KR20090099831A - Plasma display panel and method for fabricating in thereof - Google Patents

Abstract

PURPOSE: A plasma display panel and a manufacturing method thereof are provided to reduce a manufacturing cost by including a near infrared ray shielding function inside a front panel. CONSTITUTION: A plasma display panel includes a first substrate(170) and a second substrate(110). A first substrate includes at least one electrode, a first dielectric layer(190), and a protective layer(195). The first dielectric layer is formed in the rear surface of the electrode. A LaB(Lanthanum Boride)6 nano particle is added to the first dielectric layer for shielding the near infrared ray. The protective layer is formed in the rear surface of the first dielectric layer. The second substrate is bonded with the first substrate while interposing a barrier rib(140). A second substrate includes at least one address electrode(120), a second dielectric layer(130), and a fluorescent layer. The second dielectric layer and the fluorescent layer are formed on the address electrode.

Description

Plasma display panel and method for manufacturing the same

The present invention relates to an image display device, and more particularly, to a plasma display panel.

With the advent of the multimedia era, display devices that can express more detailed, larger, and more natural colors are required.

However, the current CRT (Cathode Ray Tube) has a limit to compose a large screen of 40 inches or more, and the LCD (Liquid Crystal Display), PDP (Plasma Display Panel), and projection TV (Television) are used for high definition video. It is rapidly developing for expansion.

The maximum characteristics of the display device such as the PDP can be manufactured in a thin thickness compared to the CRT, which is self-luminous, and is easy to manufacture a large flat screen (60 to 80 inches) and clearly distinguished from the conventional CRT in terms of style and design. Becomes

The PDP has a lower plate having an address electrode, a top plate having a sustain electrode pair, and a discharge cell defined as a partition wall, and a phosphor is coated in the discharge cell to display a screen.

Specifically, when discharge occurs in the discharge space between the upper plate and the lower plate, ultraviolet rays generated at this time are incident on the phosphor to generate visible light, and the screen is displayed by the visible light.

However, since the above-described PDP and the like generate near-infrared rays during the driving process, the front filter is provided in front of the panel on which the image is displayed to block the infrared rays.

The above-described front filter shields electromagnetic waves (EMI, abbreviated as 'EMI') and near infrared rays (hereinafter, abbreviated as 'NIR'), color correction, and reflection of light incident from the outside. Serves to prevent this.

As described above, the NIR blocking front filter includes a NIR absorbing dye, and the NIR absorbing dye blocks near infrared rays emitted from the PDP panel.

An object of the present invention is to provide a plasma display panel having a near-infrared shielding function in a front panel on which scan and sustain electrodes are formed and a method of manufacturing the same.

A plasma display panel according to a first embodiment of the present invention for achieving the above object is, at least one electrode, a first formed on the back of the electrode and added LaB (Lanthanum Boride) ₆ nanoparticles for near-infrared shielding A first substrate having a dielectric layer and a protective film formed on a rear surface of the first dielectric layer; And a second substrate bonded to the first substrate with a partition therebetween and having at least one address electrode, a second dielectric layer and a phosphor layer formed on the address electrode.

At this time, the LaB ₆ Nanoparticles may be added in an amount of 0.001 to 1.0% by weight to the first dielectric layer.

In addition, in the method of manufacturing a plasma display panel according to the first embodiment of the present invention, preparing a dielectric layer material comprising a mixture of parent glass and LaB (Lanthanum Boride) ₆ nanoparticles and a vehicle for shielding near infrared rays. Wow; Applying the prepared dielectric layer material to a substrate on which scan and sustain electrodes are formed; Firing the substrate to which the dielectric layer material is applied.

In addition, the plasma display panel according to the second exemplary embodiment of the present invention may include a thin film formed on the front surface of the glass and including LaB (Lanthanum Boride) ₆ nanoparticles for shielding near infrared rays, and at least one formed on the rear surface of the glass. A first substrate having an electrode, a first dielectric layer formed on the back side of the electrode, and a protective film formed on the back side of the first dielectric layer; And a second substrate bonded to the first substrate with a partition therebetween and having at least one address electrode, a second dielectric layer and a phosphor layer formed on the address electrode.

In this case, the thin film may be formed on the glass of the first substrate to a thickness of 1 to 20㎛.

In addition, the LaB ₆ Nanoparticles may have a 10 to 20% by weight relative to the total amount of the thin film.

In addition, the manufacturing method of the plasma display panel according to the second embodiment of the present invention, forming a thin film containing LaB (Lanthanum Boride) ₆ nanoparticles for near-infrared shielding on the glass front of the first substrate; Sequentially forming a protective film including a transparent electrode, an upper dielectric layer, and magnesium oxide (MgO) on a glass rear surface of the first substrate; And bonding the second substrate on which the address electrode is formed and the first substrate.

At this time, the thin film forming step is 10 to 20% by weight of LaB ₆ Nanoparticles and 80 to 90% by weight of the vehicle (Vehicle) may be mixed and the mixed material may be formed by applying the entire surface of the glass of the first substrate.

In addition, the thin film forming step is 10 to 20% by weight of LaB ₆ Nanoparticles and 80 to 90% by weight of the dispersant may be mixed, and the mixed material may be formed by spraying on the entire glass surface of the first substrate.

In addition, the plasma display panel according to the third exemplary embodiment of the present invention may include a thin film formed on the rear surface of the glass and including LaB (Lanthanum Boride) ₆ nanoparticles for shielding near infrared rays, and at least one formed on the rear surface of the thin film. A first substrate having an electrode, a first dielectric layer formed on the back side of the electrode, and a protective film formed on the back side of the first dielectric layer; And a second substrate bonded to the first substrate with a partition therebetween and having at least one address electrode, a second dielectric layer and a phosphor layer formed on the address electrode.

In addition, the manufacturing method of the plasma display panel according to the third embodiment of the present invention includes forming a thin film including LaB (Lanthanum Boride) ₆ nanoparticles for near-infrared shielding on the glass back surface of the first substrate; Sequentially forming a protective film including a transparent electrode, an upper dielectric, and magnesium oxide (MgO) on a rear surface of the thin film; And bonding the second substrate on which the address electrode is formed and the first substrate.

In addition, the plasma display panel according to the fourth embodiment of the present invention may include at least one electrode formed on the rear surface of the glass, a first dielectric layer formed on the rear surface of the electrode, and a rear surface of the first dielectric layer. A first substrate having a thin film including LaB (Lanthanum Boride) ₆ nanoparticles for shielding near infrared rays, and a protective film formed on a rear surface of the thin film; And a second substrate bonded to the first substrate with a partition therebetween and having at least one address electrode, a second dielectric layer and a phosphor layer formed on the address electrode.

In addition, a method of manufacturing a plasma display panel according to a fourth embodiment of the present invention includes the steps of sequentially forming a transparent electrode and an upper dielectric layer on the glass back surface of the first substrate; Forming a thin film including LaB (Lanthanum Boride) ₆ nanoparticles for near-infrared shielding on a back surface of the upper dielectric layer; Forming a protective film including magnesium oxide (MgO) on a rear surface of the thin film; And bonding the second substrate on which the address electrode is formed and the first substrate.

The plasma display panel and the method of manufacturing the same according to the present invention have a near infrared shielding function inside the front panel of the plasma display panel, so that the front filter does not have to have a near infrared shielding layer, thereby reducing the manufacturing cost. .

Other objects, features and advantages of the present invention will become apparent from the following detailed description of embodiments with reference to the accompanying drawings.

Hereinafter, preferred embodiments of the present invention, in which the above object can be specifically realized, are described with reference to the accompanying drawings.

In the accompanying drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity.

On the other hand, when a part such as a layer, film, region, plate, etc. is formed or positioned on another part, it is formed directly on the other part and not only in direct contact but also when another part exists in the middle thereof. It should also be understood to include.

Hereinafter, a plasma display panel and a method of manufacturing the same according to the present invention will be described in detail with reference to the accompanying drawings.

<First Embodiment>

1 is a diagram of a first embodiment showing a discharge cell structure of a plasma display panel according to the present invention.

As shown in FIG. 1, the plasma display panel of the present invention is formed of a scan electrode and sustain electrodes 180a and 180b made of indium tin oxide (ITO) in one direction on a rear surface of the front substrate 170 and a conventional metal material. Bus electrodes 180a 'and 180b' are formed. The back top dielectric layer 190 and the passivation layer 195 of the front substrate 170 are sequentially formed to cover the scan electrodes, the sustain electrodes 180a and 180b, and the bus electrodes 180a 'and 180b'. .

The front substrate 170 is formed through processing such as milling and cleaning of the glass for display substrate.

In this case, the scan electrode 180a and the sustain electrode 180b may be indium-tin-oxide (ITO), SnO ₂ , or the like by a photoetching method by sputtering or a lift-off by CVD. ) And the like.

The bus electrodes 180a 'and 180b' include silver (Ag) and the like. In addition, a black matrix may be formed on the scan electrode and the sustain electrode, and may include a low melting glass and a black pigment.

The top dielectric layer 190 is formed on the rear surface of the front substrate 170 on which the scan electrode, the sustain electrode, and the bus electrode are formed. Here, in the upper dielectric layer 190, LaB (Lanthanum) to replace the near-infrared shielding function of the front filter (not shown in FIG. 1, but formed on the front surface of the front substrate 170) according to the first embodiment of the present invention. Boride (hereinafter abbreviated as 'LaB') ₆ nanoparticles 191 is added.

Currently, a lot of dyes such as anthraquinone, dithiol-metal comples, cyanine, phthalocyanine, and diimmonium are used for near-infrared shielding. It is used.

However, such conventional near-infrared absorbing dyes are organic dyes, and characteristic deterioration occurs at a temperature of 120 ° C. or higher.

That is, when the above-described near-infrared absorbing dye is added to the front substrate 170 to provide the near-infrared shielding function inside the PDP, the high-temperature firing process (approximately 560 to 580 ° C.), which is a manufacturing process of the PDP, causes a high temperature. As a result, deterioration of properties occurs, which leads to problems that cannot be used.

In contrast, LaB ₆ according to the invention Nanoparticles 191 can not only withstand the temperature of the calcination process of the PDP, but also the LaB ₆ Since the absorption wavelength band of the nanoparticle 191 is present in the near infrared band, it is used as the near-infrared shielding material according to the present invention.

In other words, the conductive nanoparticles exhibit light absorption due to surface plasmon excitation, LaB ₆ The nanoparticle 191 has a light absorption wavelength band due to surface plasmon excitation in the near infrared band, and thus LaB ₆ The nanoparticles 191 may be used to shield the near infrared rays of the PDP.

LaB ₆ of the present invention as described above When the nanoparticles 191 are added to the upper dielectric layer 190 in less than 0.001% by weight, the near-infrared shielding function according to the present invention is not performed well. Problems that may affect the system may occur.

Thus, LaB ₆ according to the invention Nanoparticles 191 is preferably added in 0.001 to 1.0% by weight inside the top dielectric layer 190.

Hereinafter, a description of the manufacturing process of the top dielectric layer 190 according to the first embodiment of the present invention will be described in detail below.

In addition, a protective film 195 is formed on the back surface of the upper dielectric layer 190 to protect the dielectric from the impact of (+) ions during discharge and to increase secondary electron emission.

The passivation layer 195 may be formed using an electron beam deposition method, a sputtering method, an ion plating method, a screen printing method, or the like.

Meanwhile, an address electrode 120 is formed on one surface of the rear substrate 110 along a direction crossing the scan electrodes and the sustain electrodes 180a and 180b, and covers the address electrode 120 to cover the rear substrate 110. A white bottom dielectric layer 130 is formed on the front surface of the substrate.

The lower dielectric layer 130 is applied by a printing method or a film laminating method, and then completed through a firing process.

The partition wall 140 is formed on the lower dielectric layer 130 to be disposed between the address electrodes 120. In this case, the partition wall 140 may be stripe-type, well-type, or delta-type.

In addition, phosphor layers 150a, 150b, and 150c of red (R), green (G), and blue (B) are formed between each partition wall 140. The points where the address electrode 120 on the rear substrate 110 and the pair of sustain electrodes on the front substrate 110 cross each other constitute a part of the discharge cell.

In addition, the front substrate 170 and the rear substrate 110 are bonded to each other with the partition wall 140 interposed therebetween, and are bonded through a sealing material provided at an outer side of the substrate.

In addition, the front substrate 170 and the rear substrate 110 are connected to the driving device.

2 is a view showing a driving device and a connection portion of a plasma display panel according to the present invention.

As shown in FIG. 2, the entire plasma display device 210 according to the present invention includes a panel 220, a driving substrate 230 supplying a driving voltage to the panel 220, and the panel 220. A tape carrier package 240, which is a type of flexible substrate that connects the electrodes for each cell and the driving substrate 230, is formed. As described above, the panel 220 includes the front substrate 170, the rear substrate 110, and the partition wall 140.

In addition, an electrical and physical connection between the panel 220 and the TCP 240 and an electrical and physical connection between the TCP 240 and the driving substrate 230 may include an anisotropic conductive film (hereinafter referred to as an ACF). use. ACF is a conductive resin film made of nickel (Ni) balls coated with gold (Au).

3 is a view showing a substrate wiring structure of a typical tape carrier package.

As shown in FIG. 3, the TCP 240 is in charge of the connection between the panel 220 and the driving substrate 230, and the driving driver chip is mounted thereon.

The TCP 240 is connected to the wiring 243 on the flexible substrate 242 and the wiring 243 and receives power from the driving substrate 230 to provide a specific electrode of the panel 220. The driver chip 241 is formed.

Here, since the driving driver chip 241 has a structure in which a small number of voltages and driving control signals are applied and alternately outputs a large number of high power signals, the number of wirings connected to the driving substrate 230 is small. The number of wires connected to the panel 220 side is large.

Accordingly, since the wirings of the driving driver chip 241 may be connected by utilizing the space on the driving substrate 230 side, the wiring 243 may not be separated by a boundary of the center of the driving driver chip 341. It may be.

4 is a view schematically showing another embodiment of a plasma display device according to the present invention.

In the present embodiment, the panel 220 is connected to the driving device through a flexible printed circuit (FPC) 250. Here, the FPC 250 is a film having a pattern formed therein using polymide. In addition, in the present embodiment, the FPC 250 and the panel 220 are connected through the ACF. In addition, in this embodiment, the driving substrate 230 is a natural PCB circuit.

Here, the driving device includes a data driver, a scan driver, a sustain driver, and the like. Here, the data driver is connected to the address electrode to apply a data pulse. The scan driver is connected to the scan electrode to supply a rising ramp waveform, a ramping ramp waveform, a scan pulse, and a sustain pulse. The sustain driver also applies a sustain pulse and a DC voltage to the common sustain electrode.

The plasma display panel is driven by being divided into a reset period, an address period, and a sustain period. In the reset period, the rising ramp waveform Ramp-up is simultaneously applied to the scan electrodes. In the address period, the negative scan pulse scan is sequentially applied to the scan electrodes, and at the same time, the positive data pulse is applied to the address electrodes in synchronization with the scan pulse. In the sustain period, a sustain pulse sus is alternately applied to the scan electrodes and the sustain electrodes.

Hereinafter, a method of manufacturing a plasma display panel according to the present invention will be described in detail with reference to FIGS. 5 and 6.

5A to 5C are flowcharts of a first embodiment showing a method of manufacturing a front substrate of a plasma display panel according to the present invention.

A method of manufacturing a front substrate of a plasma display panel according to the present invention will be described with reference to FIGS. 5A to 5C.

First, as illustrated in FIG. 5A, the scan electrode 180a, the sustain electrode 180b, and the bus electrodes 180a 'and 180b' are formed on the front substrate 170.

Here, the front substrate 170 is manufactured by milling and cleaning the glass or soda lime glass for the display substrate.

In addition, the scan electrode 180a and the sustain electrode 180b may be formed by photoetching by sputtering ITO, ion plating, vacuum deposition, or the like. SnO ₂ can be formed by a lift-off method by CVD.

When the indium tin oxide (ITO) is formed using the photoetching method, the scan electrode 180a and the sustain electrode 180b are formed by depositing ITO on the front substrate 170 and photoresist on the deposited ITO. Apply and dry. Thereafter, a photo mask having a predetermined pattern is placed on the photoresist and exposed to light. After the exposure process, the uncured portion is developed and then etched to form the scan electrode 180a and the sustain electrode 180b.

In addition, in the case of forming the scan electrode 180a and the sustain electrode 180b by using the lift-off method, the photoresist is coated on the front substrate 170, and then, the SnO ₂ is formed on the coated photoresist. The photomask on which the pattern is formed is placed and exposed by irradiation with light. After the exposure process, the uncured portion is developed. Thereafter, after the development process, SnO ₂ is deposited, and then the photoresist is removed to form the scan electrode 180a and the sustain electrode 180b.

In addition, a black matrix may be formed on the scan electrode 180a and the sustain electrode 180b, and may include a low melting glass and a black pigment.

The bus electrodes 180a 'and 180b' may be formed of silver (Ag) using a screen printing method, a photosensitive paste method, or the like, or by using a photoetching method by sputtering Cr / Cu / Cr or Cr / Al / Cr. Can be formed.

When the bus electrode bus electrodes 180a 'and 180b' are formed using the screen printing method, a conductive material paste such as silver (Ag) is printed on the front substrate 170 through a screen mask, and then dried and dried. It forms by baking.

In addition, when the bus electrodes 180a 'and 180b' are formed by using the photosensitive paste method, photosensitive silver (Ag) is printed and coated on the front substrate 170 and dried. Subsequently, a photo mask having a predetermined pattern is placed on the coated silver and exposed to light. After the exposure process, the uncured portion is developed and then dried and baked again to form the bus electrodes 180a 'and 180b'.

When the bus electrodes 180a 'and 180b' are formed using the photoetching method, the Cr / Cu / Cr or Cr / Al / Cr is deposited on the front substrate 170, and the deposited Cr / Cu The photoresist is applied and dried on / Cr or Cr / Al / Cr. Thereafter, a photo mask having a predetermined pattern is placed on the photoresist and exposed to light. After the exposure process, the uncured portion is developed and then etched to form the bus electrodes 180a 'and 180b'.

Subsequently, as illustrated in FIG. 5B, the LaB ₆ nanoparticles 191 are 0.001 to 1.0 wt% according to the first embodiment of the present invention on the front substrate 170 on which the transparent electrode 180a and the bus electrode 180b are formed. Top dielectric layer 190 added in% is formed.

Hereinafter, a manufacturing process of the top dielectric layer 190 according to the present invention will be described in detail.

The top dielectric layer 190 according to the present invention is formed including a lead-free mother glass material, LaB ₆ nanoparticles 191 and a vehicle.

The lead-free mother glass material includes PbO, ZnO, B ₂ O ₃ , and SiO ₂ .

The PbO is a substance that is harmful to environmental pollution and may not be added to the lead-free mother glass material. That is, when the PbO is not added, the lead-free base glass may be manufactured using B, ZnO, B ₂ O ₃ , and SiO ₂ as main compositions.

Further, since the above-mentioned B is an expensive material, it is also possible to manufacture the non-linked matrix to the glass and ZnO, B ₂ O ₃ and, SiO ₂ as the main composition.

The ZnO suppresses the thermal expansion of the glass and lowers the melting point, the B ₂ O ₃ improves the glass forming ability, and the SiO ₂ is an additive for preventing crystallization of the glass forming component and the dielectric composition.

In addition, the lead-free mother glass according to the present invention can be further added to K ₂ O to lower the firing temperature of the top dielectric layer 190, and serves to reduce the vitrification temperature by increasing the non-crosslinking oxygen as a mesh formula Na ₂ O or Li ₂ O may be further added, and Al ₂ O ₃ may be further added to prevent crystallization of the upper dielectric layer 190.

In addition, in the lead-free mother glass according to the present invention, TiO ₂ , MgO, SrO, CaO, or P ₂ O ₅ may be further added to finely adjust the vitrification temperature and the coefficient of thermal expansion, and the upper dielectric layer 190 ) CoO, Cr ₂ O ₃ , MnO, FeO, NiO transition element oxides and CoO, Cr ₂ O ₃ , MnO, FeO, NiO transition element oxides and CeO ₂ , Er ₂ O ₃ , Nd ₂ O ₃ , Pr ₂ O ₃ Rare earth element oxides may be further added.

The material of the lead-free base glass as described above is melted in a crucible, the glass of the composition of the molten upper dielectric layer 190 is cooled to form a thin plate shape, and the formed plate shape is pulverized to obtain a glass powder.

The glass powder obtained as described above, the LaB ₆ nanoparticles 191 and the vehicle according to the present invention are mixed to form a paste, and the paste is coated on the front substrate 170 by the conventional printing method on the front substrate 170. To form.

The vehicle may be composed of a conventional binder such as ethyl cellulose and the like, and a common solvent such as α-terpineol and BCA.

As described above, the top dielectric layer 190 according to the first embodiment of the present invention is 70 to 80% by weight of the glass powder, 20 to 30% by weight of the vehicle and 0.001 to 1.0% by weight of LaB ₆ nanoparticles (191) ) Is formed by mixing.

Meanwhile, a top dielectric layer 190 may be formed on the front substrate 170 by manufacturing a dry film based on the paste and laminating it.

When the top dielectric layer 190 is formed, the top dielectric layer 190 according to the first embodiment of the present invention is completed by undergoing a baking process at 540 to 580 ° C.

Subsequently, a protective film 195 is deposited on the top dielectric 190 as shown in FIG. 5C. The protective film 195 may be made of magnesium oxide or the like, and may include silicon or the like as a dopant. The protective film 195 may be formed by chemical vapor deposition (CVD), electron beam (E-beam), ion-plating, sol-gel, sputtering, or the like.

Hereinafter, the near-infrared shielding ability of the top dielectric layer 190 according to the amount of LaB ₆ nanoparticles 191 added according to the present invention will be described in detail with reference to FIG. 6.

FIG. 6 is a graph showing transmission spectra of the top dielectric layers to which LaB ₆ nanoparticles are added according to the present invention. FIG.

As shown in FIG. 6, the first curve A is a transmission spectrum of a conventional top dielectric layer to which LaB ₆ nanoparticles 191 according to the present invention is not added, and the second curve B is LaB ₆ nano. The transmission spectrum of the top dielectric layer 190 according to the first embodiment of the present invention to which the particle 191 is added at 0.01% by weight, and the third curve C is 0.02% by weight of the LaB ₆ nanoparticles 191. The transmission spectrum of the top dielectric layer 190 according to the first embodiment of the present invention is added, and the fourth curve D is a first embodiment of the present invention in which LaB ₆ nanoparticles 191 is added at 0.03% by weight. Is the transmission spectrum of the top dielectric layer 190 according to FIG.

Currently, the band of visible light is in the 300 to 750 nm band, and the near infrared band is in the 750 to 1000 nm band.

As shown in FIG. 6, in the first curve A, which is a transmission spectrum of the conventional upper dielectric layer, near infrared absorption does not occur in the near infrared band of 750 to 1000 nm.

However, it can be seen that the near infrared absorption occurs in the second to fourth curves B, C, and D of the upper dielectric layer 190 according to the present invention in the near infrared band of 750 to 1000 nm.

7A to 7F are flowcharts of a first embodiment showing a method of manufacturing a back substrate of a plasma display panel according to the present invention.

First, as shown in FIG. 7A, the address electrode 120 is formed on the rear substrate 110. Here, the back substrate 110 forms a glass for display substrate or soda-lime glass through a process such as milling or cleaning.

The address electrode 120 may be formed of silver (Ag) using a screen printing method, a photosensitive paste method, or the like, or Cr / Cu / Cr or Cr / Al / Cr using a photoetching method by sputtering. .

That is, when the address electrode 120 is formed by using the screen printing method, a conductive material paste such as silver (Ag) is printed on the rear substrate 110 through a screen mask, and then dried and baked. do.

In addition, when the address electrode 120 is formed using the photosensitive paste method, photosensitive silver (Ag) is printed and coated on the back substrate 110 and dried. Subsequently, a photo mask having a predetermined pattern is placed on the coated silver and exposed to light. After the exposure process, the uncured portion is developed and then dried and baked again to form the address electrode 120.

In addition, when the address electrode 120 is formed using the photoetching method, the Cr / Cu / Cr or Cr / Al / Cr is deposited on the rear substrate 110, and the deposited Cr / Cu / The photoresist is applied and dried on Cr or Cr / Al / Cr. Thereafter, a photo mask having a predetermined pattern is placed on the photoresist and exposed to light. After the exposure process, the uncured portion is developed and then etched to form the address electrode 120.

As shown in FIG. 7B, a white lower dielectric layer 130 is formed on the back substrate 110 on which the address electrode 120 is formed.

Subsequently, partition walls are formed to distinguish each discharge cell from those shown in Figs. 7C to 7E.

In this case, the material 140a of the partition includes a mother glass and a filler.

After the vehicle (including binder and / or solvent) is mixed with the partition material 140a as described above to make the partition fabrication paste according to the present invention, the partition wall paste is applied onto the lower plate dielectric layer 130, and then Dry for a period of time.

Thereafter, the coating and drying processes are repeatedly performed to make a constant thickness (eg, 150-200 μm). Next, the partition material 140a is patterned to form the partition wall 140.

In this case, the patterning process is performed by covering and exposing the mask 155. That is, when the mask 155 is positioned and exposed to a portion corresponding to the address electrode, only the portion irradiated with light remains after the development and baking process to form the partition 140.

Subsequently, as illustrated in FIG. 7F, phosphors 150a, 150b, and 150c are applied to a surface of the lower dielectric layer 130 in contact with the discharge space and a side surface of the partition wall 140 to form the phosphor layer 150. ). That is, in the phosphor layer 250, phosphors of R, G, and B are sequentially applied according to respective discharge cells, and are applied by screen printing or photosensitive paste.

At this time, as the red (R) fluorescent material (Y, Gd) BO ^3: Use the Eu3 ⁺ and a green (G) fluorescent material, Zn ₂ SiO _4: to use Mn2 ^+, and blue (B) fluorescent materials is BaMgAl ₁₀ O _17: use a lot of Eu2 ^+.

Subsequently, the front substrate 170 completed by the process of FIG. 5 is bonded and sealed with the rear substrate 110 with the partition wall 140 interposed therebetween, after exhausting internal impurities and the like, the partition wall ( Injecting and then discharging the discharge gas 160 of Xe + Ne or Xe + He or Xe + Ne + He into the discharge cell in 140, the plasma display panel according to the first embodiment of the present invention as shown in FIG. do.

Hereinafter, the sealing process of the front substrate 170 and the back substrate 110 will be described in detail.

The sealing process is usually performed by screen printing, dispensing, or the like.

The screen printing method is a method of printing a sealing material having a desired shape by holding a patterned screen at a predetermined interval, placing the patterned screen on a substrate, and pressing and transferring a paste necessary for forming the sealing material. The screen printing method has advantages of simple production equipment and high use efficiency of materials.

The dispensing method is a method of forming a sealing material by directly discharging a thick film paste onto a substrate using air pressure using CAD wiring data used for screen mask fabrication. The dispensing method has the advantage of reducing the manufacturing cost of the mask and having a large degree of freedom in the shape of the thick film.

8A is a view illustrating a process of bonding the front substrate and the back substrate of the plasma display panel.

FIG. 8B is a cross-sectional view taken along the line AA ′ of FIG. 7A.

As shown, the sealing material 600 is applied to the front substrate 170 or the rear substrate 110. Specifically, the substrate is printed or dispensed at the same time with a predetermined interval at the outermost side of the substrate and applied.

Next, the sealing material 600 is fired. In the firing process, the organic material included in the sealing material 600 is removed, and the front substrate 170 and the rear substrate 110 are bonded.

In this firing process, the width of the sealing material 600 may be widened and the height may be low. In the present embodiment, the sealing material 600 is printed or coated, but may be formed in the form of a sealing tape and adhered to the front substrate 170 or the rear substrate 110. And the characteristic of a protective film etc. is improved at predetermined temperature through an aging process.

The LaB ₆ nanoparticles 191 according to the first embodiment of the present invention described above may be formed in the front substrate 170 in one thin film form as well as included in the top plate dielectric layer 190. .

In the following second to fourth embodiments, a process of forming a thin film including LaB ₆ nanoparticles will be described in detail.

Second Embodiment

9 is a cross-sectional view illustrating a front substrate of a plasma display panel including a thin film including LaB ₆ nanoparticles according to the present invention.

As shown in FIG. 9, in the second embodiment of the present invention, LaB ₆ nanoparticles 191 described in the first embodiment are formed on the front surface of the front substrate 170 in the form of a thin film 200.

When the thin film 200 including the LaB ₆ nanoparticles 191 is formed to be less than 1 μm on the front surface of the front substrate 170, the near infrared absorption ability of the LaB ₆ nanoparticles 191 falls, and exceeds 20 μm. If the thickness is formed in one thickness, the size of the PDP front substrate 170 is increased, so that the efficiency is lowered.

In this case, the thin film 200 may be formed by screen printing, laminating, or spraying.

First, when the thin film 200 is formed by screen printing, 10 to 20 wt% of LaB ₆ Nanoparticles 191 and 80 to 90% by weight of the vehicle (Vehicle) is mixed to prepare a paste. At this time, the vehicle may use the vehicle in the above-described first embodiment.

The paste prepared as described above is applied to the entire surface of the front substrate 170 completed in the first embodiment, dried and baked to complete the thin film 200 according to the second embodiment of the present invention.

In addition, when the thin film 200 is formed by laminating, the front substrate 170 completed in the first embodiment is manufactured by manufacturing a dry film based on the prepared paste and laminating it. It is also possible to form the thin film 200 according to the second embodiment of the present invention on the front surface.

In addition, when forming the thin film 200 by the spray method, 10 to 20% by weight of LaB ₆ The nanoparticles 191 and 80 to 90% by weight of the dispersant may be mixed, and the mixed material may be formed by spraying on the entire surface of the front substrate 170 completed in the first embodiment.

As described above, when the thin film 200 is formed by the spray method, the LaB ₆ is formed on the front surface of the front substrate 170. The nanoparticles 191 are distributed to absorb near infrared rays.

As described above, when the thin film 200 is completed, a front filter in which the near-infrared shielding function is omitted is formed on the thin film 200.

Third Embodiment

10 is a cross-sectional view of a third embodiment of a front substrate of a plasma display panel including a thin film including LaB ₆ nanoparticles according to the present invention.

As shown in FIG. 10, in the third embodiment of the present invention, the LaB ₆ nanoparticles 191 described in the first embodiment are scanned and sustained electrodes 180a and 180b of the front substrate 170 in the form of a thin film 200. ) And the top dielectric layer 190.

The thin film 200 in the third embodiment of the present invention as described above may be formed by the screen printing method, the laminating method and the spray method as in the second embodiment described above.

In this case, when the thin film 200 according to the third embodiment of the present invention is formed by the spray method, the LaB ₆ nanoparticles 191 may be formed on the scan and sustain electrodes 180a and 180b and the bus electrodes 180a 'and 180b'. ) May cause problems.

Accordingly, the electrodes 180a, 180b, 180a ', and 180b' are covered with a mask to cover the electrodes 180a, 180b, 180a ', and 180b', and 10 to 20% by weight of LB ₆ Nanoparticles 191 and 80 to 90% by weight of the dispersant are mixed, and the mixed material is sprayed onto the front substrate 170 including the electrodes 180a, 180b, 180a ', and 180b'. The thin film 200 according to the third embodiment of the present invention may be formed.

Fourth Example

11 is a cross-sectional view illustrating a front substrate of a plasma display panel including a thin film including LaB ₆ nanoparticles according to the present invention.

As shown in FIG. 11, in the fourth embodiment of the present invention, the LaB ₆ nanoparticles 191 described in the first embodiment are formed of the thin film 200 and the top dielectric layer 190 of the front substrate 170. It is formed between the protective film 195.

The thin film 200 in the fourth embodiment of the present invention as described above may be formed by the screen printing method, the laminating method and the spray method as in the second embodiment described above.

It will be apparent to those skilled in the art that the present invention can be embodied in other specific forms without departing from the spirit and essential features of the present invention. For example, it will be very easy for those skilled in the art to use the above-described embodiments in combination with each other.

Accordingly, the above detailed description should not be construed as limiting in all aspects and should be considered as illustrative.

The scope of the invention should be determined by reasonable interpretation of the appended claims, and all changes within the equivalent scope of the invention are included in the scope of the invention.

1 is a diagram of a first embodiment showing a discharge cell structure of a plasma display panel according to the present invention.

2 is a view showing a driving device and a connection portion of a plasma display panel according to the present invention.

3 is a view showing a substrate wiring structure of a typical tape carrier package.

4 is a view schematically showing another embodiment of a plasma display device according to the present invention.

5A to 5C are flowcharts of a first embodiment showing a method of manufacturing a front substrate of a plasma display panel according to the present invention.

FIG. 6 is a graph showing transmission spectra of the top dielectric layers to which LaB ₆ nanoparticles are added according to the present invention. FIG.

7A to 7F are flowcharts of a first embodiment showing a method of manufacturing a back substrate of a plasma display panel according to the present invention.

8A is a view illustrating a process of bonding the front substrate and the back substrate of the plasma display panel.

FIG. 8B is a cross-sectional view taken along the line AA ′ of FIG. 7A.

9 is a cross-sectional view of a second embodiment of a front substrate of a plasma display panel including a thin film including LaB ₆ nanoparticles according to the present invention.

10 is a cross-sectional view of a third embodiment of a front substrate of a plasma display panel including a thin film including LaB ₆ nanoparticles according to the present invention.

11 is a cross-sectional view illustrating a front substrate of a plasma display panel including a thin film including LaB ₆ nanoparticles according to the present invention.

<Description of Symbols in Drawings>

<Description of Major Symbols in Drawing>

110: back substrate 120: address electrode

130: lower plate dielectric 140: partition wall

150a, 150b, 150c: phosphor 160: discharge gas

170: front substrate 180a: scan electrode

180b: sustain electrode 180a ', 180b': bus electrode

190: top dielectric 191: LaB ₆ nanoparticles

195: protective film 200: thin film

220: panel 230: driving substrate

240: TCP 241: driver driver chip

242: flexible substrate 243: wiring

250: FPC 260: heat sink

Claims (15)

A first dielectric layer having at least one electrode, a first dielectric layer formed on the back side of the electrode and including LaB (Lanthanum Boride) ₆ nanoparticles for shielding near infrared rays, and a protective film formed on the back side of the first dielectric layer Board; And And a second substrate bonded to the first substrate with a partition therebetween and having at least one address electrode, a second dielectric layer and a phosphor layer formed on the address electrode. According to claim 1, LaB ₆ Nanoparticles, plasma display panel, characterized in that added to the first dielectric layer in 0.001 to 1.0% by weight. Preparing a dielectric layer material comprising a mixture of mother glass and Lanthanum Boride (LaB) ₆ nanoparticles and a vehicle for near-infrared shielding; Applying the prepared dielectric layer material to a substrate on which scan and sustain electrodes are formed; And Firing the substrate coated with the dielectric layer material. The method of claim 3, wherein LaB ₆ Nanoparticles are added in 0.001 to 1.0% by weight in the dielectric layer material. A thin film formed on the front surface of the glass and including LaB (Lanthanum Boride) ₆ nanoparticles for shielding near infrared rays, at least one electrode formed on the rear surface of the glass, a first dielectric layer formed on the rear surface of the electrode, A first substrate having a protective film formed on a rear surface of the first dielectric layer; And And a second substrate bonded to the first substrate with a partition therebetween and having at least one address electrode, a second dielectric layer and a phosphor layer formed on the address electrode. The method of claim 5, The thin film is plasma display panel, characterized in that formed on the glass of the first substrate with a thickness of 1 to 20㎛. The method of claim 5, LaB ₆ Nanoparticles, characterized in that 10 to 20% by weight relative to the total amount of the thin film plasma display panel. Forming a thin film including LaB (Lanthanum Boride) ₆ nanoparticles for near-infrared shielding on the entire glass surface of the first substrate; Sequentially forming a protective film including a transparent electrode, an upper dielectric layer, and magnesium oxide (MgO) on a glass rear surface of the first substrate; And And bonding the first substrate and the second substrate on which the address electrode is formed. The method of claim 8, The thin film forming step may be formed on the glass of the first substrate with a thickness of 1 to 20㎛. The method of claim 8, The thin film forming step, 10 to 20% by weight of LaB ₆ A method of manufacturing a plasma display panel comprising mixing nanoparticles with 80 to 90% by weight of a vehicle and applying the mixed material to the entire glass surface of the first substrate. The method of claim 8, The thin film forming step, 10 to 20% by weight of LaB ₆ The nanoparticles and 80 to 90% by weight of the dispersant are mixed, and the mixed material is formed by spraying the spray on the entire surface of the first substrate to form a plasma display panel manufacturing method. A thin film formed on the rear surface of the glass and including LaB (Lanthanum Boride) ₆ nanoparticles for shielding near infrared rays, at least one electrode formed on the rear surface of the thin film, a first dielectric layer formed on the rear surface of the electrode, A first substrate having a protective film formed on a rear surface of the first dielectric layer; And And a second substrate bonded to the first substrate with a partition therebetween and having at least one address electrode, a second dielectric layer and a phosphor layer formed on the address electrode. Forming a thin film including LaB (Lanthanum Boride) ₆ nanoparticles for near-infrared shielding on the glass back surface of the first substrate; Sequentially forming a protective layer including a transparent electrode, an upper dielectric, and magnesium oxide (MgO) on a rear surface of the thin film; And And bonding the first substrate and the second substrate on which the address electrode is formed. At least one electrode formed on the back side of the glass, a first dielectric layer formed on the back side of the electrode, and LaBan (Lanthanum Boride) ₆ nanoparticles formed on the back side of the first dielectric layer for shielding near infrared rays A first substrate having a thin film and a protective film formed on a rear surface of the thin film; And And a second substrate bonded to the first substrate with a partition therebetween and having at least one address electrode, a second dielectric layer and a phosphor layer formed on the address electrode. Sequentially forming a transparent electrode and an upper dielectric layer on a glass rear surface of the first substrate; Forming a thin film including LaB (Lanthanum Boride) ₆ nanoparticles for near-infrared shielding on a rear surface of the upper dielectric layer; Forming a protective film including magnesium oxide (MgO) on a rear surface of the thin film; And And bonding the first substrate and the second substrate on which the address electrode is formed.

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