KR20100106138A - Heat sink for packaging light emitting device - Google Patents

Abstract

PURPOSE: A heat sink for packaging a light emitting device is provided to obtain an excellent heat radiation effect by forming heat radiation protrusions having at least one penetration hole. CONSTITUTION: A heat sink(300) for a light emitting device package comprises a heat radiation projection(310) equipped with a plurality of heat radiation protrusions. The heat radiation projection are arranged to maximize radiation efficiency through air. The heat radiation projection has a horizontal penetration hole and a vertical penetration hole. The heat radiation projection is divided into nine partitions by penetration holes.

Description

Heat sink for packaging light emitting device

The present invention relates to a heat sink, and more particularly to a heat sink for a light emitting device package.

A heat sink refers to a device for dissipating heat emitted from circuit elements such as power semiconductor elements used in electronic devices. It is a device that must be provided in a computer or the like that includes a CPU that performs high-speed operation as well as industrial electronics.

The importance of heat sinks capable of effectively dissipating heat dissipated in display devices or devices incorporating highly integrated circuits is increasing day by day.

In particular, light emitting diodes (LEDs) are required to have luminous power of several tens of lumens or more in order to be used in applications such as lighting sources. The light output of the light emitting diode is generally proportional to the input power, and the increase in the input power increases the junction temperature of the light emitting diode. Therefore, heat sink is very important as a structure for preventing an increase in junction temperature of a light emitting diode due to an increase in input power.

Most large-capacity LED modules have large heat sinks, and if the thermal sinks do not thermally stabilize, the LED chip is thermally shocked, causing a decrease in brightness and ultimately shortening the life of the LED module.

An object of the present invention is to provide a heat sink for a light emitting device package with increased heat dissipation efficiency and reduced volume.

According to an aspect of the present invention, in a heat sink that is a conductive substrate, the conductive substrate includes a heat radiating protrusion having a plurality of heat radiating protrusions, and the heat radiating protrusion has heat at least one through hole for a light emitting device package. Provide a sink.

The light emitting device may be a light emitting diode (LED).

The through holes may be arranged at equal intervals from each other in the heat radiating protrusions.

The printed circuit board may be closely attached to the conductive substrate, and the light emitting device may be packaged through the printed circuit board.

The surface area of the heat sink for heat radiation is much increased, so the heat dissipation effect is excellent. It is possible to miniaturize the heat sink and prevent the life of the light emitting element from being lowered.

As the invention allows for various changes and numerous embodiments, particular embodiments will be illustrated and described in the drawings. However, this is not intended to limit the present invention to specific embodiments, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments will be described in detail with reference to the accompanying drawings, and the same or corresponding components will be given the same reference numerals regardless of the reference numerals, and redundant description thereof will be omitted.

Figure 1a is a plan view showing a heat sink for a conventional light emitting device package, Figure 1b is a rear view and Figure 1c is a side view.

1A and 1B, the heat sink 100 for a light emitting device package includes a plurality of heat radiating protrusions. The heat sink 100 for the light emitting device package is generally used a metal material excellent in thermal conductivity and electrical conductivity.

Referring to FIG. 1C, a thermal radiator is disposed over almost the entire area of the top surface of the heat sink 100. The lower portion of the heat sink 100 for a light emitting device package may include a printed circuit board for mounting a light emitting device or other circuits.

2 is a plan view of an example of a heat sink for a light emitting device package according to the present embodiment, FIG. 3 is a rear view and FIG. 4 is a side view.

Referring to FIG. 2, the heat sink 200 for a light emitting device package includes a heat radiating protrusion 210 having a plurality of heat radiating protrusions. The heat sink 200 including the heat radiating protrusion 210 may be manufactured through a mold process. Each of the heat radiating protrusions of the heat radiating protrusion 210 may be arranged in a form for maximizing heat radiation through the air. For example, each of the plurality of thermal radiating protrusions may be spaced apart from each other at uniform intervals.

The number of protrusions or pins of the heat radiating protrusion 210 is preferably higher than that of the conventional heat sink. For example, if the number of protrusions in the conventional heat sink is 14, the number of protrusions of the heat radiating protrusion 210 according to the present embodiment may be larger than this. For example, the number of protrusions may be 17.

In addition, the height of the entire heat sink 200 is preferably smaller than the conventional heat sink. For example, if the height of the conventional heat sink is 50 mm, the heat sink according to the present embodiment may be smaller than this height. For example, the height of the heat sink may be 45 mm.

The heat sink 200 for the light emitting device package is made of a metal material having excellent thermal conductivity and electrical conductivity, and a heat dissipation substrate used for heat dissipation of a general electrical device may be used. Preferably made of aluminum, copper or an alloy of both.

The thermal radiation projection part 210 includes a through hole 222 (through hole). Here, the through hole refers to a hole that is completely bored because the depth of the hole is equal to the thickness of the substrate. The heat radiating protrusion 210 is divided into two compartments 211 and 212 by the through hole 222. Here, the through hole includes only one through hole, but various types of through holes may be included in various numbers. Therefore, the partition of the thermal radiation projection portion 210 according to the through hole may also vary according to the number of through holes in addition to the two as shown in FIG. The heat radiating protrusions of the heat radiating protrusions 210 may be spaced apart from each other at predetermined intervals to easily enter and exit the air, and radiate heat generated from the light emitting device to the outside.

Referring to FIG. 3, the surface area for heat radiation of the heat sink 200 is further increased through the through hole 222 of the heat radiating protrusion 210, and the through hole 222 is used to generate heat generated from the light emitting device. Maximize external radiation. In the heat sink 200 according to the present embodiment, the heat radiating protrusion 210 may have a smaller area than that of the conventional heat sink. Although the area occupied by the heat radiating protrusions 210 is smaller, the heat dissipation efficiency is increased through the through holes 222.

As shown in the figure, the heat sink 200 for a light emitting device package may be manufactured in various shapes such as an oval, a triangle, a rectangle, a rhombus, and the like in addition to a circle.

Referring to FIG. 4, a lower portion of the heat sink 200 for a light emitting device package may include a substrate (not shown) for mounting a light emitting device or other circuit. The substrate may be the same material as the heat sink 200 or different materials may be used.

For example, a printed circuit board (PCB) may be used as a substrate for mounting a light emitting device or other circuits. The printed circuit board includes a through hole at the same position where the heat sink according to the present embodiment has a through hole, so that air can enter and exit the heat sink and the printed circuit board according to the present embodiment. Preferably, the printed circuit board may be a metal printed circuit board (PCB). Metal printed circuit boards have better heat dissipation effects than conventional printed circuit boards.

5 is a plan view of another example of a heat sink for a light emitting device package according to the present embodiment, FIG. 6 is a rear view, and FIG. 7 is a side view.

5 and 6, the heat sink 300 for a light emitting device package includes a heat radiating protrusion 310 having a plurality of heat radiating protrusions. As shown in FIG. 2, each of the heat radiating protrusions of the heat radiating protrusion 310 may be arranged in a form for maximizing heat radiation through the air.

The thermal radiation projection part 310 includes the vertical through-holes 322a to 322f and the horizontal through-holes 324a to 324f. By the through holes 322a to 322f and 324a to 324f, the heat radiating protrusion 310 is divided into nine compartments 311 to 319.

Here, the through-hole includes only the through-hole in the form of a vertical line and the through-hole in the form of a horizontal line, but in addition to the bar shown in FIG. May be included. Here, vertical lines, horizontal lines, diagonal lines, etc. may change at any time based on the angle of the viewer. Vertical lines can be horizontal lines, and horizontal lines can be diagonal lines. Therefore, the partition of the thermal radiation projections 310 according to the through holes may also vary according to the number of through holes in addition to nine as shown in FIG. 5.

Preferably, the plurality of through holes are arranged at equal intervals from each other as shown in the thermal radiation projections 310.

Referring to FIG. 6, the surface area for heat radiation of the heat sink 300 is further increased through the through holes 322a to 322f and 324a to 324f of the heat radiating protrusion 310, and the through holes 322a to 322f, 324a to 324f maximize the external radiation of heat generated from the light emitting element. In the heat sink 300 according to the present embodiment, the heat radiating protrusion 310 may have a smaller area than that of the conventional heat sink. Although the area occupied by the heat radiating protrusion 310 is smaller, the heat dissipation efficiency is increased through the through hole 322.

Referring to FIG. 7, a lower portion of the heat sink 300 for a light emitting device package may include a substrate (not shown) for mounting a light emitting device or other circuit.

8 is a view illustrating an example of a package of a light emitting device using the heat sink according to the present embodiment.

Referring to FIG. 8, the packaging of the light emitting device includes a heat sink 510, a printed circuit board 520, and a light emitting device 530 according to the present embodiment.

The heat sink 510 according to the present embodiment is made of a metal material having excellent thermal conductivity and electrical conductivity, and includes a heat radiating protrusion 515 having a plurality of heat radiating protrusions. The heat radiating protrusion 515 includes a plurality of through holes. The printed circuit board 520 is closely attached to the heat sink 510 according to the present embodiment. The printed circuit board 520 includes a through hole at the same position where the heat sink 510 according to the present embodiment has a through hole, and the air flows through the heat sink 510 and the printed circuit board 520 according to the present embodiment. Can be made. A plurality of printed circuit boards 520 may be arranged to allow air to enter and exit through the through holes of the heat sink 510 according to the present embodiment.

The light emitting device 530 or other circuits are mounted on the printed circuit board 520. The light emitting device 530 may be attached to the printed circuit board 520 as a chip on board (COB). Here, the light emitting device may be a light emitting diode, a cold cathode fluorescent lamp or a high temperature cathode fluorescent lamp. Preferably, the light emitting element is a light emitting diode. In addition to the light emitting device 530, the number may be smaller or larger. The printed circuit board 520 may be formed of another substrate having the same or different material as that of the heat sink 200. The light emitting device 530 or other circuits may be connected by using an insulating layer and an electrode without using a separate substrate on the heat sink 510.

A molding unit (not shown) may be mounted on the heat sink 510 to protect the light emitting device 530 while the light emitting device 530 is packaged. Such molding may be formed through an injection process using an epoxy resin.

In the embodiment of FIG. 8, the temperature of the light emitting device was measured using a conventional heat sink having no through-holes. On the contrary, when the temperature of the light emitting device was measured using the heat sink according to the present embodiment, the temperature was 58 ° C. The heat sink according to the present embodiment can be seen that the heat dissipation effect is increased by 8% compared to the conventional heat sink.

As shown, the heat sink according to the present embodiment has a large surface area capable of dissipating heat through the through-holes, thereby facilitating convection of air to effectively dissipate heat.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made therein without departing from the spirit and scope of the invention. You will understand. Therefore, the present invention is not limited to the above-described embodiment, and the present invention will include all embodiments within the scope of the following claims.

Figure 1a is a plan view showing a heat sink for a conventional light emitting device package, Figure 1b is a rear view and Figure 1c is a side view.

2 is a plan view of an example of a heat sink for a light emitting device package according to the present embodiment.

3 is a rear view of an example of a heat sink for a light emitting device package according to the present embodiment.

4 is a side view of an example of a heat sink for a light emitting device package according to the present embodiment.

5 is a plan view of another example of a heat sink for a light emitting device package according to the present embodiment.

6 is a rear view of another example of a heat sink for a light emitting device package according to the present embodiment.

7 is a side view of another example of a heat sink for a light emitting device package according to the present embodiment.

8 is a view illustrating an example of a package of a light emitting device using the heat sink according to the present embodiment.

<Explanation of symbols for the main parts of the drawings>

200: heatsink

210: heat radiation projection

222: through hole

Claims (7)

In a heat sink that is a conductive substrate, The conductive substrate includes a heat radiating protrusion having a plurality of heat radiating protrusions, and the heat radiating protrusion has at least one through hole. The method of claim 1, The light emitting device is a heat sink for a light emitting device package, characterized in that the light emitting diode (LED). The method of claim 1, The plurality of through-holes, the heat sink for the light emitting device package, characterized in that spaced apart from each other at equal intervals in the thermal radiation projections. The method of claim 1, The printed circuit board (Printed Circuit Board) is in close contact with the conductive substrate and the light emitting device is a heat sink for a light emitting device package, characterized in that is packaged through the printed circuit board. The method of claim 4, wherein The printed circuit board includes a through hole in the same position where the conductive substrate has a through hole, the heat sink for the light-emitting device package to the air in and out through the conductive substrate and the printed circuit board. The method of claim 4, wherein The light emitting device is a heat sink for a light emitting device package, characterized in that the printed circuit board is packaged as a Chip On Board (COB). The method of claim 1, The conductive substrate is a heat sink for a light emitting device package, characterized in that made of aluminum, copper or an alloy of both.

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