KR20100054390A - Image sensor package of optical joystick and method of fabricating the same - Google Patents

Image sensor package of optical joystick and method of fabricating the same Download PDF

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KR20100054390A
KR20100054390A KR1020080113299A KR20080113299A KR20100054390A KR 20100054390 A KR20100054390 A KR 20100054390A KR 1020080113299 A KR1020080113299 A KR 1020080113299A KR 20080113299 A KR20080113299 A KR 20080113299A KR 20100054390 A KR20100054390 A KR 20100054390A
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South Korea
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image sensor
substrate
mold
optical joystick
package
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KR1020080113299A
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Korean (ko)
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안건준
이상권
손동남
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크루셜텍 (주)
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Publication of KR20100054390A publication Critical patent/KR20100054390A/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/042—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by opto-electronic means
    • G06F3/0421—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by opto-electronic means by interrupting or reflecting a light beam, e.g. optical touch-screen
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Human Computer Interaction (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Position Input By Displaying (AREA)
  • Studio Devices (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

PURPOSE: An image sensor package of a light joystick and a manufacturing method thereof are provided to manufacture molding material protecting an image sensor and a wire and a holder mounting imaging member into all in one, thereby reducing a manufacturing process stage, time and production cost. CONSTITUTION: An adhesive member is composed in a substrate(S500). An image sensor is mounted on the adhesive member(S510). A wire which electrically connects the image sensor and the substrate is bonded(S520). A mold which is manufactured in advance adheres to the image sensor and the substrate(S530). After adhering mold, resin is injected and the injected resin is air-cooled(S540). After resin is air-cooled, the mold is separated from the resin(S550).

Description

광조이스틱의 이미지센서패키지 및 그 제조방법{IMAGE SENSOR PACKAGE OF OPTICAL JOYSTICK AND METHOD OF FABRICATING THE SAME}Image sensor package of optical joystick and its manufacturing method {IMAGE SENSOR PACKAGE OF OPTICAL JOYSTICK AND METHOD OF FABRICATING THE SAME}

본 발명은 광조이틱의 이미지센서패키지 및 그 제조방법에 관한 것이다. The present invention relates to an image sensor package of optical joytic and a method of manufacturing the same.

최근 전자제품은 사용자의 요구에 따라 소형화, 경량화 및 다기능화 되고 있으며, 이를 실현하기 위한 기술중에 하나가 반도체패키지 기술이다.Recently, electronic products have become smaller, lighter and more versatile according to the needs of users, and one of the technologies for realizing this is semiconductor package technology.

패키징기술은 집적회로가 들어 있는 반도체 칩의 입출력 및 전원단자들을 외부와 전기적으로 연결하고 습기나 먼지 등의 주위 환경으로부터 보호할 뿐만 아니라, 기계적인 충격에도 잘 견딜 수 있도록 하는 제조공정이다.Packaging technology is a manufacturing process that electrically connects the input / output and power terminals of a semiconductor chip containing an integrated circuit to the outside, protects it from moisture and dust, and also withstands mechanical shock.

또한, 패키징기술은 완성된 반도체패키지를 인쇄회로기판(Printed Circuti Board)에 장착시키는 조립공정을 빠르고 정확하게 할 뿐만 아니라 전체적인 필요면적과 공간을 줄일 수 있도록 개발진행 되고 있다.In addition, the packaging technology is being developed to not only quickly and accurately the assembly process for mounting the completed semiconductor package on the printed circuit board (Board Circuti Board) but also to reduce the overall required area and space.

그리고, 반도체패키지는 종류에 따라 수지밀봉패키지, 글래스밀봉패키지, 금속밀봉패키지 등이 있으며, 반도체패키지는 실장방법에 따라 삽입형, 표면실장형(Surface Mount Technology)으로 분류된다.The semiconductor package may be a resin sealing package, a glass sealing package, a metal sealing package, or the like, and the semiconductor package may be classified into an insert type and a surface mount technology according to a mounting method.

이때,삽입형으로 대표적인 것은 PGA(Pin Grid Array), DIP(Dual In-Line Package)등이 있고, 표면실장형으로 대표적인 것은 QFP(Quad Flat Package), SOP(Small Outline Package)등이 있다.In this case, the insert type may include a pin grid array (PGA), a dual in-line package (DIP), and the like, and the surface mount type may include a quad flat package (QFP) and a small outline package (SOP).

한편, 반도체 소자는 고성능화에 되고 소형 전자제품의 수요 급증에 따라 반도체패키지 실장방법이 삽입형에서 표면실장형으로 변화되어 인쇄회로기판에 대한 실장밀도를 높였다.On the other hand, semiconductor devices have been improved in performance, and as the demand for small electronic products has increased, the semiconductor package mounting method has been changed from an insert type to a surface mount type, thereby increasing the mounting density of a printed circuit board.

표면실장형 반도체는 기능의 특성을 그대로 유지한채 반도체 크기를 줄일수 있는 칩 스케일 패키지(Chip Scale Package:이하 'CSP'라 함)기술이 활발히 진행되고 있다.Surface-mount semiconductors are actively proceeding with chip scale package (CSP) technology that can reduce the size of semiconductors while maintaining the characteristics of functions.

도 1은 종래 기술에 따른 이미지센서가 포함된 광 조이스틱의 부분단면도이고, 도 2는 종래기술에 따른 이미지센서가 포함된 광 조이스틱의 분해사시도이다.1 is a partial cross-sectional view of an optical joystick including an image sensor according to the prior art, Figure 2 is an exploded perspective view of an optical joystick including an image sensor according to the prior art.

도시된 바와 같이, 종래 광조이스틱은 내부에 수용홈이 형성된 홀더(30)와, 홀더(30) 내부에 거치되는 결상부재(20)와 홀더(30) 하측에 결합되며 CSP된 이미지센서와 이들을 내부에 수용하는 하우징(50)으로 구성된다.As shown, the conventional optical joystick is coupled to the holder 30 is formed in the receiving groove therein, the imaging member 20 and the holder 30 is mounted on the inside of the holder 30 and the CSP inside them It consists of a housing 50 accommodated in.

여기서, 광조이스틱에 적용된 이미지센서 패키지는 메인 인쇄회로기판(40)이 구비되고, 메인 인쇄회로기판(40)에 에폭시(14)가 도포된 후 CSP된 이미지센서(12)가 장착된다. 이때, CSP된 이미지센서(12)는 기판(10)과 기판(10)에 실장된 이미지센서(12)와, 기판(10)과 센서를 전기적으로 연결하는 와이어(16)와, 이미지센서(12)와 와이어(16)를 보호하는 봉지재(18)가 포함된다. Here, the image sensor package applied to the optical joystick is provided with a main printed circuit board 40, the epoxy 14 is coated on the main printed circuit board 40, and then the CSP image sensor 12 is mounted. In this case, the CSP image sensor 12 includes a substrate 10 and an image sensor 12 mounted on the substrate 10, a wire 16 electrically connecting the substrate 10 and the sensor, and the image sensor 12. ) And an encapsulant 18 for protecting the wire 16.

그리고, CSP된 이미지센서의 외부의 일측을 감싸고 상단 결상부재(20)를 수용시키는 홀더(30)가 장착된다.Then, the holder 30 is wrapped around the outside of the CSP image sensor and accommodates the upper imaging member 20.

그러나, 종래에는 CSP된 이미지센서를 메인인쇄회로기판에 장착하거나 CSP된 이미지센서와 홀더를 결합하고자 할때, 접착부재인 에폭시가 도포되는데, 도포된 에폭시가 완전경화까지 약40분정도의 시간이 소요됨으로써 차후 공정이 지연되는 문제점이 있다. However, conventionally, when mounting the CSP image sensor on the main printed circuit board or combining the CSP image sensor and the holder, epoxy as an adhesive member is applied, and the coated epoxy takes about 40 minutes to fully cure. There is a problem that the subsequent process is delayed by the required.

본 발명은 상기와 같은 문제점을 감안하여 안출된 것으로, 이미지센서 패키지 조립공정을 단순화시켜 조립성 및 생산성을 개선한 광조이스틱의 이미지센서 패키지를 제공하는데 있다.The present invention has been made in view of the above problems, to simplify the image sensor package assembly process to provide an image sensor package of the optical joystick improves the assembly and productivity.

본 발명의 다른 목적은 이미지센서의 패키지가 진행되는 과정에서 봉지재가 이미지센서를 보호함은 물론 홀더의 기능도 동시에 수행하여 제품의 조립성 및 생산성을 향상시킬수 있는 이미지센서 패키지를 제공하는데 있다.Another object of the present invention is to provide an image sensor package that can improve the assembly and productivity of the product by performing the function of the holder at the same time as the encapsulant not only protects the image sensor in the process of the package of the image sensor.

본 발명에 의한 광조이스틱의 이미지센서 패키지 및 그 제조방법은 이미지센서와 와이어를 보호하는 몰딩재와 결상부재를 거치시키는 홀더를 일체형으로 제작함으로써 제조공정단계, 시간 및 생산 비용을 줄일 수 있는 효과가 있다.The image sensor package and manufacturing method of the optical joystick according to the present invention have an effect of reducing the manufacturing process step, time and production cost by integrally manufacturing a holder for mounting the molding material and the image forming member to protect the image sensor and the wire. have.

이와 같은 목적을 효과적으로 달성하기 위해 본 발명은, 기판과 상기 기판에 실장된 이미지센서와 상기 이미지센서를 보호하는 봉지재로 구성된 광조이스틱의 이미지센서 패키지에 있어서, 상기 봉지재는 이미지센서 및 기판의 일면을 덮으면서 기판과 일체형으로 구성되며, 내부에 결상부재가 결합되는 수용홈이 구비된 것을 특징으로 한다.In order to effectively achieve the above object, the present invention, in the image sensor package of the optical joystick composed of a substrate, an image sensor mounted on the substrate and an encapsulant for protecting the image sensor, the encapsulant is one surface of the image sensor and the substrate It is integrally formed with the substrate while covering the, characterized in that the receiving groove is provided with the image forming member is coupled therein.

상기 기판은 인쇄회로기판, 리드 프레임 중 어느 하나임을 특징으로 한다.The substrate may be any one of a printed circuit board and a lead frame.

상기 봉지재는 IR EMC임을 특징으로 한다.The encapsulant is characterized in that the IR EMC.

기판에 접착부재를 구성하는 단계; 상기 접착부재에 이미지센서를 실장하는 단계; 상기 이미지센서와 기판을 전기적으로 연결하는 와이어를 본딩하는 단계; 상기 미리 가공된 몰드를 상기 이미지센서 및 기판에 밀착시키는 단계; 상기 몰드를 밀착시킨후 수지를 주입하여 공냉시키는 단계; 상기 수지가 공냉된후, 몰드를 수지로부터 분리시키는 단계를 포함하는 것을 특징으로 한다.Forming an adhesive member on the substrate; Mounting an image sensor on the adhesive member; Bonding a wire for electrically connecting the image sensor and a substrate; Bringing the preprocessed mold into close contact with the image sensor and the substrate; Intimately cooling the mold by injecting the mold into close contact with the mold; After the resin is air-cooled, the step of separating the mold from the resin.

이하, 본 발명에 의한 광조이스틱의 이미지센서 패키지 및 그 제조방법의 바람직한 실시예를 첨부된 도면을 참고하여 상세하게 설명한다.Hereinafter, exemplary embodiments of an image sensor package and a method of manufacturing the light joystick according to the present invention will be described in detail with reference to the accompanying drawings.

도 3은 본 발명의 실시예에 의한 광조이스틱의 단면도이다. 도 4는 본 발명의 실시예에 의한 광조이스틱의 분리사시도이다.3 is a cross-sectional view of the optical joystick according to the embodiment of the present invention. 4 is an exploded perspective view of the optical joystick according to the embodiment of the present invention.

도 3 및 도 4에 도시된 바와 같이, 먼저 광조이스틱은 내부에 수용홈이 형성된 홀더(30)와, 홀더(30) 내부에 거치되는 결상부재(20)와 홀더(30) 하측에 결합되며 CSP된 이미지센서와 이들을 내부에 수용하는 하우징(50)으로 구성된다.As shown in FIGS. 3 and 4, first, the optical joystick is coupled to the holder 30 having an accommodating groove therein, the image forming member 20 mounted inside the holder 30, and the lower side of the holder 30. It consists of an image sensor and a housing 50 to accommodate them therein.

이와 같이 구성된 본 발명의 광조이스틱의 이미지센서 패키지는 기판(10)과, 기판(10)에 실장되는 이미지센서(12)와, 이미지센서(12)와 기판(10)이 전기적으로 연결되는 와이어(16)와, 결상부재(20)를 수용하는 홀더(30)로 구성된다.The image sensor package of the optical joystick of the present invention configured as described above includes a substrate 10, an image sensor 12 mounted on the substrate 10, and a wire to which the image sensor 12 and the substrate 10 are electrically connected. 16 and a holder 30 for receiving the image forming member 20.

여기서, 기판(10)은 전기적 연결을 하기 위한 것으로, 인쇄회로기판 또는 리드 프레임이 될 수 있다. Here, the substrate 10 is for electrical connection, and may be a printed circuit board or a lead frame.

그리고, 이미지센서(12)는 결상부재(20)를 통해 유입된 빛을 검출하는 역할을 한다. 즉, 이미지센서(12)는 결상부재(20)로 유입되는 빛을 검출하여, 검출된 변위값을 마이컴(미도시함)에 송신한다. 이때, 마이컴은 검출된 변위값을 디스플레이화면(미도시함)에 출력하도록 한다.In addition, the image sensor 12 serves to detect light introduced through the imaging member 20. That is, the image sensor 12 detects light flowing into the image forming member 20 and transmits the detected displacement value to the microcomputer (not shown). At this time, the microcomputer outputs the detected displacement value on the display screen (not shown).

다음으로, 이미지센서(12)가 기판(10) 상단에 실장될 경우에는 기판(10) 상단에 접착부재(14)인 에폭시가 도포된 상태에서 실장하게 된다. 그러면, 도포된 에폭시는 경화되면서 이미지센서를 기판상단에 고정하게 된다.Next, when the image sensor 12 is mounted on the top of the substrate 10, the image sensor 12 is mounted in the state in which an epoxy, which is an adhesive member 14, is applied to the top of the substrate 10. Then, the applied epoxy is cured to fix the image sensor on the substrate.

이때, 접착부재(14)는 에폭시 이외에 실리콘, 은 에폭시, 접착필름 및 액상(Liquid)중 하나일 수도 있다.In this case, the adhesive member 14 may be one of silicon, silver epoxy, adhesive film, and liquid in addition to epoxy.

그리고, 와이어(16)는 전기적 연결을 하는 것으로, 이미지센서(12)와 기판(10)을 연결한다. 이때, 본 발명의 와이어(16)는 금(Au)를 채용하고 있지만, 제조환경에 따라 은(Ag),구리(Cu),알루미늄(Al) 등이 채용될 수도 있다. In addition, the wire 16 is an electrical connection, and connects the image sensor 12 and the substrate 10. In this case, although the wire 16 of the present invention employs gold (Au), silver (Ag), copper (Cu), aluminum (Al), or the like may be employed depending on the manufacturing environment.

다음으로, 결상부재(20)는 피사체로부터 반사된 빛을 이미지센서상에 상을 맺게 하는 역할을 한다. Next, the image forming member 20 serves to form an image on the image sensor reflected light from the subject.

그리고, 홀더(30)는 결상부재(20)를 지지하는 역할을 한다. 이때, 홀더(30)는 기판(10)과 이미지센서(12)의 일면을 덮도록 일체형으로 구성되며, 내부에 결상부재(20)가 수용되도록 수용홈이 형성된다. 여기서, 홀더(30)는 미리 구비된 홀더형상의 몰드에 봉지재인 IR EMC를 주입하여 제작하게 된다. In addition, the holder 30 serves to support the imaging member 20. At this time, the holder 30 is integrally formed to cover one surface of the substrate 10 and the image sensor 12, the receiving groove is formed to accommodate the imaging member 20 therein. Here, the holder 30 is manufactured by injecting IR EMC, which is an encapsulant, into a holder-shaped mold provided in advance.

다시 말해, 봉지재인 IR EMC는 이미지센서(12)와 와이어(16)를 덮어 외부충격으로부터 보호하는 동시에 홀더형상을 하여 결상부재(20)를 수용하는 역할을 한다.In other words, the IR EMC, which is an encapsulant, covers the image sensor 12 and the wire 16 to protect the external sensor from external shock, and serves to receive the imaging member 20 by forming a holder.

이때, IR EMC는 특성상 적외선 빛만 투과하고, 가시광선, 자외선 등의 빛은 차단하게 된다.At this time, the IR EMC transmits only infrared light, and blocks light such as visible light and ultraviolet light.

다음으로, 메인 인쇄회로기판(40)은 전기적 연결을 하며, 이미지센서(12)에 전원공급 및 통신을 수행하도록 하는 역할을 한다. Next, the main printed circuit board 40 makes an electrical connection and serves to power and communicate with the image sensor 12.

그리고, 하우징(50)은 결상부재(20), 홀더(30) 및 이미지센서(12)를 덮도록 구성되며, 가시광선 및 자외선을 차단하는 역할을 한다. 여기서, 하우징(50)은 메인 인쇄회로기판(40)과 접착부재(14)인 에폭시로 고정된다. In addition, the housing 50 is configured to cover the imaging member 20, the holder 30, and the image sensor 12, and serves to block visible and ultraviolet rays. Here, the housing 50 is fixed with epoxy, which is the main printed circuit board 40 and the adhesive member 14.

도 5는 본 발명의 실시예에 의한 광조이스틱의 이미지센서 패키지 제조방법을 위한 순서도이다.5 is a flowchart illustrating a method of manufacturing an image sensor package of an optical joystick according to an exemplary embodiment of the present invention.

도 5에 도시된 바와 같이, 본 발명은 기판(10)에 접착부재(14)를 구성하는 것으로 시작된다(S500). 이때, 기판(10)은 인쇄회로기판, 리드 프레임 중 어느 하나일 수도 있다.As shown in FIG. 5, the present invention begins by configuring the adhesive member 14 on the substrate 10 (S500). In this case, the substrate 10 may be any one of a printed circuit board and a lead frame.

그리고, 접착부재(14)에 이미지센서(12)를 실장한다(S510). 여기서, 접착부재(14)는 본 발명에서 에폭시를 채용 하였으며, 이밖에 실리콘, 은 에폭시, 접착필름 및 액상(Liquid)접착체 중 어느 하나일 수도 있다. Then, the image sensor 12 is mounted on the adhesive member 14 (S510). Here, the adhesive member 14 employs an epoxy in the present invention, and may be any one of silicon, silver epoxy, an adhesive film, and a liquid adhesive.

이때, 에폭시는 경화를 통해 기판(10)과 이미지센서(12)를 견고하게 결합하게 된다.At this time, the epoxy is firmly coupled to the substrate 10 and the image sensor 12 through curing.

다음으로, 이미지센서(12)와 기판(10)을 전기적으로 연결하는 와이어(16)를 본딩한다(S520). 이때, 와이어(16)는 전기 전도성이 높은 금(Au)을 채용하며, 이외에도 은(Ag),구리(Cu),알루미늄(Al) 중 어느 하나가 채용될 수 있다. Next, the wire 16 for electrically connecting the image sensor 12 and the substrate 10 is bonded (S520). In this case, the wire 16 employs gold (Au) having high electrical conductivity. In addition, any one of silver (Ag), copper (Cu), and aluminum (Al) may be employed.

그리고, 미리 가공된 몰드를 이미지센서(12) 및 기판(10)에 밀착시킨다(S530).Then, the mold processed in advance is in close contact with the image sensor 12 and the substrate 10 (S530).

다음으로, 몰드를 밀착시킨후, 수지를 주입하여 공냉 시킨다(S540). Next, after the mold is in close contact, the resin is injected and air cooled (S540).

다시 말해, 본 발명은 수지가 주입되어 이미지센서(12)와 와이어(16)를 보호하는 봉지재 역할 및 홀더 형상으로 경화되어 결상부재(20)를 수용하는 역할을 같이 하게 되는 것이다.In other words, in the present invention, the resin is injected to act as an encapsulant to protect the image sensor 12 and the wire 16 and to be cured into a holder shape to accommodate the imaging member 20.

이때, 수지는 IR EMC로서 적외선 빛은 투과 시키고 가시광선, 자외선등의 빛은 차단하게된다. At this time, the resin is IR EMC, which transmits infrared light and blocks light such as visible light and ultraviolet light.

그리고, 몰드의 수지가 공냉된 후, 몰드를 수지로부터 분리시킨다(S550).Then, after the resin of the mold is air cooled, the mold is separated from the resin (S550).

이와 같이 본 발명의 봉지재는 제조공정 단계에서 이미지센서(12)와 와이어(16)를 보호하는 몰딩역할을 하는 동시에 결상부재(20)를 지지하는 홀더의 기능을 수행하게 됨에 따라 제조공정 단계를 개선시킬수 있다.As described above, the encapsulant of the present invention improves the manufacturing process step by performing a function of a holder supporting the imaging member 20 at the same time as the molding to protect the image sensor 12 and the wire 16 in the manufacturing process step. You can.

이상에서 본 발명의 실시예에 따른 광조이스틱의 이미지센서패키지 및 그 제조방법에 대해 설명하였으나 본 발명은 이에 한정하지 아니하며 당업자라면 그 응용과 변형이 가능함은 물론이다.The image sensor package of the optical joystick and the method of manufacturing the same according to the embodiment of the present invention have been described above, but the present invention is not limited thereto, and those skilled in the art can of course apply and modify them.

도 1은 종래 기술에 따른 이미지센서가 포함된 광 조이스틱의 부분단면도.1 is a partial cross-sectional view of an optical joystick including an image sensor according to the prior art.

도 2는 종래기술에 따른 이미지센서가 포함된 광 조이스틱의 분해사시도.Figure 2 is an exploded perspective view of an optical joystick including an image sensor according to the prior art.

도 3은 본 발명의 실시예에 의한 광조이스틱의 단면도.3 is a cross-sectional view of the optical joystick according to the embodiment of the present invention.

도 4는 본 발명의 실시예에 의한 광조이스틱의 분리사시도.Figure 4 is an exploded perspective view of the optical joystick according to the embodiment of the present invention.

도 5는 본 발명의 실시예에 의한 광조이스틱의 이미지센서 패키지 제조방법을 위한 순서도.Figure 5 is a flow chart for the image sensor package manufacturing method of the optical joystick according to an embodiment of the present invention.

*도면의 주요부분에 대한 부호의 설명** Description of the symbols for the main parts of the drawings *

10:기판 12:이미지센서10: substrate 12: image sensor

14:접착부재 16:와이어14: adhesive member 16: wire

20:결상부재 30:홀더20: imaging member 30: holder

40:메인 인쇄회로기판 50:하우징 40: main printed circuit board 50: housing

Claims (4)

기판과 상기 기판에 실장된 이미지센서와 상기 이미지센서를 보호하는 봉지재로 구성된 광조이스틱의 이미지센서 패키지에 있어서,In the image sensor package of the optical joystick composed of a substrate, an image sensor mounted on the substrate and an encapsulant for protecting the image sensor, 상기 봉지재는 이미지센서 및 기판의 일면을 덮으면서 기판과 일체형으로 구성되며, 내부에 결상부재가 결합되는 수용홈이 구비된 것을 특징으로 하는 광조이스틱의 이미지센서 패키지.The encapsulation material is integrally formed with the substrate while covering one surface of the image sensor and the substrate, and the image sensor package of the optical joystick, characterized in that the receiving groove is provided therein coupled to the imaging member. 제 1 항에 있어서,The method of claim 1, 상기 기판은 인쇄회로기판, 리드 프레임 중 어느 하나임을 특징으로 하는 광조이스틱의 이미지센서 패키지.The substrate is an image sensor package of the optical joystick, characterized in that any one of a printed circuit board, a lead frame. 제 1 항에 있어서,The method of claim 1, 상기 봉지재는 IR EMC임을 특징으로 하는 광조이스틱의 이미지센서 패키지.The encapsulant is an IR EMC image sensor package of the optical joystick. 기판에 접착부재를 구성하는 단계;Forming an adhesive member on the substrate; 상기 접착부재에 이미지센서를 실장하는 단계;Mounting an image sensor on the adhesive member; 상기 이미지센서와 기판을 전기적으로 연결하는 와이어를 본딩하는 단계;Bonding a wire for electrically connecting the image sensor and a substrate; 상기 미리 가공된 몰드를 상기 이미지센서 및 기판에 밀착시키는 단계; Bringing the preprocessed mold into close contact with the image sensor and the substrate; 상기 몰드를 밀착시킨후 수지를 주입하여 공냉시키는 단계;Intimately cooling the mold by injecting the mold into close contact with the mold; 상기 수지가 공냉된후, 몰드를 수지로부터 분리시키는 단계를 포함하는 것을 특징으로 하는 광조이스틱의 이미지센서 패키지 제조방법. And after the resin is air cooled, separating the mold from the resin.
KR1020080113299A 2008-11-14 2008-11-14 Image sensor package of optical joystick and method of fabricating the same KR20100054390A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9966401B2 (en) 2015-03-04 2018-05-08 Samsung Electronics Co., Ltd. Package for image sensor with outer and inner frames

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9966401B2 (en) 2015-03-04 2018-05-08 Samsung Electronics Co., Ltd. Package for image sensor with outer and inner frames

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