KR20100061028A - Chemical mixing apparatus - Google Patents
Chemical mixing apparatus Download PDFInfo
- Publication number
- KR20100061028A KR20100061028A KR1020080119898A KR20080119898A KR20100061028A KR 20100061028 A KR20100061028 A KR 20100061028A KR 1020080119898 A KR1020080119898 A KR 1020080119898A KR 20080119898 A KR20080119898 A KR 20080119898A KR 20100061028 A KR20100061028 A KR 20100061028A
- Authority
- KR
- South Korea
- Prior art keywords
- cleaning liquid
- mixing tank
- mixing
- ipa
- nitrogen gas
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cleaning liquid mixing apparatus, and more particularly, to a cleaning liquid mixing apparatus capable of shortening the time required for mixing a cleaning liquid required for cleaning a semiconductor wafer to a predetermined concentration.
In the cleaning liquid mixing apparatus according to the embodiment of the present invention, an IPA supplied through a separate pipe from the outside and a mixing tank in which ultrapure water is stored, and a nitrogen gas supplied from the outside are injected into the mixing tank to generate bubbles. As a result, the bubble generator includes a bubble generator for smoothly mixing IPA and ultrapure water in the mixing tank by the bubbles.
Description
The present invention relates to a cleaning liquid mixing apparatus, and more particularly, to a cleaning liquid supply apparatus capable of shortening the time for mixing the cleaning liquid when mixing the cleaning liquid required to clean the semiconductor wafer, and improving the mixing effect of the cleaning liquid. It is about.
Generally, a semiconductor device is manufactured by forming a predetermined film on a wafer and forming the film in a pattern having electrical properties. The pattern is formed by sequential or repeated performance of unit processes such as film formation, photolithography, etching, ion implantation, polishing, and the like. During the process described above, foreign substances such as compounds or dusts remain on the surface of the wafer, which may cause malfunction of semiconductor devices or other various problems.
Therefore, in order to improve the quality of the semiconductor device, a cleaning process must be performed. Conventional cleaning methods may be classified into wet scrubbing using chemical liquids, dry scrubbing using gases, mechanical cleaning using fine particles, and the like. Among these methods, a wet cleaning method also includes a method using an IPA mixed solution which cleans a wafer using a cleaning solution obtained by mixing IPA (Iso Propyl Alcohol) and ultrapure water (DIW: Deionized Water) at a predetermined concentration.
In general, the mixing device for mixing IPA and ultrapure water is a nozzle for mixing the first mixing tank and the second mixing tank, the circulation unit, the chemical liquid of the first mixing tank and the chemical liquid of the second mixing tank mixed with IPA and ultrapure water supplied from the outside. It may include a supply unit for supplying to.
IPA and ultrapure water are respectively supplied to the first mixing tank and the second mixing tank, and the other mixing tank is ready for the cleaning liquid exchange while the cleaning liquid is supplied from the mixing tank to the nozzle.
The circulation unit circulates the cleaning liquid of the first mixing tank and the cleaning liquid of the second mixing tank with each other, or circulates the cleaning liquid in each of the mixing tanks so that the IPA and the ultrapure water in the mixing tank can be smoothly mixed. To this end, the circulation part may include a pump. When mixing IPA and ultrapure water using a pump as in the related art, there is a problem in that it takes a long time to mix the cleaning liquid.
The present invention has been made to solve the above problems, when mixing the cleaning liquid for cleaning the semiconductor element, it is possible to shorten the time that the cleaning liquid is mixed, the cleaning liquid mixing apparatus that can improve the mixing effect of the cleaning liquid The purpose is to provide.
The objects of the present invention are not limited to the above-mentioned objects, and other objects that are not mentioned will be clearly understood by those skilled in the art from the following description.
In order to achieve the above object, the cleaning liquid mixing apparatus according to an embodiment of the present invention is a mixing tank in which the IPA and ultrapure water is stored, and nitrogen gas supplied from the outside into the mixing tank By injecting bubbles to be generated, the bubble generator includes a bubble generator to smoothly mix the IPA and ultrapure water in the mixing tank by the bubbles.
Specific details of other embodiments are included in the detailed description and the drawings.
According to the washing | cleaning liquid mixing apparatus by this invention, there exist one or more of the following effects.
First, the time required for mixing the cleaning liquid can be shortened.
Second, it is possible to improve the mixing effect of the cleaning liquid, thereby improving the quality of the semiconductor device.
The effects of the present invention are not limited to the above-mentioned effects, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.
Specific details of other embodiments are included in the detailed description and the drawings. Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various different forms, and only the embodiments make the disclosure of the present invention complete, and the general knowledge in the art to which the present invention belongs. It is provided to fully inform the person having the scope of the invention, which is defined only by the scope of the claims. Like reference numerals refer to like elements throughout.
Hereinafter, the cleaning solution mixing apparatus according to the embodiment of the present invention with reference to the accompanying drawings will be described in detail.
1 is a view schematically showing the configuration of a cleaning liquid mixing device according to an embodiment of the present invention.
As shown in FIG. 1, the cleaning solution mixing apparatus according to an embodiment of the present invention is mixed by the cleaning
The cleaning
The ultrapure
One or
According to one embodiment of the present invention, each mixing tank is connected to the nitrogen gas supply unit 1 through the nitrogen
On the other hand, the nitrogen
Specifically, when the nitrogen
In addition, the cleaning
The cleaning
The
The
The
The
In the above-described example, the case where the cleaning liquid mixing device includes two mixing
Although embodiments of the present invention have been described above with reference to the accompanying drawings, those skilled in the art to which the present invention pertains have various permutations and modifications without departing from the spirit and essential features of the present invention. It is to be understood that the present invention may be practiced in other specific forms, since modifications may be made. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. The scope of the present invention is shown by the following claims rather than the above description, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included in the scope of the present invention. do.
1 is a view schematically showing the configuration of a cleaning liquid mixing device according to an embodiment of the present invention.
2 is a view schematically showing the configuration of a cleaning liquid mixing device according to another embodiment of the present invention.
<Explanation of symbols for the main parts of the drawings>
10: nitrogen gas supply piping 11: nitrogen gas supply valve
20: IPA supply piping 21: IPA supply valve
50: first mixing
52, 62: bubble generator 60: second mixing tank
70: cleaning
80: cleaning liquid supply part 81: pump
82: filter 83: IPA densitometer
90: nozzle
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080119898A KR20100061028A (en) | 2008-11-28 | 2008-11-28 | Chemical mixing apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080119898A KR20100061028A (en) | 2008-11-28 | 2008-11-28 | Chemical mixing apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20100061028A true KR20100061028A (en) | 2010-06-07 |
Family
ID=42361876
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080119898A KR20100061028A (en) | 2008-11-28 | 2008-11-28 | Chemical mixing apparatus |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR20100061028A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108273797A (en) * | 2018-03-26 | 2018-07-13 | 中山翰荣新材料有限公司 | Automatic cleaning equipment with novel drive structure |
-
2008
- 2008-11-28 KR KR1020080119898A patent/KR20100061028A/en not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108273797A (en) * | 2018-03-26 | 2018-07-13 | 中山翰荣新材料有限公司 | Automatic cleaning equipment with novel drive structure |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101514863B1 (en) | Cleaning water for electronic material, method of cleaning electronic material, and system for supplying water containing dissolved gases | |
US20090145463A1 (en) | Ozonated water mixture supply apparatus and method, and substrate treating facility with the apparatus | |
TWI402902B (en) | Substrate treating apparatus and substrate treating method | |
US20060021634A1 (en) | Method and apparatus for creating ozonated process solutions having high ozone concentration | |
KR20080087690A (en) | Substrate treating apparatus | |
US20050133066A1 (en) | Substrate treating method and apparatus | |
US20110220157A1 (en) | Substrate processing apparatus, substrate processing method, and storage medium storing a computer program for performing substrate processing method | |
KR100625320B1 (en) | Apparatus for supplying functional water of substrate cleaning equipment | |
JP2004014642A (en) | Cleaning method and cleaning equipment | |
KR20100061028A (en) | Chemical mixing apparatus | |
US20090087566A1 (en) | Substrate treating apparatus and substrate treating method | |
JP2007035733A (en) | Chemical processing apparatus | |
KR100683273B1 (en) | Apparatus for supplying chemical liquor | |
KR100794585B1 (en) | Apparatus and method for wet cleaning | |
JP7423980B2 (en) | Wafer surface cleaning device and wafer surface cleaning method | |
JP2008159977A (en) | Apparatus for treating substrate | |
JP4475781B2 (en) | Substrate processing equipment | |
KR100479310B1 (en) | Method for rinsing cleaned object and apparatus therefor | |
KR100895965B1 (en) | Wet station | |
JP6099996B2 (en) | Cleaning method and cleaning apparatus using ozone water | |
KR20080096065A (en) | Substrate cleaning apparatus and method | |
KR100549203B1 (en) | Method and apparatus for wafer transaction | |
KR20040032200A (en) | Apparatus for washing and drying wafer and method of washing and drying wafer using that | |
JP4294271B2 (en) | Washing water manufacturing apparatus for electronic material and method for manufacturing the cleaning water | |
JP4767205B2 (en) | Substrate processing equipment |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |