KR20100091676A - Soldering device with vibration part - Google Patents

Abstract

The present invention relates to a soldering apparatus having a vibrating part, and further comprising a vibrating part such as ultrasonic vibration in a frame of a metal mask for applying solder cream to a surface of a printed circuit board or a wafer, thereby pushing the surface of the metal mask with a squid blade. After the solder cream is applied, the metal mask and the printed circuit board or wafer are separated while the vibrating part is applied to the frame of the metal mask using the vibrating part. The present invention provides a soldering apparatus having a vibrating part that can prevent the solder cream from being applied properly or the excessive application of the solder cream to minimize the defect rate of electronic products such as mobile phones, mobile phones, and notebook computers.

To this end, the present invention, the metal mask (1) is located on the printed circuit board (3) or the top of the wafer and the solder cream is applied, and the metal mask (1) by pushing the upper surface from one side to the other side of the metal mask ( In the soldering apparatus of a printed circuit board composed of a squid blade (4) so that the solder cream applied to 1) is dropped onto the printed circuit board (3) or the wafer, the frame constituting the edge of the metal mask (1) Vibrating portion (5) to vibrate the metal mask (1) to prevent the solder cream is excessively applied to the printed circuit board (3) or wafer, or the applied solder cream is buried in the metal mask (1) (5) ) Is further provided.

Description

Soldering Device with Vibration Part {SOLDERING DEVICE WITH VIBRATION PART}

The present invention relates to a soldering apparatus for a printed circuit board (PCB) or a wafer, and more particularly, a vibration unit is further configured in a holder of a metal mask configured to apply solder cream to a printed circuit board or a wafer positioned at a lower end thereof. The present invention relates to a soldering apparatus provided with a vibrating portion that enables the solder cream to be appropriately applied to a printed circuit board or a wafer, thereby significantly reducing the defect rate of the printed circuit board or the wafer.

In general, polyimide, polyester, polyetherimide film and the like are mainly used as substrate materials of printed circuit boards because of their excellent thermal, electrical, and mechanical properties.

The substrate is coated with an adhesive material, and a metal foil such as copper or aluminum is adhered to the substrate, and then the screen and the dry film photoresister are used to etch the circuit and the conductive metal foil, followed by insulation and circuitry. The coverlay film is coated for the arc to produce a printed circuit board.

In order to mount the electronic component on the printed circuit board manufactured as described above, the pre-solder is placed at the position where the chip-type component is to be mounted by screen printing or the like, and the chip-mounter is placed on the pre-solder position with the chip mounter, and then rippled. After fixing in a reflow method, the lead-type component is inserted into a hole on a printed circuit board and bonded again by wave soldering to manufacture a finished product.

In another method, the preliminary solder is placed at the position where the substrate hole and the chip-like component are to be mounted by screen printing or the like, and the chip-type component is placed on the preliminary solder position with the chip mounter, and the lead-type component is placed on the printed circuit board. After inserting into the holder, they are collectively bonded by reflow soldering.

In recent years, a printed cream that mounts surface-mounted components on a circuit board by pushing a solder cream into the hole using a metal mask with holes punched in place for soldering to clean and quickly solder many parts to a complex circuit board. Cream soldering is done. Therefore, the metal mask may be an important component that determines the soldering quality in the cream soldering process.

That is, solder cream is formed on a predetermined portion on a printed circuit board in order to mount an electronic component such as a semiconductor chip. In order to form the solder cream, a liquid solder cream is coated on the printed circuit board by a conventional soldering apparatus using a metal mask having a hole corresponding to a position on the printed circuit board on which the solder cream is to be formed.

1 is a conceptual diagram illustrating a process in which solder cream is applied onto a printed circuit board by a conventional soldering apparatus. As illustrated, the printed circuit board 3 may be formed by using a transfer conveyor 2 at the bottom of the metal mask 1. ), The upper surface of the metal mask (1) is pushed from one side to the other side using the squeeze blade (4), the solder cream falls on the printed circuit board (3) located at the bottom of the metal mask (1) The solder cream is applied in a desired pattern. When the solder cream is applied in this manner, the chip is mounted to separate the metal mask 1 from the printed circuit board 3.

As a small hole is formed in the metal mask 1, when the surface of the metal mask 1 is pushed by the squeeze blade 4, the solder cream applied to the metal mask is dropped through the small hole, and the metal mask 1 is removed. Solder cream is applied to the printed circuit board (3) located at the bottom of the.

In this way, the solder cream is applied to the printed circuit board. In the case of the conventional soldering apparatus, the solder mask is applied to the printed circuit board and then the metal mask is removed. Solder cream may be smeared out or too much solder cream may be applied to the printed circuit board, resulting in a defect of the printed circuit board. This may cause a problem in performance of various electronic products using the printed circuit board. do.

Soldering similar to the printed circuit board soldering is performed on the surface of the wafer in the wafer etching as well as the printed circuit board, and the above soldering or soldering problem occurs during the soldering process.

On the other hand, in order to solve the problems caused in the solder cream coating process of the printed circuit board made of a metal mask as a prior art, a metal mask having elasticity of Patent Registration No. 10-0170660 has been devised, which is a public announcement As described in the claims of the present invention, a metal mask portion having an opening for cream soldering, a frame for attaching and supporting the metal mask portion, and a metal mask portion formed around the edge of the metal mask portion are formed. A plurality of elastic holes are formed to impart a predetermined elasticity.

Therefore, by applying elasticity to the metal mask used for cream soldering using solder cream on the circuit board on which the surface mount component is mounted, high quality solder printing is possible by preventing solder defects. It can be used for a long time and expects to reduce labor and cost.

However, even if elasticity is applied to the metal mask in this way, it does not solve the problem caused by solder cream on the metal mask or excess solder cream on the printed circuit board when the metal mask and the printed circuit board are separated. There is a situation.

The present invention has been made to solve the problems of the conventional soldering apparatus of a printed circuit board or wafer, further comprising a vibration unit such as an ultrasonic vibrator in the frame of the metal mask for applying solder cream to the surface of the printed circuit board or wafer Push the surface of the metal mask with a squid blade to apply solder cream, and then separate the metal mask and the printed circuit board or wafer by vibrating the frame of the metal mask with the vibrating part using the vibrating part to separate the solder cream. It is an object of the present invention to provide a soldering apparatus having a vibrating portion that is applied to a mask so that solder cream is not properly applied to a printed circuit board or a wafer, or excessive solder cream is applied to a printed circuit board or a wafer.

In order to achieve the above object, the present invention provides a soldering apparatus including a vibrating part, a metal mask disposed on an upper end of a printed circuit board or a wafer and coated with a solder cream, and pushing the metal mask from one side to the other side of the metal mask. In the soldering device consisting of a squid blade so that the solder cream applied to the drop falls on the printed circuit board or the wafer, the frame forming the edge of the metal mask vibrates the metal mask so that the solder cream is printed on the printed circuit board or It is further provided with a vibrating portion that prevents the excessive application of the solder cream applied to the wafer or the printed circuit board or the wafer on the metal mask.

The soldering device with the vibration part of the present invention further comprises a vibration part such as ultrasonic vibration in the frame of the metal mask which applies the solder cream to the surface of the printed circuit board or the wafer, thereby pushing the surface of the metal mask with a squid blade to remove the solder cream. After coating, the metal mask and the printed circuit board or wafer are separated while the frame of the metal mask is vibrated using the vibrator to separate the metal mask from the printed circuit board or the wafer, and the solder cream is buried in the separated metal mask and the solder cream is applied to the printed circuit board or the wafer. This prevents the application of excessive solder cream on the printed circuit boards or wafers, thereby minimizing the defective rate of electronic products such as mobile phones, mobile phones or notebooks.

Hereinafter, the configuration and operation of the present invention will be described in more detail with reference to the accompanying drawings. In describing the present invention, the term or word used in the present specification and claims is based on the principle that the inventor can appropriately define the concept of the term in order to best describe the invention of his or her own. It should be interpreted as meanings and concepts corresponding to the technical idea of

In addition, in describing the soldering apparatus provided with the vibrating part which is this invention, the same name and same code | symbol are applied as it is about the same technique as a prior art idea.

2 is a conceptual view illustrating a soldering apparatus having a vibration unit according to the present invention, and FIG. 3 is a conceptual view illustrating another example of a soldering apparatus for a printed circuit board having the vibration unit according to the present invention. Although the drawings of the present invention all show a soldering apparatus for a printed circuit board, the same concept is applied to the wafer soldering process instead of the printed circuit board.

As shown, a soldering apparatus for a printed circuit board having a vibration unit according to the present invention includes a transfer conveyor 2 to which the printed circuit board 3 is transferred, and a printed circuit board 3 to be transported on the transfer conveyor 2. The metal mask (1) is located on the top of the solder cream is applied, and the solder cream applied to the metal mask (1) by pushing the upper surface of the metal mask (1) from the other side to the printed circuit board (3) The present invention relates to a soldering apparatus for a printed circuit board including a squid blade (4) to be applied onto a drop. The frame (11) forming an edge of the metal mask (1) vibrates the metal mask (1) and solders. The vibration part 5 which prevents the cream from being excessively applied to the printed circuit board 3 or the solder cream applied to the printed circuit board 3 from the metal mask 1 is further provided.

The vibrator 5 may be made of an ultrasonic vibrator equipped with an ultrasonic vibrator or various vibration devices.

It will be described that the solder cream is applied on the printed circuit board by the soldering device with a vibration unit of the present invention configured as described above.

First, the vibrator 5 transfers the printed circuit board 3 for applying solder cream to the lower end of the metal mask 1 formed in the frame 11 by using the transfer conveyor 2.

When the printed circuit board 3 is transferred to the lower end of the metal mask 1, the solder cream applied to the metal mask 1 may be applied onto the printed circuit board 3. Slide the blade 4 from one side of the metal mask 1 in the other direction to scrape off, so that the solder cream placed on the metal mask 1 is dropped onto the printed circuit board 3 onto the printed circuit board 3. Apply solder cream in the desired pattern.

In addition, when the solder cream is applied to the printed circuit board 3 in a desired pattern, the printed circuit board 3 and the metal mask 1 are separated from each other, and then the printed circuit board 3 is transferred. When the metal mask 1 is spaced apart from the printed circuit board 3 as described above, vibration is transmitted to the metal mask 1 by driving the vibration unit 5 formed in the frame 11 of the metal mask 1. By doing so, the solder cream applied to the printed circuit board 3 by vibration may be prevented from being applied to the metal mask 1 or the excessive amount of solder cream applied to the printed circuit board.

That is, since the vibration through the vibrator 5 is transmitted to the metal mask 1, the soldering phenomena accompanying solder cream during the separation operation between the metal mask 1 and the printed circuit board 3 or vice versa printing. Too much soldering on the circuit board is avoided.

Accordingly, as a proper amount of solder cream is applied to the printed circuit board, the defective rate of the printed circuit board can be significantly reduced, and finally, the defective rate of electronic products such as a mobile phone, a mobile phone, or a notebook where the printed circuit board is used. Can be minimized.

If necessary, the vibrator 5 is configured on either side of the frame 11 of the metal mask 1 as shown in FIG. 2 or as shown in FIG. 3. 11) Can be configured on both sides or four sides respectively.

The present invention may be variously modified in addition to those shown and described, all modifications are to be included in the scope of the present invention without departing from the scope of the present invention.

1 is a conceptual diagram illustrating a process in which solder cream is applied to a printed circuit board by a soldering apparatus of a conventional printed circuit board.

2 is a conceptual diagram illustrating a soldering apparatus for a printed circuit board having a vibration unit according to the present invention.

3 is a conceptual view illustrating another example of a soldering apparatus for a printed circuit board having a vibration unit according to the present invention.

<Description of the symbols for the main parts of the drawings>

1: Metal Mask 2: Transfer Conveyor

3: printed circuit board 4: squid blade

5: vibrating portion 11: metal mask frame

Claims (1)

A metal mask 1 positioned on the printed circuit board 3 or the wafer and coated with a solder cream, and a solder applied to the metal mask 1 by pushing the upper surface of the metal mask 1 from one side to the other side. In the soldering apparatus of a printed circuit board composed of a squid blade (4) so that the cream is applied dropping on the printed circuit board (3), The frame 11 constituting the edge of the metal mask 1 vibrates the metal mask 1 so that solder cream is excessively applied to the printed circuit board 3 or the wafer, or to the printed circuit board 3 or the wafer. Soldering device with a vibrating portion, characterized in that the vibrating portion (5) is further provided to prevent the applied solder cream buried in the metal mask (1).

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