KR20100079252A

KR20100079252A - Light emitting device

Info

Publication number: KR20100079252A
Application number: KR20080137679A
Authority: KR
Inventors: 김태광
Original assignee: 서울반도체 주식회사
Priority date: 2008-12-31
Filing date: 2008-12-31
Publication date: 2010-07-08

Abstract

PURPOSE: A light emitting device is provided to prevent the deformation inside a package by forming a groove of a threshold at the side of a slug. CONSTITUTION: A housing is prepared. A heat slug is installed inside the housing. A light emitting diode is mounted in the heat slug(120). The lead terminal supplies power to the light emitting diode. The heat slug forms a groove in a partial region of the interface between heat slug and the housing.

Description

Light emitting device {LIGHT EMITTING DEVICE}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device, and more particularly, to a power type light emitting device using heat dissipating slugs in order to increase heat dissipation efficiency.

In general, a light emitting diode (LED) is a kind of semiconductor device that converts an electrical signal into light and outputs the light using characteristics of a compound semiconductor, and has high luminous efficiency, long life, low power consumption, and eco-friendliness. There are many advantages of the technology field using the light emitting diode is increasing trend.

In recent years, interest in lighting using light emitting diodes is increasing, and in order to use such light emitting diodes for lighting, not only the quality of light emission but also light output of several thousand lumens or more is required. Since the high output light emission is proportional to the input current, if a high current is provided, the required light output can be obtained. However, if the input current is increased, a lot of heat is generated.

Since heat generated from the light emitting chip has a fatal effect on the life of the light emitting chip, in order to solve this problem, a light emitting diode additionally equipped with a heat dissipation member such as a slug has been manufactured.

However, since the conventional slug is formed in a smooth cylindrical shape, if a small gap is generated in the interface with the housing due to the molding conditions or the modification of the material, the deterioration material such as external moisture is easily penetrated through the gap and the package The oxidation or modification of the internal metal or resin is promoted, resulting in a problem of shortening the performance and life of the product.

Accordingly, the present invention has been made in view of the above problems, and the present invention provides a light emitting device capable of prolonging the life of a product by preventing degradation of performance and reliability of the light emitting diode.

A light emitting device according to an aspect of the present invention includes a housing, a heat dissipation slug mounted inside the housing, a light emitting chip mounted on the heat dissipating slug, and lead terminals for supplying power to the light emitting chip. The heat dissipation slug has a groove formed in at least a portion of the boundary surface in contact with the housing. The groove may be formed in a thread form. The groove may be formed on a surface of the heat dissipation slug. The heat dissipation slug may be formed in a multistage structure.

The light emitting device may further include a lens unit formed on the housing to cover the light emitting chip. The light emitting device may further include a wavelength conversion part formed inside the lens part to cover the light emitting chip, and including a phosphor for converting at least a portion of the light generated from the light emitting chip into light having a different wavelength.

According to such a light emitting device, by forming a threaded groove on the side surface of the heat dissipating slug, it is possible to suppress the penetration of moisture or a material having low reliability, thereby preventing oxidation and denaturation inside the package, and improving the bonding force of the package.

The above-described features and effects of the present invention will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, and thus, those skilled in the art to which the present invention pertains may easily implement the technical idea of the present invention. Could be. As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "having" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described in the specification, and that one or more other features It should be understood that it does not exclude in advance the possibility of the presence or addition of numbers, steps, actions, components, parts or combinations thereof. Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings.

1 is a perspective view showing a light emitting device according to an embodiment of the present invention, Figure 2 is a cross-sectional view of the light emitting device shown in FIG.

1 and 2, a light emitting device 100 according to an embodiment of the present invention is mounted on a housing 110, a heat dissipation slug 120 mounted inside the housing 110, and a heat dissipation slug 120. The light emitting chip 130 and lead terminals 140 for supplying power to the light emitting chip 130 are included. In addition, the light emitting device 100 may further include a lens unit 150 formed on the housing 110 to cover the light emitting chip 130.

The housing 110 is intended to support and protect the entire structure of the LED package. The housing 110 may be formed of an insulating material such as poly phthalamide (PPA) or liquid crystal polymer (LCP). The housing 110 formed of an insulating material electrically insulates and supports the lead terminals 140 formed in the housing 110.

The heat dissipation slug 120 is for efficiently dissipating heat generated from the light emitting chip 130 and is mounted on the center portion of the housing 110, and the lower portion thereof is exposed to the outside of the housing 110. The heat dissipation slug 120 is preferably formed of a material having excellent thermal conductivity, and may be formed of a material having conductivity.

3 is an enlarged view illustrating an enlarged portion of an interface between the heat dissipating slug and the housing illustrated in FIG. 2, and FIG. 4 is a perspective view of the heat dissipating slug illustrated in FIG. 2.

3 and 4, the heat dissipation slug 120 is formed in a multi-stage structure in which a plurality of cylinders whose diameter decreases toward the top thereof are stacked. Alternatively, the heat dissipation slug 120 may be formed in one cylindrical shape, and may be formed in various pillar shapes such as square pillars instead of cylinders.

The heat dissipation slug 120 includes a groove 122 formed in at least a portion of the boundary surface in contact with the housing 110. For example, the groove 122 is formed on the surface of the heat dissipation slug 120, that is, the vertical surface of the heat dissipation slug 120, and extends along the outer circumferential surface of the heat dissipation slug 120. The groove 122 may be formed entirely on the side surface of the heat dissipation slug 120, or may be formed only at an interface contacting the housing 110. In addition, the groove 122 may be formed not only in the vertical plane of the heat dissipation slug 120 but also in the horizontal plane.

The groove 122 formed in the heat dissipation slug 120 is, for example, formed in the form of a screw thread that is triangular in shape. In addition, the grooves 122 formed in the heat dissipation slug 120 may be formed in various shapes such as a rectangular shape, a semicircular shape, and the like.

On the other hand, the inner surface of the housing 110 in contact with the heat dissipation slug 120 is formed in a shape corresponding to the groove 122 formed in the heat dissipation slug 120 so that a gap does not occur between the heat dissipation slug 120. The housing 110 may be manufactured by injecting and curing a liquid resin into the mold in a state where the heat dissipation slug 120 and the lead terminals 140 having the grooves 122 are disposed in the mold.

As such, when the groove 122 is formed along the thickness of the heat dissipation slug 120, the penetration path of the external foreign material becomes longer and more complicated, and thus, through the interface between the heat dissipation slug 120 and the housing 110. It is possible to suppress penetration of a reliability deterioration substance such as moisture and prevent oxidation and denaturation inside the package. In addition, the bonding force and adhesion between the heat dissipation slug 120 and the housing 110 may be improved.

Referring back to FIGS. 1 and 2, the light emitting chip 130 is mounted on an upper surface of the heat dissipating slug 120. The light emitting chip 130 generates light in response to power applied through the lead terminals 140. The light emitting chip 130 may be electrically connected to the lead terminals 140 through a conductive wire (not shown). The light emitting chip 130 may generate light in various wavelength bands according to its use. For example, the light emitting chip 130 may generate light in a blue, red, yellow, or ultraviolet wavelength band.

The lead terminals 140 are for applying external power to the light emitting chip 130 and are formed on one side and the other side of the housing 110, respectively. One portion of the lead terminals 140 is inserted into the housing 110, and the other portion protrudes out of the housing 110 to be connected to a circuit board (not shown) for applying external power. Meanwhile, the lead terminals 140 may be electrically connected to the light emitting chip 130 through the conductive wires in the housing 110. In addition, the lead terminals 140 are substantially insulated from the heat dissipation slug 120, but in some cases, one lead terminal 140 may be electrically connected to the heat dissipation slug 120.

The lens unit 150 is formed on the housing 110 to cover the light emitting chip 130. The lens unit 150 encapsulates the light emitting chip 130 and fixes the conductive wire connected to the light emitting chip 1230. In addition, the lens unit 150 may be formed in a convex lens shape to serve as a lens for collecting light generated from the light emitting chip 130. The lens unit 150 is formed of a transparent resin such as a transparent epoxy resin or a silicone resin so that light generated from the light emitting chip 130 may be emitted to the outside. The lens unit 150 may be formed through a molding process using a predetermined mold.

The light emitting device 100 may further include a wavelength converter 160 formed inside the lens unit 150 to cover the light emitting chip 130. The wavelength converter 160 includes a phosphor for converting at least a portion of the light generated by the light emitting chip 130 into light having a different wavelength. For example, the wavelength converter 160 may include any one or more of red, green, and blue phosphors to implement light having a desired color such as white light. Meanwhile, instead of using the wavelength converter 160, a phosphor may be formed in the lens unit 150.

According to the light emitting device 100 having such a configuration, the groove 122 such as a thread is formed on the side surface of the heat dissipation slug 120 to lengthen the penetration path of the foreign matter, thereby suppressing oxidation and denaturation inside the package, Can improve the binding force.

In the detailed description of the present invention described above with reference to the preferred embodiments of the present invention, those skilled in the art or those skilled in the art having ordinary skill in the art will be described in the claims to be described later It will be understood that various modifications and variations can be made in the present invention without departing from the scope of the present invention.

1 is a perspective view showing a light emitting device according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of the light emitting device shown in FIG. 1.

3 is an enlarged view illustrating an enlarged portion of an interface between the heat dissipating slug and the housing illustrated in FIG. 2.

4 is a perspective view of the heat dissipation slug shown in FIG. 2.

100: light emitting device 110: housing

120: heat dissipation slug 130: light emitting chip

140: lead terminal 150: lens portion

160: wavelength conversion unit

Claims

housing;

A heat dissipation slug mounted inside the housing;

A light emitting chip mounted on the heat dissipating slug; And

Includes lead terminals for supplying power to the light emitting chip,

The heat dissipation slug is a light emitting device, characterized in that the groove is formed in at least a portion of the interface in contact with the housing.

The method of claim 1,

The groove is light emitting device, characterized in that formed in the form of a screw.

The method of claim 1,

And the groove is formed on a surface of the heat dissipating slug.

The method of claim 1,

The heat dissipating slug is formed in a multi-stage structure.

The method of claim 1,

And a lens part formed on the housing to cover the light emitting chip.

The method of claim 5,

And a wavelength conversion part formed inside the lens part to cover the light emitting chip and including a phosphor for converting at least a portion of the light generated from the light emitting chip into light having a different wavelength.