu / Cr or Cr / Al / Cr is deposited on the front substrate 170, and the deposited Cr The photoresist is applied and dried on / Cu / Cr or Cr / Al / Cr. Thereafter, a photo mask having a predetermined pattern is placed on the photoresist and exposed to light. After the exposure process, the uncured portion is developed and then etched to form the bus electrodes 180a 'and 180b'.

The scan electrode 180a, the sustain electrode 180b, and the bus electrodes 180a 'and 180b' are discharge electrodes, and the plasma display panel according to the present invention does not use ITO material and the bus electrode 180a does not use an ITO material. Only 180b 'may form an ITO-less structure discharge electrode integrating the functions of the scan electrode 180a and the sustain electrode 180b.

Subsequently, as illustrated in FIG. 6B, a first dielectric layer 190 is formed on the front substrate 170 on which the scan electrode 180a, the sustain electrode 180b, and the bus electrodes 180a 'and 180b' are formed.

The first dielectric layer 190 may be formed by using a screen printing method, a coater method, and a method of laminating the green sheet.

The coater method may use any one of two methods, a roll or a slot.

A protective film according to the present invention is then formed on the first dielectric layer 190 as shown in FIG. 6C.

Here, the protective film according to the present invention includes a first protective film 195a and a second protective film 195b.

The first passivation layer 195a is formed on the first dielectric layer 190. And, a dopant such as silicon (Si) may be included. The first passivation layer 195a may be formed by chemical vapor deposition (CVD), electron beam (E-beam), ion-plating, sol-gel, sputtering, or the like.

At this time, when silicon is doped in the first passivation layer 195a, the jitter value of the address period is reduced. However, when the silicon content is larger than a predetermined value, the jitter value may be increased. Therefore, the silicon is preferably doped in a range where the jitter value is minimized, and it is preferable that the silicon is included in the protective film at an optimum content of 20 to 500 parts per million (ppm). And other materials may be used as dopants instead of silicon to reduce jitter.

The second passivation layer 195b is formed on the first passivation layer 195a as shown in the figure.

Here, the second passivation film 195b includes single crystal diamond powder. In this case, the diamond powder in the second passivation layer 195b has a size of 0.1 to 10 μm, and is formed to be 0.5 to 25% of the area of the first passivation layer 195a. Here, 'size' means the diameter if the crystal is in the shape of a sphere, and the length of one side if the shape of the cube. The single crystal refers to a solid in which all of the crystals are regularly formed along a constant crystal axis, and are distinguished from polycrystals, which are sets of small single crystals having different orientations.

In addition, the second passivation layer 195b may be formed on only one portion of the surface of the first passivation layer 195a, not the entire surface. That is, the second passivation layer 195b may be formed in an irregular shape as shown, and may be formed in an area of 0.5 to 25% of the surface of the first passivation layer 195a.

Hereinafter, a process of forming the second passivation layer 195b including the diamond powder will be described in detail.

First, as shown in Figure 6c, the diamond powder and the dispersant according to the present invention are mixed. Next, the mixed material is sprayed onto the first passivation layer 195a and then dried to form the second passivation layer 195b. In this case, a crosslinking material such as TiO may be further mixed with the mixed material in order to increase adhesion between the single crystal diamond powder and the first passivation layer 195a. In addition, the single crystal diamond powder may have 1 to 30% by weight, and the dispersant may be mixed at 70 to 99% by weight.

In addition, the dispersant may be acrylic, epoxy, urethane, acrylic urethane, alkyd, poly amid polymer, polycarboxylic acid or PCA. Use a mixture.

Second Embodiment

7A to 7F are flowcharts showing an embodiment of a method of manufacturing a back substrate of a plasma display panel according to the present invention.

First, as shown in FIG. 7A, the address electrode 120 is formed on the rear substrate 110. Here, the back substrate 110 forms a glass for display substrate or soda-lime glass through a process such as milling or cleaning.

The address electrode 120 may be formed of silver (Ag) using a screen printing method or a photosensitive paste method.

In addition, the address electrode 120 may be formed using a photoetching method by sputtering Cr / Cu / Cr or Cr / Al / Cr.

In this case, when the address electrode 120 is formed using the screen printing method, a conductive material paste such as silver (Ag) is printed on the rear substrate 110 through a screen mask, and then dried and baked. do.

In addition, when the address electrode 120 is formed using the photosensitive paste method, photosensitive silver (Ag) is printed and coated on the back substrate 110 and dried. Subsequently, a photo mask having a predetermined pattern is placed on the coated silver and exposed to light. After the exposure process, the uncured portion is developed and then dried and baked again to form the address electrode 120.

In addition, when the address electrode 120 is formed using the photoetching method, the Cr / Cu / Cr or Cr / Al / Cr is deposited on the rear substrate 110, and the deposited Cr / Cu / The photoresist is applied and dried on Cr or Cr / Al / Cr. Thereafter, a photo mask having a predetermined pattern is placed on the photoresist and exposed to light. After the exposure process, the uncured portion is developed and then etched to form the address electrode 120.

Referring to FIG. 7B, the second dielectric layer 130 is formed by using any one of a screen printing method, a coater method, and a green sheet method by laminating a low melting glass and a filler such as TiO ₂ . can do.

The coater method may use any one of two methods, a roll or a slot.

Subsequently, partition walls are formed to distinguish each discharge cell from those shown in Figs. 7C to 7E.

In this case, the partition material 140a according to the second embodiment of the present invention includes 50 to 80 wt% of the mother glass, 15 to 30 wt% of the filler, and 0.1 to 20 wt% of the single crystal diamond powder. .

In this case, the mother glass may include PbO, SiO ₂ , B ₂ O _3, and Al ₂ O ₃ , and the filler may include TiO ₂ and Al ₂ O ₃ .

After the vehicle (including a binder and / or solvent) is mixed with the partition material 140a as described above to make the partition wall production paste 140a according to the present invention, as shown in FIG. 8C, the partition wall production paste 140a ) Is applied on the second dielectric layer 130, and then dried for a predetermined time.

Thereafter, the coating and drying processes are repeatedly performed to form a constant thickness (for example, 150-200 μm), and the partition material 140a is patterned to form the partition wall 140 according to the second embodiment of the present invention. To form.

In this case, as shown in FIGS. 9D and 9E, the patterning process is performed by covering and exposing a mask 155 and then developing.

That is, when the mask 155 is positioned and exposed to a portion corresponding to the address electrode, only the portion irradiated with light remains after the development and baking process to form the partition wall 140.

Third Embodiment

As shown in FIG. 7F, phosphors 150a, 150b, and 150c are coated on the side of the partition wall 140 and a region of the second dielectric 130 that is in contact with the discharge space. Form.

That is, the phosphor layer 250 is coated with phosphors of R, G, and B in order according to each discharge cell, and is applied by screen printing or photosensitive paste.

In this case, the phosphors 150a, 150b, and 150c according to the present invention include 80 to 99.9 wt% of each of red, green and blue phosphors, and 0.1 to 20 wt% of single crystal diamond powder doped with Sc. .

In addition, the red (R), a fluorescent material (Y, Gd) BO ^3: Use the Eu3 ⁺ and a green (G) optical material is Zn ₂ SiO _4: using Mn2 ^+, and blue (B) fluorescent materials BaMgAl ₁₀ O ₁₇ : Eu 2 ⁺ is often used as the furnace.

Subsequently, the front substrate 170 completed by the process of FIG. 6 is bonded and sealed with the rear substrate 110 with the partition wall 140 interposed therebetween, and after the internal impurities and the like are exhausted, the partition wall ( When the discharge gas 160 of Xe + Ne or Xe + He or Xe + Ne + He is injected into and then sealed in the discharge cell in 140, the plasma display panel of FIG. 1 is completed.

Meanwhile, as shown in FIG. 8, as another embodiment of the present invention, the second passivation layer 195b may be formed including any one of diamond powder and carbon powder and single crystal MgO powder.

In addition, as another embodiment of the present invention, the barrier rib 140 and the phosphor layer 150 may be formed including any one of diamond powder and carbon powder.

FIG. 8 is a view showing another embodiment of the discharge cell structure of the plasma display panel including the second protective film including any one of diamond powder and carbon powder and a single crystal MgO powder according to the present invention.

As shown in FIG. 8, the protective film according to the present embodiment is formed on the first protective film 195a and the first protective film 195a including a magnesium oxide (MgO) thin film, and diamond powder and And a second protective film 195b including any one of the carbon powders 195d and the single crystal MgO powder 195c.

That is, in the present invention, the second protective film 195b including the single crystal diamond powder or the single crystal carbon powder 195d and the single crystal MgO powder 195c having a? Value greater than the MgO is formed on the first protective film 195a. To form.

9 is a view showing a second protective film including a single crystal diamond powder (195d) and MgO powder (195c) in accordance with the present invention.

The diamond powder and the carbon powder 195d have a smaller E _g and χ compared to MgO of the first passivation layer 195a, and sometimes have a negative value of χ.

At this time, the diamond powder 195d, the carbon powder 195d and the MgO powder 195c in the second passivation layer 195b have a size of 0.1 to 10 μm, and 0.5 to 25% of the area of the first passivation layer 195a. Is formed.

At this time, the surface of the diamond powder (195d) is hydrogenated to have a negative χ value to further increase γ, thereby increasing the secondary electron emission coefficient to lower the discharge voltage and increase the efficiency.

That is, as shown in FIG. 10, the PDP having the second protective film including the diamond powder 195d and the MgO powder 195c according to the present invention includes the diamond powder 195d and the MgO powder 195c. It can be seen that the efficiency is increased because the discharge voltage is lower than that of the PDP without the second passivation layer 195b.

In addition, as shown in FIG. 11, the PDP having the second protective film 195b including the diamond powder 195d and the MgO powder 195c according to the present invention is the diamond powder 195d and the MgO powder 195c. It can be seen that the discharge delay time is lower than that of the PDP having no second protective film 195b included therein.

As described above, the second passivation layer 195b including any one of the diamond powder and the carbon powder 195d and the MgO powder 195c may be formed only on a part of the surface of the first passivation layer 195a. . That is, the second passivation layer 195b may be formed in an irregular shape as shown, and may be formed with an area of 0.5 to 25% of the surface of the first passivation layer 195a.

That is, the second passivation layer 195b is consequently formed irregularly on the first passivation layer 195a to increase the surface area of the entire passivation layer, thereby increasing secondary electron emission.

Accordingly, either one of the diamond powder and the carbon powder 195d and the MgO powder 195c are formed in a cluster form on a portion of the first passivation film 195a so that the entire surface of the passivation film is not flat and has an uneven shape. .

Therefore, the surface area where ultraviolet ions collide with the protective film during gas discharge of the plasma display panel increases, so that the emission amount of secondary electrons increases and the discharge start voltage can be lowered. As a result, the discharge efficiency is increased and the jitter is reduced. Let's do it.

Hereinafter, a manufacturing process of a plasma display panel according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings.

<Fourth Embodiment>

12A to 12C are flowcharts of another embodiment of a method of manufacturing a front substrate of a plasma display panel including a second protective film including one of diamond powder and carbon powder and a single crystal MgO powder according to the present invention.

The fourth embodiment of the present invention forms a secondary electron emission coefficient by forming any one of the single crystal diamond powder and carbon powder 195d in the second protective film 195b and the single crystal MgO powder 195c. It is possible to increase the efficiency by lowering the discharge voltage and improving discharge delay characteristics.

Hereinafter, a process of manufacturing the front substrate 170 of the plasma display panel according to the first embodiment of the present invention will be described in detail with reference to FIGS. 12A to 12C.

First, as illustrated in FIG. 12A, scan electrodes 180a, sustain electrodes 180b, and bus electrodes 180a 'and 180b', which are discharge electrodes, are formed on the front substrate 170.

Subsequently, as illustrated in FIG. 12B, a first dielectric layer 190 is formed on the front substrate 170 on which the scan electrode 180a, the sustain electrode 180b, and the bus electrodes 180a 'and 180b' are formed.

Next, as shown in FIG. 12C, a protective film according to the fourth embodiment of the present invention is formed on the first dielectric layer 190.

Here, the protective film according to the present invention includes a first protective film 195a and a second protective film 195b.

The first passivation layer 195a is formed on the first dielectric layer 190. And, a dopant such as silicon (Si) may be included. The first passivation layer 195a may be formed by chemical vapor deposition (CVD), electron beam (E-beam), ion-plating, sol-gel, sputtering, or the like.

At this time, when silicon is doped in the first passivation layer 195a, the jitter value of the address period is reduced. However, when the silicon content is larger than a predetermined value, the jitter value may be increased. Therefore, the silicon is preferably doped in a range where the jitter value is minimized, and it is preferable that the silicon is included in the protective film at an optimum content of 20 to 500 parts per million (ppm). And other materials may be used as dopants instead of silicon to reduce jitter.

The second passivation layer 195b is formed on the first passivation layer 195a as shown in the figure.

Here, according to the present invention, the second protective film 195b includes any one of the single crystal diamond powder and the carbon powder 195d and the single crystal MgO powder 195c. In this case, the diamond powder, the carbon powder and the MgO powder 195c in the second protective film 195b have a size of 0.1 to 10 μm, and are formed to be 0.5 to 25% of the area of the first protective film 195a.

In addition, the second passivation layer 195b may be formed on only one portion of the surface of the first passivation layer 195a, not the entire surface. That is, the second passivation layer 195b may be formed in an irregular shape as shown, and may be formed in an area of 0.5 to 25% of the surface of the first passivation layer 195a.

Hereinafter, a process of forming the second passivation layer 195b including any one of the diamond powder and the carbon powder 195d and the single crystal MgO powder 195c will be described in detail.

First, as shown in FIG. 12C, any one of the diamond powder and the carbon powder 195d according to the present invention is mixed with the single crystal MgO powder 195c and the dispersant.

Next, the mixed material is sprayed onto the first passivation layer 195a and then dried to form the second passivation layer 195b. In this case, one of the diamond powder and the carbon powder 195d and the MgO powder 195c may further be mixed with a crosslinking material such as TiO to the mixed material to increase the adhesion to the first protective film 195a.

In this case, the dispersant may be acrylic, epoxy, urethane, acrylic urethane, alkyd, poly amid polymer, polycarboxylic acid or PCA. Use a mixture.

<Fifth Embodiment>

13A to 13F are flowcharts of another embodiment of a method of manufacturing a back substrate of a plasma display panel having a partition and a phosphor layer including any one of diamond powder and carbon powder according to the present invention.

First, as shown in FIGS. 13A and 13B, the address electrode 120 and the white second dielectric layer 130 are sequentially formed on the rear substrate 110.

Subsequently, partition walls are formed to distinguish each discharge cell from those shown in Figs. 13C to 13E.

In this case, the partition material 140a according to the fifth embodiment of the present invention may be formed of 50 to 80% by weight of mother glass, 15 to 30% by weight of filler, and 0.1 to 20% by weight of single crystal diamond powder 195d or It consists of single crystal carbon powder 195d.

In this case, the mother glass may include PbO, SiO ₂ , B ₂ O _3, and Al ₂ O ₃ , and the filler may include TiO ₂ and Al ₂ O ₃ .

After the vehicle (including a binder and / or solvent) is mixed with the partition material 140a as described above to form the partition wall production paste 140a according to the present invention, as shown in FIG. 13C, the partition wall production paste 140a ) Is applied on the second dielectric layer 130, and then dried for a predetermined time.

Thereafter, the coating and drying processes are repeatedly performed to form a constant thickness (for example, 150-200 μm), and the partition material 140a is patterned to form the partition wall 140 according to the fifth embodiment of the present invention. To form.

In this case, as shown in FIGS. 13D and 13E, the patterning process is performed by covering and exposing a mask 155 and then developing.

That is, when the mask 155 is positioned and exposed to a portion corresponding to the address electrode, only the portion irradiated with light remains after the development and baking process to form the partition wall 140.

Sixth Example

As shown in FIG. 13F, phosphors 150a, 150b, and 150c are coated on the side of the partition wall 140 and the region of the second dielectric 130 in contact with the discharge space. Form.

That is, the phosphor layer 250 is coated with phosphors of R, G, and B in order according to each discharge cell, and is applied by screen printing or photosensitive paste.

At this time, the phosphors 150a, 150b, and 150c according to the present invention are 80 to 99.9% by weight of each of red, green and blue phosphors, and 0.1 to 20% by weight of single crystal diamond powder (195d) or single crystal carbon powder. 195d.

Further, as the red (R) fluorescent material (Y, Gd) BO ^3: Use the Eu3 ⁺ and a green (G) fluorescent material, Zn ₂ SiO _4: to use Mn2 ^+, and blue (B) fluorescent materials is BaMgAl ₁₀ O _17: use a lot of Eu2 ^+.

Next, the front substrate 170 completed by the process of FIG. 12 is bonded and sealed with the rear substrate 110 with the partition wall 140 interposed therebetween, after exhausting internal impurities and the like, the partition wall ( Injecting and then discharging the discharge gas 160 of Xe + Ne or Xe + He or Xe + Ne + He into the discharge cell in 140, the plasma display panel of the present invention as shown in FIG. 8 is completed.

Hereinafter, the sealing process of the front substrate 170 and the back substrate 110 completed in FIGS. 1 and 8 will be described in detail.

The sealing process is usually performed by screen printing, dispensing, or the like.

The screen printing method is a method of printing a sealing material having a desired shape by holding a patterned screen at a predetermined interval, placing the patterned screen on a substrate, and pressing and transferring a paste necessary for forming the sealing material. The screen printing method has advantages of simple production equipment and high use efficiency of materials.

The dispensing method is a method of forming a sealing material by directly discharging a thick film paste onto a substrate using air pressure using CAD wiring data used for screen mask fabrication. The dispensing method has the advantage of reducing the manufacturing cost of the mask and having a large degree of freedom in the shape of the thick film.

FIG. 14A illustrates a process of bonding the front substrate and the rear substrate of the plasma display panel.

FIG. 14B is a cross-sectional view taken along the line AA ′ of FIG. 14A.

As shown, the sealing material 600 is applied to the front substrate 170 or the rear substrate 110. Specifically, the substrate is printed or dispensed at the same time with a predetermined interval at the outermost side of the substrate and applied.

Next, the sealing material 600 is fired. In the firing process, the organic material included in the sealing material 600 is removed, and the front substrate 170 and the rear substrate 110 are bonded.

In this firing process, the width of the sealing material 600 may be widened and the height may be low.

In the present embodiment, the sealing material 600 is printed or coated, but may be formed in the form of a sealing tape and adhered to the front substrate 170 or the rear substrate 110. And the characteristic of a protective film etc. is improved at predetermined temperature through an aging process.

In addition, a front filter may be formed on the front substrate 170.

The front filter is provided with an electromagnetic shielding film for shielding electromagnetic radiation emitted from the panel to the outside. The electromagnetic shielding film may be patterned in a specific form in order to shield electromagnetic waves while ensuring the visible light transmittance required by the display device.

In addition, a near infrared shielding film, a color correction film, an antireflection film, and the like may be formed on the front filter.

It will be apparent to those skilled in the art that the present invention can be embodied in other specific forms without departing from the spirit and essential features of the present invention. For example, it will be very easy for those skilled in the art to use the above-described embodiments in combination with each other.

Accordingly, the above detailed description should not be construed as limiting in all aspects and should be considered as illustrative.

The scope of the invention should be determined by reasonable interpretation of the appended claims, and all changes within the equivalent scope of the invention are included in the scope of the invention.

1 is a diagram illustrating a discharge cell structure of a plasma display panel including a second protective film including diamond powder according to the present invention.

2 is a view comparing the efficiency of the PDP to which the diamond powder is applied and the PDP not doped with the diamond powder according to the present invention.

3 is a view showing a driving device and a connecting portion of the plasma display panel according to the present invention.

4 is a view showing a substrate wiring structure of a typical tape carrier package.

5 is a view schematically showing another embodiment of a plasma display device according to the present invention.

6A to 6C are flowcharts illustrating an embodiment of a method of manufacturing a front substrate of a plasma display panel including a second protective film including diamond powder according to the present invention.

7A to 7F are flowcharts illustrating an embodiment of a method of manufacturing a back substrate of a plasma display panel including a partition wall and a phosphor layer including diamond powder according to the present invention.

FIG. 8 is a view showing another embodiment of the discharge cell structure of the plasma display panel including the second protective film including any one of diamond powder and carbon powder and a single crystal MgO powder according to the present invention.

9 is a view showing a second protective film containing a single crystal diamond powder and MgO powder in accordance with the present invention.

10 is a view comparing the efficiency of the PDP to which the diamond powder and MgO powder is applied and the PDP not doped with the diamond powder and MgO powder according to the present invention.

11 is a view comparing discharge rate change rate of the PDP to which the diamond powder and the MgO powder are applied and the PDP not doped with the diamond powder and the MgO powder according to the present invention.

12A to 12C are flowcharts of another embodiment of a method of manufacturing a front substrate of a plasma display panel including a second protective film including any one of diamond powder and carbon powder and a single crystal MgO powder according to the present invention.

13A to 13F are flowcharts of another embodiment of a method of manufacturing a back substrate of a plasma display panel having a partition and a phosphor layer including any one of diamond powder and carbon powder according to the present invention.

FIG. 14A illustrates a process of bonding the front substrate and the rear substrate of the plasma display panel.

FIG. 14B is a cross-sectional view taken along the line AA ′ of FIG. 14A.

Claims (13)

A plurality of discharge electrodes, a first dielectric layer formed on the discharge electrodes, a first passivation layer formed on the first dielectric layer and including magnesium oxide (hereinafter referred to as "MgO"), and on the first passivation layer A first substrate formed thereon and sequentially having a second passivation layer including any one of diamond powder and carbon powder; And And a second substrate bonded to the first substrate with a partition therebetween, the second substrate sequentially comprising a plurality of address electrodes, a second dielectric layer, and a phosphor layer. According to claim 1, The diamond powder is plasma display panel, characterized in that the surface is hydrogenated to have a negative electron affinity. According to claim 1, The second protective film, the plasma display panel, characterized in that the monocrystalline MgO powder is further included. The method of claim 3, Any one of the diamond powder and carbon powder, MgO powder is 1: 100 to 1: 1, characterized in that the plasma display panel is mixed. According to claim 1, The barrier rib panel includes any one of the diamond powder and the carbon powder. According to claim 1, The phosphor display panel, characterized in that any one of the diamond powder and carbon powder is included. Sequentially forming a plurality of discharge electrodes and a first dielectric layer on the first substrate; Forming a first passivation layer including magnesium oxide (hereinafter referred to as "MgO") on the first dielectric layer; Forming a second protective film including any one of diamond powder and carbon powder on the first protective film; Forming a plurality of address electrodes, a second dielectric layer and a phosphor layer on the second substrate; Forming a partition on the second dielectric layer; And And bonding the first substrate and the second substrate to each other with the partition wall therebetween. 8. The method of claim 7, The second protective film forming step, the method of manufacturing a plasma display panel characterized in that it further comprises a single crystal MgO powder. The method of claim 8, wherein the forming of the second passivation layer, Mixing the MgO powder with any one of the diamond powder and the carbon powder in a dispersant; And Spraying and drying the mixed material on the first protective film by a spray method. 8. The method of claim 7, The partition wall forming method may include forming any one of diamond powder and carbon powder. The method of claim 10, wherein the forming of the partition wall, Generating a paste in which any one of diamond powder and carbon powder and a partition material and MgO powder are mixed; Applying the paste onto a second dielectric layer; And Patterning the applied paste; and a method of manufacturing a plasma display panel. 8. The method of claim 7, The forming of the phosphor layer, the plasma display panel manufacturing method characterized in that it comprises any one of diamond powder and carbon powder. The method of claim 12, wherein the forming of the phosphor layer, Generating a paste in which any one of the diamond powder and the carbon powder and the phosphor material and the MgO powder are mixed; And And applying the paste between the sidewalls of the partition and the second dielectric layer.

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