KR20100069938A

KR20100069938A - Probe card

Info

Publication number: KR20100069938A
Application number: KR1020080128498A
Authority: KR
Inventors: 심영대
Original assignee: 주식회사 코리아 인스트루먼트
Priority date: 2008-12-17
Filing date: 2008-12-17
Publication date: 2010-06-25

Abstract

The probe card of the present invention is electrically connected to a tester, and used to test a probe by contacting a probe with a semiconductor device formed on a wafer, the main circuit board electrically connecting a plurality of the probes to the tester; A base plate positioned above the main circuit board and comprising a base plate having a thermal expansion coefficient of 3.4 at a temperature of 100 ° C .; And a base bar made of nobinite having a thermal expansion coefficient of 3.4 at a temperature of 100 ° C., which is fitted to the base plate, and is placed on the support bar, and is made of mullite 3.6 at a temperature of 100 ° C. The formed slit holder, and the slit holder and the probe inserted into the slit from the top and the reinforcement cover portion made of mullite 3.6 thermal expansion coefficient at 100 ℃ condition, the thermal expansion coefficient at 100 ℃ It includes; a plurality of fixed bar adjusted to 3.0 to 3.5.

Description

Probe card

The present invention relates to a probe card. Specifically, the present invention relates to a probe card capable of compensating for thermal expansion of a wafer on which an inspection target semiconductor chip is formed.

A plurality of probes may be provided on the probe card to contact or contact the contact pads of each individual semiconductor chip formed on the wafer to transmit or receive an electrical signal so that both parts of the semiconductor chip may be tested.

A plurality of such probes are inserted into and fixed to a probe card. Recently, a probe card structure is proposed in which a probe is configured in a two-dimensional blade type, a plurality of slots are formed in the probe card, and the probe is inserted into and fixed in a corresponding slot. It is becoming.

The probe card is generally formed to have a size corresponding to a wafer on which the semiconductor chip to be inspected is formed, and the positions of the plurality of probes on the probe card correspond to the positions of the plurality of semiconductor chips to be inspected on the wafer.

On the other hand, with the development of semiconductor manufacturing process technology, wafers of 12 inches or more are widely used instead of the conventional 8 inch wafers. However, such a 12 inch or more wafer has a larger thermal expansion or heat shrinkage range than an 8 inch wafer with respect to thermal conditions applied in a semiconductor inspection process by a probe.

As such, when the wafer is thermally expanded or contracted with respect to the probe card, the plurality of probes included in the probe card may not be in contact with the corresponding plurality of semiconductor chips on the wafer.

In this case, even though the test signal is transmitted through the probe, the semiconductor chip may not receive the test signal accurately, and thus an error may occur in which the test of the semiconductor chip is not performed.

In order to solve the above problems of the prior art, the present invention is to provide a probe card of a new structure that can be exactly in contact with the semiconductor chip provided on the wafer even if the wafer is thermally expanded or thermally contracted.

The probe card of the present invention for solving the above problems is electrically connected to the tester, is used to test the probe by contacting the semiconductor element formed on the wafer, the main for electrically connecting a plurality of the probe to the tester A circuit board; A base plate positioned above the main circuit board and comprising a base plate having a thermal expansion coefficient of 3.4 at a temperature of 100 ° C .; And a base bar made of nobinite having a thermal expansion coefficient of 3.4 at a temperature of 100 ° C., which is fitted to the base plate, and is placed on the support bar, and is made of mullite 3.6 at a temperature of 100 ° C. The formed slit holder, and the slit holder and the probe inserted into the slit from the top and the reinforcement cover portion made of mullite 3.6 thermal expansion coefficient at 100 ℃ condition, the thermal expansion coefficient at 100 ℃ It includes; a plurality of fixed bar adjusted to 3.0 to 3.5.

The probe card may include a plurality of connection circuit boards inserted in a direction perpendicular to the base plate to electrically connect the probe and the main circuit board;

Pressurizing the plurality of fixing bars, the plurality of connecting circuit boards, and the base plate to secure the coupling between the plurality of fixing bars and the base play, and coupling the plurality of connecting circuit boards with the base play. A cover plate, characterized in that to firmly; A main reinforcing plate positioned under the main circuit board and supporting the main circuit board; And a sub reinforcing plate positioned below the main reinforcing plate and supporting the main circuit board, wherein the total thermal expansion coefficient may be adjusted to 1.2 to 1.5 under conditions of 100 ° C.

In the probe card of the present invention, as described above, since the fixing bar has a three-layer structure such as a supporting bar, a slit holder, and a reinforcing cover part, the materials of each of the supporting bar, the slit holder, and the reinforcing cover part are individually selected. This makes it possible to precisely adjust the coefficient of thermal expansion of the entire fixed bar.

Thus, even if the thermal expansion coefficient of the probe card in which the main circuit board, the base plate, the connecting circuit board, the cover plate, the main reinforcement plate, and the sub reinforcement plate are assembled is outside the range of the thermal expansion coefficient of the wafer, the probe thus assembled By adding a fixed bar in which the thermal expansion coefficient is precisely adjusted to the card as described above, the thermal expansion coefficient of the entire probe card can be adjusted to be equal to the thermal expansion coefficient of the wafer.

Therefore, in the probe card of the present invention, even if the wafer is thermally deformed and expanded or shrunk during the test, the probe card is also expanded or shrunk to the same degree, so that the plurality of probes provided in the probe card can accurately contact the semiconductor chip to be inspected in the wafer. Will be. Accordingly, the probe card of the present invention can achieve excellent heat deformation characteristics.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.

First, a probe card according to an embodiment of the present invention will be described in detail with reference to FIG. 1.

As shown in FIG. 1, a probe card according to an embodiment of the present invention may include a main circuit board 100, a base plate 200, a fixing bar 300, a connection circuit board 400, and a cover plate 500. , The main reinforcement plate 700, and the secondary reinforcement plate 800 is formed.

First, the main circuit board 100 is electrically connected to a tester (not shown), and transmits a test signal applied from the tester to each of the plurality of probes 600 through each of the corresponding connection circuit boards 400. The result signal transmitted from the two probes 600 is received through each of the corresponding connection circuit boards 400 and transmitted to the tester.

Since the main circuit board 100 can be variously designed and manufactured by conventional methods according to the purpose, detailed description thereof will be omitted in the specification of the present invention.

Again, returning to FIG. 1, the base plate 200 is positioned on the main circuit board 100 and configured to support the fixed bar 300 and the connection circuit board 400.

1 and 2, the base plate 200 has a structure in which a plurality of rod-shaped ribs 205 are integrally connected to the edge portion 230, and the plurality of ribs 205 are formed. Are connected to each other through a plurality of connecting parts 220. Accordingly, the base plate 200 has a rigid structure in both the horizontal and vertical directions through the plurality of ribs 205 and the connecting portion 220.

Here, the plurality of ribs 205, as shown in Figure 4, is formed in the form of a rail (rail) is formed with jaws on both sides in the longitudinal direction. That is, each rib 205 has a jaw formed on both sides when viewed in the width direction, and has a structure in which the receiving groove is formed in the longitudinal direction at the center thereof. Accordingly, when the fixing bar 300 having a width corresponding to the width of the receiving groove is positioned on the corresponding rib 205, the fixing bar 300 is precisely and stably fitted to the rib 205 and seated. Therefore, for this purpose, the width of the receiving groove of the rib 205 is preferably formed corresponding to the width of the fixing bar (300).

On the other hand, the thickness of the plurality of ribs 205 and the connecting portion 220 is made thinner than the thickness of the edge portion 230.

As shown in FIG. 1, the edge portion 230 includes a plurality of recesses 210 in which portions extending from the plurality of ribs 205 by a predetermined distance are concave. At this time, the depth of the recess 210 preferably corresponds to the difference between the thickness of the remaining edge portion 230 and the thickness of the bottom surface of the receiving groove of the rib 205.

The base plate 200 of the present invention is preferably made of a ceramic material having novenite or the same thermal expansion coefficient of 3.4 in the thermal expansion coefficient of 100 ℃ condition.

Fixing bar 300 serves to fix the probe in the present invention in the form of a rod, provided with a plurality, such a plurality of fixing bar 300 is a plurality of ribs 205 of the corresponding base plate 200 It is fitted in each and fixed.

As shown in FIG. 4, the fixing bar 300 includes a supporting bar 310, a slit holder 320, and a reinforcing cover part 330.

Here, the support bar 310 has a rod shape as shown in FIG. 2, the length of which is equal to the sum of the lengths of the recesses 210 formed on both sides of the rib 205 to the length of the corresponding rib 205. It is formed to correspond. Accordingly, the support bar 310 is positioned to fit over the rib 205 and the rim 230 area in the base plate 200.

On the other hand, the width of the support bar 310 is made to correspond to the width of the receiving groove of the rib 205 and the width of the recess 210, respectively, the support bar 310 is the receiving groove and the recess of the rib 205 When inserted into 210, the support bar 310 is firmly fixed without play.

And, the support bar 310 is to be coupled to the base plate 200 according to the additional coupling means, this coupling means is not particularly limited, in this embodiment of both sides of the support bar 310 shown in FIG. The bolt hole may be coupled to the recess 210 of the edge 230 of the base plate 200 by bolting. At this time, even if the rotational force generated when the bolt is applied to the support bar 310, the support bar 310 is firmly fixed without play as described above, so the position thereof is not changed.

The support bar 310 firmly supports the slit holder 320 to suppress the slit holder 320 from being twisted, expanded or contracted.

In addition, the support bar 310 is preferably made of a ceramic material having the same thermal expansion coefficient or novenite having a thermal expansion coefficient of 3.4 at 100 ° C.

In addition, a plurality of slits 321 for inserting a probe are formed in the slit holder 320 along the length direction. A plurality of probes are inserted into and fixed to the plurality of slits 321, respectively.

Although the slit holder 320 may be formed in various forms, the slit holder 320 according to an embodiment of the present invention, as shown in Figure 4, a plurality of slits 321 at both ends of the width direction Are formed, the slit 321 is formed in a narrow shape and a deep depth.

In addition, the end portions of both sides of the slit holder 320 in which the slit 321 is formed form a jaw 322, and the receiving groove 323 is formed in the longitudinal direction of the slit holder 320 between these jaws 322 on both sides. Is formed.

Then, the protrusion 331 formed in the longitudinal direction in the center portion of the reinforcing cover portion 330 is located in the receiving groove 323 of the slit holder 320 formed as described above.

In addition, the reinforcement cover part 330 has a rod shape, and the probe is inserted into the slit holder 320 between the slit holder 320 and the reinforcement cover part 330 by pressing the slit holder 320 from above. The pressure 600 is fixed.

The slit holder 320 and the reinforcement cover part 330 are preferably made of mullite having a thermal expansion coefficient of 3.6 at 100 ° C. or a ceramic having the same thermal expansion coefficient.

To this end, the reinforcing cover part 330 is provided at both sides with respect to the projection 331 and the width direction protruding in the longitudinal direction from the center to the width direction so as to contact and press the receiving groove 323 of the slit holder 320. And a pressurizing portion 332 that is positioned to actually press the probe 600 in contact with the probe 600.

At this time, the protruding height of the protrusion 331 with respect to the pressing portion 332 in the reinforcing cover 330, the height of the jaw 322 of the slit holder 320 and the height of the probe 600 for fixing the probe 600 Corresponds to the sum of the heights of the trunk portion 650. Accordingly, the reinforcement cover part 330 can press the probe 600 inserted into the slit holder 320 to an appropriate pressure.

Accordingly, in the present invention, the probe 600 is inserted into the slit 321 and not only fits the jaw 322 of the slit holder 320, but also is pressed by the cover 330, so that the slit holder is more stably and firmly. Coupled to 320.

As such, in the present invention, the fixing bar 300 is stably and firmly coupled to the base plate 200 through the supporting bar 310, and fixes the probe 600 through the slit holder 320, and the cover 330. ) To secure the fixing of the probe 600.

On the other hand, in the present invention, as shown in Figure 3, the connection circuit board 400 is made of a plurality of rods, each of which is inserted in the vertical direction between the plurality of ribs 205 of the base plate 200, respectively. .

Due to the insertion of the connection circuit board 400 to the base plate 200, one side thereof is electrically connected to the probe 600, and the other side thereof is electrically connected to the main circuit board 100. That is, in the present invention, the probe 600 and the main circuit board 100 are electrically connected through the connection circuit board 400.

The connection circuit board 400 may be made of various shapes and materials depending on the purpose, but preferably made of a flexible printed circuit board (FPCB).

1 again, the probe card according to the embodiment of the present invention further includes a cover plate 500 for fixing the fixing bar 300 and the base plate 200.

The cover plate 500 pressurizes the fixing bar 300 and the base plate 200 at the same time from the top to make the fixing bar 300 and the base plate 200 more stable, and to reinforce the fixing bar 300. Not only makes the fixing of the probe 600 by the cover part 330 more stable, but also the pressing of the connection circuit board 400 prevents the connection circuit part 400 from being separated.

The main reinforcement plate 700 is coupled to the lower portion of the main circuit board 100, and the sub reinforcement plate 800 is coupled to the lower portion of the main reinforcement plate 700 to support the main circuit board 100 so as to support the main circuit. The deformation of the substrate 200 such as warpage is prevented.

In addition, a handle (not shown) may be additionally coupled to allow the probe card to be easily manipulated by a probing inspection apparatus for inspecting the wafer using such a probe card.

At this time, the main reinforcement plate 700 is preferably made of nobinite having a thermal expansion coefficient of 3.4 at 100 ° C.

As described above, in the present invention, since the fixing bar 300 has a three-layer structure such as a supporting bar 310, a slit holder 320, and a reinforcing cover part 330, the supporting bar 310 and the slit holder 320 are provided. , And the material of each of the reinforcing cover part 330 can be individually selected, thereby making it possible to precisely adjust the thermal expansion coefficient of the entire fixing bar 300.

In general, the thermal expansion coefficient of the wafer on which the semiconductor chip to be inspected is formed is about 1.2 to 1.5 at a condition of about 100 ° C.

However, as described above, the support bar 310 and the base plate 200 of the fixing bar 300 of the present invention are made of nobinite, and the slit holder 320 and the reinforcing cover part 330 are made of mullite. . However, since the thermal expansion coefficient of the novinite is 3.4 at 100 ° C. and the mullite thermal expansion coefficient is 3.6 at 100 ° C., the thermal expansion coefficient of the base plate 200 to which the fixed bar 300 is coupled is about 3.0 to about 3. Adjusted to 3.5.

However, the probe card of the present invention, in addition to the base plate 200 and the fixed bar 300, as shown in Figures 1 and 3, the main circuit board 100, the connection circuit board 400, the cover plate 500 It further comprises a main reinforcement plate 700, and a secondary reinforcement plate 800.

Accordingly, the thermal expansion coefficient of the probe card in which the main circuit board 100, the connection circuit board 400, the cover plate 500, the main reinforcement plate 700, and the sub reinforcement plate 800 are assembled is a target. Even if it is out of the range of the thermal expansion coefficient of the wafer, the thermal expansion coefficient of the entire probe card can be adjusted to be the same as the thermal expansion coefficient of the wafer by adding the fixed bar 300 in which the thermal expansion coefficient is appropriately adjusted.

Specifically, the thermal expansion coefficient of the probe card in the state in which the main circuit board 100, the connection circuit board 400, the cover plate 500, the main reinforcement plate 700, and the sub reinforcement plate 800 are assembled, is a wafer. Even if the coefficient of thermal expansion is outside of the range, the fixed expansion bar having the thermal expansion coefficient of 3.0 to 3.5 is added to the assembled probe card so that the thermal expansion coefficient of the entire probe card is 1.2 to 1.5, which is about the same as the thermal expansion coefficient of the wafer. It becomes possible.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications can be made within the scope of the technical idea of the present invention, and it is obvious that the present invention belongs to the appended claims. Do.

1 is an exploded perspective view of a probe card according to an embodiment of the present invention.

FIG. 2 shows a state in which a fixing bar is coupled to a base plate fixed to a main circuit board in the probe card of FIG. 1.

FIG. 3 is a view illustrating a state added to the connection circuit board in FIG. 2.

FIG. 4 is a partial perspective view illustrating a support bar, a slit holder, and a reinforcing cover of the fixing bar coupled to the rib of the base plate of FIG. 1.

Claims

In the probe card is electrically connected to the tester and test by contacting the probe to the semiconductor element formed on the wafer,

A main circuit board electrically connecting the plurality of probes to the tester;

A base plate positioned above the main circuit board and formed of a novinite or ceramic material having a thermal expansion coefficient of 3.4 at a temperature of 100 ° C .; And

A base bar made of novenite or ceramic material having a thermal expansion coefficient of 3.4 at 100 ° C. and fitted to the base plate, and a mullite or ceramic material having a thermal expansion coefficient of 3.6 at 100 ° C. And a slit holder having a plurality of slits, and a slit holder and a reinforcement cover part which presses the slit holder and the probe inserted into the slit from the top and has a thermal expansion coefficient of 3.6 in mullite or ceramic material at a temperature of 100 ° C., A plurality of fixed bars whose thermal expansion coefficient is adjusted to 3.0 to 3.5 under conditions of 100 ° C .;

Probe card comprising a.

The method of claim 1,

A plurality of connection circuit boards inserted in the direction perpendicular to the base plate to electrically connect the probe and the main circuit board;

Pressurizing the plurality of fixing bars, the plurality of connecting circuit boards, and the base plate to secure the coupling between the plurality of fixing bars and the base play, and coupling the plurality of connecting circuit boards with the base play. A cover plate, characterized in that to firmly;

A main reinforcing plate positioned under the main circuit board and supporting the main circuit board; And

A sub reinforcing plate positioned below the main reinforcing plate and supporting the main circuit board;

More,

The probe card, characterized in that the total thermal expansion coefficient is adjusted to 1.2 to 1.5 at 100 ℃ conditions.