KR20100031015A - A heat exchanger using thermoelectric modules - Google Patents

Abstract

PURPOSE: A thermoelectric module heat exchanger is provided to reduce the volume of a unit heat exchanger using a water cooling block which consists of thin tubes and a header tank, and to improve heat transfer performance. CONSTITUTION: A thermoelectric module heat exchanger comprises an unit heat exchanger(500) and a cover(110). The unit heat exchanger comprises a water cooling block(200), a thermoelectric module array(100), and a heat radiation fin block(300). The water cooling block comprises an inlet(210), and an outlet(220), and a coolant path. The thermoelectric module array is installed on the upper and lower sides of the water cooling block. The heat radiation fin block transfers the air in width direction of the water cooling block. The cover has a slot shape and includes the thermoelectric module array while contacting with the upper and lower sides and the inner side of the thermoelectric module array. The water cooling block and the heat radiation fin block are brazing-combined with the upper and lower sides of the cover, respectively. One selected among one side edge, one side, both sides corner, and both sides of the cover can be opened and closed through loop coupling.

Description

Thermoelectric Module Heat Exchanger {A Heat Exchanger using Thermoelectric Modules}

The present invention relates to a thermoelectric module heat exchanger, and more particularly, to a thermoelectric module heat exchanger for improving heat exchange performance by minimizing volume and reducing flow resistance and heat resistance on a flow path.

Thermoelectric Element is a generic term for elements that use various effects caused by the interaction of heat and electricity.Thermistor, temperature, which is a device with the characteristics of negative resistance temperature coefficient that decreases as the temperature increases, the electrical resistance decreases. There is a device using the Seebeck effect, a phenomenon in which electromotive force is generated by a difference, and a device using the Peltier effect, a phenomenon in which heat absorption (or generation) is caused by current. In particular, by using the Peltier effect, a thermoelectric module is a thermo-electric heat pump that is capable of performing a cooling function similar to a freon compressor or an endothermic refrigerator even with a small solid-state device. The Peltier effect is a phenomenon in which one side is heated and the other side is cooled according to the direction of current when DC power is applied to two different electrical conductors. This phenomenon is caused by electrons moving from one semiconductor to the other. It is caused by absorbing thermal energy to increase

Figure 1 shows a simple circuit that can explain the operation principle of such a thermoelectric module. When the N-type semiconductor (semiconductor whose current carrier is mainly electrons) and the P-type semiconductor (semiconductor whose current carriers are mainly holes) are connected as shown in FIG. In the process of moving electrons from the N-type semiconductor to the P-type semiconductor, electrons passing through the upper surface 5 absorb the thermal energy, so that the upper surface 5 is cooled, and at the lower surface 4, the electrons absorb the thermal energy. The lower surface 4 is heated because it is released. At this time, if proper heat transfer is performed between the upper surface 5 where cooling takes place and the lower surface 4 where heating occurs, the thermoelectric module operates as a heat pump that transfers heat from the upper surface 5 to the lower surface 4. Done. The thermoelectric module changes its efficiency and capacity according to its operating environment, and it is well known that the efficiency tends to decrease as the temperature difference between both sides of cold and hot increases. Therefore, as the temperature difference between the two sides of the thermoelectric module is reduced, the efficiency of the thermoelectric module increases. As such, the thermoelectric module is an element that enables electrical energy and thermal energy to be interchanged.

1 (B) shows a form of a general thermoelectric module. As shown, the P-type semiconductor and the N-type semiconductor are arranged to cross each other on a plane, connected to each other by a conductor, and the substrate is covered above and below. As shown in FIG. 1 (B), when electricity of (+) and (-) is externally applied, as shown in FIG. 1, an endothermic phenomenon occurs on one side and a heat dissipation phenomenon occurs on the other side. As shown in FIG. 1 (B), thermoelectric modules which are generally used have a plurality of P-type and N-type semiconductors, and a pair of positive and negative wires are coupled to supply electricity thereto. By arranging a plurality of thermoelectric modules made in such a standard on the surface of the heat exchanger to form a thermoelectric module array, there has been a study to improve the heat exchange performance of the heat exchanger using the thermoelectric module.

US Patent No. 5,561,981 ("Heat Exchanger for Thermoelectric Cooling Device", hereinafter referred to in the prior art) is a water cooling block 200 is provided with a cooling water inlet and outlet in the center of the thermoelectric module heat exchanger (1000 '), as shown in FIG. ') And the thermoelectric module array 100' and the heat dissipation fin block 300 'in which a plurality of thermoelectric modules are arranged outside of the water cooling block 200', thereby cooling and heating in one heat exchanger. It is designed to be possible at the same time. The heat dissipation fin block 300 'has a structure in which a plurality of rows of fins are stacked in parallel, and the central water cooling block 200' and the heat dissipation fin block 300 'are also arranged in parallel with each other. The heat dissipation fin block 300 'is fastened to each other by the fixing bolt 310' so that the heat dissipation fin block 300 ', the water cooling block 200', and the thermoelectric module array 100 'are integrally coupled to each other. . In addition, a wire 110 'is connected to the thermoelectric module array 100' to supply power to the thermoelectric module array 100 'from the outside.

In the conventional thermoelectric module heat exchanger (1000 '), the water cooling block (200') is a risk factor such as damage by internal pressure or external force to prevent the cooling water leakage from the flow path (230 '). It should be made firmly in consideration, it should be formed to have a predetermined thickness or more in the portion having the flow path (230 '). However, when the thickness of the water cooling block 200 'is increased, thermal resistance in heat transfer from the cooling oil in the flow path 230' to the thermoelectric module array 100 'or the heat dissipation fin block 300' is increased. There is a problem that becomes large. That is, as the thickness of the water cooling block 200 'becomes thicker, the heat resistance increases, so that the heat exchange performance of the conventional thermoelectric module heat exchanger 1000' is greatly reduced.

In addition, as the thickness of the water cooling block 200 'becomes thick, it becomes impossible to lower the volume of the conventional thermoelectric module heat exchanger 1000' to a predetermined level or less. In light of the current trend of production of automotive parts, which are becoming lighter and smaller, and the space utilization in the engine room is increasing, the inability to reduce the volume of the conventional thermoelectric module heat exchanger (1000 ') is considered to be a big problem in production. have.

In addition, in this structure, as shown in order to combine the water cooling block 200 'and the heat dissipation fin block 300', bolting or the like must be used, that is, the upper and lower fins on the surface where air flows and heat exchanges. Since fasteners are formed to fix the air flow, the air flow is hindered, thereby degrading heat exchange performance.

Accordingly, the present invention has been made to solve the problems of the prior art as described above, the object of the present invention is to use a thin tube and header tank, unlike the conventional water-cooled block using a bolt fastening method in the thermoelectric module heat exchanger The present invention provides a thermoelectric module heat exchanger that significantly reduces the volume of a thermoelectric module heat exchanger and increases heat exchange performance by using a water cooling block. Another object of the present invention, by using a water-cooled block consisting of a thin tube and a header tank and at the same time using a cover for accommodating the thermoelectric module array and using a structure for brazing attaching the water-cooled block and the heat radiation fin block to the thermoelectric module array cover, It is to provide a thermoelectric module heat exchanger that minimizes the thermal resistance between the module array and the water cooling block / heat radiating fin block, and completely eliminates air resistance generation factors caused by coupling holes such as bolts.

Thermoelectric module heat exchanger of the present invention for achieving the object as described above, the water cooling block 200 having the inlet 210, the outlet 220 and the cooling water flow path so that the coolant flows therein, the water cooling block 200 The heat dissipation fin block 300 provided on both sides of the thermoelectric module array 100 provided on the upper and lower sides of the thermoelectric module array 100 and fixed to the outer sides of the layer of the thermoelectric module array 100 to distribute air in the width direction of the water cooling block 200. Unit heat exchanger 500 made of; Including, the unit heat exchanger 500 is one or at least two or more in the thermoelectric module heat exchanger 1000 is configured to be stacked in the height direction, is formed in the form of a slot of the thermoelectric module array 100 layer It characterized in that it comprises a cover 110 for accommodating the thermoelectric module array 100 while the surface contact in the upper and lower surfaces.

At this time, the cover 110 is characterized in that the water cooling block 200 or the heat radiation fin block 300 is brazed on the upper and lower surfaces, respectively.

In addition, the cover 110 is characterized in that any one selected from one side, one side, both sides, both sides is formed to be opened and closed by the ring coupling.

In addition, the cover 110 is characterized in that for receiving a combination consisting of a pair of thermoelectric module array 100, respectively disposed on the upper and lower surfaces of the thermoelectric module array 100 or the water cooling block 200.

In addition, the water cooling block 200 is provided at both ends of the flow path and the tube 230 consisting of a single tube 230 or a plurality of tubes 230 are arranged in parallel close to each other inlet 210 or outlet ( It is characterized by consisting of a pair of header tanks 240 provided with 220.

In addition, the cover 110 is characterized in that it is made integral with the tube (230).

In addition, the tube 230 is characterized in that any one selected from the extrusion tube or welded tube.

In addition, the unit heat exchanger 500 is characterized in that it further comprises a cover plate 310 of the plate covering the outermost upper and lower surfaces.

According to the present invention, by improving the structure of the water cooling block that had to be formed to a predetermined thickness or more so as to have a sufficient rigidity in the past while forming a flow path therein, by adopting a water cooling block consisting of a thin tube and a header tank, a conventional thermoelectric module Compared to the heat exchanger, the volume of the unit heat exchanger is significantly reduced, and thus the overall volume of the thermoelectric module heat exchanger is also significantly reduced, and of course, there is an effect of maximizing the space utilization inside the engine room.

In addition, in the case of the water-cooled block using the conventional bolt fastening method is formed in a predetermined thickness or more as described above in the heat exchange process between the cooling water passing through the water cooling block and the air passing through the heat radiation fin block (attached to the outside of the water cooling block) Since the heat resistance was very large, a large amount of heat loss occurred. However, in the present invention, the volume of the water cooling block is minimized. Accordingly, the heat resistance between the cooling water passing through the water cooling block and the air passing through the heat radiating fin block is also minimized. This is greatly reduced and there is a great effect that can significantly increase the heat exchange performance.

In addition, according to the present invention, there is an effect that the thermoelectric module array can be stably assembled and coupled by introducing a cover structure surrounding the thermoelectric module array. The cover of the present invention not only protects the thermoelectric module array but also has the effect of greatly simplifying the assembly process of the unit heat exchanger by attaching the water cooling block and the heat dissipation fin block on the cover in advance, and of course, production time and cost accordingly. There is also the effect of saving costs and increasing production efficiency. In addition, the cover of the present invention, unlike the conventional thermoelectric module heat exchanger in order to assemble each component requires a fastener that prevents the flow of air through the heat radiating fin block, there is no air resistance structure in the air flow portion Since it does not exist, there is an effect of greatly improving the performance in the pressure drop amount characteristics of the air and further increasing the heat exchange performance.

Hereinafter, the thermoelectric module heat exchanger according to the present invention having the configuration as described above will be described in detail with reference to the accompanying drawings.

3A and 3B illustrate a unit heat exchanger constituting the thermoelectric module heat exchanger according to the present invention, and FIG. 3A shows a perspective view of an assembled state and FIG. 3B shows an exploded perspective view. In addition, Figure 3c shows two embodiments of the water-cooled block of the present invention. 3A, 3B, and 3C will be referred to as 3 in the present specification, and the same applies to other drawings.

The thermoelectric module heat exchanger 1000 of the present invention is also basically a unit heat exchanger 500 is laminated in the height direction, as in the conventional thermoelectric module heat exchanger bar, as shown in FIG. The structure of the unit heat exchanger 500 by this invention was shown. The unit heat exchanger 500 according to the present invention includes a water cooling block 200 and a water cooling block 200 having an inlet 210, an outlet 220, and a flow path for circulating the coolant in a longitudinal direction so that the coolant is circulated therein. Heat dissipation fin block 300 is provided in close contact with both sides of the thermoelectric module array 100, the thermoelectric module array 100 provided on both sides of the upper and lower sides of the thermoelectric module array 100, and distributes air in the width direction of the water cooling block 200. Unit heat exchanger 500 consisting of; The unit heat exchanger 500 of the present invention is formed in a slot shape, as shown in FIG. 3, and the thermoelectric module array is in surface contact with the upper and lower surfaces of the layer of the thermoelectric module array 100. It is made to include a cover 110 for receiving (100).

The heat dissipation fin block 300 may be made of corrugated fins as shown in FIG. 3, and of course, may be made of plate fins. In FIG. 3, the heat dissipation fin block 300 is illustrated as being made of a corrugated fin, in particular a louver. In addition, the unit heat exchanger 500 of the present invention preferably further comprises a cover plate 310 of a plate covering the outermost side of the heat dissipation fin block 300.

The thermoelectric module heat exchanger 1000 according to the present invention may be formed of a single unit heat exchanger 500 having the configuration shown in FIG. 3, and as illustrated in FIG. 4, a plurality of unit heat exchangers 500 are provided. Dogs may be stacked in the height direction. 4 illustrates a cross-sectional view of the thermoelectric module heat exchanger 1000 of the present invention in the width direction front side of FIG. 3A. As described above, when the thermoelectric module heat exchanger 1000 is formed by stacking a plurality of unit heat exchangers 500, each inlet 210 and outlet 220 of the unit heat exchanger 500 are connected to each other. The coolant introduced into the unit heat exchanger 500 is sequentially discharged through each unit heat exchanger 500.

The cover 110 is formed in a slot shape as described above, and accommodates the thermoelectric module array 100 layer while being in surface contact with the thermoelectric module array 100 layer. Here, the slot shape refers to a shape in which the overall shape is formed in a wide rectangular parallelepiped shape (that is, in the form of an enclosure) and one of the narrow faces or a pair of facing faces is removed. Of course, the thermoelectric module array 100 is inserted into a side which is formed in a slot shape but one side is formed to be open and close as shown in FIGS. 3 and 4 or all sides are open and closed. You may make it possible. The shape of the cover 110 will be described in more detail in the description of FIG. 6 below.

Meanwhile, as shown in FIGS. 3 and 4, the cover 110 is formed of a thin plate, and in the process of passing heat from the upper and lower layers of the thermoelectric module array 100 through the cover 110. Almost no loss occurs. In the conventional thermoelectric module heat exchanger as illustrated in FIG. 2, since a base plate is provided between the heat dissipation fin and the thermoelectric module array to stably attach the heat dissipation fin to the thermoelectric module array, heat is transferred between the heat dissipation fin and the thermoelectric module array. Naturally, heat loss occurred while passing through the thick base plate. In addition, in the case of the conventional thermoelectric module heat exchanger, a configuration in which a flow path through which cooling water flows is formed in the water cooling block is adopted. Accordingly, even though the thermoelectric module array is in close contact with the water cooling block, the heat passing distance between the flow path through which the coolant flows and the thermoelectric module array is also increased, resulting in a large amount of heat loss.

However, in the case of the present invention, the heat dissipation fin block 300 may be formed of pure fins as shown in the drawing, and thus may be brazed on the cover 110. The heat dissipation fin block 300 and the thermoelectric module array 100 Since only the cover 110 is made of a thin plate between the layers, the heat loss in the heat transfer process between the heat dissipation fin block 300 and the thermoelectric module array 100 is significantly reduced compared to the prior art. In addition, in the present invention, by improving the configuration of the water-cooled block 200 to be attached directly to the cover 110 also heat loss during the heat transfer process between the water-cooled block 200 and the thermoelectric module array 100 It is drastically reduced compared to the conventional. Therefore, according to the present invention, no coupling structure is required at all in the coupling of the cover 110 accommodating the water cooling block 200, the heat dissipation fin block 300, and the thermoelectric module array 100. Since there is no room for flow resistance and the heat loss generated during the heat transfer process between the components is also greatly reduced, according to the present invention, heat exchange performance can be dramatically increased.

An improved configuration of the water cooling block 200 will be described in more detail below. The water cooling block 200 is provided in the present invention, the body formed of a thin tube 230, as shown in Figures 3 and 4, both sides of the tube 230 and the inlet 210 and outlet 220, respectively It comprises a header tank 240 is provided. 3C shows two embodiments of the water cooling block of the present invention, in which only one tube 230 (wide) is provided in FIG. 3C (A), and FIG. 3C (B) is narrower in width. The case where the several tube is arrange | positioned side by side in the width direction is shown, respectively. Both ends of the tube 230 formed as described above are inserted and coupled to the header tank 240, and the tube 230 is attached to the cover 110 directly by brazing or the like.

As the water cooling block 200 is formed in this way, the medium passing in the heat transfer process between the cooling water flowing in the tube 230 and the thermoelectric module array 100 is the wall of the tube 230 and the cover 110. The wall of the tube 230 is also formed in a thin plate shape as well as the wall of the cover 110, and the wall of the cover 110 is also made of a thin plate, so that the heat loss can be drastically reduced as compared with the prior art. The tube 230 forming the water cooling block 200 may be formed in the form of a simple extruded tube as shown in FIG. 5 (A), or welded as shown in FIG. 5 (B). It may be formed in any form, such as a tube).

6 illustrates various embodiments of a cover of the present invention.

The cover 110 illustrated in FIG. 6A (A) is an embodiment having the same shape as that shown in FIGS. 3 and 4, and has a slot shape, and one side or one edge thereof is openable by a ring coupling. have. That is, the thermocouple module array 100 is opened by inserting the ring-coupled portion, and then the closed surface is closed again by the ring coupling to stably accommodate the thermoelectric module array 100. Here, the opening or closing of one side or one edge is determined according to the position of the ring. That is, when the ring coupling structure portion is formed close to the edge, it can be said that one side edge is opened, and when the ring coupling structure portion is formed close to the middle, one side can be opened.

The cover 110 shown in FIG. 6A (B) is an embodiment in the form of a simple slot in which all sides are not open. In this case, the thermoelectric module array 100 may be inserted into the cover 110 through a surface that is open in itself in the slot form. In addition, as illustrated in FIG. 6A (B), partition walls may be formed in the cover 110 so that the thermoelectric modules forming the thermoelectric module array 100 may be inserted.

The cover 110 shown in FIG. 6B (C) is an embodiment in which one side or one corner is formed in a slot shape that can be opened and closed by a ring coupling, and is integrally formed with the tube 230. As described above, since the tube 230 is formed of a thin plate, it may be made by extrusion, but may be made by bending the plate. Therefore, by bending the plate to an appropriate shape as shown in Figure 6b (C) and by brazing the necessary portion, it is possible to make the cover 110 formed integrally with the tube 230. In this case, when one side or one corner is opened, two layers of the thermoelectric module array 100 are inserted into both upper and lower sides of the tube 230 integrally formed with the cover 110, and then open again by a ring coupling. The configuration is completed by closing the face or edge that has been used.

The cover 110 illustrated in FIG. 6B (D) is an embodiment in which both sides or both edges are formed in a slot shape which can be opened and closed by a ring coupling. In addition, the cover 110 illustrated in FIG. 6B (D) is configured to accommodate the bonded body in which the thermoelectric module array 100 layers are provided in close contact with each other on the upper and lower sides of the tube 230. In this case, after opening both sides of the cover 110, the bottom of the cover 110-the thermoelectric module array 100 layer-the tube 230-the thermoelectric module array 100 layer-the cover The configuration can be completed by placing the upper portion of the 110 in sequence and then closing the ring coupling at both sides. As shown in FIG. 6B (D), when the cover 110 is formed to accommodate a combination of a pair of thermoelectric module arrays 100 disposed on the upper and lower surfaces of the water cooling block 200, the thermoelectric module The array 100 and the tube 230 are in direct contact with each other may be a heat loss during the heat transfer process.

6A (A) to 6B (D), the present invention is not limited to the embodiments, and may be formed in any form as long as it does not depart from the spirit of the present invention. That is, for example, in FIG. 6A (A), the cover 110 is formed in a slot shape in which one side can be opened and closed to accommodate only the thermoelectric module array 100 layer, but the cover 110 is opened and closed on one side. 6B (D) may be formed to accommodate the combination consisting of a pair of thermoelectric module array 100 disposed on the upper and lower surfaces of the water cooling block 200 as shown in Figure 6b (D). On the contrary, in FIG. 6B (D), the cover 110 is formed in a slot shape in which both sides are open and close, and includes an assembly including a pair of thermoelectric module arrays 100 disposed on upper and lower surfaces of the water cooling block 200, respectively. Although it is possible to accommodate, the cover 110 may be formed in a slot shape that both sides can be opened and closed to accommodate only the thermoelectric module array 100 layer. In addition, in FIG. 6A (B), a partition wall is formed inside the cover 110 to show that each of the thermoelectric modules forming the thermoelectric module array 100 is accommodated in each of the spaces separated by the partition wall. The cover 110 may be formed without the partition so that the thermoelectric module array 100 layer itself may be inserted into the cover 110. In addition, although an example of a bending design for integrally forming the cover 110 and the tube 230 is illustrated in FIG. 6B (C), the cover may be different from the example illustrated in FIG. 6B (C). If the 110 and the tube 230 can be integrally formed, bending may be performed in any form.

The present invention is not limited to the above-described embodiments, and the scope of application of the present invention is not limited to those of ordinary skill in the art to which the present invention pertains without departing from the gist of the present invention as claimed in the claims. Of course, various modifications can be made.

1 is a working principle of the thermoelectric module.

Figure 2 is a conventional thermoelectric module heat exchanger.

3a and 3b is a unit heat exchanger constituting the thermoelectric module heat exchanger of the present invention.

Figure 3c is two embodiments of the water-cooled block of the present invention.

4 is a thermoelectric module heat exchanger of the present invention.

5 are embodiments of a tube of the present invention.

6A and 6B illustrate embodiments of the cover of the present invention.

** Description of the symbols for the main parts of the drawings **

1000: thermoelectric module heat exchanger 100: thermoelectric module array

110: cover 120: hook

200: water cooling block

210: inlet 220: outlet

230: tube 240: header tank

300: heat radiation fin block 310: plate cover

500: unit heat exchanger

Claims (8)

A water cooling block 200 having an inlet 210, an outlet 220, and a cooling water flow path so that coolant flows therein, a thermoelectric module array 100 provided on upper and lower surfaces of the water cooling block 200, and the thermoelectric module array. A unit heat exchanger (500) made of a heat dissipation fin block (300) which is fixed in close contact with both sides of the (100) layer and distributes air in the width direction of the water cooling block (200); Including, The unit heat exchanger 500 is one or at least two or more in the thermoelectric module heat exchanger 1000 is configured to be stacked in the height direction, The thermoelectric module heat exchanger is formed in a slot shape and comprises a cover (110) for accommodating the thermoelectric module array (100) while being in surface contact with the upper and lower surfaces of the thermoelectric module array (100) layer. The method of claim 1, wherein the cover 110 The thermoelectric module heat exchanger, characterized in that the water cooling block 200 or the radiating fin block 300 is brazed on the upper and lower surfaces, respectively. The method of claim 1, wherein the cover 110 A thermoelectric module heat exchanger, characterized in that any one selected from one side, one side, both side edges, both sides is formed to be opened and closed by the ring coupling. The method of claim 1, wherein the cover 110 Thermoelectric module heat exchanger, characterized in that for receiving a combination consisting of a pair of thermoelectric module array (100) disposed on the upper and lower surfaces of the thermoelectric module array (100) or the water cooling block (200). According to claim 1, wherein the water cooling block 200 is A pair of headers provided with a single tube 230 or a flow path composed of a plurality of tubes 230 arranged in parallel with each other, and both ends of the tube 230 and having an inlet 210 or an outlet 220 at one side thereof. Thermoelectric module heat exchanger, characterized in that consisting of a tank (240). The method of claim 5, wherein the cover 110 Thermoelectric module heat exchanger, characterized in that the integral with the tube (230). The method of claim 5, wherein the tube 230 is Thermoelectric module heat exchanger, characterized in that any one selected from extrusion tube or welded tube. According to claim 1, wherein the unit heat exchanger 500 The thermoelectric module heat exchanger further comprises a cover plate 310 of a plate covering the outermost upper and lower surfaces.

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