JP2009126114A - Manufacturing process of printing apparatus and mask printed circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To conduct printing efficiently when conducting a printing process to a printing subject such as a printed circuit board or the like, by improving detaching property regarding the printed circuit board or the like and a mask. <P>SOLUTION: The printed circuit board 2 is placed on a stage 1. The metal mask 31 is placed on a mount 5, and is further closely attached to the printing subject. Then, a solder paste 6 is placed on the mask 31 and printing is carried out using a squeegee 4. In addition, an ultrasound oscillator for applying an ultrasound oscillation to the mask 31 is provided to the mount 5. Accordingly, after applying a solder pattern, the solder paste left at an opening portion of the mask is oscillated by applying an ultrasound wave from the stage 1 which supports the board and from the mount 5 which supports the mask 31 when the printed circuit board 2 and the mask 31 are removed from each other, thereby enabling the solder paste to be easily removed and transferring the solder entirely to the printed circuit board. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a printing apparatus having a function of performing printing using a mask (plate) having an opening, such as a screen plate or a metal plate, and a squeegee, and a method for manufacturing a mask printed wiring board.

  Conventionally, for example, when printing solder on a printed wiring board, a metal plate having an opening in a portion to be printed with solder and a squeegee made of metal are used in combination.

  In a general printing method, a metal mask opening is put in close contact with a printed wiring board which is a substrate to be printed. Then, the solder paste is pushed into the opening on the metal mask with a squeegee, and finally the metal mask is peeled off from the printed wiring board to complete the printing.

  However, the smaller the size of the hole on the metal mask, the more the solder remains on the metal mask, and the solder cannot be properly transferred onto the printed wiring board.

Recently, in order to improve the releasability between the printed solder pattern and the metal plate, we have also proposed a device that has been devised such as speeding up the separation of the wiring board and the metal plate and pushing out air from above. (For example, refer to Patent Document 1).
JP 2000-233489 A

  However, even in the above prior art, there is a problem that it is not easy to transfer all the solder when the solder pattern is fine and complicated, or the solder paste grains are very small.

  Therefore, the present invention provides a printing apparatus and a method for manufacturing a mask printed wiring board that improve printing separation between the printed wiring board and the mask and perform printing efficiently when performing printing on a printed material such as a printed wiring board. The purpose is to provide.

  In order to achieve the above-described object, a printing apparatus of the present invention includes a support base that supports a substrate, a plate that has an opening corresponding to a printing pattern, and is disposed on the substrate, and is disposed on the plate. It has a squeegee that presses and slides the applied coating paste to the printed material side, and oscillation means for applying ultrasonic vibration to the printed material or plate.

  Further, the mask printed wiring board manufacturing apparatus of the present invention has a support base for supporting the printed wiring board, an opening corresponding to a solder pattern for the printed wiring board, and a mask disposed on the printed wiring board, A squeegee that presses and slides the solder paste disposed on the mask to the printed wiring board side; and an oscillating means that applies ultrasonic vibrations to the printed wiring board or the mask. After the solder paste pattern is formed on the printed wiring board, the solder paste is separated from the mask while applying ultrasonic vibration by the oscillation means when the mask is peeled off.

  The mask printed wiring board manufacturing method of the present invention also includes a pattern of a solder paste by placing a mask on the printed wiring board, pressing the solder paste on the mask toward the printed wiring board with a squeegee, and sliding. A method for manufacturing a mask printed wiring board on a printed wiring board, wherein after the solder paste pattern is formed on the printed wiring board using a squeegee from above the mask, the printed wiring board or The solder paste is separated from the mask while applying ultrasonic vibration to the mask.

  According to the present invention, a solder paste pattern is formed on a printed wiring board using a squeegee from above the mask (plate), and then the ultrasonic wave is applied to the printed wiring board or mask while peeling the mask. From the mask, for example, when performing a solder pattern transfer to a printed circuit board or other printing process on a printed material, the printing property between the printing material and the mask (plate) is improved and printing is performed. There is an effect that can be performed efficiently.

Hereinafter, embodiments of the present invention will be specifically described with reference to the drawings.
FIG. 1 is a front view showing a configuration of a printing apparatus according to an embodiment of the present invention.
As shown in the figure, this printing apparatus forms a solder pattern on a printed wiring board 2 as a substrate 2, and the printed wiring board 2 is arranged on a stage (support base) 1.
A mask (plate) 31 having openings corresponding to the solder patterns is disposed on the printed surface (solder coated surface) of the printed wiring board 2. The mask 31 is held by a mask frame 32, the mask frame 32 is supported by the gantry 5, and the mask 31 is positioned on the printed surface of the printed wiring board 2.

On the upper surface of the mask 31, the solder paste 6 is supplied, and the squeegee 4 is arranged thereon.
The squeegee 4 is moved by a drive mechanism (not shown), and the solder paste 6 is pressed and slid toward the mask 31 by the squeegee 4, and the solder pattern is applied to the printed wiring board 2 side through the mask 31.
In the work, the printed wiring board 2 is placed on the stage 1 and the metal mask 31 is placed on the mount 5 and is further brought into close contact with the substrate. The solder paste 6 is placed on the mask 31 and printing is performed using the squeegee 4.

  The gantry 5 is provided with an ultrasonic oscillator (not shown) for applying ultrasonic vibration to the mask 31. In this example, the ultrasonic oscillator is provided on the gantry 5 (that is, on the mask 31 side). However, it may be provided on the stage 1 side to apply ultrasonic vibration.

  In the printing apparatus of this example, when the printed wiring board 2 and the mask 31 are peeled off after the solder pattern is applied, the ultrasonic wave is oscillated from the stage 1 that supports the board and the gantry 5 that supports the mask 31. The solder paste remaining in the mask opening is vibrated so that it can be easily peeled off and transferred to the printed circuit board.

With the conventional method of changing the plate separation speed and the method of extruding with air from above, it is possible to loosely remove the solder paste from the mask, but for the very small amount of solder paste remaining at the edge of the mask opening. Is totally powerless.
Therefore, as in this example, the ultrasonic wave is oscillated on the printed wiring board or mask, and the vibration is directly applied to the solder paste at the opening of the mask. You can improve your separation.

Moreover, the optimal vibration can be given to the paste used by setting appropriately the timing, intensity | strength, and time which the ultrasonic oscillator installed in this apparatus operate | moves. It is assumed that the printing apparatus of this example has various circuits, timers, input devices, and the like necessary for such control and setting.
In addition, the ultrasonic oscillator needs to be installed as close to the mask opening as possible, and should be installed to prevent the effect from being diminished by interference waves.
In this case, the ultrasonic oscillation source can be selected from the stage 1, the gantry 5, or an area on the mask 31 that does not interfere with printing. However, when the substrate to be printed is not a rigid body such as metal, it is more efficient to install the ultrasonic oscillation source on the mask.

According to the present embodiment as described above, it is possible to transfer all of the solder paste to the printed wiring board without leaving the solder paste in the opening of the mask. Thereby, all the solder paste required for producing a printed wiring board can be transferred, and there is an advantage that the solder paste is not chipped from the board.
Further, when cleaning the plate, the cleaning property is improved by simultaneously oscillating ultrasonic waves.
Although the present invention has been described above with an example of a printing apparatus specialized in a mask printed wiring board manufacturing apparatus, the present invention is not limited to a printed wiring board but can be applied to various printing apparatuses.

1 is a front view illustrating a configuration example of a printing apparatus according to an embodiment of the present invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Stage, 2 ... Substrate, 31 ... Mask (plate), 32 ... Mask frame, 4 ... Squeegee, 5 ... Mount, 6 ... Paste.

Claims (8)

A support base for supporting the substrate;
A plate having an opening corresponding to a printing pattern and disposed on the substrate;
A squeegee that presses and slides the coating paste disposed on the plate toward the substrate;
An oscillating means for applying ultrasonic vibration to the substrate or plate;
A printing apparatus comprising:   The printing apparatus according to claim 1, wherein the plate is a metal plate, a screen plate, or the like.   The printing apparatus according to claim 1, wherein the oscillating means is capable of changing an intensity of ultrasonic vibration.   The printing apparatus according to claim 1, wherein the oscillating unit is capable of changing a time during which the ultrasonic vibration is continuously applied.   The printing apparatus according to claim 1, wherein the oscillating means can variably set a timing for applying the ultrasonic vibration. A support base for supporting the printed wiring board;
A mask having an opening corresponding to a solder pattern with respect to the printed wiring board, and disposed on the printed wiring board;
A squeegee that slides against the printed wiring board by pressing the solder paste disposed on the mask, and
Oscillating means for applying ultrasonic vibration to the printed wiring board or mask,
After a solder paste pattern is formed on a printed wiring board using a squeegee from above the mask, the solder paste is detached from the mask while applying ultrasonic vibrations by the oscillation means at the time of mask peeling.
An apparatus for manufacturing a mask printed wiring board, comprising: A mask printed wiring board for forming a solder paste pattern on a printed wiring board by placing a mask on the printed wiring board, pressing the solder paste on the mask toward the printed wiring board with a squeegee, and sliding the mask. A manufacturing method comprising:
After the solder paste pattern is formed on the printed wiring board using a squeegee from above the mask, the solder paste is detached from the mask while applying ultrasonic vibration to the printed wiring board or the mask when the mask is peeled off.
A method for manufacturing a mask printed wiring board, comprising: 8. The method of manufacturing a mask printed wiring board according to claim 7, wherein the ultrasonic vibration is applied by an ultrasonic oscillating means installed on the mask.

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