KR20100043385A - Probe assembly - Google Patents

Abstract

PURPOSE: A probe assembly is provided to improve the reliability of a bonding process by forming an accommodating unit on an electrode pad to arrange a probe at right position. CONSTITUTION: A probe assembly comprises a wiring board(10), a plurality of probes(100a to 100d), and a receiving part. The wiring board has a plurality of electrode pads on the top. A plurality of probes are combined with a plurality of electrode pads(200a to 200d) is electrically connected to the wiring board. The receiving part on the electrode pad and is inserted into a fixed part formed on the end of the probe.

Description

Probe assembly

The present invention relates to a probe assembly, and more particularly, to a probe assembly that allows the probe to be bonded to the correct position on the wiring board.

In general, a semiconductor device is completed through a number of processes to achieve its performance in one completed semiconductor package. The processes can be broadly divided into semiconductor wafer production, fabrication (FAB), and assembly processes.

In particular, a plurality of semiconductor devices (Device Under Test, DUT) is formed on the wafer by the FAB process, the plurality of semiconductor devices are screened for good or bad through the electrical die sorting (EDS). As described above, the purpose of the EDS is to firstly select the quantity and defects of each semiconductor element on the wafer, and secondly, to repair the repairable semiconductor element among the defective semiconductor elements. This is to feed back the problem in early stage, and fourthly, to reduce the cost of assembly and package test by early removal of defective semiconductor devices.

The equipment used to test the electrical characteristics of semiconductor devices is mainly composed of a tester and a probe station, which are in mechanical and electrical contact with electrode pads or device pins of semiconductor devices on the wafer. Probe Card is installed. The probe card is equipped with a wiring board on which a plurality of probes are installed, and an electrode pad on which the plurality of probes are electrically connected is formed on the wiring board.

Recently, the number of semiconductor devices on the wafer and the number of device pins formed in each semiconductor device have increased, so that the probing area of the probe card is gradually widened. With the development of semiconductor manufacturing technology, the size of the semiconducting integrated circuit, the size and pitch of electrodes are It is getting smaller to tens of micrometers.

On the other hand, the probe bonding technology for coupling the probe to the electrode pad formed on the wiring board is a plurality of on the wiring board by exposure, etching and plating of photoresist (PR) using MEMS (Micro-Electro-Mechanical Systems) technology. And probes of the blade type probes separately manufactured by using MEMS technology and individually bonded to the wiring board. Among these, when separately fabricated probes are individually bonded to the wiring board, it is important to accurately position the probes on the electrode pads formed on the wiring board. However, as semiconductor patterns become more highly integrated and denser, electrode pads have fine pitch, which makes it difficult to bond the probe to the correct position on the electrode pad. Accordingly, there is a need for a probe assembly that enables bonding of a separately manufactured probe to an exact location on a wiring board mounted on a probe card.

The present invention has been devised to improve the above-mentioned problems, and the problem to be solved by the present invention is to provide a probe assembly that can be bonded to the probe fabricated separately to the correct position on the wiring board mounted on the probe card.

Technical problem of the present invention is not limited to those mentioned above, another technical problem that is not mentioned will be clearly understood by those skilled in the art from the following description.

In order to achieve the above object, the probe assembly according to an embodiment of the present invention, a plurality of wiring boards having a plurality of electrode pads formed on the upper surface, and a plurality of coupled to each of the plurality of electrode pads electrically connected to the wiring board In the probe assembly comprising a probe, the upper surface of the electrode pad is characterized in that the receiving portion is inserted into the fixing portion formed at one end of the probe is fixed.

Specific details of other embodiments are included in the detailed description and the drawings.

According to the probe assembly according to an embodiment of the present invention as described above has the following effects.

First, by forming a slot-shaped receiving portion into which the fixing part of the probe is inserted and fixed to the upper surface of the electrode pad formed on the wiring board, it is possible to be coupled to the correct position on the wiring board when the probes are individually bonded to the electrode pads. Can be.

In addition, since the probe may be aligned at the correct position by forming the receiving portion on the upper surface of the electrode pad, the reliability of the bonding process may be increased.

In addition, since the positional alignment of the probes can be quickly made to facilitate the fabrication of the probe assembly, a probe assembly suitable for a high density probe card having a plurality of probes having a fine pitch can be provided.

In addition, when the probe is coupled to the electrode pad, the side of the fixing part may also be coupled to the side of the receiving part, thereby increasing the bonding strength and increasing the durability of the probe.

The effects of the present invention are not limited to the above-mentioned effects, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various different forms, and only the embodiments make the disclosure of the present invention complete, and the general knowledge in the art to which the present invention belongs. It is provided to fully inform the person having the scope of the invention, which is defined only by the scope of the claims. Like reference numerals refer to like elements throughout.

Hereinafter, the present invention will be described with reference to the drawings for describing the probe assembly according to embodiments of the present invention.

1 is a perspective view showing the configuration of a probe assembly according to an embodiment of the present invention, Figure 2 is an exploded perspective view showing the configuration of a probe assembly according to an embodiment of the present invention, Figure 3 is an embodiment of the present invention It is a side view which shows the structure of the probe assembly which concerns on this.

As shown in FIG. 1, a probe assembly 1 according to an embodiment of the present invention may include a plurality of electrode pads in which a plurality of probes 100a to 100d and a plurality of probes 100a to 100d are coupled to each other. It may be configured to include a wiring board 10 is formed 200a to 200d. The wiring board 10 may be mounted on a probe card for inspecting electrical characteristics of the semiconductor device. In general, a plurality of probes 100a to 100d may be used to simultaneously inspect a plurality of semiconductor devices. A plurality of electrode pads 200a to 200d corresponding to the plurality of probes 100a to 100d may be formed on the upper surface of the wiring board 10. Probe 100a to 100d may be coupled to each electrode pad 200a to 200d to be electrically connected to the wiring board 10. Since each of the electrode pads 200a to 200d and each of the probes 100a to 100d coupled thereto may have the same structure, as shown in FIG. 2, one electrode pad 200 and one coupled thereto may be used. Only the probe 100 will be described.

The probe 100 may be composed of a contact portion 110, a body portion 120, and a fixing portion 130. The probe 100 may be electrically connected to the wiring board 10 by being coupled to the electrode pad 200 through a fixing part 130 formed at one end thereof. In addition, the probe 100 may be electrically connected to a device pin or a bond pad (not shown) of the semiconductor device to be inspected through the contact unit 110.

According to one embodiment of the present invention, the probe 100 may use a blade type of a thin plate shape. The blade-type probe 100 may be manufactured using a micro thin plate technology applied in semiconductor manufacturing. Preferably, as shown in FIG. 2, the probe 100 includes a fixing part 130 coupled to the electrode pad 220, and a body part 120 long connected to the fixing part 130 to one side. And a cantilever structure formed perpendicularly to one end of the body part 120 and including a contact part 110 contacting an element to be inspected (not shown). When the probe 100 has a cantilever structure, one end of the probe 100 is fixed and the other end thereof is elastically deformed up and down about the fixed end thereof, and thus, more advantageous in flatness due to the restoring force of the probe 100 itself. Can have The probe 100 having a cantilever structure may be integrally formed by stacking a metal such as nickel, cobalt, or a nickel-cobalt alloy. At this time, the body portion 120 may have a structure of a substantially rectangular bar. In the present embodiment, the probe 100 having the cantilever structure has been described, but the structure of the probe 100 is not limited thereto and can be changed by those skilled in the art.

The electrode pad 200 may be formed on the upper surface of the wiring board 10 and may be formed at a position corresponding to the electrode of the semiconductor integrated circuit. The wiring board 10 may be made of a material such as ceramic, and a multilayer board or a double-sided board may be used. As illustrated in FIG. 3, an electrode hole 11 penetrating up and down may be formed in the wiring board 10 to connect the pattern circuits formed on the upper and lower surfaces, respectively. The electrode pad 200 is connected to the electrical connection element 12 located inside the electrode hole 11 through the contact 230 formed at one end thereof, and the contact 13 connected to the lower end of the electrical connection element 12. It may be connected to the pattern circuit formed on the lower surface of the wiring board 10 through.

As shown in FIG. 2, in the case of the probe assembly 1 according to the exemplary embodiment, a fixing part 130 formed at one end of the probe 100 is inserted into and fixed to an upper surface of the electrode pad 200. Receiving portion 210 may be formed. At this time, the electrode pad 200 and the receiving portion 210 is preferably composed of a conductor.

As shown in FIG. 2, the fixing part 130 of the probe 100 may be formed to be long in the longitudinal direction of the probe 100. In this case, the receiving part 210 is larger than the thickness of the fixing part 130. The slot 220 may have a wide width and may be elongated to have a shape corresponding to the fixing part 130 to insert the fixing part 130 therein. The shape of the accommodation portion 210 is not limited thereto, and may be changed by those skilled in the art.

In this case, the electrode pad 200 and the receiver 210 may be formed using a lithography technique. The electrode pad 200 and the receiving portion 210 may be formed by increasing the thickness by gradually growing by using a lithography technique, for example, a photo process and a plating process. Since lithography techniques are known for forming thin films and patterns, detailed descriptions thereof will be omitted below. Referring to FIG. 3, an example in which the electrode pad 200 and the receiving portion 210 are integrally formed in a single layer form using a lithography technique of exposing, etching, and plating a photoresist is illustrated. At this time, the electrode pad 200 is preferably formed to have a predetermined thickness to form the receiving portion 210 for the fixing portion 130 of the probe 100 is inserted. However, the electrode pad 200 and the receiving portion 210 may be formed by separating two or more layers.

4 is a side view illustrating an example in which a receiver is formed of a different layer from an electrode pad in a probe assembly according to an exemplary embodiment.

In FIG. 4, an example in which the body part 330 and the receiving part 310 of the electrode pad 300 are separated into two layers is shown. That is, the accommodating part 310 may be formed in different layers from the electrode pad 300. First, the body 330 of the electrode pad 300 to which the probe 100 is coupled is thinly formed, and at one end, a contact 340 is formed to be connected to the electrical connection element 12 inside the electrode hole 11. Can be. In addition, the receiving portion 310 may be formed on the body portion 330 of the electrode pad 300. Each layer can be formed using lithographic techniques. A slot 320 for inserting the fixing unit 130 of the probe 100 into the accommodation unit 310 may be provided.

As such, in the case of the probe assembly 1 according to the exemplary embodiment of the present invention, the accommodating part 210 to which the fixing part 130 of the probe 100 is inserted and fixed to the upper surface of the electrode pad 200 is formed. As a result, when the separately manufactured probe 100 is individually bonded to the electrode pad 200 formed on the upper surface of the wiring board 10, the probe 100 may be coupled to the correct position on the wiring board 10. Can be. In addition, since the receiving part 210 is formed on the upper surface of the electrode pad 200, the probe 100 may be aligned at the correct position, thereby increasing reliability of the bonding process. In addition, since the positional alignment of the probe 100 can be quick, the fabrication of the probe assembly can be facilitated. Accordingly, it is possible to provide a probe assembly suitable for a high density probe card having a plurality of probes having a fine pitch.

Meanwhile, the fixing part 130 of the probe 100 may be inserted into the receiving part 130 formed in the electrode pad 200 and then fixedly coupled by soldering. As a soldering material for bonding the probe 100 to the electrode pad 200, a solder paste such as SnPb, SnAgCu, AuSn, or a conductive epoxy may be used. However, the method of coupling the probe 100 to the electrode pad 200 is not limited thereto, and the fixing part 130 of the probe 100 may be thermally compressed according to the material of the electrode pad 200 and the probe 100. May be directly bonded to the receiving portion of the electrode pad 200.

As such, when the probe 100 is coupled to the electrode pad 200, only the lower surface of the fixing part 130 is not bonded to the electrode pad 200, but the side of the fixing part 130 is also the side of the receiving part 210. Since it can be bonded together, it is possible to increase the bonding strength and increase the durability of the probe (100).

5 is a view showing various modifications of the receiving portion in the probe assembly according to an embodiment of the present invention.

In FIG. 5A, as illustrated in FIG. 2, a slot 220a elongated in the accommodating part 210a is illustrated, and a fixing part elongated at one end of the probe 100 is provided in the slot 220a. 130 may be inserted and fixed.

In FIG. 5B, in the example of FIG. 4A, both sidewalls of the receiving portion 210a in which the slots 220a are formed are opened. That is, two slots 220b and 220c may be formed in the two accommodating parts 210b and 210c to fix both ends in the longitudinal direction of the fixing part 130. In this case, both ends of the fixing part 130 formed at one end of the probe 100 and both sides of each end may be supported.

On the other hand, although not shown, the fixing part 130 of the probe 100 may be formed long in the longitudinal direction of the probe 100 and may include two protrusions protruding downward in both ends of the lower surface. These protrusions may be formed to more accurately position the coupling of the probe 100.

In this case, as shown in (c) of FIG. 5, the receiving portion 210d of the electrode pad 200 has two fixing grooves formed to insert two projections formed at the lower end of the fixing portion 130 at both ends. 220d and 220e can be provided. In addition, in FIG.5 (d), the center part of the accommodating part 210d is opened in the example of FIG.5 (c). That is, two fixing parts 220f and 220g may be formed in the two receiving parts 210f and 210g to fix both ends of the fixing part 130 in the longitudinal direction. In this case, both ends of the two protrusions formed on the bottom of the fixing part 130 of the probe 100 and both sides of each end may be supported.

The shape of the accommodation part shown in FIG. 5 is exemplary, and can be modified in various forms depending on the shape of the fixing part 130 formed at one end of the probe 100.

As described above, in the case of the probe assembly according to the exemplary embodiment of the present invention, the probe is individually attached to the electrode pad by forming a slot-shaped receiving part into which the fixing part of the probe is inserted and fixed to the upper surface of the electrode pad formed on the wiring board. Can be bonded to the correct position on the wiring board when bonded.

On the other hand, the embodiments of the present invention disclosed in the specification and drawings are merely presented specific examples to easily explain the technical contents and help the understanding of the present invention, and are not intended to limit the scope of the present invention. It will be apparent to those skilled in the art that other modifications based on the technical idea of the present invention can be carried out in addition to the embodiments disclosed herein.

1 is a perspective view showing the configuration of a probe assembly according to an embodiment of the present invention.

Figure 2 is an exploded perspective view showing the configuration of a probe assembly according to an embodiment of the present invention.

Figure 3 is a side view showing the configuration of a probe assembly according to an embodiment of the present invention.

4 is a side view illustrating an example in which a receiver is formed of a different layer from an electrode pad in a probe assembly according to an exemplary embodiment.

5 is a view showing various modifications of the receiving portion in the probe assembly according to an embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

1: probe assembly 10: substrate

100: probe 110: contact

120: body portion 130: fixed portion

200: electrode pad 210: receiving portion

220: slot 230: contact

300: electrode pad 310: receiving portion

320: slot 330: circuit pattern

340: contact

Claims (8)

A probe assembly comprising a wiring board having a plurality of electrode pads formed on an upper surface thereof, and a plurality of probes coupled to each of the plurality of electrode pads and electrically connected to the wiring board. Probe assembly, characterized in that the upper surface of the electrode pad is formed with a receiving portion is fixed to the fixing portion formed at one end of the probe. The method of claim 1, The probe assembly is characterized in that the probe has a cantilever (Cantilever) structure consisting of a contact portion which is connected to the fixed portion and formed long to one side, the contact portion is formed perpendicular to the end of the body portion in contact with the device under test. The method of claim 2, The fixing part is formed long in the longitudinal direction of the probe, And the receiving part has a slot formed to have a shape corresponding to the fixing part so as to insert the fixing part therein. The method of claim 2, The fixing part is formed long in the longitudinal direction of the probe and has two protrusions protruding downward in both ends of the lower surface, And the receiving portion includes two fixing grooves formed at both ends to insert the two protrusions. The method of claim 1, And the electrode pad and the receptacle are formed using lithography technology. The method of claim 5, The receiving part is separated from the electrode pad probe assembly, characterized in that formed in a different layer (layer) separate from the electrode pad. The method of claim 1, And the electrode pad and the receiving portion are made of a conductor. The method of claim 1, And the fixing part is fixedly coupled by soldering after being inserted into the receiving part.

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