KR20100048685A - Printed circuit board and the method of manufacturing thereof - Google Patents

Abstract

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to reduce processing costs by eliminating a process of attaching or removing a carrier film. CONSTITUTION: A printed circuit board comprises a first insulation layer(110), a circuit pattern(100a), and a second insulation layer(130). The circuit pattern is formed in both sides of the first insulation layer. The circuit pattern is made of a metal alloy including at least two among cu, Ni, and Fe. A second insulation layer is laminated in both sides of the first insulation layer including the circuit pattern. A first via-hole(120) is formed inside the first insulation layer. A second via hole(140) is formed inside the second insulation layer.

Description

Printed circuit board and the method of manufacturing thereof

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board and a method of manufacturing the same, and more particularly, to a printed circuit board and a method of manufacturing the same using a metal alloy layer having enhanced stiffness compared to pure copper.

As electronic products become smaller, denser, thinner, and packaged, thinner and finer patterned printed circuit boards are in progress. In order to reflect such a trend, a structure and a manufacturing method of a printed circuit board differentiated from the prior art are required.

That is, in the manufacture of printed circuit board, not only the process shortening and cost reduction through this, but also thinness and high stiffness to cope with the thinning which is an essential condition of the next generation flip-chip BGA. That is, there is an active research on the substrate material having the toughness.

Conventionally, the method of strengthening the rigidity of a printed circuit board is to increase the constituents of the filler in the insulating material to increase the rigidity, or to attach and remove the carrier film to prevent bending in the manufacturing process and then remove it. I have used the method.

However, as the filler (filler) is put a lot of weight and hygroscopicity, there is a disadvantage that the plating adhesion is reduced, there is a problem that the additional cost, such as the attachment and removal of the carrier film occurs to increase the process cost.

Accordingly, the present invention has been made to solve the above problems, and an object of the present invention is to manufacture a printed circuit board including a metal alloy layer having stiffness, thereby maintaining the rigidity of the substrate while keeping the weight of the substrate lightly. The present invention provides a printed circuit board and a method of manufacturing the same, which can prevent the warpage and increase the process cost by not attaching a carrier film.

A printed circuit board according to a first embodiment of the present invention for achieving the above object, the first insulating layer; A rigid circuit pattern formed on both surfaces of the first insulating layer; And a second insulating layer laminated on both surfaces of the first insulating layer including the circuit pattern having the enhanced rigidity.

Here, the rigid circuit pattern may be made of a metal alloy containing any two of Cu, Ni and Fe.

The semiconductor device may further include a first via formed through a portion of the first insulating layer to electrically connect the stiffened circuit patterns formed on both surfaces of the first insulating layer.

In addition, a second via formed through a portion of the second insulating layer and electrically connected to the rigid circuit pattern; And a circuit pattern formed on the second insulating layer and electrically connected to the second via.

In addition, the circuit pattern formed on the second insulating layer and electrically connected to the second via may be made of copper or a rigid metal alloy, wherein the rigid metal alloy is formed of Cu, Ni, and the like. It may be made of a metal alloy containing any two of Fe.

In addition, the first insulating layer and the second insulating layer may be made of Ajinomoto build-up film (ABF) or prepreg.

A printed circuit board according to a second embodiment of the present invention for achieving the above object, the first insulating layer; A rigid circuit pattern formed on the bottom surface of the first insulating layer; And a second insulating layer formed on a lower surface of the first insulating layer on which the rigid circuit circuit pattern is formed.

Here, the rigid circuit pattern may be made of a metal alloy containing any two of Cu, Ni and Fe.

In addition, a first via formed through a portion of the first insulating layer and the second insulating layer and electrically connected to the circuit pattern having the enhanced rigidity; And a circuit pattern formed on the first insulating layer and the second insulating layer and electrically connected to the first via.

In addition, the circuit pattern formed on the first insulating layer and the second insulating layer and electrically connected to the first via may be made of copper or a rigid metal alloy.

In addition, the method of manufacturing a printed circuit board according to the first embodiment of the present invention for achieving the above object comprises the steps of: laminating a rigid metal alloy layer on both sides of the first insulating layer; Removing a portion of the rigid metal alloy layer to form a rigid circuit pattern; And laminating a second insulating layer on both surfaces of the first insulating layer on which the rigid circuit pattern is enhanced.

Here, the rigid metal alloy layer may be made of a metal alloy containing any two of Cu, Ni and Fe.

The method may further include forming a first via hole penetrating a portion of the first insulating layer including the rigid circuit circuit pattern after forming the rigid circuit circuit pattern; And filling the inside of the first via hole with a conductive material to form a first via.

In addition, after the stacking of the second insulating layer, forming a second via hole penetrating a portion of the second insulating layer to expose a portion of the surface of the stiffened circuit pattern; Filling the inside of the second via hole with a conductive material to form a second via; And forming a circuit pattern electrically connected to the second via on the second insulating layer.

In addition, in the forming of the circuit pattern electrically connected to the second via on the second insulating layer, the circuit pattern may be made of copper or a rigid metal alloy.

In addition, the method of manufacturing a printed circuit board according to the second embodiment of the present invention for achieving the above object comprises the steps of: laminating a first insulating layer on a rigid metal alloy layer; Removing a portion of the rigid metal alloy layer to form a rigid circuit pattern; And stacking a second insulating layer on a lower surface of the first insulating layer on which the rigid circuit circuit pattern is formed.

Here, after the step of laminating a second insulating layer on the lower surface of the first insulating layer on which the circuit pattern with enhanced rigidity is formed, the rigidity is reinforced by passing through the first insulating layer and a portion of the second insulating layer. Forming a first via electrically connected to the circuit pattern; And forming a circuit layer electrically connected to the first via on the first insulating layer and the second insulating layer.

In addition, another method of manufacturing a printed circuit board according to a second embodiment of the present invention for achieving the above object comprises the steps of: laminating a first insulating layer on a rigid metal alloy layer; Forming a first via penetrating a portion of the first insulating layer; Forming a circuit layer on the first insulating layer, the circuit layer electrically connected to the first via; Removing a portion of the rigid metal alloy layer to form a rigid circuit pattern that is electrically connected to the first via; Stacking a second insulating layer on a lower surface of the first insulating layer on which the rigid circuit pattern is formed; Forming a second via penetrating a portion of the second insulating layer; And forming a circuit layer electrically connected to the second via on the second insulating layer.

As described above, according to the printed circuit board and the manufacturing method thereof according to the present invention, by manufacturing a printed circuit board comprising a metal alloy layer with stiffness (stiffness), the filler to the insulating layer constituting the printed circuit board There is no need to add additional components, etc., while maintaining the weight of the substrate lightly, the rigidity of the substrate is increased, thereby preventing warpage or warping.

In addition, the present invention does not need to attach a separate carrier film for preventing the bending of the insulating layer has the advantage of lowering the process cost.

Matters relating to the operational effects including the technical configuration of the printed circuit board and the manufacturing method according to the present invention will be clearly understood by the following detailed description with reference to the drawings showing preferred embodiments of the present invention.

Printed Circuit Board Structure

<First Embodiment>

A printed circuit board according to a first embodiment of the present invention will be described in detail with reference to FIG. 1.

1 is a cross-sectional view showing the structure of a printed circuit board according to a first embodiment of the present invention.

As shown in FIG. 1, the printed circuit board according to the first exemplary embodiment of the present invention includes a first insulating layer 110 and circuit patterns formed on both surfaces of the first insulating layer 110 and having rigidity. And a second insulating layer 130 stacked on both surfaces of the first insulating layer 110 including the rigidity-reinforced circuit pattern 110a.

As the first insulating layer 110 and the second insulating layer 130, an insulating material that can be processed by a drill process or the like with adhesive force and fluidity, such as Ajinomoto Build-up Film (ABF) by Ajinomoto, or Prepreg and the like can be used.

In addition, the rigid circuit pattern 110a may be formed of a metal alloy including two of Cu, Ni, and Fe. For example, the rigid circuit pattern 110a may be formed of a metal alloy including Cu and Ni, a metal alloy including Cu and Fe, or a metal alloy including Ni and Fe. These metal alloys are superior in rigidity to pure copper, thereby improving the warpage of the printed circuit board.

A first via hole 120 penetrating a portion of the first insulating layer 110 is formed in the first insulating layer 110.

A conductive material, for example, copper is plated in the first via hole 120 to form a first via 120a. The first via 120a electrically connects between the rigid circuit patterns 100a formed on both surfaces of the first insulating layer 110.

In addition, a second via hole 140 is formed inside the second insulating layer 130 to expose a portion of the surface of the rigid circuit pattern 100a through a portion of the second insulating layer 130. The inside of the second via hole 140 is plated with copper to form a second via 140a.

A circuit pattern 150a electrically connected to the second via 140a is formed on the second insulating layer 130 on which the second via 140a is formed.

The circuit pattern 150a may be formed using copper in the same manner as the first and second vias 120a and 140a, but the stiffness as described above is enhanced instead of copper to further enhance the rigidity of the substrate. It can also be formed using a metal alloy.

A third insulating layer 160 is stacked on the second insulating layer 130 including the circuit pattern 150a. The third insulating layer 160 may be made of Ajinomoto build-up film (ABF) or prepreg.

A third via hole 170 is formed in the third insulating layer 160 to penetrate a portion of the third insulating layer 160 to expose a part of the surface of the circuit pattern 150a. Copper is plated inside the third via hole 170 to form a third via 170a.

In addition, an outer circuit layer 180 is formed on the third insulating layer 160 to be electrically connected to the third via 170a. The outer circuit layer 180 may be formed of copper, but instead of copper, the outer circuit layer 180 may be formed of a rigid metal alloy as described above to further strengthen the rigidity of the printed circuit board.

As described above, in the printed circuit board according to the first embodiment of the present invention, since the stiffened circuit pattern 100a is formed on both surfaces of the first insulating layer 110 positioned at the center of the substrate. In addition, the rigidity of the printed circuit board can be strengthened to prevent bending or warping.

In addition, as described above, the rigid metal alloy is used not only for the circuit pattern 100a located at the center of the substrate but also for the entire circuit layer, that is, the inner circuit pattern 150a and the outer circuit layer 180. The rigidity of the printed circuit board can be further enhanced.

Second Embodiment

A printed circuit board according to a second embodiment of the present invention will be described in detail with reference to FIG. 2.

2 is a cross-sectional view illustrating a structure of a printed circuit board according to a second exemplary embodiment of the present invention.

As shown in FIG. 2, the printed circuit board according to the second embodiment has the same configuration as that of the printed circuit board according to the first embodiment, except that the rigid circuit pattern 200a has the first insulation. Instead of being formed on both sides of the layer (see reference numeral 110 in FIG. 1), it differs from the first embodiment only in that it is formed on one surface of the first insulating layer 210.

That is, the printed circuit board according to the second exemplary embodiment of the present invention may include a first insulating layer 210, a rigid circuit pattern 200a formed on the bottom surface of the first insulating layer 210, and the rigidity. The second insulating layer 220 is formed on the bottom surface of the first insulating layer 210 on which the reinforced circuit pattern 200a is formed.

A first via hole 230 is formed in the first insulating layer 210 and the second insulating layer 220 to expose a portion of the surface of the rigid circuit pattern 200a.

A conductive material, for example, copper is plated in the first via hole 230 to form a first via 230a.

In addition, a circuit pattern 240a electrically connected to the first via 230a is formed on the first and second insulating layers 210 and 220.

The circuit pattern 240a may be formed using copper in the same manner as the first via 230a, but may be formed using a rigid metal alloy instead of copper. As the metal alloy with enhanced rigidity, a metal alloy including any one of Cu, Ni, and Fe may be used as described above.

A third insulating layer 250 and a fourth insulating layer 260 are stacked on the first and second insulating layers 210 and 220 including the circuit pattern 240a, respectively.

Second via holes 270 are formed in the third and fourth insulating layers 250 and 260 to expose a portion of the surface of the circuit pattern 240a, and copper is formed in the second via holes 270. The second via 270a is formed by plating.

In addition, outer circuit layers 280 electrically connected to the second vias 270a are formed on the third and fourth insulating layers 250 and 260. The outer circuit layer 180 may be formed of copper or a rigid metal alloy.

The printed circuit board according to the second embodiment of the present invention can obtain the same operation and effect as the first embodiment.

Manufacturing method of chip embedded printed circuit board

<First Embodiment>

Hereinafter, a method of manufacturing a printed circuit board according to a first embodiment of the present invention will be described in detail with reference to FIGS. 3A to 3E.

3A to 3E are cross-sectional views sequentially illustrating a method of manufacturing a printed circuit board according to the first embodiment of the present invention.

First, as shown in FIG. 3A, the metal alloy layer 100 having the rigidity of the foil shape is laminated on both surfaces of the first insulating layer 110. As the first insulating layer 110, an insulating material that can be processed by a drill process or the like with adhesive force and fluidity, such as Ajinomoto's ABF (Ajinomoto Build-up Film), or prepreg, may be used. Can be.

In addition, the rigid metal alloy layer 100 may be made of a metal alloy including any one of Cu, Ni, and Fe.

Here, according to the method of manufacturing a printed circuit board according to the first embodiment of the present invention, by laminating a rigid metal alloy layer 100 on both sides of the first insulating layer 110, the first insulating layer It is possible to prevent the 110 from bending. Therefore, according to the present exemplary embodiment, there is no need to attach a separate carrier film for preventing warpage on one surface of the first insulating layer 110, thereby reducing the process cost associated with attaching and removing the carrier film. There is this.

Next, as shown in FIG. 3B, a portion of the rigid metal alloy layer 100 is removed to form a circuit pattern 100a having enhanced rigidity.

3C, the first via hole 120 penetrating a portion of the first insulating layer 110 including the rigid circuit pattern 100a is formed. The first via hole 120 may be formed by mechanical drilling, or may be formed by a YAG laser, a CO ₂ laser, or the like.

Thereafter, the inside of the first via hole 120 is filled with a conductive material to form a first via 120a for electrically connecting the interlayer circuit. As the conductive material for forming the first via 120a, it is preferable to use copper having excellent electrical conductivity.

Next, as illustrated in FIG. 3D, a second insulating layer 130 is stacked on and under the first insulating layer 110 in which the first via 120a is formed.

Next, a second via hole 140 is formed through the portion of the second insulating layer 130 to expose a portion of the surface of the stiffened circuit pattern 100a and then the second via hole 140. The inside of the plated with copper to form a second via (140a).

Next, a circuit pattern 150a is formed on the second insulating layer 130 to be electrically connected to the second via 140a. The circuit pattern 150a may be formed of copper as described above, but may be formed of a metal alloy having rigidity instead of copper to further strengthen the rigidity of the substrate.

Next, as shown in FIG. 3E, after the third insulating layer 160 is laminated on the second insulating layer 130 on which the circuit pattern 150a is formed, the third insulating layer 160 is formed. A third via hole 170 penetrating a portion is formed. The third via hole 170 may be formed to expose a portion of the surface of the circuit pattern 150a.

Then, the inside of the third via hole 170 is plated with copper to form a third via 170a, and an outer layer electrically connected to the third via 170a on the third insulating layer 160. The circuit layer 180 is formed. Here, the outer circuit layer 180 may be formed of copper, but the rigidity of the substrate may be further enhanced by using a rigid metal alloy instead of copper.

According to the method of manufacturing the printed circuit board according to the first embodiment of the present invention as described above, by forming the rigid metal alloy layer 100 on both sides of the first insulating layer 110, the printed circuit By improving the rigidity of the substrate there is an effect that can prevent the bending of the substrate.

Second Embodiment

Hereinafter, a method of manufacturing a printed circuit board according to a second embodiment of the present invention will be described in detail with reference to FIGS. 4A to 4H.

4A to 4H are cross-sectional views sequentially illustrating a method of manufacturing a printed circuit board according to a second exemplary embodiment of the present invention.

First, as shown in FIG. 4A, a metal alloy layer 200 having a rigid rigidity in the form of a foil is prepared.

Next, as shown in FIG. 4B, a first insulating layer 210 is stacked on the rigid metal alloy layer 200. The first insulating layer 210 may be made of Ajinomoto build-up film (ABF), prepreg, or the like.

Next, as shown in FIG. 4C, a portion of the rigid metal alloy layer 200 is removed to form a rigid circuit pattern 200a.

Next, as illustrated in FIG. 4D, the second insulating layer 220 is stacked on the bottom surface of the first insulating layer 210 on which the rigid circuit pattern 200a is formed.

Next, as shown in FIG. 4E, a portion of the surface of the stiffened circuit pattern 200a is exposed through the portions of the first insulating layer 210 and the second insulating layer 220. The first via hole 230 is formed.

Next, as shown in FIG. 4F, a first via 230a for electrically connecting the inside of the first via hole 230 with a conductive material, for example, copper, to be electrically connected to the rigid circuit pattern 200a. ) Is formed on the first and second insulating layers 210 and 220 to form a circuit layer 240 electrically connected to the first via 230a. Here, the circuit layer 240 may be made of copper or a metal alloy with rigidity.

Then, as shown in FIG. 4G, a portion of the circuit layer 240 is removed to form a circuit pattern 240a.

Next, as shown in FIG. 4H, a third insulating layer 250 and a fourth insulating layer on the first insulating layer 210 and the second insulating layer 220 on which the circuit pattern 240a is formed. 260 is laminated respectively.

Next, a second via hole 270 is formed through the portions of the third and fourth insulating layers 250 and 260 to expose a portion of the surface of the circuit pattern 240a. Then, the second via hole 270 is formed. The inside is plated with copper to form a second via 270a.

Next, an outer circuit layer 280 is formed on the third and fourth insulating layers 250 and 260 to be electrically connected to the second via 270a. The outer circuit layer 280 may also be made of copper or a rigid metal alloy.

Next, another manufacturing method of the printed circuit board according to the second exemplary embodiment of the present invention will be described in detail with reference to FIGS. 5A to 5H.

5A through 5H are cross-sectional views sequentially illustrating a method of manufacturing a printed circuit board according to a second exemplary embodiment of the present invention.

First, as shown in FIG. 5A, a metal alloy layer 200 having a rigid rigidity in the form of a foil is prepared.

Next, as shown in FIG. 5B, a first insulating layer 210 is stacked on the stiffened metal alloy layer 200.

Next, as illustrated in FIG. 5C, a first via hole 230 is formed through the portion of the first insulating layer 210 to expose a portion of the surface of the rigid metal alloy layer 200. .

Next, as illustrated in FIG. 5D, the inside of the first via hole 230 is plated with copper to form a first via 230a, and then the first insulating layer 210 is formed on the first via layer 230a. A circuit layer 240 is formed to be electrically connected to the via 230a. Here, the circuit layer 240 may be made of copper or a metal alloy with rigidity.

Thereafter, as shown in FIG. 5E, a portion of the rigid metal alloy layer 200 is removed to form a rigid circuit circuit 200a electrically connected to the first via 230a. do.

Next, as illustrated in FIG. 5F, a second insulating layer 220 is stacked below the first insulating layer 210 on which the rigid circuit pattern 200a is formed.

Then, similarly to the first insulating layer 210, the first via hole 230 exposing a part of the surface of the stiffened circuit pattern 200a is formed in the second insulating layer 220. The inside of the first via hole 230 is plated with copper to form a first via 230a. Thereafter, a circuit layer 240 is formed on the second insulating layer 220 to be electrically connected to the first via 230a.

Next, as shown in FIG. 5G, a portion of the circuit layer 240 is removed to be electrically connected to the first via 230a on the first and second insulating layers 210 and 220. The pattern 240a is formed.

Next, as illustrated in FIG. 5H, a third insulating layer 250 and a fourth insulating layer (not shown) may be formed on the first insulating layer 210 and the second insulating layer 220 on which the circuit pattern 240a is formed. 260 are stacked respectively.

Thereafter, a second via hole 270 is formed through the portions of the third and fourth insulating layers 250 and 260 to expose a portion of the surface of the circuit pattern 240a. Then, the second via hole 270 is formed. The inside of the substrate is plated with copper to form a second via 270a.

Next, an outer circuit layer 280 is formed on the third and fourth insulating layers 250 and 260 to be electrically connected to the second via 270a. The outer circuit layer 280 may also be made of copper or a rigid metal alloy.

Preferred embodiments of the present invention described above are disclosed for the purpose of illustration, and various substitutions, modifications, and changes within the scope without departing from the spirit of the present invention for those skilled in the art to which the present invention pertains. It will be possible, but such substitutions, changes and the like should be regarded as belonging to the following claims.

1 is a cross-sectional view showing the structure of a printed circuit board according to a first embodiment of the present invention.

2 is a cross-sectional view showing the structure of a printed circuit board according to a second embodiment of the present invention.

3A to 3E are cross-sectional views sequentially illustrating the method of manufacturing the printed circuit board according to the first embodiment of the present invention.

4A to 4H are cross-sectional views sequentially illustrating a method of manufacturing a printed circuit board according to a second exemplary embodiment of the present invention.

5A to 5H are cross-sectional views sequentially illustrating a method of manufacturing a printed circuit board according to a second exemplary embodiment of the present invention.

<Explanation of symbols for main parts of the drawings>

100: rigid metal alloy layer 100a: rigid circuit pattern

110: first insulating layer 120: first via hole

120a: first via 130: second insulating layer

140: second via hole 140a: second via

150a: circuit pattern 160: third insulating layer

170: third via hole 170a: third via

180: outer circuit layer

Claims (19)

A first insulating layer; A rigid circuit pattern formed on both surfaces of the first insulating layer; And A second insulating layer laminated on both surfaces of the first insulating layer including the rigid circuit pattern; Printed circuit board comprising a. The method of claim 1, The rigid circuit circuit pattern is a printed circuit board made of a metal alloy containing any one of Cu, Ni and Fe. The method of claim 1, And a first via formed through a portion of the first insulating layer to electrically connect between the rigid circuit patterns formed on both surfaces of the first insulating layer. The method of claim 1, A second via formed through a portion of the second insulating layer and electrically connected to the rigid circuit pattern; And And a circuit pattern formed on the second insulating layer and electrically connected to the second via. The method of claim 4, wherein The printed circuit board formed on the second insulating layer and electrically connected to the second via is made of copper or a rigid metal alloy. The method of claim 5, The rigid metal alloy is reinforced, a printed circuit board made of a metal alloy containing any two of Cu, Ni and Fe. The method of claim 1, The first insulating layer and the second insulating layer is a printed circuit board made of Ajinomoto build-up film (ABF) or prepreg. A first insulating layer; A rigid circuit pattern formed on the bottom surface of the first insulating layer; And A second insulating layer formed on a lower surface of the first insulating layer on which the rigid circuit pattern is formed; Printed circuit board comprising a. The method of claim 8, The rigid circuit circuit pattern is a printed circuit board made of a metal alloy containing any one of Cu, Ni and Fe. The method of claim 8, A first via formed through a portion of the first insulating layer and the second insulating layer and electrically connected to the rigid circuit pattern; And And a circuit pattern formed on the first insulating layer and the second insulating layer and electrically connected to the first via. The method of claim 10, The printed circuit board formed on the first insulating layer and the second insulating layer and electrically connected to the first via is made of copper or a rigid metal alloy. Stacking a rigid metal alloy layer on both sides of the first insulating layer; Removing a portion of the rigid metal alloy layer to form a rigid circuit pattern; And Stacking a second insulating layer on both surfaces of the first insulating layer on which the rigid circuit circuit pattern is formed; Method of manufacturing a printed circuit board comprising a. The method of claim 12, The rigid metal alloy layer is a method of manufacturing a printed circuit board made of a metal alloy containing any one of Cu, Ni and Fe. The method of claim 12, After the step of forming the rigid circuit pattern, Forming a first via hole penetrating a portion of the first insulating layer including the rigid circuit pattern; And Filling the inside of the first via hole with a conductive material to form a first via; Method of manufacturing a printed circuit board further comprising. The method of claim 12, After laminating the second insulating layer, Forming a second via hole penetrating a portion of the second insulating layer to expose a portion of the surface of the rigid circuit pattern; Filling the inside of the second via hole with a conductive material to form a second via; And Forming a circuit pattern on the second insulating layer, the circuit pattern being electrically connected to the second via; Method of manufacturing a printed circuit board further comprising. The method of claim 15, And forming a circuit pattern electrically connected to the second via on the second insulating layer, wherein the circuit pattern is made of copper or a rigid metal alloy. Stacking a first insulating layer on the rigid metal alloy layer; Removing a portion of the rigid metal alloy layer to form a rigid circuit pattern; And Stacking a second insulating layer on a lower surface of the first insulating layer on which the rigid circuit pattern is formed; Method of manufacturing a printed circuit board comprising a. The method of claim 17, After the step of laminating a second insulating layer on the lower surface of the first insulating layer on which the rigid circuit pattern is strengthened, Forming a first via penetrating the first insulating layer and a portion of the second insulating layer to be electrically connected to the rigid circuit pattern; And Forming a circuit layer electrically connected to the first via on the first insulating layer and the second insulating layer; Method of manufacturing a printed circuit board further comprising. Stacking a first insulating layer on the rigid metal alloy layer; Forming a first via penetrating a portion of the first insulating layer; Forming a circuit layer on the first insulating layer, the circuit layer electrically connected to the first via; Removing a portion of the rigid metal alloy layer to form a rigid circuit pattern that is electrically connected to the first via; Stacking a second insulating layer on a lower surface of the first insulating layer on which the rigid circuit pattern is formed; Forming a second via penetrating a portion of the second insulating layer; And Forming a circuit layer on the second insulating layer, the circuit layer electrically connected to the second via; Method of manufacturing a printed circuit board comprising a.

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