KR20100054519A - Spin head supporting and rotating the substrate - Google Patents

Spin head supporting and rotating the substrate Download PDF

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Publication number
KR20100054519A
KR20100054519A KR1020080113478A KR20080113478A KR20100054519A KR 20100054519 A KR20100054519 A KR 20100054519A KR 1020080113478 A KR1020080113478 A KR 1020080113478A KR 20080113478 A KR20080113478 A KR 20080113478A KR 20100054519 A KR20100054519 A KR 20100054519A
Authority
KR
South Korea
Prior art keywords
substrate
plate
rotating
present
eccentricity
Prior art date
Application number
KR1020080113478A
Other languages
Korean (ko)
Inventor
임정수
Original Assignee
세메스 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 세메스 주식회사 filed Critical 세메스 주식회사
Priority to KR1020080113478A priority Critical patent/KR20100054519A/en
Publication of KR20100054519A publication Critical patent/KR20100054519A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A substrate rotating device is provided. Substrate rotating apparatus according to an embodiment of the present invention includes a circular plate for fixing the substrate on the top, a rotating portion for rotating the plate, formed in the lower portion of the plate in the form of a ring, the eccentric correction unit is inserted into the filling that can flow therein do.

Description

Spin head supporting and rotating the substrate

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate rotating apparatus, and more particularly, to a spin head for supporting and rotating a substrate in a manufacturing process of a semiconductor substrate.

The semiconductor manufacturing process forms a desired pattern on a substrate such as a semiconductor substrate, a glass substrate, or a liquid crystal panel through various processes.

Currently, in the etching process and the cleaning process, a process of removing residues or thin films on the substrate by spinning the substrate is performed. At this time, a spinning operation is performed while supplying deionized water or etching liquid or cleaning liquid while rotating the substrate to several thousand RPM. Of course, the process performed while spinning the substrate is used in various kinds of semiconductor manufacturing processes such as photoresist process as well as the cleaning process.

At this time, the substrate is fixed to the plate supporting the substrate to rotate as the plate rotates. The substrate rotating apparatus including the plate includes several structures therein, so that the weight may be unbalanced with respect to the center of rotation. Therefore, eccentricity occurs when rotating. Due to the eccentricity, vibration may occur in the substrate during rotation, and it becomes difficult to rotate the substrate at a uniform speed.

In order to correct the eccentricity, a hole or a weight is attached to the substrate rotating apparatus. In this method, it is difficult to precisely correct and there is a problem in that the difference in the correction is large according to the skill of the operator.

The present invention was devised to improve the above problems, and an object of the present invention is to form a tube in which the flowable filler is inserted into the substrate rotating apparatus to move the filling inside by centrifugal force. To correct the eccentricity of.

The objects of the present invention are not limited to the above-mentioned objects, and other objects that are not mentioned will be clearly understood by those skilled in the art from the following description.

In order to achieve the above object, a substrate rotating apparatus according to an embodiment of the present invention comprises a circular plate for fixing the substrate on the top; Rotating part for rotating the plate; It is formed in the lower portion of the plate in the form of a ring, and includes an eccentricity correction portion is inserted into the filling that can flow therein.

According to the substrate rotating apparatus of the present invention as described above has one or more of the following effects.

First, there is an advantage that the eccentricity can be automatically corrected according to the rotational speed of the substrate rotating apparatus by moving the filling material inserted therein according to the rotation of the substrate rotating apparatus by the centrifugal force to a point where the weight is imbalanced.

Second, there is an advantage that the eccentricity can be corrected accurately according to the rotational speed of the substrate regardless of the skill of the operator.

Details of the embodiments are included in the detailed description and drawings.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various different forms, and only the embodiments make the disclosure of the present invention complete, and the general knowledge in the art to which the present invention belongs. It is provided to fully inform the person having the scope of the invention, which is defined only by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

Hereinafter, the present invention will be described with reference to the drawings for describing a substrate rotating apparatus according to embodiments of the present invention.

1 is a plan view of a substrate rotating apparatus according to an embodiment of the present invention, Figure 2 is a side view of a substrate rotating apparatus according to an embodiment of the present invention, Figure 3 is a substrate rotation according to another embodiment of the present invention Side view of the device.

The substrate rotating apparatus according to the exemplary embodiment of the present invention may include a plate 110, a rotating unit 120, and an eccentric correction unit 130.

The plate 110 is fixed to the substrate (S) at the top in a circular shape and is rotated around the rotating shaft 112 connected to the plate 110 by receiving power by the rotating unit 120. Therefore, as the plate 110 rotates, the substrate S fixed to the plate 110 rotates together.

When the substrate S is fixed in detail, the support pin 114 supporting the bottom surface of the substrate S is disposed on the upper portion of the plate 110 at a predetermined interval.

In addition, the chucking pins 116 are formed to fix the substrate S. The chucking pins 116 apply a force to the side surface of the substrate S to fix the substrate S. As shown, the chucking pins 116 are arranged in a predetermined number at predetermined intervals along the circle at the edge of the substrate, and each chucking pin 116 is formed by a separate driving device (not shown). 110 can be moved in the direction of the center. Therefore, after the substrate S is lifted up on the support pin 114 by the substrate transfer robot, each chucking pin 116 at the edge of the substrate S is moved to the center of the plate 110 by the moving means. The force is applied while contacting the edge of the substrate (S) while moving toward, thereby fixing the substrate (S) by the chucking pin (116).

The rotating unit 120 generates power to rotate the plate 110 to rotate the plate 110. The rotating unit 120 may be formed of a motor, and the like, by connecting the shaft shaft 122 of the motor with the rotating shaft 112 that connects the center of the plate 110 to rotate the plate 110 by the rotation of the motor. have. The shaft shaft 122 of the motor may be directly connected to the rotating shaft 112 of the plate 110 or may be connected to a belt or the like to transmit power.

The eccentric correction unit 130 is formed in the lower portion of the plate 110 in the form of a ring. For example, the eccentricity correction unit 130 may be formed of a rubber tube. Preferably, the center of the eccentric correction unit 130 and the center of the plate 110 should be formed to match.

The filling 132 is inserted into the eccentric correction unit 130, and the filling 132 may include a solid or liquid material that can move freely therein. Liquid materials may include, but are not limited to, water, mercury, oil, and the like. In addition, a spherical substance may be inserted into the solid substance. For example, a spherical iron ball can be inserted.

2 and 3, the cross section of the eccentricity correcting unit 130 may have a circular or triangular shape. In the case of having a circular cross section, a circular groove may be formed along the lower side of the plate 110, and an eccentric correction unit 130 having a circular cross-sectional area may be inserted and fixed in the circular groove. Even when it has a triangular cross-sectional area, as shown in FIG. 4, the eccentric correction unit 130 may be inserted into and fixed to the groove formed in the lower side of the plate 110. The shape of the cross section of the eccentric correction unit is not limited thereto and may be variously changed.

Hereinafter, an operation of the substrate rotating apparatus according to an embodiment of the present invention will be described with reference to FIGS. 4 and 5.

4 and 5 are views showing the movement of the filling 132 according to the eccentricity when the filling 132 inserted into the eccentricity correcting unit 130 is a spherical material in the substrate rotating apparatus according to an embodiment of the present invention. to be.

First, the substrate S is loaded by a substrate transfer robot (not shown), and then the substrate S is placed on the support pin 114 formed on the plate 110. After the substrate S is placed on the support pin S, the chucking pins 116 formed around the substrate S move toward the center of the substrate S to contact the side surface of the substrate S to exert a force. The substrate S is fixed by the addition.

After the substrate S is fixed by the chucking pins 116, the plate 110 is rotated by receiving power from the rotating unit 120. Therefore, the substrate S fixed to the plate 110 rotates together. At this time, the substrate rotating apparatus including the plate 110 has an eccentricity when rotating because the weight is not distributed evenly around the center of rotation so that the substrate S rotates or rotates at a constant speed. I can't.

However, in the present invention, as described above, the eccentricity correction unit 130 including the filling material 132 is formed therein to correct the eccentricity of the substrate rotating apparatus. As shown in FIGS. 4 and 5, when eccentricity occurs in a specific direction while the substrate rotating device rotates, the filling 132 inserted into the eccentricity correction unit also moves in the opposite direction in which eccentricity is generated by centrifugal force. . Therefore, the filling material 132 inserted into the eccentricity correction unit 130 in accordance with the eccentricity can be corrected while moving automatically according to the rotational speed of the substrate rotating apparatus.

Those skilled in the art will appreciate that the present invention can be embodied in other specific forms without changing the technical spirit or essential features of the present invention. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. The scope of the present invention is indicated by the scope of the following claims rather than the detailed description, and all changes or modifications derived from the meaning and scope of the claims and equivalent concepts are included in the scope of the present invention. Should be interpreted as

1 is a plan view of a substrate rotating apparatus according to an embodiment of the present invention.

2 is a side view of a substrate rotating apparatus according to an embodiment of the present invention.

3 is a side view of a substrate rotating apparatus according to another embodiment of the present invention.

4 and 5 are views showing the movement of the filling according to the eccentricity when the filling inserted in the eccentricity correction unit in the substrate rotating apparatus according to an embodiment of the present invention is a spherical material.

<Explanation of symbols for the main parts of the drawings>

110: plate

114: support pin

116: chucking pin

120: rotating part

130: eccentricity correction unit

132: filling

Claims (5)

A circular plate for fixing the substrate thereon; Rotating part for rotating the plate; It is formed in the lower portion of the plate in the form of a ring, the substrate rotation device including an eccentricity correction portion is inserted into the flowable filling therein. The method of claim 1, A cross section of the eccentric correction unit is a substrate rotating apparatus having a circular or triangular shape. The method of claim 1, The filling material is any one of water, mercury, and oil. The method of claim 1, And said fill is a spherical solid material. The method of claim 1, A support pin disposed in a circle with respect to the upper surface of the platen and supporting the lower surface of the substrate; And And a plurality of chucking pins disposed in a circular shape with respect to the center of the upper surface of the plate and moving toward the center of the plate and in contact with the side surfaces of the substrate.
KR1020080113478A 2008-11-14 2008-11-14 Spin head supporting and rotating the substrate KR20100054519A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020080113478A KR20100054519A (en) 2008-11-14 2008-11-14 Spin head supporting and rotating the substrate

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Application Number Priority Date Filing Date Title
KR1020080113478A KR20100054519A (en) 2008-11-14 2008-11-14 Spin head supporting and rotating the substrate

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KR20100054519A true KR20100054519A (en) 2010-05-25

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014123310A1 (en) * 2013-02-06 2014-08-14 Ap Systems Inc. Substrate support and substrate treating apparatus having the same
CN114156227A (en) * 2022-02-10 2022-03-08 上海隐冠半导体技术有限公司 Clamping device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014123310A1 (en) * 2013-02-06 2014-08-14 Ap Systems Inc. Substrate support and substrate treating apparatus having the same
KR101432157B1 (en) * 2013-02-06 2014-08-20 에이피시스템 주식회사 Substrate support and apparatus for treating substrate having thereof substrate support
CN114156227A (en) * 2022-02-10 2022-03-08 上海隐冠半导体技术有限公司 Clamping device
CN114156227B (en) * 2022-02-10 2022-07-08 上海隐冠半导体技术有限公司 Clamping device

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