KR20100029652A - Low temperature dryable conductive paste composite for solar cell and printing method using the same - Google Patents
Low temperature dryable conductive paste composite for solar cell and printing method using the same Download PDFInfo
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- KR20100029652A KR20100029652A KR1020080088503A KR20080088503A KR20100029652A KR 20100029652 A KR20100029652 A KR 20100029652A KR 1020080088503 A KR1020080088503 A KR 1020080088503A KR 20080088503 A KR20080088503 A KR 20080088503A KR 20100029652 A KR20100029652 A KR 20100029652A
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- South Korea
- Prior art keywords
- acid
- electrode paste
- low temperature
- conductive paste
- screen printing
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- 238000000034 method Methods 0.000 title claims description 25
- 238000007639 printing Methods 0.000 title abstract description 13
- 239000002131 composite material Substances 0.000 title abstract 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 34
- 238000007650 screen-printing Methods 0.000 claims abstract description 30
- 229920005989 resin Polymers 0.000 claims abstract description 26
- 239000011347 resin Substances 0.000 claims abstract description 26
- 239000011230 binding agent Substances 0.000 claims abstract description 15
- 239000007787 solid Substances 0.000 claims abstract description 15
- 239000002245 particle Substances 0.000 claims abstract description 9
- 238000009826 distribution Methods 0.000 claims abstract description 8
- 239000003085 diluting agent Substances 0.000 claims abstract description 7
- 238000001035 drying Methods 0.000 claims abstract description 5
- 229920000728 polyester Polymers 0.000 claims abstract description 5
- 239000000843 powder Substances 0.000 claims abstract description 5
- 239000002003 electrode paste Substances 0.000 claims description 25
- 239000000203 mixture Substances 0.000 claims description 23
- 239000000654 additive Substances 0.000 claims description 22
- 230000000996 additive effect Effects 0.000 claims description 18
- 229910052709 silver Inorganic materials 0.000 claims description 14
- 239000004332 silver Substances 0.000 claims description 14
- -1 polysiloxane Polymers 0.000 claims description 13
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 12
- 229920001296 polysiloxane Polymers 0.000 claims description 12
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 10
- 239000002253 acid Substances 0.000 claims description 10
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 8
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 6
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 6
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims description 6
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 5
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 claims description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims description 4
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims description 4
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims description 4
- 235000021355 Stearic acid Nutrition 0.000 claims description 4
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 4
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 claims description 4
- 239000002518 antifoaming agent Substances 0.000 claims description 4
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 claims description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 4
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 claims description 4
- 239000011256 inorganic filler Substances 0.000 claims description 4
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 4
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 4
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 claims description 4
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims description 4
- 239000008117 stearic acid Substances 0.000 claims description 4
- 229940116411 terpineol Drugs 0.000 claims description 4
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 claims description 4
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 claims description 3
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 claims description 3
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 claims description 3
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 claims description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 3
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 3
- 235000019253 formic acid Nutrition 0.000 claims description 3
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims description 3
- 239000011976 maleic acid Substances 0.000 claims description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims description 2
- 235000011054 acetic acid Nutrition 0.000 claims description 2
- 229910000410 antimony oxide Inorganic materials 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims description 2
- 125000004386 diacrylate group Chemical group 0.000 claims description 2
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 2
- 229910000480 nickel oxide Inorganic materials 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 claims description 2
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 claims description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 2
- 229920000058 polyacrylate Polymers 0.000 claims description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 2
- 229910001887 tin oxide Inorganic materials 0.000 claims description 2
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims 3
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 claims 1
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 claims 1
- 229910052738 indium Inorganic materials 0.000 claims 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 1
- 235000011007 phosphoric acid Nutrition 0.000 claims 1
- 239000000853 adhesive Substances 0.000 abstract description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- 239000002904 solvent Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000010304 firing Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229920001225 polyester resin Polymers 0.000 description 4
- 239000004645 polyester resin Substances 0.000 description 4
- 230000001965 increasing effect Effects 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 238000007865 diluting Methods 0.000 description 2
- 238000010790 dilution Methods 0.000 description 2
- 239000012895 dilution Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- HMUNWXXNJPVALC-UHFFFAOYSA-N 1-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)C(CN1CC2=C(CC1)NN=N2)=O HMUNWXXNJPVALC-UHFFFAOYSA-N 0.000 description 1
- LDXJRKWFNNFDSA-UHFFFAOYSA-N 2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]ethanone Chemical compound C1CN(CC2=NNN=C21)CC(=O)N3CCN(CC3)C4=CN=C(N=C4)NCC5=CC(=CC=C5)OC(F)(F)F LDXJRKWFNNFDSA-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 239000002305 electric material Substances 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- AHHYEKPJZYDDFK-UHFFFAOYSA-N formic acid;phosphoric acid Chemical compound OC=O.OP(O)(O)=O AHHYEKPJZYDDFK-UHFFFAOYSA-N 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000013035 low temperature curing Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Dispersion Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Manufacturing & Machinery (AREA)
- Conductive Materials (AREA)
- Photovoltaic Devices (AREA)
Abstract
Description
본 발명은 각종 전기전자 소재의 전극형성 또는 패키징이나 어셈블리 등에 사용되는 전극 페이스트 조성물 및 이를 이용한 인쇄방법에 관한 것으로서, 보다 상세하게는 태양열전지의 전극을 포함하는 전기전자 기기 부품용 스크린 인쇄에 사용되는 태양전지용 저온 건조형 전극 페이스트 조성물 및 이를 이용한 인쇄방법에 관한 것이다. The present invention relates to an electrode paste composition used for electrode formation or packaging or assembly of various electric and electronic materials, and a printing method using the same, and more particularly, to screen printing for electric and electronic device parts including electrodes of solar cells. It relates to a low temperature dry electrode paste composition for a solar cell and a printing method using the same.
일반적으로 인쇄라고 하면, 색을 부여하는 잉크를 이용하여 문자나 화상 정보를 종이에 인쇄하는 것을 떠올리게 된다. 그러나 현재 인쇄라는 것은 필요한 것을, 필요한 장소에, 필요한 양(두께)만큼 패턴을 형성하는 것을 의미한다. 최근에 전기, 전자 분야에 스크린 인쇄기술이 많이 응용되고 있는데, 평면뿐만 아니라 곡면 인쇄가 가능하며, 공정의 단축 및 코스트의 절감, 전도성 물질 등을 부여하여 전극을 형성하기 쉽기 때문이다. 스크린 인쇄는 스크린 판의 화선부에 잉크를 놓고 스퀴지로 밀어내어 피인쇄물에 전이시키는 인쇄방식이다.Generally speaking, printing of letters or image information onto paper is conceived using ink for giving color. However, current printing means forming a pattern in a necessary amount and a necessary amount (thickness) at a necessary place. Recently, screen printing technology has been widely applied to the electric and electronic fields because it is possible to print not only flat surfaces but also curved surfaces, and to shorten processes, reduce costs, and provide conductive materials to form electrodes. Screen printing is a printing method in which ink is placed on the line of the screen plate and pushed with a squeegee to be transferred to a to-be-printed object.
기존에 전도성 도막의 형성방법으로 사용된 에칭법 및 포토리소그래피법의 경우에는 공정이 복잡하고 생산성이 낮으며 많은 장비를 필요로 하고 재료의 낭비율이 높고, 유해 물질이 다량 발생, 환경처리비용이 추가적으로 발생 등의 단점이 있었다. In the case of the etching method and the photolithography method which are conventionally used as the method of forming the conductive coating film, the process is complicated, the productivity is low, it requires a lot of equipment, the waste rate of the material is high, the generation of harmful substances, the environmental treatment cost are high. There were additional disadvantages such as occurrence.
스크린 인쇄를 하기 위해서는 스크린 인쇄용 페이스트가 필요하게 되며, 전극을 형성하기 위해서 페이스트에 전도성을 부여해줄 수 있는 물질을 넣게 된다. 전도성을 부여하는 스크린 인쇄용 전극 페이스트는 고온 소성형 타입과 저온 경화형 타입이 있는데, 현재 주로 사용하고 있는 타입은 고온 소성형 전극 페이스트가 대부분이다. Screen printing requires a screen printing paste, and in order to form an electrode, a material capable of providing conductivity to the paste is added. There are two types of electrode pastes for screen printing that impart conductivity, a high temperature baking type and a low temperature curing type, and most of the types currently used are high temperature baking type electrode pastes.
하지만, 스크린 인쇄 기술을 이용하더라도 고온 소성형 타입의 경우, 공정 라인에서 보다 많은 에너지를 필요로 하게 되어 공정 코스트가 올라가게 되고, 소성 후 전도성 도막의 수축으로 인해 접착력 저하라든지, 패턴의 정밀성이 떨어지는 등의 문제점이 나타나고 있다. However, even if screen printing technology is used, the high temperature firing type requires more energy in the process line, thereby increasing the processing cost, and deteriorating the adhesive strength due to shrinkage of the conductive coating after firing, or inferior pattern precision. Problems such as the above appear.
이에, 본 발명은 스크린 인쇄 적성, 인쇄 피막의 접착력 및 전기 전도성이 우수하면서, 저온에서 건조하여 전극 도막 형성이 가능하도록 특정한 은 충전제에 특정 배합 비율의 고형분 수지와 희석용제로 이루어지는 바인더가 혼합된 새로운 전극 페이스트 조성물 및 이를 이용한 인쇄방법을 개발한 것이다.Accordingly, the present invention is excellent in screen printing aptitude, adhesion of the print film and electrical conductivity, and a new mixture of a solid resin and a dilution solvent in a specific blending ratio to a specific silver filler to form an electrode coating by drying at a low temperature An electrode paste composition and a printing method using the same have been developed.
종래에는 높은 온도에서 소성하여 도막을 형성함에 따라 도막의 수축에 의해 선 저항 및 접촉 저항이 커지게 되어 전도성이 떨어지게 되며, 생산 공정 시 소요되는 비용도 많아지게 된다. Conventionally, as the coating film is formed by firing at a high temperature, the wire resistance and the contact resistance are increased due to the shrinkage of the coating film, so that the conductivity is lowered, and the cost required for the production process increases.
따라서, 본 발명의 목적은 페이스트를 저온에서 건조하여 생산 공정 시의 코스트를 줄이고, 전기 전도성을 높여서 전극의 특성이 우수한 태양전지용 저온 건조형 전극 페이스트 조성물을 제공하는 것이다.Accordingly, it is an object of the present invention to provide a low temperature dry electrode paste composition for solar cells having excellent electrode properties by reducing the cost during the production process by drying the paste at a low temperature and increasing the electrical conductivity.
또한, 본 발명의 다른 목적은 상기 전극 페이스트 조성물과 상기 조성물에 접착력 및 전기전도성의 성능을 높이기 위한 특정된 첨가물을 더 첨가한 전극 페이스트 조성물을 이용한 인쇄방법을 제공하는 것이다.In addition, another object of the present invention is to provide a printing method using the electrode paste composition and the electrode paste composition further added to the composition, the specified additives for enhancing the performance of adhesion and electrical conductivity.
전술한 기술적 과제를 해결하기 위하여 본 발명에서는, 스크린 인쇄에 사용되는 전극 페이스트에 있어서, 전기 전도성을 가지는 성분으로 특정한 은 파우더를 사용하고, 이 외 스크린 인쇄적성을 부여하기 위한 특정 배합의 고형분 수지와 희석 용제로 이루어진 바인더로 구성된 것으로서 상기 전도성 페이스트 100 wt% 에 대하여 은 파우더의 함량이 60~90 wt%이고, 바인더의 함량이 10~40 wt% 인 것을 특징으로 하는 태양전지용 저온 건조형 전극 페이스트 및 이를 이용한 인쇄방법에 관하여 개시한다.In order to solve the above technical problem, in the present invention, in the electrode paste used for screen printing, a specific silver powder is used as a component having electrical conductivity, and in addition, a solid resin of a specific formulation for imparting screen printability and A low temperature dry electrode paste for solar cells, comprising a binder composed of a diluent solvent, the content of silver powder being 60 to 90 wt% and the binder content of 10 to 40 wt% with respect to 100 wt% of the conductive paste; Disclosed is a printing method using the same.
여기서, 상기 바인더 수지에는 전극 페이스트 100 wt%에 대하여 수지 고형분 5~20 wt%, 수지 고형분의 희석용제 5~35 wt%의 조성비로 이루어지는 폴리에스테르계 수지를 사용하는 것이 바람직하다. 이는 바인더 수지에 수지 고형분이 5 wt% 미만을 사용하면 전도성 페이스트의 점도가 낮고 20 wt%를 초과하면 점도가 높아서 스크린 인쇄 시 작업성이 낮아지기 때문이다.Here, it is preferable to use the polyester resin which consists of a composition ratio of 5-20 wt% of resin solid content and 5-35 wt% of dilution solvent of resin solid content with respect to 100 wt% of electrode pastes for the said binder resin. This is because when the resin solid content is less than 5 wt% in the binder resin, the viscosity of the conductive paste is low, and when the resin solid content is more than 20 wt%, the viscosity is high so that workability during screen printing is low.
또한, 본 발명에서는 상기 전도성 페이스트 100 wt%에 대하여 페이스트에 전도성, 접착성, 분산성, 저장 안정성, 인쇄 적성 등의 특성들을 부여하는 첨가물 0.1~3 wt%를 더 첨가하는 것이 바람직하다. 이는 첨가제가 0.1 wt% 미만을 더 첨가하여 사용하면 상술한 특성을 부여하기가 어렵고, 3 wt%를 초과하여 첨가하면 오히려 전도 효율이나 인쇄 적성이 저하될 수 있기 때문이다.In addition, in the present invention, it is preferable to further add 0.1 to 3 wt% of the additive to impart the properties such as conductivity, adhesion, dispersibility, storage stability, printability, etc. to the paste 100 wt%. This is because it is difficult to impart the above-described characteristics when the additive is used in an amount of less than 0.1 wt%, and the conductivity or printing aptitude may be lowered when the additive is added in excess of 3 wt%.
더 바람직하게는 전도성, 접착성, 분산성, 저장 안정성, 인쇄 적성 등을 고려하여 수지 고형분 5~20 wt%와 수지 고형분의 희석용제 5~35 wt%에 나머지는 은 파우더로 이루어진 전극 페이스트 100 wt%에 대하여 첨가제 0.1~3 wt% 가 더 포함하는 것이 바람직하다. More preferably, in consideration of conductivity, adhesion, dispersibility, storage stability, printing aptitude, etc., 100 wt% of an electrode paste consisting of 5 to 20 wt% of a resin solid content and 5 to 35 wt% of a diluting solvent of the resin solid content is made of silver powder. It is preferable that 0.1-3 wt% of additives are further contained with respect to%.
상기 바인더 수지에서 고형분 수지는 유리전이온도가 5~40 ℃ 의 범위 또는 분자량이 10,000~50,000의 범위 내인 폴리에스테르 수지 등을 사용하는 것이 바람직하다. 이는 다양한 피인쇄체에 적용이 가능하면서 저온에서 경화될 수 있는 바인더의 특성을 갖고 있기 때문이다.In the binder resin, the solid resin is preferably a polyester resin having a glass transition temperature in the range of 5 to 40 ° C. or a molecular weight in the range of 10,000 to 50,000. This is because it is applicable to various printed materials and has the characteristics of a binder that can be cured at low temperatures.
상기 희석용제는 수지 고형분이 상온이나 200℃ 이하의 온도에서 1시간 이내에 건조될 수 있도록, 비점이 150~240 ℃ 범위 내인 것을 사용하는 것이 바람직한데, 구체적으로 N-메칠피로리돈, 부틸 셀로솔브, 디에틸렌글리콜모노부틸에테르아 세테이트, 에틸 캐비톨, 에틸 캐비톨 아세테이트 및 부틸 캐비톨, 에톡시에틸 아세테이트, 에틸 셀로솔브, 부틸 아세테이트, 프로필렌글리콜 모노메틸에테르 및 프로필렌글리콜 모노메틸에테르 아세테이트 등을 포함하여 이루어지는 그룹 중에서 선택되는 어느 하나 이상인 것을 사용하는 것이 바람직하다.The diluent solvent is preferably a boiling point in the range of 150 ~ 240 ℃ so that the resin solid content can be dried within 1 hour at room temperature or 200 ℃ or less, specifically N-methylpyrrolidone, butyl cellosolve, Diethylene glycol monobutyl ether acetate, ethyl cavitol, ethyl cavitol acetate and butyl cavitol, ethoxyethyl acetate, ethyl cellosolve, butyl acetate, propylene glycol monomethyl ether and propylene glycol monomethyl ether acetate and the like. It is preferable to use any one or more selected from the group consisting of.
이때, 상기 희석용제는 보다 구체적으로 테르피네올, N-메칠피로리돈(N-Methylpyrrolidone,b.p 202 ℃), 부틸 셀로솔브(butyl cellosolve, b.p 171.2 ℃), 에틸렌글리콜모노부틸에테르아세테이트(Ethylene glycol monobutyl ether acetate, b.p 192 ℃), 에틸 캐비톨(Ethyl carbitol, b.p 201.9 ℃), 에틸 캐비톨 아세테이트(Ethyl cabitol acetate, b.p 217.4 ℃), 부틸 캐비톨(Butyl cabitol, b.p 230.6 ℃) 에톡시에틸 아세테이트(Ethoxyethyl acetate, b.p 156.3 ℃), 에틸 셀로소브(Ethyl cellosolve, b.p 135 ℃), 부틸 아세테이트 (Butyl acetate, b.p 126 ℃), 프로필렌글리콜 모노메틸에테르(Propylene glycol monomethyl ether, b.p 121 ℃), 프로필렌글리콜 모노메틸에테르 아세테이트(Propylene glycol monomethyl ether acetate, b.p 146 ℃) 등을 사용할 수 있으며, 그 중 피인쇄체에 대한 인쇄 피막의 접착력과 인쇄적성 등을 고려하여 테르피네올(Terpineol b.p: 217 ℃)을 사용하는 것이 가장 바람직하다.At this time, the diluent is more specifically terpineol, N-methylpyrrolidone (N-Methylpyrrolidone, bp 202 ℃), butyl cellosolve (bp 171.2 ℃), ethylene glycol monobutyl ether acetate (Ethylene glycol monobutyl ether acetate, bp 192 ° C.), ethyl carbitol (bp 201.9 ° C.), ethyl cabitol acetate (Ethyl cabitol acetate, bp 217.4 ° C.), butyl capitol (Butyl cabitol, bp 230.6 ° C.) ethoxyethyl acetate ( Ethoxyethyl acetate (bp 156.3 ° C), Ethyl cellosolve (bp 135 ° C), Butyl acetate (Butyl acetate, bp 126 ° C), Propylene glycol monomethyl ether (bp 121 ° C), Propylene glycol mono Methyl ether acetate (Propylene glycol monomethyl ether acetate, bp 146 ℃) and the like can be used, among them terpineol (Terpineol bp: 2 in consideration of the adhesion and printability of the print film to the printed material). 17 ° C.) is most preferred.
상기 은 파우더는 1~10㎛의 미크론 크기와 100~500㎚의 나노 크기의 입도 분포를 갖는 평평한 형태의 판상형(flake type)을 혼합하여 사용하는 것이 바람직하고, 더 바람직하게는 미크론 크기의 은과 나노 크기의 은을 중량기준으로 1:1 내지 1:5로 혼합하여 사용한다. 이는 상기 은 파우더의 형상이 판상형이 아닌 구 형(sphere type)의 경우, 스크린 인쇄된 막의 은 파우더는 서로 간에 면 접촉을 하지 못하고 점접촉을 하게 되어 도전 패스가 형성되기 어렵고 요구되는 전기 전도성을 얻지 못하는 문제가 있고 또한, 중량부를 기준으로 전도성 페이스트를 형성함에 있어서 부피가 작은 구형의 은 파우더를 사용하는 경우 인쇄된 막의 전체 부피 중에서 은 파우더가 차지하는 부피가 작게 되어 인쇄된 전도성 패턴에 핀홀이 발생하는 등 은 파우더의 패킹 불량이 발생하여 전기 전도성이 떨어지는 문제점이 발생할 수 있기 때문이고, 입도 크기가 다른 은 파우더를 혼합하는 경우 은 파우더 간의 공극을 줄여서 밀도를 균일하게 해서 전도성을 향상시킬 수 있기 때문이다. 이때, 중량으로 미크론 크기의 은 1을 기준으로 나노 크기의 은이 1 미만이나 5를 초과하면 상술한 공극을 메워주는 효과가 저감되기 때문에, 상술한 범위 내에서 혼합하는 것이 바람직하다.The silver powder is preferably used by mixing a flat plate (flake type) having a micron size of 1 ~ 10㎛ and a particle size distribution of 100 ~ 500nm, more preferably a micron size of silver and Nano-size silver is used by mixing 1: 1 to 1: 5 by weight. This is because when the shape of the silver powder is not a plate-shaped sphere type, the silver powder of the screen-printed film does not have surface contact with each other and is in point contact with each other, so that a conductive path is difficult to be formed and the required electrical conductivity is not obtained. In addition, in the case of using a small-volume spherical silver powder in forming the conductive paste based on the weight part, the volume of the silver powder becomes smaller in the total volume of the printed film, resulting in pinholes in the printed conductive pattern. This is because a poor packing of silver powder may cause a problem of poor electrical conductivity, and when silver powders having different particle sizes are mixed, the conductivity may be improved by reducing the air gap between the silver powders to make the density uniform. . In this case, when the nano-size silver is less than 1 or more than 5 based on the micron-sized silver 1 by weight, the effect of filling the above-mentioned voids is reduced, and it is preferable to mix within the above-mentioned range.
또한, 본 발명에서는 비용과 전도성 측면에서 상기 은 파우더는 순수 은만을 사용하거나 은에 산화질리코늄, 산화주석, 산화안티몬 및 ITO(Indium Tin Oxide), 산화니켈, 산화알루미늄 파우더로 이루어진 군에서 선택된 전도성 물질을 첨가한 것을 사용할 수 있는데, 바람직하게는 혼합물 100 wt% 기준으로 1~30 wt%혼합한 것을 사용하는 것이 바람직하다. 이는 1 wt% 미만을 사용하면 전도성 향상 효과가 미미하고 30wt%를 초과하여 사용하면 필요한 은을 충분하게 사용하지 못하므로, 상술한 사용범위 내에서 사용하는 것이 바람직하다. In the present invention, in terms of cost and conductivity, the silver powder may use pure silver or conductive silver selected from the group consisting of zirconia, tin oxide, antimony oxide and indium tin oxide (ITO), nickel oxide, and aluminum oxide powder. Addition of a substance can be used, and preferably a mixture of 1 to 30 wt% based on 100 wt% of the mixture is preferable. If it is less than 1 wt%, the effect of improving conductivity is insignificant, and if it is used in excess of 30 wt%, the necessary silver is not sufficiently used. Therefore, it is preferable to use it within the above-mentioned range.
본 발명에서 상기 첨가물은 (a)스테아린산, 초산, 개미산 인산, 마론산, 마 레인산, 염산 및 황산 등에서 선택된 산 첨가물과; (b) 디메틸폴리실록산, 메틸에틸폴리실록산 및 디에틸폴리실록산 등에서 선택된 폴리실록산계 소포제, 실리콘 디아크릴레이트나 실리콘 폴리아크릴레이트 등에서 선택된 실리콘계 레벨링제 또는 메탄올, 에탄올, 부탄올 등에서 선택된 알코올계 레벨링제, 헥사플로로안티모네이트, 트리플릭산으로 블록되어 있는 암모늄 및 무기 충전제 등에서 선택된 첨가물;로 이루어지는 첨가물을 사용하는 것이 전도성 페이스트의 특성상 바람직하다. 하지만, 본 발명이 상술한 첨가물로 국한되는 것은 아니며 전도성 페이스트 분야에서 상업적으로 판매되는 것을 사용해도 무방하다.In the present invention, the additive is (a) an acid additive selected from stearic acid, acetic acid, formic acid phosphoric acid, maronic acid, maric acid, hydrochloric acid and sulfuric acid; (b) a polysiloxane antifoaming agent selected from dimethylpolysiloxane, methylethylpolysiloxane, diethylpolysiloxane, etc., a silicone leveling agent selected from silicone diacrylate or silicone polyacrylate, or an alcohol leveling agent selected from methanol, ethanol, butanol, etc., hexafluoroanti It is preferable in view of the properties of the conductive paste to use an additive consisting of an additive selected from an ammonium, an inorganic filler, and the like blocked with triflic acid. However, the present invention is not limited to the above-described additives and may be commercially available in the conductive paste field.
본 발명에 따른 전도성 페이스트의 점도는 스크린 인쇄의 인쇄 적성 및 작업성을 감안하여 5,000~1,000,000 cps의 범위 내인 것이 바람직하다.The viscosity of the conductive paste according to the present invention is preferably in the range of 5,000 to 1,000,000 cps in consideration of the printability and workability of screen printing.
본 발명에 따른 전극 페이스트 조성물은 최대 200℃의 온도에서 또는 상온 내지 200℃의 온도에서 1시간 이내에 건조되어 전극 도막을 형성된다.The electrode paste composition according to the present invention is dried at a temperature of up to 200 ° C. or at a temperature from room temperature to 200 ° C. within 1 hour to form an electrode coating film.
또한, 본 발명에 따른 전극 페이스트 조성물을 사용하여 스크린 인쇄를 하는 데 있어서, 전도성을 보다 향상시키기 위하여 피인쇄체에 전도성 페이스트로 이루어진 액을 사용하여 1차 스크린 인쇄를 하고, 그 위에 다시 혼합 첨가물로 2차 스크린 인쇄하는 것을 말한다.In addition, in screen printing using the electrode paste composition according to the present invention, in order to further improve the conductivity, the first screen printing is carried out using a liquid consisting of a conductive paste on the printed object, and again, as a mixed additive. Car screen says to print.
구체적으로 본 발명에서는 전도성 페이스트를 사용한 스크린 인쇄방법에 있어서, (a) 피 인쇄체에 은 파우더의 함량이 60~90 wt%과 폴리에스테르계 바인더 수지의 함량이 10~40 wt%로 이루어지는 전극 페이스트를 1차 스크린 인쇄한 단계; 및Specifically, in the present invention, a screen printing method using a conductive paste, comprising: (a) forming an electrode paste containing 60 to 90 wt% of silver powder and 10 to 40 wt% of polyester binder resin in the printed object; Primary screen printing step; And
(b) 상기 1차 스크린 인쇄 상에, (b) on the primary screen printing,
(ⅰ) 황산, 초산, 개미산, 인산, 마론산, 마레인산, 염산 및 스테아린산으로 이루어지는 군에서 선택된 산 첨가물과;(Iii) an acid additive selected from the group consisting of sulfuric acid, acetic acid, formic acid, phosphoric acid, maronic acid, maleic acid, hydrochloric acid and stearic acid;
(ⅱ) 폴리실록산계 소포제, 실리콘계 레벨링제 또는 알코올계 레벨링제, 헥사플로로안티모네이트, 트리플릭산으로 블록되어 있는 암모늄 및 무기 충전제로 이루어지는 군에서 선택된 첨가물;로 이루어지는 혼합 첨가물 0.01~3.0 wt%로 2차 스크린 인쇄하는 것을 특징으로 하는 전도성 페이스트를 이용한 스크린 인쇄방법을 제공한다. 이는 1차 스크린 인쇄 상에 혼합 첨가물 0.01 wt% 미만을 사용하면 전도성 향상 효과가 미미하고 3.0 wt%를 초과하면 주변의 전기적 손상을 야기할 수 있게 때문에, 상기와 같은 사용범위 내에서 사용하는 것이 바람직하다. (Ii) an additive selected from the group consisting of a polysiloxane antifoaming agent, a silicone leveling agent or an alcohol leveling agent, hexafluoroantimonate, ammonium blocked with triflic acid and an inorganic filler; a mixed additive consisting of 0.01 to 3.0 wt% It provides a screen printing method using a conductive paste, characterized in that the second screen printing. It is preferable to use it within the range of use as the use of a mixed additive of less than 0.01 wt% on the primary screen printing may cause a slight increase in conductivity and cause an electrical damage to the surrounding when it exceeds 3.0 wt%. Do.
본 발명의 전도성 페이스트는 페이스트의 스크린 인쇄 적성, 인쇄 피막의 접착력, 유연성, 전기 전도성이 우수하며, 저온 건조만으로도 도막이 형성되어 생산 공정 코스트가 감소하므로 각종 전기, 전자기기를 위한 스크린 인쇄에 매우 효율적으로 적용 가능하며 인쇄 품질 또한 매우 우수하여 제품의 신뢰도를 향상시킬 수 있게 된다. The conductive paste of the present invention is excellent in screen printing aptitude of the paste, adhesion of the print film, flexibility, and electrical conductivity, and the coating film is formed even by low temperature drying, so that the production process cost is reduced, so it is very efficient for screen printing for various electric and electronic devices. It is applicable and the print quality is also very good, which can improve the reliability of the product.
[공시 재료][Publication Materials]
1. 은 충전제1.silver filler
본 발명에서는 전도성 금속재료로서 은 파우더를 사용하는데, 그 물성은 아래 표 1과 같다. 도 1은 본 발명의 은 파우더의 SEM 사진으로, 미크론 크기(A)의 입도 분포와 나노 크기(B)의 입도 분포를 갖는 판상형을 나타낸 것이다. In the present invention, silver powder is used as the conductive metal material, and physical properties thereof are shown in Table 1 below. 1 is a SEM photograph of the silver powder of the present invention, showing a plate-like shape having a particle size distribution of the micron size (A) and a particle size distribution of the nano size (B).
2. 바인더 수지2. Binder Resin
2-1. 수지 고형분2-1. Resin solids
본 발명에서는 전도성 페이스트에 점성을 부여하는 바인더의 수지로서 폴리에스테르 수지가 사용되고, 그 물성과 희석 용제는 아래의 표 2와 같다. In the present invention, a polyester resin is used as the resin of the binder for imparting viscosity to the conductive paste, and the physical properties and the diluting solvent are shown in Table 2 below.
이때, 상기 폴리에스테르 수지의 점도는 2,000~50,000 cps 인 것을 선택하였다.At this time, the viscosity of the polyester resin was selected to be 2,000 ~ 50,000 cps.
[[ 실시예Example 1] 전극 페이스트 제조 1] electrode paste manufacturing
[[ 실시예Example 2] 스크린 인쇄 2] screen printing
1. 1액형 1도 1.1 part 1 degree
상기 실시예 1의 전도성 페이스트를 스크린 판위에서 스크래퍼로 롤링(rolling)하여 도포시킨 다음, 스퀴지로 스크린 판의 화선부로 토출시키면서 판분리를 하여 피 인쇄체에 레벨링되면서 스크린 인쇄를 한 다음, 이를 200℃에서 30분간 건조시켜서 전극을 형성하였다.The conductive paste of Example 1 was applied by rolling on a screen plate with a scraper, and then plate-separated while being discharged to the caustic part of the screen plate with a squeegee, and then screen-printed while leveling the printed object, and then at 200 ° C. It dried for 30 minutes and formed the electrode.
2. 2액형 2도2. 2-
상기 실시예 3-1의 전도성 페이스트를 스크린 판위에서 스크래퍼로 롤링(rolling)하여 도포시킨 다음, 스퀴지로 스크린 판의 화선부로 토출시키면서 판분리를 하여 피인쇄체에 레벨링되면서 1차 스크린 인쇄를 한 다음, 상기 1차 인쇄상에 동일한 방법으로 상기 실시예 3-2의 산 첨가물로 2차 스크린 인쇄를 하고, 이를 200℃에서 30분간 건조시켜서 전극을 형성하였다.The conductive paste of Example 3-1 was applied by rolling on a screen plate with a scraper and then plate-separated while being discharged to the wire portion of the screen plate with a squeegee to be leveled on the printed object, followed by primary screen printing. Second screen printing was carried out with the acid additive of Example 3-2 on the primary printing in the same manner, and dried at 200 ° C. for 30 minutes to form an electrode.
[실험 예]Experimental Example
1. 접착성1.adhesive
상기 실시 예2에서 시험적으로 인쇄한 전극의 접착력 테스트를 확인한 결과, 고온에서 소성하여 형성시킨 전극과 같은 특성을 나타냄을 알 수 있었다. 접착력 테스트는 KS M ISO 2409(도료의 밀착성 시험방법)에 의거하여 인쇄된 전극을 십자가 모양으로 크로스 커팅(cross-cutting)한 후 셀로판 테이프로 부착한 뒤 인쇄된 패턴 셀이 떨어지는 개수로써 양호한지 아닌지를 판단하였다. 상기 실시 예2로 인쇄한 전극으로 형성된 100개의 셀 중 크로스 커팅(cross-cutting) 후에도 100개 모두 부착되어 있어 접착력이 우수함을 알 수 있었다.As a result of confirming the adhesion test of the test electrode printed in Example 2, it can be seen that the same characteristics as the electrode formed by firing at a high temperature. The adhesion test is based on KS M ISO 2409 (Paint Adhesion Test Method). Cross-cut the printed electrodes in cross shape, attach them with cellophane tape, and check whether the printed pattern cells are good as falling numbers. Judged. Among the 100 cells formed by the electrode printed in Example 2, all of the 100 cells were attached even after cross-cutting.
2. 전기전도성2. Electrical conductivity
형성된 전극패턴에 대한 전기전도성은 전극 패턴의 표면을 표면저항 측정기(CMT-series, Korea)를 이용하여 4-point probe 방식에 의해 면저항을 측정하고, SEM 촬영을 하여 두께를 측정한 뒤 이를 비저항으로 환산하여 하기 표 4에 나타내었다.The electrical conductivity of the formed electrode pattern was measured on the surface of the electrode pattern by the 4-point probe method using a surface resistance measuring instrument (CMT-series, Korea), and the thickness was measured by SEM photographing. In conversion, it is shown in Table 4 below.
비저항을 측정한 결과, 상기 표 4와 같이 나타남을 알 수 있었다. 이는 일반 전극 패턴과 비교하여 전극패턴으로 사용하기에 양호한 물성을 나타내는 것으로 판단됨을 알 수 있었다.As a result of measuring the specific resistance, it can be seen that the results are shown in Table 4. Compared with the general electrode pattern, it can be seen that it shows good physical properties for use as the electrode pattern.
이의 결과, 본 발명에 따라 제조된 인쇄 피막은 전극 형성에 있어서 고온 소성에 의한 것과 비교하여 접착력뿐만 아니라 인쇄 피막의 전도성이 동일 내지 우수함을 알 수 있었다.As a result, it was found that the printed film prepared according to the present invention had the same or superior conductivity as well as the adhesive strength as compared with the high temperature baking in forming the electrode.
도 1은 본 발명의 은 파우더의 SEM 사진으로, 미크론 크기(A)의 입도 분포와 나노 크기(B)의 입도 분포를 갖는 판상형을 나타낸 것이다. 1 is a SEM photograph of the silver powder of the present invention, showing a plate-like shape having a particle size distribution of the micron size (A) and a particle size distribution of the nano size (B).
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