KR20100059237A - Unit for transferring a substrate and apparatus for baking a substrate having the unit - Google Patents

Unit for transferring a substrate and apparatus for baking a substrate having the unit Download PDF

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Publication number
KR20100059237A
KR20100059237A KR1020080117934A KR20080117934A KR20100059237A KR 20100059237 A KR20100059237 A KR 20100059237A KR 1020080117934 A KR1020080117934 A KR 1020080117934A KR 20080117934 A KR20080117934 A KR 20080117934A KR 20100059237 A KR20100059237 A KR 20100059237A
Authority
KR
South Korea
Prior art keywords
substrate
vacuum
unit
rollers
transfer unit
Prior art date
Application number
KR1020080117934A
Other languages
Korean (ko)
Inventor
김성희
Original Assignee
세메스 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세메스 주식회사 filed Critical 세메스 주식회사
Priority to KR1020080117934A priority Critical patent/KR20100059237A/en
Publication of KR20100059237A publication Critical patent/KR20100059237A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE: A substrate transferring unit and a bake apparatus including the same are provided to prevent the slide of a substrate by vacuum-absorbing the substrate in process of a transferring process. CONSTITUTION: A plurality of rotary shafts(110) is arranged to a horizontal direction. A plurality of rollers(120) is installed on the rotary shafts. The rollers transfer a substrate by rotating the rotary shafts. The rollers include a plurality of vacuum holes(120a) for absorbing the substrate. A vacuum supplying unit(140) supplies vacuum. A driving unit rotates the rotary shafts.

Description

Unit for transferring a substrate and apparatus for baking a substrate having the unit

The present invention relates to a substrate transfer unit and a baking apparatus having the same, and more particularly, to a substrate transfer unit and a baking apparatus having the same using a roller.

In general, a flat substrate such as a glass substrate is used to manufacture a flat panel display such as a liquid crystal display, and various unit processes for forming circuit patterns on the glass substrate may be performed. For example, a deposition process for forming a film on the glass substrate, an etching process for forming the film into desired patterns, a cleaning process for removing impurities on the glass substrate, a drying process for drying the glass substrate, and the like. This can be done.

The substrate may be transferred to a chamber in which the unit processes are performed by a substrate transfer unit to perform the unit processes, or the unit processes may be performed while being transferred by the substrate transfer unit in the chamber.

The substrate transfer unit includes a rotating shaft that is rotated by a driving unit and a plurality of rollers fixed to the rotating shaft to support the substrate and transferring the substrate in the conveying direction according to the rotation of the rotating shaft.

However, it may slip on the substrate and the rollers and the substrate transfer unit may not accurately transfer the substrate.

O-rings may be provided along the outer circumferential surface of the rollers to prevent slippage of the substrate and increase friction with the substrate. However, when the substrate transfer unit is used in a high temperature condition such as a baking apparatus, the material of the O-ring is limited, and the price of the O-ring becomes high.

The present invention provides a substrate transfer unit for transferring a substrate without slipping at a high temperature condition.

The present invention provides a baking apparatus having the substrate transfer unit.

The substrate transfer unit according to the present invention is arranged in a horizontal direction and is mounted to the plurality of rotating shafts extending in another horizontal direction perpendicular to the horizontal direction and the rotating shafts to support the substrate, and according to the rotation of the rotating shaft. The substrate may include a plurality of rollers each having a plurality of vacuum holes for adsorbing the substrate along a contact surface with the substrate to transfer the substrate and to prevent the substrate from slipping.

According to one embodiment of the present invention, the substrate transfer unit may further include a vacuum providing unit connected to the vacuum holes and providing a vacuum force to the vacuum holes.

According to one embodiment of the present invention, each of the rotating shafts has an inner space connected to the vacuum holes, the vacuum providing unit may be connected to the vacuum holes through the inner space.

According to one embodiment of the present invention, each of the rollers may have a groove passing through the vacuum holes on the outer peripheral surface.

According to one embodiment of the present invention, the substrate transfer unit may be connected to the rotating shafts, and may further include a driving unit for rotating the rotating shafts.

The baking apparatus according to the present invention is arranged in a horizontal direction and is mounted in a plurality of rotating shafts extending in another horizontal direction perpendicular to the horizontal direction and the rotating shafts to support the substrate, and the substrate is rotated according to the rotation of the rotating shaft. The substrate transfer unit and the substrate transfer unit including a plurality of rollers each having a plurality of vacuum holes for adsorbing the substrate along a contact surface with the substrate to prevent the substrate from slipping. And a heater unit for heating the substrate.

According to one embodiment of the present invention, the heater unit may include a first heater disposed between the rotating shafts.

According to one embodiment of the present invention, the heater unit may further include a second heater provided on the rotating shaft.

The substrate transfer unit according to the present invention has a vacuum hole formed in the roller. Since the roller transports the substrate by vacuum suction, it is possible to prevent the substrate from slipping. Thus, the transfer accuracy of the substrate transfer unit can be improved.

In addition, since the roller adsorbs the substrate using a vacuum, the substrate transfer unit can be used even at a high temperature condition.

Hereinafter, a substrate transfer unit and a baking apparatus having the same according to embodiments of the present invention will be described in detail with reference to the accompanying drawings. As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. Like reference numerals are used for like elements in describing each drawing. In the accompanying drawings, the dimensions of the structures are shown in an enlarged scale than actual for clarity of the invention.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described in the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

1 is a plan view for explaining a substrate transfer unit according to an embodiment of the present invention, Figure 2 is a schematic cross-sectional view for explaining the rotating shaft and the roller shown in Figure 1, Figure 3 is a roller shown in Figure 1 It is a schematic sectional drawing for demonstrating.

1 to 3, the substrate transfer unit 100 transfers the substrate 10 in a first horizontal direction. The substrate 10 may be a glass substrate for manufacturing a flat panel display device or a semiconductor substrate for manufacturing a semiconductor device.

The substrate transfer unit 100 includes a plurality of rotating shafts 110, a plurality of rollers 120 mounted on the rotating shafts 110 to support the substrate 10 and having vacuum holes 120a, and the rotating shafts. It may include a driving unit 130 for rotating the (110) and the vacuum providing unit 140 for providing a vacuum force to the vacuum holes (120a).

The rotation shafts 110 are arranged in the first horizontal direction and extend in a second horizontal direction perpendicular to the first horizontal direction. The rotation shafts 110 are spaced apart from each other in the first horizontal direction.

The rotation shafts 110 have an inner space 110a. The internal space 110a extends in the extending direction of the rotation shaft 110. For example, the rotation shafts 110 may have a pipe shape.

On the other hand, the rotary shaft 110 may be provided with a heater (not shown) or a heat insulating member (not shown). The temperature of the internal space 110a may be lowered due to the vacuum force provided by the vacuum providing unit 140. The heater may be embedded in the rotation shafts 110 or provided at an outer surface of the heater to prevent a temperature drop of the rotation shafts 110. The heat insulation member is embedded in the rotation shafts 110 to surround the internal space 110a. The insulation member may prevent thermal diffusion to prevent the temperature of the rotation shafts 110 from being lowered.

The support frame 112 supports both ends of the rotation shafts 110. A bearing 114 is provided between the rotation shafts 110 and the support frame 112 to reduce friction between the rotation shafts 110 and the support frame 114. Therefore, the rotation shafts 110 can be easily rotated.

The rollers 120 are provided on the respective rotation shafts 110. The rollers 120 may be integrally provided with the respective rotation shafts 110. The rollers 120 contact the lower surface of the substrate 10 to transfer the substrate. For example, as the rotary shafts 110 rotate, the rollers 120 rotate, and the substrate 10 is transferred in the first direction by the rotation of the rollers 120.

Each roller 120 has a plurality of vacuum holes (120). The vacuum holes 120 extend radially along the radial direction with respect to the center of rotation of the roller 120. The vacuum holes 120 may be connected to the internal space 110a of the rotation shafts 110. Therefore, the vacuum holes 120 are disposed along the outer circumferential surface of the roller 120.

The vacuum force may be provided through the vacuum hole 120. When the rollers 120 and the substrate 10 are in contact with each other, the substrate 10 may be instantly adsorbed by a vacuum force provided through the vacuum hole 120. Accordingly, the substrate 10 may be accurately transported by preventing the substrate 10 from slipping on the rollers 120. In addition, since the substrate 10 is adsorbed by the vacuum force, the substrate 10 can be prevented from slipping even at a high temperature.

For example, the vacuum holes 120 may have a circular shape. As another example, the vacuum holes 120 may have an ellipse shape extending along the circumferential direction of the rollers 120. When the vacuum holes 120 have the elliptic shape, the contact area between the vacuum holes 120 and the substrate 10 may increase.

When the diameter of the vacuum hole 120 exceeds about 0.2 mm, the diameter of the vacuum hole 120 is relatively large, and thus the substrate 10 may not be sufficiently absorbed by the vacuum force. When the diameter (a) of the vacuum hole 120 is less than about 0.1 mm, the adsorption of the rollers 120 and the substrate 10 is strong, so that the substrate 10 may not be separated from the roller 120. have. Therefore, the diameter (a) of the vacuum hole 120 is preferably about 0.1 to 0.2 mm. When the elliptic shape of the vacuum hole 120 has a shape, a short width a of the vacuum hole 120 may be about 0.1 mm to about 0.2 mm.

When the distance b between the vacuum holes 120 on the outer circumferential surface of the rollers 120 exceeds about 0.2 mm, the distance between the vacuum holes 120 is relatively wide so that the rollers 120 The substrate 10 may not be adsorbed. That is, when the substrate 10 comes into contact with the roller 120 between the vacuum holes 120, slippage of the substrate 10 may occur. When the space b between the vacuum holes 120 is less than about 0.1 mm, it is difficult to process the vacuum holes 120 in the rollers 120. Therefore, the distance b between the vacuum holes 120 on the outer circumferential surface of the rollers 120 is preferably about 0.1 to 0.2 mm.

4 is a schematic plan view for describing another example of the roller illustrated in FIG. 1.

Referring to FIG. 4, the roller 120 has a groove 120b formed along an outer circumferential surface thereof. The groove 120b passes through the vacuum hole 120a disposed along the outer circumferential surface of the roller 120. The vacuum force for adsorbing the substrate 10 is partially leaked through the groove 120b. Therefore, the phenomenon in which the substrate 10 adsorbed to the rollers 120 is not separated can be prevented.

When the depth c of the groove 120b exceeds about 0.1 mm, the vacuum force of the vacuum holes 120 leaks through the groove 120b, so that the substrate 10 is rotated by the roller 120. May not be adsorbed to the field. When the depth c of the groove 120b is less than about 0.02 mm, the vacuum leakage effect of the groove 120b is insignificant and the substrate 10 may not be separated by being adsorbed by the rollers 120. Therefore, the depth c of the groove 120b is preferably about 0.05 to 0.1 mm.

Referring back to FIGS. 1 to 3, the driving unit 130 is for rotating the rotating shafts 110 and includes a motor 132, a driving shaft 134, and a worm gear 140.

The motor 132 generates a rotational force. For example, the motor 132 may be a servo motor capable of precisely controlling the rotational force.

The drive shaft 134 extends in the first direction. The drive shaft 134 is connected to the motor 132, and rotates by the rotational force of the motor 132.

The worm gear 136 includes a worm and a worm wheel. The worm is provided on the drive shaft 134. The worm has one or more threads. The worm wheels are respectively provided at one end of the rotation shafts 110. The worm wheel has a plurality of gear teeth on the outer circumferential surface. The gear tooth meshes with the thread.

The worm gear 136 connects the drive shaft 134 and the rotation shaft 110. The worm gear 136 transmits the rotational force of the drive shaft 134 to the rotation shaft (110). That is, the worm gear 136 rotates the rotating shafts 110 by transmitting rotational force between the driving shaft 132 and the rotating shafts 110 disposed perpendicular to each other.

On the other hand, the drive unit 130 may include a motor, belts and pulleys (pulleys). The pulleys are respectively provided at one end of the rotation shafts 110, and belts are interposed between the pulleys. The driving force of the motor is transmitted to the respective rotating shafts 110 through the pulleys and the belts. Thus, each of the rotating shafts 110 rotates in the same direction.

The vacuum providing unit 140 includes a vacuum pump 142 and a vacuum pipe 144.

The vacuum pump 142 generates a vacuum force through a pumping operation.

The vacuum pipe 144 extends along the first horizontal direction and is coupled to the other ends of the rotary shafts 110 to communicate with the internal space 110a of the rotary shafts 110. The vacuum pipe 144 and the rotation shaft 110 may be connected using a rotary joint.

The vacuum force generated by the vacuum pump 142 is provided to the vacuum holes 120a through the vacuum pipe 144 and the inner space 110a of the rotating shafts 110. Thus, the substrate 10 may be adsorbed onto the rollers 120.

5 is a plan view for explaining a baking apparatus according to an embodiment of the present invention, Figure 6 is a schematic cross-sectional view for explaining the rotating shaft and the roller shown in FIG.

5 and 6, the baking apparatus 200 includes a substrate transfer unit 202 for transferring the substrate 10 and a heater unit 204 for heating the transferred substrate 10. .

The substrate transfer unit 202 includes a plurality of rotating shafts 210, a plurality of rollers 220 mounted on the rotating shafts 210 to support the substrate 10 and having vacuum holes 220a, and the rotating shafts. And a driving unit 230 for rotating the 210 and a vacuum providing unit 240 for providing a vacuum force to the vacuum holes 220a.

Detailed descriptions of the rotating shafts 210, the rollers 220, the driving unit 230, and the vacuum providing unit 240 may include the rotating shafts 110, the rollers 120, and the driving unit with reference to FIGS. 1 to 4. It is substantially the same as the description of the 130 and the vacuum providing unit 140.

The heater unit 204 includes a first heater 250 and a second heater 260.

The first heater 250 is disposed between the rotating shafts 210. An example of the first heater 250 may include a heating plate. The first heater 250 may be disposed to be adjacent to the substrate 10 transferred by the substrate transfer unit 202. Therefore, the efficiency of the first heater 250 can be improved.

The first heater 250 may maintain a constant temperature of the substrate 10 or may cure the photoresist film formed on the substrate 10.

The second heater 260 is provided on the rotation shafts 110, respectively. As shown in FIG. 2, the second heater 260 may be built in the rotation shafts 110. As another example, the second heater 260 may be provided on the outer surfaces of the rotation shafts 110.

The second heater 260 may maintain a constant temperature of the substrate 10 transferred by the substrate transfer unit 202 or may cure the photoresist film formed on the substrate 10.

In addition, since the second heater 260 heats the substrate 10 between the first heaters 250, the second heater 260 may prevent the substrate 110 from being unevenly heated by the first heater 250. Can be.

On the other hand, the temperature in the vacuum holes 120a and the internal space 110a may be lowered due to the pressure drop due to the vacuum force. The second heater 260 may prevent the temperature drop by heating the vacuum holes 120a and the internal space 110a.

The substrate transfer unit according to the present invention has a vacuum hole formed in the roller. Since the roller transports the substrate by vacuum suction, it is possible to prevent the substrate from slipping. Thus, the transfer accuracy of the substrate transfer unit can be improved.

In addition, since the roller adsorbs the substrate using a vacuum, the substrate transfer unit can be used even at a high temperature condition.

While the foregoing has been described with reference to preferred embodiments of the present invention, those skilled in the art will be able to variously modify and change the present invention without departing from the spirit and scope of the invention as set forth in the claims below. It will be appreciated.

1 is a plan view illustrating a substrate transfer unit according to an exemplary embodiment of the present invention.

FIG. 2 is a schematic cross-sectional view for describing the rotating shaft and the roller shown in FIG. 1.

FIG. 3 is a schematic cross-sectional view for explaining the roller shown in FIG. 1.

4 is a schematic plan view for describing another example of the roller illustrated in FIG. 1.

5 is a plan view illustrating a baking apparatus according to an embodiment of the present invention.

FIG. 6 is a schematic cross-sectional view for describing the rotating shaft and the roller shown in FIG. 5.

Explanation of symbols on the main parts of the drawings

100: substrate transfer unit 110: rotation axis

110a: internal space 120: roller

120a: vacuum hole 130: drive unit

140: vacuum providing unit S: substrate

Claims (8)

A plurality of rotation axes arranged in a horizontal direction and extending in another horizontal direction perpendicular to the horizontal direction; And A plurality of vacuum holes mounted on the rotation shafts to support the substrate, transfer the substrate according to the rotation of the rotation shaft, and adsorb the substrate along the contact surface with the substrate to prevent the substrate from slipping. A substrate transfer unit comprising a plurality of rollers each having. The substrate transfer unit of claim 1, further comprising a vacuum providing unit connected to the vacuum holes and providing a vacuum force to the vacuum holes. The substrate transport apparatus of claim 2, wherein the rotation shafts each have an internal space connected to the vacuum holes, and the vacuum providing unit is connected to the vacuum holes through the internal space. The substrate transfer unit of claim 1, wherein each of the rollers has a groove passing through the vacuum holes on an outer circumferential surface thereof. The substrate transfer unit of claim 1, further comprising a driving unit connected to the rotation shafts and configured to rotate the rotation shafts. A plurality of rotating shafts arranged in a horizontal direction and extending in another horizontal direction perpendicular to the horizontal direction and mounted to the rotating shafts to support the substrate, and transfer the substrate according to the rotation of the rotating shaft, A substrate transfer unit including a plurality of rollers each having a plurality of vacuum holes for adsorbing the substrate along a contact surface with the substrate to prevent slippage; And And a heater unit for heating the substrate conveyed by the substrate transfer unit. The baking apparatus according to claim 6, wherein the heater unit includes a first heater disposed between the rotation shafts. The baking apparatus according to claim 7, wherein the heater unit further comprises a second heater provided on the rotating shaft.
KR1020080117934A 2008-11-26 2008-11-26 Unit for transferring a substrate and apparatus for baking a substrate having the unit KR20100059237A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020080117934A KR20100059237A (en) 2008-11-26 2008-11-26 Unit for transferring a substrate and apparatus for baking a substrate having the unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020080117934A KR20100059237A (en) 2008-11-26 2008-11-26 Unit for transferring a substrate and apparatus for baking a substrate having the unit

Publications (1)

Publication Number Publication Date
KR20100059237A true KR20100059237A (en) 2010-06-04

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KR1020080117934A KR20100059237A (en) 2008-11-26 2008-11-26 Unit for transferring a substrate and apparatus for baking a substrate having the unit

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