KR20100038859A - Via hole forming device using laser beam - Google Patents

Abstract

PURPOSE: A via hole processing device using a laser is provided to reduce vibration and increase work speed by installing two or more scan heads on one line. CONSTITUTION: A via hole processing device using a laser comprises a frame, a fixed table(14), a scan head module(27), and a laser module. The scan head module moves in the straight line at a right angle to the traveling direction of the fixed table. The two or more scan heads(11a,11b) are mounted in the scan head module. The laser module comprises a laser generator(10), a mirror, and a beam splitter(17).

Description

Via hole forming device using laser

The present invention relates to a via hole processing apparatus such as a substrate, and more particularly, compared to the conventional laser processing apparatus, a laser having an improved structure to improve processing accuracy, processing speed and processing productivity, and to reduce the weight and size of the apparatus. It relates to a via hole processing apparatus used.

Conventionally, a drill is used to form a via hole in a flexible substrate, but there is a problem in the case of fine machining having a via hole of 100 μm or less due to the physical size limitation of the drill blade. In addition, in the case of the drill blade has a disadvantage that its life is not long due to the long working time. Therefore, recently, a drilling method using a laser has been adopted to replace this.

Drilling by laser is a method of forming a via hole, which is a minute hole, by irradiating a laser onto a surface of a substrate to be processed. Recently, in addition to processing a flexible substrate, it is also applied to drilling a semiconductor wafer.

4 is a front view of a conventional via hole processing apparatus, FIG. 5 is a side view of FIG. 4, and FIG. 6 is a partially enlarged view of FIG. 4.

In the drilling method by the laser, when the beam from the laser oscillator 30 is reflected from the mirror 36 and input to the scan heads 31a and 31b, the beam head is controlled by the scan heads 31a and 31b to process the flexible substrate. By drilling the beam into position, drilling is done.

Conventionally, a single scan head is used, but recently, in order to increase the processing speed and increase productivity, the scan heads 31a and 31b are installed in two lines, respectively, and at the same time, the flexible substrate supply devices 32a and 32b are provided. ) Are arranged in two rows so that the flexible substrate is supplied to two lines at the same time. In the case of the conventional via hole processing apparatus, the drilling operation is simultaneously performed on the flexible substrate 33 supplied to the two lines at the same time, thereby improving productivity compared to the single line method in which one scan head is disposed.

The beam from the laser oscillator 30 is incident on the two scanheads 31a and 31b by the mirror 36 and the beam splitter, and the beam passing through the scanhead is beamed to a position controlled by the scanhead. Will be investigated.

As described above, the conventional via hole processing apparatus has two scan heads 31a and 31b and two rows of flexible substrate feeders 32a and 32b. The scan heads 31a and 31b are fixed on the upper frame 51. The flexible substrate feeders 32a and 32b are fixed to the x-axis stage 55 and move with the x-axis stage. The x-axis stage 55 is placed on a separate y-axis stage 54 and linearly moves in the x-axis direction shown on the y-axis stage 54. The y-axis stage 54 is configured to move in the y-axis direction on the frame 53. As described above, the scan heads 31a and 31b are fixed, and the x-axis stage 55 and the y-axis stage 54 to which the flexible substrate holders 34a and 34b and the flexible substrate supply devices 32a and 32b are coupled. ) Is irradiated to the beam by moving to the via hole forming position to be processed while moving in the x-axis and y-axis directions, respectively.

As shown in FIG. 6, in the case of the conventional via hole processing apparatus, the flexible substrate 33 supplied from the flexible substrate supply devices 32a and 32b moves together with the x-axis stage 55, and the scanhead 31a, 31b) is irradiated with the beam fixed. The flexible substrate 33 supplied to two lines is subjected to via hole processing by a laser beam irradiated by two scan heads 31a and 31b. That is, one substrate 33 is a structure that is processed by one scan head. The flexible substrate 33 is wound around the flexible substrate supply devices 32a and 32b in the form of a roll, and supplies the flexible substrate 33 while rotating the roll in the supply device. Therefore, when the entire xy-axis stages 54 and 55 are moved to arbitrary working positions in the x- and y-axis directions, the scan heads 31a and 31b irradiate a laser beam to drill in the working area of the flexible substrate 33. You will be working.

In the conventional via hole processing apparatus, as shown in FIG. 5, the flexible substrate supply devices 32a and 32b move while moving in the x-y direction while being fixed on the x-axis stage 55. In this case, due to the weight of the substrate supply devices (32a, 32b) and the weight of the stage itself, there is a problem that can not be driven at high speed due to the vibration generated during the drive, the difficulty in improving the degree of via hole processing There is. After all, in order to improve the degree of processing, it is necessary to drive at a low speed. In this case, the productivity of the device is greatly reduced. In addition, since the two substrate supply devices (32a, 32b) must be installed in each of the two lines, each one has a problem that the size and weight of the equipment is very large. That is, in the case of the conventional via hole processing apparatus, two scan heads and two flexible substrate feeders are installed to improve the processing productivity (processing speed), which is twice as much as the case of adopting one scan head and the substrate feeder. To secure. However, such a system doubles the weight of the substrate feeder, and also doubles the weight of the substrate holder and the stage, causing vibration during driving for the movement in the xy axis and improving the feeding accuracy of the stage. It is difficult to secure. As a result, in order to secure the machining accuracy, a problem arises in that it must be driven at a low speed. Since the size of the equipment is almost doubled or more, it requires a lot of installation place, and there is a problem that it is not easy to install and change because of its large weight.

An object of the present invention is to solve the problems such as the processing accuracy, processing speed, the generation of vibration and the size of the device, which is a problem of the conventional via hole processing apparatus, the product is lighter, the processing speed and accuracy is excellent, the transfer device during processing It provides a via hole processing device using laser optimized to double the productivity and less vibration caused by the weight of the.

In order to solve the above technical problem, in the present invention, in the processing apparatus for forming a hole in the substrate using a laser, the frame coupled to the substrate supply device (12a, 12b) for loading and unloading the substrate 13 23, a fixing table 14 installed on the frame 23 so as to be movable in a straight line, and a clamping device 19 provided to fix the substrate 13 to the upper portion of the fixing table 14. Attached to the frame so as to be linearly movable in a direction orthogonal to the moving direction of the fixed table, the scanhead module 27 and the scanheads 11a and 11b equipped with at least two scanheads 11a and 11b are mounted. For transmitting a laser beam to the, comprising a laser module consisting of a laser oscillator 10, a mirror 16 and a beam splitter 17, the fixed table 14 and the scanhead module 27 This book While moving in the direction perpendicular to the via hole using a laser processing machine, characterized in that for forming a via hole in a substrate on the fixed table 14 is provided.

Here, the spacing between the scan heads 11a and 11b may be adjusted by the linear guide 24 and the ball screw 25 installed on the scan head module 27.

The fixed table 14 is linearly coupled to an upper surface of the stage 20 which is linearly moved on the linear guide 20a by a motor.

The scanhead module 27 is linearly moved in a direction orthogonal to the fixed table 14 by the linear guide 15 and the ball screw 26.

According to the present invention, it is possible to precisely process the ultra-fine via holes as compared to the case of the conventional mechanical drill, and it is very convenient because the drill blade does not need to be frequently replaced by the wear of the mechanical drill blade.

In the present invention, the substrate feeder is not transported together with the stage on which the substrate is loaded, but the substrate feeder is fixedly attached to the frame and the fixed table and the scanhead module move in a direction perpendicular to each other. Since the scan head is disposed above, the high speed operation is easy and the vibration generated due to the high speed operation is less than that of the conventional art. In addition, while improving the production efficiency more than twice, it is possible to reduce the weight and size of the device, it is possible to work with high precision, and does not matter in the installation place.

Hereinafter, with reference to the accompanying drawings, the configuration and operation principle of the present invention will be described in more detail.

1 is a front view of a via hole processing apparatus of the present invention, FIG. 2 is a side view of FIG. 1, and FIG. 3 is a partially enlarged view of FIG. 1.

As shown in the drawing, the via hole processing apparatus of the present invention includes a frame 23 serving as a skeleton, a fixing table 14 coupled to the frame, a scanhead module 27 and a laser module. The frame 23 is composed of a main frame 23a at the bottom, a support frame 23b at the side, and an upper frame 23c at the top. Flexible substrate supply devices 12a and 12b for supplying the flexible substrate 13, which is a substrate for via hole processing, are fixedly coupled to both sides of the main frame 23a. The flexible substrate supply device is composed of a loading device 12a for supplying the flexible substrate to the fixed table 14 and an unloading device 12b for recovering the flexible substrate 13 which has been processed. The loading and unloading devices 12a and 12b perform a loading or unloading operation while the roller on which the flexible substrate 13 is wound rotates.

The fixing table 14 is formed with a clamping device 19 for fixing the loaded substrate as the supplied substrate 13 is loaded and seated. The fixed table 14 is coupled to the upper surface of the stage 20 linearly moving in the x-axis direction is linearly moved together. The stage 20 is installed on the main frame 23a to linearly move in the x-axis direction on the linear guide 20a by a motor (not shown).

The laser module is configured to deliver a laser beam to the scan heads 11a and 11b to be described later. The laser oscillator 10 provided on the upper frame 23c and the beam from the laser oscillator 10 are divided. Beam splitter 17 and mirrors 16a and 16b for reflecting the beam.

The scan head module 27 is arranged so that two scan heads 11a and 11b are arranged in a line at a predetermined interval, and are installed to move in the y-axis direction, which is a direction perpendicular to the x-axis direction, on the upper frame 23c. do. That is, the scanhead module 27 is configured to linearly move on the linear guide 15 as the ball screw rotates by the linear guide 15 and the ball screw 26. The spacing between the scan heads 11a and 11b can be adjusted by the linear guide 24 and the ball screw 25, as shown in FIG. That is, the spacing can be adjusted by rotating the ball screw 25 so that each scan head 11a, 11b moves on the linear guide 24.

In the present invention, the flexible substrate 13 supply method is not supplied to the x-axis stage moving in the x-axis direction by being coupled to the y-axis stage moving in the y-axis direction, as in the conventional art, but the flexible substrate supply device 12a, 12b. ) Itself is fixedly installed on the frame 23. Therefore, the flexible substrate feeders 12a and 12b are fixed and fixed table 14, rather than the heavy flexible substrate feeder being combined on the x-axis stage and moving with the x-axis and y-axis stage as in the prior art. ) Will only linearly move in the x-axis direction on the frame. In addition, unlike the related art, since only one flexible substrate supply device 12a or 12b is installed, the size of the product is reduced.

In the present embodiment, two scan heads 11a and 11b are installed in a row, and are assembled at a predetermined distance from which the respective scan heads 11a and 11b work. Since the relative distance between the scan heads 11a and 11b may vary depending on the size and process of the flexible substrate 13 to be processed, the distance between the scan heads can be adjusted. The adjustment of the distance between the scan head may use the linear guide 24 and the ball screw 25, and is fixed so as not to move when the adjustment is completed.

The scan heads 11a and 11b positioned at such a distance are composed of one assembly module, which can move in the y-axis direction. Movement in the y-axis direction is performed by a motor (not shown) and a linear guide 15 for guiding the ball screw 26 and the scanhead module 27 rotated by the motor.

Release the roll on which the substrate is wound in the loading device 12a of the flexible substrate supply device and transfer the flexible substrate 13 to the machining position of the fixed table 14 while winding the roll on the unloading device 12b. Is fixed on the fixed table 14 by the clamping device 19. The fixed table 14 is installed on the stage 20 driven by a motor (not shown) and moves in the x-axis direction by the driving of the motor. Since the flexible substrate 13 is fixed by the clamping device 19 of the fixed table 14 when the fixed table 14 moves in the x-axis direction, when the left and right sides of the roll are taut, the fixed table 14 Since the obstacles to movement, the left and right sides of the roll should be loosened in a loose state so that the fixed table 14 can be freely moved. That is, in the loading device 12a, the rolls should be sufficiently released, and the rolls in the unloading device 12b should be in a loose state.

When the work ready state is provided as described above, the fixed table 14 is moved to an arbitrary position to be processed by the x-axis movement of the fixed table 14 and the y-axis movement of the scan head module 27. When the laser beam is irradiated onto the substrate by the two scan heads 11a and 11b, via holes are formed in the substrate.

With this type of device, only one substrate supply device 12a, 12b is required for one line, while two scanheads are via-hole processed in one line by two scanheads, so one scanhead per line Compared to the case of using, there is an advantage of achieving twice the productivity. In addition, compared to the conventional processing apparatus that attaches two substrate feeders to the x-axis stage and moves together with the stage, the apparatus is simpler, the size of the apparatus is smaller, and the vibration and processing precision due to the weight of the stage are reduced. Can be reduced.

The operation principle of the present invention will be described with reference to FIG. 3 as follows. First, the scan heads 11a and 11b are provided at a predetermined distance, and the distance between the scan heads can be adjusted as necessary. The scanhead module 27 may move in the y-axis direction, and the flexible substrate 13 may be supplied in the form of a roll and move in the x-axis direction while being fixed to the fixed table 14. After the portion to be processed is positioned below the scan heads 11a and 11b by moving in the x-axis and y-axis directions, the respective scan heads 11a and 11b are assigned to the assigned work area A, The substrate of B) is irradiated with a laser beam to process via holes. That is, one scan head 11a forms a via hole in one work area A, and the other scan head 11b forms a via hole in another work area B. FIG. In this case, since the via holes are formed in two working areas A and B simultaneously in one line, the productivity can be doubled as compared with the prior art. As described above, when the work in the working area A and B is finished, the rolls of the substrate are loaded and unloaded by the flexible substrate supply devices 12a and 12b, and the subsequent work area is positioned on the fixing table 14 and then The same process as is repeated.

In the above-described embodiment of the present invention, the scan heads 11a and 11b are arranged in two as an example, but the technical scope of the present invention is not limited thereto, and the number of the scan heads 11a and 11b is not limited thereto. Two or more may be designed in consideration of the output of the laser beam and other circumstances.

In the present invention, the processing of the flexible substrate has been described as a main example, but the apparatus of the present invention may be similarly applied to the manufacturing process of the semiconductor wafer, and the next-generation packaging using the through-silicon via chip connection method It may be applied to packaging technology.

1 is a front view of the via hole processing apparatus of the present invention.

2 is a side view of FIG. 1;

3 is a partially enlarged view of FIG. 1;

4 is a front view of a conventional via hole processing apparatus.

5 is a side view of FIG. 4.

6 is a partially enlarged view of FIG. 4.

<Description of the symbols for the main parts of the drawings>

10: laser oscillator 11a, 11b: scanhead

12a, 12b: substrate supply unit 13: substrate

14: fixed table 15, 20a, 24: linear guide

25, 26: ballscrew 16a, 16b: mirror

17: beam splitter 19: clamping device

23a, 23b, 23c: frames

Claims (4)

In the processing apparatus for forming a hole in the substrate using a laser, A frame 23 to which the substrate supply devices 12a and 12b for loading and unloading the substrate 13 are coupled; A fixing table 14 installed on the frame 23 so as to be linearly movable and provided with a clamping device 19 to fix the substrate 13; A scan head module 27 attached to the frame so as to be linearly movable in a direction perpendicular to the moving direction of the fixing table, on which at least two scan heads 11a and 11b are mounted. ); And Laser module for transmitting a laser beam to the scan head (11a, 11b), consisting of a laser oscillator 10, a mirror 16 and a beam splitter 17 As configured to include, Via hole processing apparatus using a laser, characterized in that the via table is formed on the substrate on the fixed table 14 while the fixing table (14) and the scanhead module (27) moves in a direction perpendicular to each other. The method of claim 1, The gap between each scan head (11a, 11b) is via hole processing apparatus using a laser, characterized in that to be adjusted by the linear guide 24 and the ball screw (25) installed on the scan head module (27). The method according to claim 1 or 2, The fixing table (14) is a via-hole processing apparatus using a laser, characterized in that the linear movement by coupling to the upper surface of the stage 20 to move linearly on the linear guide (20a) by a motor. The method according to claim 1 or 2, The scan head module (27) is a via hole processing apparatus using a laser, characterized in that the linear guide (15) and the ball screw (26) to move in a direction perpendicular to the orthogonal to the fixed table (14).

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